IXYS
MX881 1 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881
Xenon Flash Controller & LED Torch Driver
Features:
Highly Integrated Solution that includes:
Optimized Flyback Boost Converter
Controller, IGBT Driver, 100mA LED Torch
Driver, and Transformer Drive Transistor
Small Size (3mm x 5mm DFN-16)
High Efficiency
3.0 to 5.5 Volt Battery Operation
1.65 to 5.5 Volt Digital Interface Operation
Low Shut Down Current: 0.1µA
SPI and I2C Bus Compatibility
Programmable Average Battery Current:
(50mA – 220mA)
Programmable Output Voltage: (300V - 330V)
Applications:
Camera Cell Phones, Digital Still Cameras, and
Optical Film Cameras
Ordering Information
Part No. Description Qty
MX881R 3mm X 5mm DFN-16 73
MX881RTR DFN-16 Tape & Reel 2000
General Description
The MX881 offers a highly integrated Xenon Flash
controller, providing an ideal solution for small form
factor flash and torch lighting applications. The
MX881 integrates a user programmable Controller,
IGBT Driver, 100mA LED Torch Driver, and
Transformer Drive Transistor to significantly reduce
component count, solution size, and design
complexity.
The Boost Control Logic manages the peak primary
current and off time to optimize charge time and
control average battery current.
The Charge Cycle Control starts the charge cycle on
a low to high transition of the CHARGE input. Then
detects when the output voltage has reached the
desired voltage and stops the Boost Control Logic,
while asserting the DONE output signal.
The SPI/I2C serial interface adds the flexibility of 6
programmable average battery currents and 4
programmable high voltage output levels for the
flash function.
Typical Application
T1
1:10 min.
CHARGE
VOUT
IPEAK
DONE
FLASH
VCC
+
22 uF
TRIGGER
CAPACITOR
FLASH
TUBE
MX881
CONTRO LLER / DRIVER
VHV
Boost Control
Logic
Charge
Cycle Logic
500V Total
Sw it ching
Diodes
VCC
SW
VFB
SPI / I2C
X 4
SPI / I2C
Interfa ce to
set VOUT
& IAVE
IGBTGATE
IGBT
DRIVER
GND
LED_EN
LED
Bandgap REF
ISET
VBATT
DVCC
DVCC
IXYS
IGBT
LSEC
MX881 IXYS
Boost Switch: When turned on, current flows in the primary of the flyback transformer. The energy
stored in the transformer is transferred to the secondary as high voltage when the boost switch is turned
off.
IGBT Driver: Switches the VCC supply to the IGBT gate when the FLASH signal is brought high. If
FLASH is low, the IGBT gate is driven to ground.
LED Driver: When LED_EN is high, the LED pin will sink 100mA to GND. If LED_EN is low, the LED
pin is high impedance.
Pin Description
Pin No. Pin Name Description
11 VCC Supply voltage from battery, (3.0V – 5.5V). Must be connected to VDVCC.
7 DVCC Digital supply voltage for I/O logic (1.65V-5.5V)
15 CHARGE
Low level stops the charging cycle and puts the device into power down mode.
Charge remains on the high voltage capacitor. A high level starts a charging cycle.
Charging continues until either the correct voltage is reached or CHARGE is brought
low.
6 DONE Open drain output that transitions high when the capacitor reaches the desired
voltage. This output is normally high except when charging so that standby current is
minimized. (Pull-up resistor not sourcing current).
12 VFB Feedback voltage input from voltage divider that determines when the output has
reached the desired voltage.
14 FLASH A high level will cause the IGBT to turn on firing the flash. A low level will turn the
IGBT off. FLASH can be brought low to shorten the flash pulse for red-eye reduction.
16 ISEL High level enables the I2C interface, low level enables SPI interface.
1 SCEn
Serial port chip enable. A low on this pin enables the SPI interface to receive data. If
SCEn is asserted low while in the I2C mode, the serial interface and control register
are reset.
4 SCLK Clock input for SPI and I2C interface.
2 SDATA Data input and output for SPI interface. Data input and acknowledge/data output for
I2C interface. This output is open drain for I2C output data.
