ZENIGATALED
SPECIFICATIONS
Feb 10, 2015
GW6DME**XFC
**:27,30,35,40,50
MEGAZENIGATA-LED
DevelopmentDepartmentⅡ
LightingDeviceDivision
ElectronicComponentsAndDevicesGroup
SHARPCORPORATION
sharp LD-E6-6-14-B
**:27,30,35,40,50
http://www.sharp-world.com/products/device/
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Contentsinthistechnicaldocumentbechangedwithoutanynoticeduetotheproductmodification.
Intheabsenceofconfirmationbydevicespecificationsheets,SHARPtakesnoresponsibilityforany
defectsthatmayoccurinwquipmentusinganySHARPdevicesshownincatalogs,databooks,etc.
Handle this document carefully for it contains material protected by international
copyright law. Any reproduction, full or in part, of this material is prohibited
without the express written permission of the company.
When using the products covered herein, please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the
company be liable for any damages resulting form failure to strictly adhere to these
conditions and precautions.
(1) Please do verify the validity of this part after assembling it in customer’s products, when customer
wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) The products covered herein are designed and manufactured for the following
application areas. When using the products covered herein for the equipment
listed in paragraph (3), even for the following application areas, be sure
to observe the precautions given in Paragraph (3). Never use the products
for the equipment listed in Paragraph (4).
Office electronics
Instrumentation and measuring equipment
Machine tools
Audiovisual equipment
Home appliances
Communication equipment other than for trunk lines
(3) These contemplating using the products covered herein for the following
equipment which demands high reliability, should first contact a sales
representative of the company and then accept responsibility for incorporating
into the design fail-safe operation, redundancy, and other appropriate
measures for ensuring reliability and safety of the equipment and the overall system.
Control and safety devices for airplanes, trains, automobiles, and other
transportation equipment
Mainframe computers
traffic control systems
Gas leak detectors and automatic cutoff devices
Rescue and security equipment
Other safety devices and safety equipment, etc.
(4) Do not use the products covered herein for the following equipment which
demands extremely high performance in terms of functionality, reliability, or accuracy.
Aerospace equipment
Communications equipment for trunk lines
Control equipment for the nuclear power industry
Medical equipment related to life support, etc.
(5) please direct all queries and comments regarding the interpretation of the
above four Paragraphs to a sales representative of the company.
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Model No. GW6DME**XFC
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GW6DME**XFC Specifications
sharp LD-E6-6-14-B
Model No. GW6DME**XFC
1
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1. Application
These specifications apply to the light emitting diode module Model No. GW6DME**XFC.
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
2. External dimensions and equivalent circuit Refer to Page 2.
3. Ratings and characteristics Refer to Page 3-6.
3-1. Absolute maximum ratings
3-2. Electro-optical characteristics
3-3. Derating curve
3-4. Characteristics diagram (TYP.)
4. Reliability Refer to Page 7.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level Refer to Page 8.
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements Refer to Page 9-12.
6-1. Chromaticity rank table
6-2. Packing
6-3. Label
6-4. Indication printed on product
7. Precautions Refer to Page 13-16.
2．External dimensions and equivalent circuit
16 series　×　10parallel　＝　160 pcs of LEDs
＋connection
terminal
－connection
terminal
R
Equivalent circuit
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ｍｍ
Unit Material Finish
Terminal：Ag
Substrate : Ceramics
Lens : Silicone resin
Top view
Side view
(Unit：mm)
24.0 +0.50/-0.10①
（18.6）
（Φ17.2）
1.0±0.1
（1.8）
（12.5）
20.0
±0.50/-0.10
②
3.5±0.1
1.4±0.1
（Φ15.6）
（Note）Values inside parentheses are reference values.
External sizes of①、②are determined by maximum dimensions,
that include salient areas on the edges of respective sides.
3．Ratings and characteristics
　　3-1.Absolute maximum ratings
Item Symbol Rating Unit
Power Dissipation（※1,4）
Forward Current（※1,4）
Reverse Voltage（※2,4）
Operating Temperature（※3）
Storage Temperature
Junction Temperature
P
IF
VR
Topr
Tstg
Tj
61.8
145
W
mA
V
℃
℃
℃
1200
-15
-30 ～ +100
-40 ～ +100
*1 Power dissipation and forward current are the values when the module temperature
is set lower than the rating by using an adequate heat sink.
*2 The maximum rating of reverse voltage is assumed, after considering the voltage that occur due to initial
connection error that may occur suddenly.
