PDM31096
2 Rev. 2.4 - 5/27/98
PRELIMINARY
T ruth Table(1)
NOTE: 1. H = VIH, L = VIL, X = DON’T CARE
OE WE CE I/O MODE
X X H Hi-Z Standby
X X X Hi-Z Standby
LHLD
OUT Read
XLLD
IN Write
H H L Hi-Z Output Disable
Pin Description
Name Description
A18-A0 Address Inputs
I/O7-I/O0 Data Inputs/Outputs
OE Output Enable Input
WE Write Enable Input
CE Chip Enable Inputs
NC No Connect
VCC Power (+3.3V)
VSS Ground
1
2
3
4
5
6
7
8
9
10
11
12
15
16
17
18
23
24
25
26
27
28
A4
A3
A2
A1
A0
CE
I/O0
I/O1
Vcc
Vss
I/O2
I/O3
WE
A18
A17
A16
A15
A14
NC
A5
A6
A7
A8
OE
I/O7
I/O6
Vss
Vcc
I/O5
I/O4
A9
A10
A11
A12
A13
NC
13
14
29
30
31
36
32
33
34
35
19
20
21
22
1
2
3
4
5
6
7
8
9
10
11
12
15
16 29
30
31
32
NC
NC
A4
A3
A2
A1
A0
CE
I/OO
I/O1
Vcc
Vss
I/O2
I/O3
WE
A18
A17
A16
A15
A14
NC
NC
NC
NC
NC
A5
A6
A7
A8
OE
I/O7
I/O6
Vss
Vcc
I/O5
I/O4
A9
A10
A11
A12
A13
NC
NC
NC
13
14
33
34
35
36
37
38
39
40
41
42
43
44
19
20
21
22
17
18
23
24
25
26
27
28
SOJ
TSOP (II)
Absolute Maximum Ratings
(1)
NO TE:1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS ma y cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. Appropriate thermal calculations should be performed in all cases and specifically for
those where the chosen package has a large thermal resistance (e.g., TSOP). The cal-
culation should be of the form: T
j
= T
a
+ P *
θ
ja
where T
a
is the ambient temperature, P
is average operating power and
θ
ja
the thermal resistance of the package. For this
product, use the following
θ
ja
value:
SOJ: 59
o
C/W
TSOP : TBD
Symbol Rating Com’l. Ind. Unit
V
TERM
Terminal Voltage with Respect to V
SS
–0.5 to +4.6 –0.5 to +4.6 V
T
BIAS
Temperature Under Bias –55 to +125 –65 to +135
°
C
T
STG
Storage Temperature –55 to +125 –65 to +150
°
C
P
T
Power Dissipation 1.0 1.0 W
I
OUT
DC Output Current 50 50 mA
T
j
Maximum Junction Temperature
(2)
125 145
°
C
Pin Configuration