3 SW Connection to internal power transistor that drives the negative terminal of the
transformer primary coil.
13 LSEC Connection to negative terminal of the transformer secondary. This input is grounded
internally through a low impedance used to sense the secondary transformer current.
9 IGBTGATE IGBT Gate driver output.
5 LED_EN A high level will cause the 100mA LED current regulator to turn on.
VF = VBATT
10 LED 100mA LED current regulator. Connect the cathode of the torch LED to this pin.
VF = VBATT
Exposed
Pad GND Ground Terminal.
8 N/C No Connect. Do not connect to any signal, ground or power source.
MX881 2 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 IXYS
Absolute Maximum Ratings
Symbol Parameter Rating Unit
VCC, DVCC DC Supply Voltage 0.3 to 7.0 V
VIN DC Input Voltage -0.3 to VCC+0.3 V
VSW Voltage On SW pad -0.3 to 55 V
TSTG Storage Temperature -40 to +150 oC
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these or any other conditions beyond
those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-
rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Symbol Parameter Rating Unit
VCC Analog and Digital Supply Voltage 3 to 5.5 V
DVCC Digital I/O Supply Voltage 1.65 to 5.5 V
VIN DC Input Voltage 0 to DVCC V
VSW Voltage On SW pad 0 to 40 V
TJJunction Temperature -20 to +115 oC
MX881 3 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 IXYS
DC Characteristics
Junction temperature range -20 to +1 15 °C
Symbol Parameter Condition Min Typ Max Unit
AVCC Supply Voltage – Analog and
voltage doubler 3 3.6 5.5 V
DVCC Supply Voltage – Digital I/O 1.65 3.3 5.5 V
ICC Supply Current (When Charging) 4 mA
ISTANDBY Supply Current (Not Charging) @ 25° C 0.1
µA
ISW_LEAK SW pin Leakage Current @ 25° C Vsw = 40V 30 nA
VT+ Schmitt trigger, positive-going
threshold (All digital inputs) 1.65V < DVCC < 2.4V
1.3
V
VT- Schmitt trigger, negative-going
threshold (All digital inputs) 1.65V < DVCC < 2.4V
0.4
V
Vhys Hysteresis, Schmitt trigger 1.65V < DVCC < 2.4V 0.15 V
VT+ Schmitt trigger, positive-going
threshold (All digital inputs) 2.4V < DVCC < 3.6V
1.6
V
VT- Schmitt trigger, negative-going
threshold (All digital inputs) 2.4V < DVCC < 3.6V
0.65
V
Vhys Hysteresis, Schmitt trigger 2.4V < DVCC < 3.6V 0.16 V
VT+ Schmitt trigger, positive-going
threshold (All digital inputs) 3.6 < DVCC <5.5V
2.1
V
VT- Schmitt trigger, negative-going
threshold (All digital inputs) 3.6V < DVCC <5.5V
0.9
V
Vhys Hysteresis, Schmitt trigger 3.6V < DVCC <5.5V 0.17 V
IIN Input Current VIN = DVCC or GND -10 10
µA
VOL Output Low Voltage 2K to DVCC 0.15 V
VOH Output High Voltage 2K to Ground DVCC-0.3 V
RSW SW Switch on resistance DVCC = 3.0V .15 .25 .50
RSW SW Switch on resistance DVCC=3.0V, @ 25°C .19 .25 .32
ILED LED drive current VLED > 0.5V 85 100 115 mA
IPEAK Primary Peak Current .7 A
OVS = 11 1.20 1.23 1.26 V
OVS = 10 1.16 1.19 1.22 V
OVS = 01 1.12 1.15 1.18 V
VTRIP Output Voltage Trip Point
OVS = 00 1.10 1.12 1.14 V
MX881 4 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 IXYS
AC Characteristics
Junction temperature range 0 to + 115°C
Symbol Parameter Condition Min Typ Max Unit
TSTART
CHARGE High to Beginning of
Charge Cycle 110
µS
TEND
CHARGE Low to End of Charge
Cycle 100 nS
TIGBT-ON FLASH High to IGBTGATE High CL = 6.8nF, 10% to
90% 100
nS
TIGBT-OFF FLASH Low to IGBTGATE Low CL = 6.8nF, 90% to
10% 100 nS
TLED-ON LED_EN High to Iout > 90mA TBD µS
TLED-OFF LED_EN Low to Iout < 1mA TBD µS
Control Register
The MX881 control register is a 5 bit register that allows the user to program the maximum output
voltage and the maximum average battery current during the charge cycle. Table1 shows how the bits in
the control register are assigned. ABC(2:0) are used to set the average battery current and OVS(1:0) are
used to set the output voltage selection reference.