(Not dealing with the possibility of always-on reverse voltage.)
*3 Operating temperature is the Case temperature Tc
(Refer to measuring point for case temperature in the next page.)
Refer to "Derating curve" in the next page as for operating current.
*4 T
c
= 25℃
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3-2.Electro-optical characteristics
Item Symbol
common
Color Temperature
Chromaticity Coordinates※７
Forward Voltage※5
27
Luminous Flux※６
I =950mA
VF
Φ
Ra 80
43.5 （47.5） 51.5
（0.4610）
lm
K
MIN.Condition TYP. MAX. Unit
V
I =950mA
3820 （4240） -
-
-
-
x
y
-
General Color Rendering Index※8
-
-
-（0.4150）
（2720）
（82） -
-
-
-
30
Φ
Ra 80
（0.4370）
lm
K
I =950mA
4040 （4480） -
-
-
-
x
y
-
-
-
-（0.4030）
（3000）
（82） -
-
-
-
35
Φ
Ra 80
（0.4090）
lm
K
I =950mA
4160 （4620） -
-
-
-
x
y
-
-
-（3440）
（82） -
-
-
-
（0.3930）
-
40
Φ
Ra 80
（0.3820）
lm
K
I =950mA
4320 （4790） -
-
-
-
x
y
-
-
-（3980）
（82） -
-
-
-
（0.3800）
-
50
Φ
Ra 80
（0.3480）
lm
K
I =950mA
4330 （4810） -
-
-
-
x
y
-
-
-（4920）
（82） -
-
-
-
（0.3600）
-
F
(Note) Values inside parentheses are shown for reference purpose only.
（Tj＝90℃）
F
F
F
F
F
Color Temperature
Chromaticity Coordinates※７
Luminous Flux※６
General Color Rendering Index※8
Color Temperature
Chromaticity Coordinates※７
Luminous Flux※６
General Color Rendering Index※8
Color Temperature
Chromaticity Coordinates※７
Luminous Flux※６
General Color Rendering Index※8
Color Temperature
Chromaticity Coordinates※７
Luminous Flux※６
General Color Rendering Index※8
*5 (After 20 ms drive, Measurement tolerance: ± 3 %)
*6 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 10 %)
*7 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 0.005)
*8 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 2)
sharp LD-E6-6-14-B
Model No. GW6DME**XFC
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3-3.Derating curve
Forward Current Derating Curve
Case Temperature Tc[℃]
(Note) To keep the case temperature lower than the rating enough heat-radiation performance needs to
be secured by using an adequate heat sink(refer to section8-③).
For soldering connection,please evaluate in your usage environment to make sure soldering reliability.
(Above derating curve is specified to LED device,not for soldering connection)
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation does not exceed case temperature over the rating
in operation.
（Measuring point for case temperature）
Thermal Resistance：1.0℃/W（Typical value）
Please take note of the following,when measuring case temperature.
1 The LED device mounting surface should be flat/plain surface.
2 The substrate surface temperature should be uniform.
measuring point
Forward Current I [mA]
F
0
200
400
600
800
1000
1200
1400
-30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110
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3-4.Characteristics diagram(TYP.)
Forward Current vs. Relative Luminous Flux
Tj=90℃
Relative Luminous Flux [%]
Forward Current　　I [mA]
Forward Voltage vs. Forward Current
Tj=90℃
Case Temperature vs. Relative Luminous Flux
I ＝ 950mA
F
Case Temperature　　Tc [℃]
Relative Luminous Flux [%]
Case Temperature　　Tc [℃]
Case Temperature vs.Forward Voltage
I ＝ 950mA
F
（Note）Characteristics data shown here are for reference purpose only.(Not guaranteed data)
Forward Current　I [mA]
F
FForward Voltage　　V [V]
F
Forward Voltage V [V]
F
0
20
40
60
80
100
120
140
0 200 400 600 800 1000 1200 1400
0
200
400
600
800
1000
1200
1400
41.5 42.5 43.5 44.5 45.5 46.5 47.5 48.5
0
20
40
60
80
100
120
0 30 60 90
42
44
46
48
52
0 30 60 90
50
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4．Reliability
　　4-1.Test items and test conditions
Test itemNo. Test conditions samples
C(%)
n
Defective LTPD
Confidence level：90％
Temperature Cycle
Temperature Humidity
Storage
High Temperature
Storage
Low Temperature
Storage
Steady State
Operaring Life
Shock
Vibration
-40℃（30 min）～ +100℃（30 min）,100cycles
Tstg=+60℃,RH=90%,Time=1 000 h
Tstg=+100℃,Time=1 000 h
Tstg=-40℃,Time=1 000 h
Tc=90℃,I =950mA,Time=1000 h
Acceleration：15000m/s,Pulse width：0.5ms
Direction：3 directions (X,Y and Z)
2
Frequency：100 ～ 2000Hz for 4 minutes per trial
Acceleration：200m/s
Direction：3 directions (X,Y and Z)
4 trials each direction
2
11 0 201
2
3
4
5
6
7
11 0 20
11 0 20
11 0 20
11 0 20
5 0 50
5 0 50
V
F
V
F
Forward Voltage
Luminous Flux
Parameter
No.
