SPHCWTHDNC45YHRT2F - SAMSUNG

http://www.samsungled.com 1/19

Rev : 003

Introduction

Features

· 26W COB LED : 31.00 x 21.00 x 1.4 (mm)

·InGaN/GaN MQW LED with long-time reliability

·Lead (Pd) free product -RoHS compliant

Applications

·Spot /Down light

·LED Retrofit Bulbs

·Outdoor illumination

·Other applications

Product Family Data Sheet

LC196A

-COB(Chip On Board) LED

SAMSUNG ELECTRONICS

95, Samsung2-Ro, Giheung-Gu,

Yongin

City, Gyeonggi

Do 446

711, KOREA

change without notice. SAMSUNG, is aregistered trademark of SAMSUNG ELECTRONICS.

http://www.samsungled.com 2/19

Contents

1. Absolute Maximum Rating ----------------- 3

2. Characteristics ----------------- 3

3. Binning Structure ----------------- 5

4. Chromaticity Coordinates ----------------- 6

5. Typical Characteristics Graph ----------------- 7

6. Outline Drawing &Dimension ----------------- 10

7. Reliability Test Items and Conditions ----------------- 11

8. Label Structure ----------------- 12

9. Lot Number ----------------- 13

10. Tray Dimension ----------------- 14

11. Aluminum Bag Dimension ----------------- 14

12. Box &Pad Dimension ----------------- 15

13. Packing Structure ----------------- 16

14. Precaution for use ----------------- 18

15. Revision History ----------------- 19

http://www.samsungled.com 3/19

1. Absolute Maximum Rating

1) Operation Forward Current (T

= 25°C) ........................................................ 840 mA

2) Flash Mode Peak Pulsed Forward Current .................................................. 880 mA

(Pulse width t

≤

10msec, Duty ratio=0.06, T

=25°C)

3) Thermal Resistance ( R

th,j-c

) ......................................................................... 1.3 °C/W

4) LED Junction Temperature ( T

) ..................................................................... 150 °C

5) Operating Temperature Range ( T

opr

) ............................................... -40°C

∼

85 °C

6) Storage Temperature Range ( T

stg

) ................................................ -40°C

∼

120 °C

2. Characteristics

1) Electro-Optical characteristics (T

: 25°C)

Item Unit Condition Rank Min Typ Max

Luminous Flux

lm I

= 720 mA

3000K 2F

20 1920 - 2020

21 2020 - 2120

22 2120 - -

5000K 2F

22 2120 - 2220

23 2220 - 2320

24 2320 - -

Forward Voltage V

= 720 mA YH 34 36.9 38.5

CRI I

= 720 mA - 80 - -

View Angle

° I

= 720 mA - - 115° -

Note :

1) Samsung LED tested in pulsed condition. T

=25°C, pulse width is 10ms at rated test current.

2) Samsung LED has ±10% tolerance of flux measurements.

3) Samsung LED has ±5% tolerance of forward voltage measurements.

4) Samsung LED has ±5% tolerance of CCT measurements.

5) Samsung LED tested in DC=720mA after Iuminous flux is saturated.

6) Samsung LED has ±0.15 mm tolerance on device dimensions.

http://www.samsungled.com 4/19

2) Current Sweep Characteristics

(mA)

Vf (V)

CCT

Flux (Lm) Lm/W CRI

Typ Typ Typ Min

120 32.66

3000K 371 95

5000K 407 104

240 33.72

3000K 736 91

5000K 808 100

360 34.61

3000K 1086 87

5000K 1192 96

480 35.42

3000K 1417 83

5000K 1556 92

600 36.17

3000K 1740 80

5000K 1909 88

720 36.90

3000K 2050 77

5000K 2250 85

840 37.61

3000K 2355 75

5000K 2585 82

Note :

1) These values on the table are for reference only.

http://www.samsungled.com 5/19

3. Binning Structure

(Condition : I

= 720 mA, T

: 25°C)

1) Color Binning

CCT Product Code Color Rank Chromaticity Bins

3000K

SPHWWTHDNC45YHVT2F VT

(Whole Bin)