Table 1 – Control Register
BIT: D4 D3 D2 D1 D0
Control: OVS1 OVS0 ABC2 ABC1 ABC0
Output Voltage Selection
The MX881 limits the high voltage placed on the external capacitor by comparing a divided down version
of the secondary flyback voltage to an internal voltage. This internal voltage is programmable to 4
discrete values to allow the user to change the flash energy. The external voltage divider ratio needed to
obtain 330V maximum output voltage should be 269 to 1. This external resistor divider network is also
used to form a low pass filter with an internal capacitor so it is important that the equivalent resistance of
the voltage divider network be 3K ohms. Table 2 shows the internal reference values used for possible
values of the capacitor charge voltage. The default value is 11.
Table 2 - Output Voltage Selection
OVS Value (Binary) Referen ce Voltage (VTRIP) Capacitor Voltage
11 1.23 330
10 1.19 320
01 1.15 310
00 1.12 300
MX881 5 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 6 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 IXYS
Average Battery Current
The 3 bits (ABC2 – ABC0) of the control register are used to program the maximum average battery
current during a charge cycle. The MX881 does this by limiting the minimum off time during a switching
cycle. The off time compensates for variation of the battery voltage so that the average current is
independent of battery voltage. The default value of ABC is 101. With the default value of ABC, the
average battery current control circuits are disabled for maximum efficiency, and the maximum battery
current is approximately 220mA. The average current versus the output voltage is shown in Figure1.
The battery current peak value is preset internally to 0.7A. This current must be averaged by placing an
external bypass capacitor from VCC to ground. A 10uF capacitor is recommended for good current
smoothing and averaging.
Figure 1 - Average Battery Current
Average Battery Current Setting of 50mA (ABC = 000)
0
10
20
30
40
50
60
0 100 200 300 400
V
mA
VCC = 3.0V
VCC = 5.5V
MX881 7 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 IXYS
Average Battery Current Setting of 100mA (ABC = 001)
0
20
40
60
80
100
120
140
0 100 200 300 400
V
mA
VCC = 3.0V
VCC = 5.5V
Average Battery Current Setting of 150mA (ABC = 010)
0
50
100
150
200
0 100 200 300 400
V
mA
VCC = 3.0V
VCC = 5.5V
MX881 8 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 IXYS
Serial Interface
The MX881 has a 4 wire serial interface that is capable of operating in two modes: I2C or SPI. Both
modes transfer 8 bits of information but only 5 bits are actually used to set the internal control register.
Table 3 - Interface Modes
ISEL Active Interface
1 Standard I2C slave only serial interface
0 Standard 3-wire SPI
I2C Bus Interface
The I2C interface (follows the standard bus protocol and timing as defined by Philips). For complete
information on this bus, refer to
www.semiconductors.philips.com
The MX881 acts as a slave device on the I2C bus and is compatible with both the HS (High Speed)
Mode and Fast Mode formats. Its primary function is as a receiver, receiving data from a master device
that is used to set a single 5 bit register that determines the average battery current and the output
voltage. It will act as a transmitter after receiving a read command. During a read, the register data will
be output onto the I2C bus. When receiving a non-broadcast message, the MX881 will respond with an
acknowledge bit, in which it pulls the data bus low at the appropriate time. Data packets begin with the
Master issuing a START command (S) and end with the Master issuing a STOP command (P). A Restart
command is simply another START command that is issued before a STOP command. Note that with
START and STOP commands that SDATA transitions while SCLK is high. Conversely, for all other bits,
SDATA is only allowed to transition while SCLK is low.