1
2
Symbol Failure criteria
Φ
＞Initial value×1.1
＜Initial value×0.7
Φ
4-2.Failure criteria
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F
5．Quality level
　　5-1.Applied standard (ISO2859-1)
　　5-2.Sampling inspection (A single normal sampling plan,level S-4)
　　5-3.Inspection items and defect criteria
No.
AQL
1
2
3
4
0.4
0.1
Item Defect criteria
No radiation
Electro-optical
characteristics
External
dimensions
Appearance
Classification
Major
defect
Minor
defect
No light emitting
Not conforming to the specification
(External dimensions of ①and②shown in Page2)
Nonconformity observed in product appearance is determined
as defective only when electro-optical characteristics is affected by.
<If any question arises regardless of above mentioned criterion>
■Foreign material,scratch, or bubble at emitting area:0.8mm
■Fiber generation at emitting area:0.2mm ib width and 2.5mm inlengh
■Foreign material at connection terminal:0.8mmΦ
■Substrate burr on edge:Over dimension tolerance
(Note) Products with removable foreign material attached on are not determined to be defective.
(Note) Substrate cracks that do not effect the electrical/optical charecterustics are not determined to be defective.
Not conforming to the specification
(Forward voltage, Luminous flux and Chromaticity values)
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Model No. GW6DME**XFC
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6．Supplements
　　6-1.Chromaticity rank table
2 700K
Point 4Point 3Point 2Point 1
0.4200
0.4600
0.4200
0.4555
0.4100
1x
y
0.4620
0.4100
0.4665
Rank Chromaticity coordinates
0.395
0.405
0.415
0.425
0.435
y
x
1
2800K2700K2600K
2 700K Chromaticity Diagram
0.440 0.450 0.460 0.470 0.480
(Tolerance：x,y±0.005)
3 000K
Point 4Point 3Point 2Point 1
0.4080
0.4360
0.4080
0.4315
0.3980
1x
y
0.4380
0.3980
0.4425
0.385
0.395
0.405
0.415
0.425
y
x
1
2900K
3000K3100K
0.415 0.425 0.435 0.445 0.455
3 000K
Chromaticity Diagram
3 500K
Point 4Point 3Point 2Point 1
0.3980
0.4080
0.3980
0.4035
0.3880
1x
y
0.4100
0.3880
0.4145
4 000K
Point 4Point 3Point 2Point 1
0.3850
0.3810
0.3850
0.3765
0.3750
1x
y
0.3830
0.3750
0.3875
5 000K
Point 4Point 3Point 2Point 1
0.3650
0.3175
0.3650
0.3420
0.3550
1x
y
0.3485
0.3550
0.3540
Rank Chromaticity coordinates
Rank Chromaticity coordinates
Rank Chromaticity coordinates
Rank Chromaticity coordinates
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(I =950mA,Tj=90℃)
F
(I =950mA,Tj=90℃)
F
(I =950mA,Tj=90℃)
F
(I =950mA,Tj=90℃)
F
(I =950mA,Tj=90℃)
F
0.375
0.385
0.395
0.405
0.415
y
x
1
3300K
3400K
3500K
0.390 0.400 0.410 0.420 0.430
3 500K
Chromaticity Diagram
0.360
0.370
0.380
0.390
0.400
y
x
1
3800K
3900K
4000K
4100K
4 000K
Chromaticity Diagram
0.360 0.370 0.380 0.390 0.400
0.340
0.350
0.360
0.370
0.380
y
x
1
4600K
4800K5000K
5200K
5 000K
Chromaticity Diagram
0.330 0.340 0.350 0.360 0.370
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6-2.Packing
・ One tray composed of 40 pieces
・ 5 trays(200 piecies)and one upper lid-tray in one moisture-proof bag
・ 2 bags(400 pieces) in one carton
・ Dimensions of outer carton:235×220×90mm (Reference value)
　(Note 1)Thre are cases of one carton composed of one bag (200 pieces)
(Note 2) State of packing is dubject to change.
