MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 Octal Buffer/Line Driver with 3-State Outputs The MC74AC540/74ACT540 and MC74AC541/74ACT541 are octal buffer/line drivers designed to be employed as memory and address drivers, clock drivers and bus oriented transmitter/receivers. The MC74AC541/74ACT541 is a noninverting option of the MC74AC540/74ACT540. These devices are similar in function to the MC74AC240/74ACT240 and MC74AC244/74ACT244 while providing flow-through architecture (inputs on opposite side from outputs). This pinout arrangement makes these devices especially useful as output ports for microprocessors, allowing ease of layout and greater PC board density. http://onsemi.com PDIP-20 N SUFFIX CASE 738 1 SOIC-20W DW SUFFIX CASE 751D Features * 3-State Outputs * Inputs and Outputs Opposite Side of Package, Allowing Easier * * * * * 1 Interface to Microprocessors Outputs Source/Sink 24 mA MC74AC540/74ACT540 Provides Inverted Outputs MC74AC541/74ACT541 Provides Noninverted Outputs ACT540 and ACT541 Have TTL Compatible Inputs Pb-Free Packages are Available TSSOP-20 DT SUFFIX CASE 948E 1 SOEIAJ-20 M SUFFIX CASE 967 1 TRUTH TABLE Inputs Outputs OE1 OE2 D L H X L L X H L H X X L 540 541 L Z Z H H Z Z L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 9 of this data sheet. H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance (c) Semiconductor Components Industries, LLC, 2006 December, 2006 - Rev. 8 1 Publication Order Number: MC74AC540/D MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 OE1 GND 1 20 VCC 2 19 OE2 3 OE1 1 20 VCC 2 19 OE2 18 3 18 4 17 4 17 5 16 5 16 6 15 6 15 7 14 7 14 8 13 8 13 9 12 9 12 10 11 10 11 GND Figure 1. MC74AC540/74ACT540 Figure 2. MC74AC541/74ACT541 MAXIMUM RATINGS Symbol Parameter Value Unit -0.5 to +7.0 V DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) VCC DC Supply Voltage (Referenced to GND) VIN VOUT -0.5 to VCC +0.5 V DC Input Current, per Pin 20 mA IOUT DC Output Sink/Source Current, per Pin 50 mA ICC DC VCC or GND Current per Output Pin 50 mA Tstg Storage Temperature -65 to +150 C IIN Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT tr, tf Parameter Min Typ Max AC 2.0 5.0 6.0 ACT 4.5 5.0 5.5 0 - VCC VCC @ 3.0 V - 150 - VCC @ 4.5 V - 40 - VCC @ 5.5 V - 25 - VCC @ 4.5 V - 10 - VCC @ 5.5 V - 8.0 - - - 140 C -40 25 85 C Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) AC Devices except Schmitt Inputs Unit V V ns/V tr, tf Input Rise and Fall Time (Note 2) ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current - High - - -24 mA IOL Output Current - Low - - 24 mA 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 ns/V MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 DC CHARACTERISTICS VIL VOH VOL 74AC TA = -40C to +85C VCC (V) Typ Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC - 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC - 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 - - - 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 - - - 0.36 0.36 0.36 0.44 0.44 0.44 Symbol VIH 74AC TA = +25C Parameter Maximum Low Level Output Voltage Guaranteed Limits Unit Conditions IOUT = -50 mA V *VIN = VIL or VIH -12 mA IOH -24 mA -24 mA IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA IIN Maximum Input Leakage Current 5.5 - 0.1 1.0 mA VI = VCC, GND IOZ Maximum 3-State Current 5.5 - 0.5 5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 - - 75 mA VOLD = 1.65 V Max 5.5 - - -75 mA VOHD = 3.85 V Min 5.5 - 8.0 80 mA VIN = VCC or GND IOLD IOHD ICC Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 3 MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 AC CHARACTERISTICS (For Figures and Waveforms - See AND8277/D at www.onsemi.com) Symbol Parameter 74AC 74AC TA = +25C CL = 50 pF TA = -40C to +85C CL = 50 pF VCC* (V) Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay Data to Output (AC540) 3.3 5.0 1.5 1.5 5.5 4.0 7.5 6.0 1.0 1.0 8.0 6.5 ns 3-5 tPHL Propagation Delay Data to Output (AC540) 3.3 5.0 1.5 1.5 5.0 4.0 7.0 5.5 1.0 1.0 7.5 6.0 ns 3-5 tPZH Output Enable Time (AC540) 3.3 5.0 3.0 2.0 8.5 6.5 11 8.5 2.5 2.0 12 9.5 ns 3-7 tPZL Output Enable Time (AC540) 3.3 5.0 2.5 2.0 7.5 6.0 10 7.5 2.0 1.5 11 8.5 ns 3-8 tPHZ Output Disable Time (AC540) 3.3 5.0 2.5 1.5 8.5 7.5 13 10.5 1.5 1.0 14 11 ns 3-7 tPLZ Output Disable Time (AC540) 3.3 5.0 2.0 1.5 7.0 6.0 10 8.0 2.0 1.5 11 9.0 ns 3-8 tPLH Propagation Delay Data to Output (AC541) 3.3 5.0 2.0 1.5 5.5 4.0 8.0 6.0 1.5 1.0 9.0 6.5 ns 3-5 tPHL Propagation Delay Data to Output (AC541) 3.3 5.0 2.0 1.5 5.5 4.0 8.0 6.0 1.5 1.0 8.5 6.5 ns 3-5 tPZH Output Enable Time (AC541) 3.3 5.0 3.0 2.0 8.0 6.0 11.5 8.5 3.0 1.5 12.5 9.5 ns 3-7 tPZL Output Enable Time (AC541) 3.3 5.0 2.5 1.5 7.0 5.5 10 7.5 2.5 1.0 11.5 8.5 ns 3-8 tPHZ Output Disable Time (AC541) 3.3 5.0 3.5 2.0 9.0 7.0 12.5 9.5 2.5 1.0 14 10.5 ns 3-7 tPLZ Output Disable Time (AC541) 3.3 5.0 2.5 2.0 6.5 5.5 9.5 7.5 2.0 1.0 10.5 8.5 ns 3-8 *Voltage Range 3.3 V is 3.3 V 0.3 V. Voltage Range 5.0 V is 5.0 V 0.5 V. http://onsemi.com 4 MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 DC CHARACTERISTICS 74ACT Symbol Parameter 74ACT TA = +25C VCC (V) Typ TA = -40C to +85C Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC - 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC - 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 - - 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 - - 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA Maximum Input Leakage Current 5.5 - 0.1 1.0 mA VI = VCC, GND Additional Max. ICC/Input 5.5 0.6 - 1.5 mA VI = VCC - 2.1 V Maximum 3-State Current 5.5 - 0.5 5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 - - 75 mA VOLD = 1.65 V Max 5.5 - - -75 mA VOHD = 3.85 V Min 5.5 - 8.0 80 mA VIN = VCC or GND VOL IIN DICCT IOZ IOLD IOHD ICC Maximum Low Level Output Voltage Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 5 V V IOUT = -50 mA *VIN = VIL or VIH IOH -24 mA -24 mA IOUT = 50 mA MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 AC CHARACTERISTICS (For Figures and Waveforms - See AND8277/D at www.onsemi.com) Symbol Parameter VCC* (V) 74ACT 74ACT TA = +25C CL = 50 pF TA = -40C to +85C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay Data to Output (ACT540) 5.0 1.0 - 7.0 1.0 7.5 ns 3-5 tPHL Propagation Delay Data to Output (ACT540) 5.0 1.0 - 8.0 1.0 8.5 ns 3-5 tPZH Output Enable Time (ACT540) 5.0 1.0 - 10.5 1.0 11.5 ns 3-7 tPZL Output Enable Time (ACT540) 5.0 1.0 - 9.5 1.0 10.5 ns 3-8 tPHZ Output Disable Time (ACT540) 5.0 1.0 - 12.0 1.0 12.5 ns 3-7 tPLZ Output Disable Time (ACT540) 5.0 1.5 - 9.0 1.0 10 ns 3-8 tPLH Propagation Delay Data to Output (ACT541) 5.0 1.5 - 7.5 1.0 8.0 ns 3-5 tPHL Propagation Delay Data to Output (ACT541) 5.0 1.5 - 7.5 1.0 8.0 ns 3-5 tPZH Output Enable Time (ACT541) 5.0 2.0 - 10.0 1.0 11.0 ns 3-7 tPZL Output Enable Time (ACT541) 5.0 1.5 - 9.5 1.0 10.5 ns 3-8 tPHZ Output Disable Time (ACT541) 5.0 2.0 - 11.0 1.0 12.0 ns 3-7 tPLZ Output Disable Time (ACT541) 5.0 2.0 - 9.0 1.0 10 ns 3-8 *Voltage Range 5.0 V is 5.0 V 0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 30 pF VCC = 5.0 V http://onsemi.com 6 MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 ORDERING INFORMATION Device Package MC74AC540N PDIP-20 MC74AC540NG PDIP-20 (Pb-Free) MC74ACT540N PDIP-20 MC74ACT540NG PDIP-20 (Pb-Free) MC74AC540DW SOIC-20 MC74AC540DWG SOIC-20 (Pb-Free) MC74AC540DWR2 SOIC-20 MC74AC540DWR2G SOIC-20 (Pb-Free) MC74ACT540DW SOIC-20 MC74ACT540DWG SOIC-20 (Pb-Free) MC74ACT540DWR2 SOIC-20 MC74ACT540DWR2G SOIC-20 (Pb-Free) MC74ACT540DTR2 TSSOP-20* MC74ACT540DTR2G TSSOP-20* MC74ACT540MEL SOEIAJ-20 MC74ACT540MELG SOEIAJ-20 (Pb-Free) MC74AC541N PDIP-20 MC74AC541NG PDIP-20 (Pb-Free) MC74ACT541N PDIP-20 MC74ACT541NG PDIP-20 (Pb-Free) MC74AC541DW SOIC-20 MC74AC541DWG SOIC-20 (Pb-Free) MC74AC541DWR2 SOIC-20 MC74AC541DWR2G SOIC-20 (Pb-Free) MC74ACT541DW SOIC-20 MC74ACT541DWG SOIC-20 (Pb-Free) MC74ACT541DWR2 SOIC-20 MC74ACT541DWR2G SOIC-20 (Pb-Free) Shipping 18 Units / Rail 38 Units / Rail 1000 / Tape & Reel 38 Units / Rail 1000 / Tape & Reel 2500 / Tape & Reel 2000 / Tape & Reel 18 Units / Rail 38 Units / Rail 1000 / Tape & Reel 38 Units / Rail 1000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb-Free. http://onsemi.com 7 MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 ORDERING INFORMATION (continued) Device Package MC74AC541DTR2 TSSOP-20* MC74AC541DTR2G TSSOP-20* MC74ACT541DT TSSOP-20* MC74ACT541DTG TSSOP-20* MC74ACT541DTR2 TSSOP-20* MC74ACT541DTR2G TSSOP-20* MC74AC541M SOEIAJ-20 MC74AC541MG SOEIAJ-20 (Pb-Free) MC74AC541MEL SOEIAJ-20 MC74AC541MELG SOEIAJ-20 (Pb-Free) MC74ACT541M SOEIAJ-20 MC74ACT541MG SOEIAJ-20 (Pb-Free) MC74ACT541MEL SOEIAJ-20 MC74ACT541MELG SOEIAJ-20 (Pb-Free) Shipping 2500 / Tape & Reel 75 Units / Rail 2500 / Tape & Reel 40 Units / Rail 2000 / Tape & Reel 40 Units / Rail 2000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb-Free. http://onsemi.com 8 MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 MARKING DIAGRAMS PDIP-20 SOIC-20W TSSOP-20 20 20 20 20 AC 54x ALYWG G AC54x AWLYYWWG MC74AC54xN AWLYYWWG SOEIAJ-20 1 74AC54x AWLYWWG 1 1 1 20 20 20 20 ACT 54x ALYWG G ACT54x AWLYYWWG MC74ACT54xN AWLYYWWG 1 1 1 x = 0 or 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) http://onsemi.com 9 74ACT54x AWLYWWG 1 MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 PACKAGE DIMENSIONS PDIP-20 N SUFFIX PLASTIC DIP PACKAGE CASE 738-03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. -A- 20 11 1 10 B L C -T- K SEATING PLANE M N E G F J D 20 PL 0.25 (0.010) 20 PL 0.25 (0.010) M T A M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 M SOIC-20W DW SUFFIX CASE 751D-05 ISSUE G 20 11 X 45 _ h 1 10 20X B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q A B M D 18X e A1 SEATING PLANE C T http://onsemi.com 10 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 PACKAGE DIMENSIONS TSSOP-20 DT SUFFIX CASE 948E-02 ISSUE C 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V K K1 IIII IIII IIII S J J1 11 B L SECTION N-N -U- PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A -V- N F DETAIL E C G D H DETAIL E 0.100 (0.004) -T- SEATING NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 C --- 1.20 --- 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC -W- H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MC74AC540, MC74ACT540, MC74AC541, MC74ACT541 PACKAGE DIMENSIONS SOEIAJ-20 M SUFFIX CASE 967-01 ISSUE A 20 LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D VIEW P e A c DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.81 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.032 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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