Figure 2 - I2C Sequences
SCLK
SDA TA
STA RT STOP
DA TA is stable during high period
of SCLK
TI2C -DS TI2C-DH
TI2C-CS TI2C-SC TI2C-CP TI2C-PC
S 0 1 1111 1 0
START
Slave Address
R/Wn
D
7
D
0
D
1
D
2
D
3
D
4
D
5
D
6
ACK
0
ACK
0
Data Byte - Written to control
Register
The slave address is internally
fixed to 0111111 b.
0Unshaded boxes represent bits
sourced by the master . 0Shaded boxes represent bits
sourced by the MX889.
Write Sequence
Overview
P
STOP
S 0 1 1111 1 1
START
Slave Address
R/Wn
1 0111101
ACK
0
ACK
0
Data Byte - Register contents
placed on bus by MX889
Slave address is 0111111b.
Status
Read
Sequence
P
STOP
MX881 IXYS
To write to the MX881 register, the master device will first issue a Start Bit. It will then transmit a 7-bit
address. In the MX881, the address is internally set to 0111111b. If the address in the message
corresponds to the address of the MX881, the device will issue an acknowledge. The master will send 8
bits of data. These 8 bits will be written into the control register. Another Acknowledge will follow. The
write sequence is illustrated in Figure 2.
To read the control register the master issues a read command by setting the R/Wn bit. The master will
then tri-state the data bus while the MX881 outputs data. See the example in Figure 2.
3-Wire SPI (Serial Peripheral Interface)
A standard 3-wire bi-directional serial interface is available (Figure 3). The interface signals are the serial
clock: SCLK, the serial data line: SDATA, and the serial chip enable: SCEn. SDATA is bidirectional.
In write mode, the microcontroller is writing to the MX881 control register. Each packet sent contains an
8-bit command followed by 8 bits of data to be written into the register.
When SCEn goes low, the rising edge of SCLK clocks in 8 bits, MSB first. At the end of the first
transmission byte, the MX881 determines whether the first byte is a recognized command. The MX881
only recognizes one write command “00011110”. If the command is recognized, the next byte clocked
into the MX881 will be written into the control register. This sequence is illustrated in Figure 3.
In read mode, a command is received which tells the MX881 to output the control register contents. The
MX881 only recognizes one read command: “01011110”. If the correct command is recognized, the
MX881 will output 8 bits of data beginning on the first falling edge of SCLK after the rising edge of SCLK
in which the last transmission bit was clocked in. In this manner, the first control register bit will be
available to the microcontroller on the next rising edge of SCLK. SCEn must remain low while the
MX881 is outputting data, going high after the MX881 has output the last bit. While the device is
outputting data, the microcontroller must stop driving the SDATA line so that the MX881 can drive the
data onto this bus. This sequence is also illustrated in Figure 3.
Table 4 - Serial Interface Timing
Symbol Parameter Condition Min Max Units
TCYCS Cycle Time 250 nS
THI, TLO Pulse Width 50 nS
TDS Data Setup Time 50 nS
TDH Data Hold Time 30 nS
TSS SCEn Setup Time, Write 30 nS
TSH SCEn Hold Time, Write 30 nS
TACCS Read Access Time CL = 100pF 30 nS
TOHS Read Output Disable Time CL = 100pF 30 nS
TI2C_CS I2C Clock High to Start Bit 50 nS
TI2C_SC I2C Start Bit to Clock Low 50 nS
TI2C_DS I2C Data Valid to Clock High 50 nS
TI2C_DH I2C Clock Low to Data Change 30 nS
TI2C_CP I2C Clock High to Stop Bit 50 nS
TI2C_PC I2C Stop Bit to Clock Low 50 nS
MX881 9 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 10 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 IXYS
Write Cy cle Timing
Read Cy cle
101 1110
Figure 3 – 3-WIRE SPI
0
SDATA
From
MX881
Control
Register
SCEn
SCLK
D7 D6 D5 D4 D3 D2 D1 D0
SDATA
T
RTF
SCEn
SCLK
SDATA To
MX881
Read Cy cle Timing - Detailed
THI
TLO
TCYCS
TSS
T
SH
TDS
TDH
TACCS TOHS
SCLK
SDATA
D7 D0
SCEn
0 0111 10
0
SCEn
SCLK
SDATA To
MX881
D4 D3 D2 D1 D0
D6 D5 D4 D3 D2 D1 D0
D7
Write Cy cle
.