＜Outer carton＞
200 pieces×２bags＝400 pieces
＜One bag＞
40 pieces×5 trays＝200 pieces
＜One tray＞
5×8＝40 pieces
(225mm)
(210mm)
Silica gel
Silica gel
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6-3.Label
・ Lot No.indication
　XX　　　11　　　B　　　25
①　　　 ②　　　③　　　④
①Production plant code
②Shipping year（Year last 2 digits）
③Shipping month
（from january to Doccmber in ABC order）
④Shipping date（01 ～ 31）
　　※Notation may be different
・ Lot No.indication
　XX　　　1　　9　　G　　11　　　123　　　A
①　　　② 　③ 　④　　⑤　　　　⑥　　　⑦
①Production plant code
②Shipping year（Year last digit）
③Shipping month（1 ～ 9 or O,N,D）
④Fixed code　G
⑤Shipping date　（01 ～ 31）
⑥Serial No.
⑦Backup code　A
　　※Notation may be different
1)Moisture-Proof bag
　　Following label is attached on moisture-proof bags.
(Note 3) Label format is subjected to change.
SHIPMENT TABLE
←Model number
←（Model number+suffix code）
←Quantity
←Lot No.
←Production country
　 ・ MADE IN ****
　 ・ MADE IN ****
PART No. GW6DME**XFC
(GW6DME**XFCM)
QUANTITY：200　　　RANK　　　１
LOT　No. 5020G2064A
SHARP CORPORATION
MADE IN *********** RC
SHARP LABEL
1) Outer carton
Following label is attached on outer carton.
(Note 3) Label format is subjected to change.
SHIPMENT TABLE
←Model number
←（Model number+ suffix code）
←Quantity
←Lot No.
←Rank
←Production country
　 ・ MADE IN ****
　 ・ MADE IN ****
PART No. GW6DME**XFC
(GW6DME**XFCM)
LOT　No. XX11B25
QUANTITY：400
RANK 1
SHARP CORPORATION
MADE IN *********** RC
SHARP LABEL
Model No. Control No.
　　　Model No. and control No. are indicated on substrate surface.
１）Model No.
　　　Abbreviated Model No” 6DME**XFC” is indicated.
２）Control No.
　　　Indicated as follows;
　　 M　　12　　B　　11　　-　1
　　　①　　②　　③　　④　　　 ⑤
①Production plant code（to be indicated alphabetically）
②Year of production（the last two figures of the year）
③Month of production
（to be indicated alphabetically with january corresponding to A）
④Date of production（01 ～ 31）
⑤Rank:Chromaticity rank is indicated as follows;
Rank 1→1
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7．Precautions
① Storage conditions
　 Please follow the conditions below.
・ Before opend:Temperature 5 ～ 30℃, Relative humidity less than 60%.
(Before opened LED should be used within a year)
・ After opened:Temperature 5 ～ 30℃, Relative humidity less than 60%.
(Please apply soldering within 1 week)
・ Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged,which may affect soldering.
② Usage conditions
This product is not designed for use under any of the following conditionds.
Pleasecarefully check the performance and reliability well enough in case of using under
any of the following conditions;
・ In a please with a lot of moisture,dew condensation,briny air, and corrosive gas.
(CL,H2S,NH3,SO2,NOX,etc)
・ Under the direct sumlight,outdoor exposure,and in a dusty please.
・ In water, oil,medical finrd, and organic solvent.
Please do not use component parts like rujbberwhich may contain sulfur(gasket packing,
adhesive material,etc.)
Please note that any strong acidic or alcoholic elements could effect the silicon resin used
in the LED device.
The heat and light released from the LED device,could generate halogen gas from the surounding
materials,which may have adverse impact on the module.Before using please consider carefully
about this issue.
③ Heat radiation and Installation
If forward curent (IF) is applied to single-state module at any curent,there is a risk of damaging
LED or emitting smoke,due to increase in temperature.
Equip with specified heat radiator(heat sink),and avoid heart being stuffed inside the module.
Material of substrate is alumina ceramic.IF installed inappropriately,trouble of insufficient heat
radiation may occur,which may result in board cracks or lighting defects due to overheat.
Please take particular notice for installation.
Refer to the following cautions while installing the LED device on heat sink.
