0603ESDA2-TR2 - BUSSMANN BY EATON

Applications

• Computers and peripherals • HDTV Equipment

• Blu-Ray/DVD players • A/V Equipment

• Satellite and HD radio • Cell phones

• PDAs • Digital still cameras

• Digital camcorders • MP3 / Multimedia players

• Set top Boxes • External storage

• DSL Modems • GPS

• High speed data ports

- USB 2.0/3.0 - IEEE 1394

- High speed ethernet - DVI

- Infiniband®- HDMI

Part Numbering System: 0603 ESDA 2TR2

Package size

Product family

Second generation designator

Packaging code

Packaging

• 5000 pieces in paper tape on 7 inch diameter (178mm) reel per

EIA Standard 481.

Packaging Code

0603ESDA2-TR2 ESD Suppressor

PolySurg™Series

0612 BU-SB12433 Page 1 of 2 Data Sheet 4419

Surface Mount Device

Description

The second generation PolySurg™ 0603ESDA2-TR2 ESD Suppressors

protect valuable high-speed data circuits from ESD damage without distorting

data signals as a result of its ultra-low (0.15pF maximum) capacitance.

Features

• Lead free, halogen free materials

• 0603/1608 footprint surface mount device

• Ideal ESD protection for high frequency, low voltage applications

• Exceeds testing requirements of IEC 61000-4-2

• Ultra low capacitance (0.15pF maximum)

• Very low leakage current

• Fast response time

• Bi-directional

Specifications

Performance Characteristics Units Min Typ Max

Continuous Operating Voltage Vdc - - 14 30

Clamping Voltage1V- -3560

Trigger Voltage2V - - 350 - -

ESD Threat Voltage Capability kv - - 8 15

Capacitance (@ 1MHz) pF - - 0.10 0.15

Leakage Current (@ 12Vdc) nA - - <0.1 100

Peak Current A - - 30 Typ. 45

Operating Temperature °C -55 +25 +105

ESD Pulse Withstand # Pulses 20 >500 - -

1. Per IEC 61000-4-2, 30A @ 8kV, Level 4, contact discharge, measurement made 30ns

after initiation of pulse.

2. Trigger measurement made using Transmission Line Pulse (TLP) method.

Device Marking

PolySurg™ ESD Suppressors are marked on the tape and reel packages, not

individually. Since the product is bi-directional and symmetrical, no orientation

marking is required.

Design Consideration

The location in the circuit for the 0603ESDA2-TR2 Series has to be carefully

determined. For better performance, the device should be placed as close to

the signal input as possible and ahead of any other component. Due to the

high current associated with an ESD event, it is recommended to use a

“0-stub” pad design (pad directly on the signal/data line and second pad

directly on common ground).

Processing Recommendations

The 0603ESDA2-TR2 Series currently has a convex profile on the top surface

of the part. This profile is a result of the construction of the device. They can

be processed using standard pick-and-place equipment. The placement and

processing techniques for these devices are similar to those used for chip

resistors and chip capacitors.

HALOGEN

FREE

Package Code Suffix Description

-TR2 5000 pieces in paper tape on 7 inch diameter

(178mm) reel per EIA Standard 481

EIA Size L W H T

0603ESDA 1.60±0.15 0.80±0.10 0.60±0.10 0.31±0.21

(0.063±0.006) (0.031±0.004) (0.024±0.004) (0.012±0.008)

www.cooperbussmann.com

0612 BU-SB12433 Page 2 of 2 Data Sheet 4419

The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is

intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change

design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-

tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.

Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-

port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result

in significant injury to the user.

Tc -5°C

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Preheat Area

Tsmax

Tsmin

Temperature

Time

Time 25°C to Peak

Supplier Tp>Tc

Supplier tp

User Tp< T c

User tp

Tc-5°C

Soldering Recommendations

• Compatible with lead and lead-free solder reflow processes

• Peak temperatures and durations:

- IR Reflow = 260°C max for 30 sec. max. Capable of 3X reflow.

- Wave Solder = 260°C max. for 10 sec. max.

- Hand Soldering = 350°C max. for 5 sec. max.

Recommended IR Reflow Profile

Tape and Reel Specifications - mm (in)

1.0 max

(0.039 max)

1.1 ref

(0.043 ref)

0.60 min

(0.023 min)

(per IPC-SM-782 )

Recommended Pad Layout - in (mm)

Environmental Specifications:

• Coating bond strength: ASTM D3359-83, Method A, Section 6.

Note: the device coating is not scored.

• Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H2O,

detergent solution, defluxer).

• Humidity(steady state): MIL-STD-883, method 1004.7, 85% RH, 85°C,

240 hrs.

• Thermal shock: MIL-STD-202F, method 107G, -65°C to 125°C, 30

min, 5 cycles.

• Vibration: MIL-STD-202F,method 201A,(10 to 55 to 10Hz, 1 minute

cycle, 2 hrs. each in X-Y-Z axis).

• Solder leach resistance and terminal adhesion per EIA-567.

• Solderability per MIL-STD-202, Method 208 (95% coverage).

• Full load voltage: 14.4Vdc, 1000hrs., 25°C.

• Operating temperature characteristics: Electrical testing at

+105°C and -55°C.

Dimensions - mm (in)

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Preheat & Soak

Temperature min (Tsmin) 100°C 150°C

Temperature max (Tsmax) 150°C 200°C

Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds

Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max.

Liquidous temperature (TL) 183°C 217°C

Time at liquidous (tL) 60-150 seconds 60-150 seconds

Peak package body temperature (Tp)* See classification temp See classification temp

in Table 4.1 in Table 4.2

Time (tp)** within 5°C of the specified 20** seconds 30** seconds

classification temperature (Tc)

Average ramp-down rate (Tpto Tsmax) 6°C/second max. 6°C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.