MX881 11 7/30/07
Drawing No. 088109 www.claremicronix.com
MX881 IXYS
1
4
5
8
6
Layout Notes
7
T1
LDT565620ST-201
C1
1.0uF
C2
10uF
R2
137K, 1%
R1
133K, 1%
R3
1K, 1%
C3
22uF/350V
C4
.1uF
C4
.1uF
21
D1
BAV23S
VHVVCC
SCEn
SDATA
SCLK
LED_EN
DONE
DVCC
ISEL
CHARGE
FLASH
VCC
LED
IGBTGATE
SDATA
2
SCEn
1
SW
3
SCLK
4
LED_EN
5
DONE
6
DVCC
7
PROG
8IGBTGATE 9
LED 10
VCC 11
VFB 12
LSEC 13
FLASH 14
CHARGE 15
ISEL 16
MX881 16 PIN DFN
U1
VSEC
VFB
VPRI
C1
C2
VCC
R1
R2
R3
MX881 12 7/30/07
MX881 IXYS
Layout Notes:
Parasitic capacitance on node VSEC or VPRI will cause loss of efficiency. Keep wires on this
node as short as possible.
Parasitic inductance on the transformer connections can cause overshoot during switching that
could damage the part. Keep connections from the capacitors and MX881 to the transformer
short.
Also keep the connection from pin 2 of D1 to C3 as short as possible.
The VFB node is sensitive to coupling from T1 and the VSEC node. The VSEC node ramps to
over 300 volts in just a few nano-seconds. Keep R1, R2, and R3 as far from T1 as possible. If
possible, shield resistors by placing on the other side of the board from T1.
VCC should be well bypassed to average charge current to the battery and reduce noise to
analog circuits within MX881.
VFB is a very fast and short pulse. Keep VFB connection to R7 short to minimize capacitance on
this node. If VFB has too much capacitance, the feedback voltage may be filtered so that the
output voltage does not stop at 330V but continues to a much higher voltage.
A good ground plane is extremely important. Large pulse currents of 0.7 amps will be flowing in
the ground. The large bottom pad of the MX881 is the only ground pad and requires a low
impedance return to C1, C2, and R7.
The ground plane must have adequate clearance from high voltage nodes VHV and VSEC to
avoid arcing. Also, the node connecting R1 to R2 will be at approximately 170V.
R1 and R2 must be at least 1206 size surface mount to withstand 200V each.
Transformer
For 330V charger, the transformer should have a turns ratio of approximately 10 to insure that the fly-
back voltage on the primary side of the transformer does not damage the power switch internal to the
MX881. The fly-back voltage should be equal to the output voltage divided by the turns ratio plus the
VCC supply voltage. The fly-back voltage will be greater than this due to the energy stored in the
transformer leakage inductance. The actual voltage will depend on the transformer leakage inductance
and the parasitic capacitance of the circuits and layout.
The MX881 is designed to work with a transformer having a primary inductance of approximately 10µH.
Larger values are acceptable as long as leakage inductance is small. Smaller primary inductance values
may cause feedback pulses that are too short and lead to higher than expected output voltage.
IXYS Corporation makes no representations or warranties with respect to the accuracy or completeness of the contents of this
publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither
circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS’ Standard Terms and Conditions of Sale,
IXYS Corporation assumes no liability whatsoever, and disclaims any expressed or implied warranty, relating to its products
including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any
intellectual property right
Drawing No. 088109 www.claremicronix.com
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MX881 13 7/30/07
IXYS
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IXYS cannot assume responsibility for use of any circuitry other than circuitry
entirely embodied in this IXYS product. No circuit patent licenses nor indemnity
are expressed or implied. IXYS reserves the right to change the specification and
circuitry, without notice at any time. The products described in this document are
not intended for use in medical implantation or other direct life support
applications where malfunction may result in direct physical harm, injury or death
to a person.
Specification: MX881
©Copyright 2007, IXYS Corporation
All rights reserved. Printed in USA.
Drawing No. 088109 www.claremicronix.com