・ Apply thermolysis adhesive,adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only,check the effectiveness and reliability before
fixing. If LED comes off from heat radiator,unusual temperature rise entails hazardous phenomena
including device deterioration,comming off of solder at leads,and emitting smoke,slong with LED
device deffects.
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　 ・ When LED device is mechanically fixed or locked,Please take into consideration regarding the
method of attachment due to fail from stress.
・ Please apply appropriate stress and design carefully,when fixing the LED device using holder.
Any excessive or uneven stress could break LED deviceʼ s substrate.
・ Avoid convexly uneven boards. Convex board is subject to substrate cracking or debasement
of heat release.
・ It is recommented to apply adhesive or adhesive sheet with high thermal conductivity for
radiation of heat effectively.
・ Please take care about the influence of color change of adhesive or adhesive sheet in initial and
long termperiod,which may affect light output or color due to change of reflectance from backside.
・ Any excessive or uneven stress on the ceramic substrate could break the substrate.
Please design such that,proper/uniform stress is applied on the substrate,when fixing the LED
device using a holder.
・ When fixing the LED device with a holder,please take note if any excessive or uneven stress is
applied when pressing the substrate with holder.Due to this,the gap may arise between LED
device and adhesive material,which may affect the heat dissipation of the device.
・ Do not touch resin part including white resin part on the surface of LED.
No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.
When using tweezers,please handle by side part of ceramic or the specified area shown below.
・ The outer edges of the substrate may be uneven in some cases. Please avoid choosing these
areas as fixing points,while designing for installation.
・ In case of using heat radiation sheet or heat radiation adhesive,light reflection or absorption of
these materials may influence the output of LED device. and hence careful consideration is required
while choosing the radiation sheet ro adhesive.
④ Connecting method
Use soldering for connections. Follow the conditioons mentioned below,to preserve the connection
strength.
・ Use soldering iron with thermo controller(tip temperature 380℃,within 5 seconds per one place.
Handring area
（0.9）
（10.0）
（4.8）
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Model No. GW6DME**XFC
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・ Secure the solderwettability on whole solder pad and leads.
・ During the soldering process,put the ceramic board on materials whose conductivity is poor
enough not to radiate heat of soldering.
・ Warm up(with using a heated plate) the substrate is recommended before soldering.
(preheat condition:100℃～ 150℃,within 60sec)
・ Avoid touching any part of resin with soldering iron.
・ This product is not designed for reflow and flow soldering.
・ Avoid such lead arrangement as applying stress to solder-applied area.
・ Please do not detach solder and make re-solder.
・ Please solder evenly on each electrode.
・ Please prevent flux from touching to resin.
・ Do the soldering on stable stand.Avoid soldering on moving or vibrating objects.
・ Please avoid touching the soldering unit to resin.
⑤ Static electricity
This product is subject to static electricity,so take measures like wearing wrist band to cope with
it. Install circuit protection device to drive circuit, if necessary.
⑥ Drive method
・ Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs
when they are out of operation.
・ Module is composed of LEDs connected in both series and parallel.
Constant voltage power supply runs off more than specified current amount due to lowered VF
caused by temperature rise.Constant current power supply is recommended to drive.
・ Be cautious while putting on/off the power supply,as excess current,excess voltage or reverse
voltage may get injucted to the device in some cases.
⑦ Cleaning
Avoid cleaning,since LED device may be effected in some cases by cleaning.
⑧ Color-tone variation
Chromaticity of this product is monitored by integrating sphere right after the operation.
Chromaticity varies depending on measuring method,light spread condition,or ambient temperature.
Please verify your actual conditions before use.
sharp LD-E6-6-14-B
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⑨ Safety
・ Looking directly at LEDs for a long time may result in hurting your eyes.
・ In case that excess curent(over ratings)is supplied to the device,hazardous phenomena
including abnormal heat generation,emitting smoke,or catching fire can caused.
Take appropriate measures to excess current and voltage.
・ In case of solder connecting method,there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity
caused by contact.
・ Please confirm the safety standards or regulations of application devices.
・ Please be careful with substrate edges,that may injure your hands.
⑩ Other cautions
Guarantee covers the compliance to the quality standards mentioned in the specifications,
however it does not cover the compatibility with application of the end-use,including
assembly and usage environment.
In case any quality problems ocurred in the application of end-use,details will be separately
discussed and determined between the parties hereto.
　　
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“Contentsinthistechnicaldocumentbechangedwithoutanynoticeduetotheproductmodification.” http://www.sharp-world.com/products/device/
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