VB, VC, VD, VE,

VF, VG, VH

SPHWWTHDNC45YHVU2F VU

(Half Bin) VB, VC, VD

SPHWWTHDNC45YHVP2F VP

(Quarter Bin) VB

5000K SPHCWTHDNC45YHRT2F RT

(Whole Bin) RW, RX, RY, RZ

2) Luminous Flux Binning

CCT Product Code Flux

Rank

Flux

Bin

Range (lm)

Min Typ Max

3000K

SPHWWTHDNC45YHVT2F

SPHWWTHDNC45YHVU2F

SPHWWTHDNC45YHVP2F

20 1920 - 2020

21 2020 - 2120

22 2120 - -

5000K SPHCWTHDNC45YHRT2F 2F

22 2120 - 2220

23 2220 - 2320

24 2320 - -

http://www.samsungled.com 6/19

4. Chromaticity Coordinates

(Condition : I

= 720 mA, T

: 25°C)

1) 3000K

Table CIE XCIE YTable CIE XCIE Y

0.4451 0.4146

0.4562 0.4260

0.4324 0.4100 0.4431 0.4213

0.4244 0.3922 0.4388 0.4122

0.4361 0.3964 0.4515 0.4168

0.4324 0.4100

0.4303 0.3944

0.4261 0.4077 0.4185 0.3902

0.4185 0.3902 0.4147 0.3814

0.4244 0.3922 0.4260 0.3854

0.4515 0.4168

0.4420 0.3985

0.4451 0.4146 0.4303 0.3944

0.4361 0.3964 0.4260 0.3854

0.4420 0.3985 0.4373 0.3893

0.4431 0.4213

0.4299 0.4165

0.4261 0.4077

0.4388 0.4122

2) 5000K

Table CIE XCIE Y

0.3376 0.3616

0.3463 0.3687

0.3451 0.3554

0.3371 0.3490

0.3451 0.3554

0.3440 0.3428

0.3366 0.3369

0.3463 0.3687

0.3551 0.3760

0.3533 0.3620

0.3451 0.3554

0.3533 0.3620

0.3515 0.3487

0.3440 0.3428

Note :

1) The Chromaticity Coordinates refers to ANSI C78.377-2008

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5. Typical Characteristics Graph

*These graphs show typical values. (Ta : 25°C)

Forward Current vs. Relative Luminous Flux Forward Current vs. Forward Voltage

Forward current vs. Chromaticity Coordination Temperature vs. Chromaticity Coordination

http://www.samsungled.com 8/19

Temperature vs. Voltage Temperature vs. Relative Luminous Flux

Radiation Pattern

http://www.samsungled.com 9/19

Relative Spectral Emission

<3000K> <5000K>

Derating Curve

http://www.samsungled.com 10/19

6. Outline Drawing &Dimension

unit :mm

Tolerance : ± 0.15

http://www.samsungled.com 11/19

7. Reliability Test Items and Conditions

1) Test Items

Test ItemsTest Conditions Test

Hours/Cycles

MSL test

125°C 24h drying

→

MSL 2a(Sunnix5) 60°C, 60%RH 120h(drying after 2h)

→

260°C 10sec 3time(each Cycle

Room Temperature cooling, MSL after 15min during 4h)

1time

Room Temperature life

test

25°C, I

=Max

1,000 h

High Temperature humidity

life test

85°C, 85% RH, DC Derating I

=Max

1,000 h

High Temperature life test

85°C, DC Derating I

=Max

1,000 h

Low Temperature life test

-40°C, DC 840 mA

1,000 h

High Temperature Storage

120°C

1,000 h

Low Temperature Storage

-40°C

1,000 h

Thermal Shock

-45°C/15min

→

125°C/15min

Temperature changes in 5min.

200 cycles

Temperature Cycle

On/Off test

-40 / 85°C, each 20min, 100min transfer

Power On/off each 5min, DC 720 mA

100 cycles

Temperature humidity

Cycle Storage

-10°C

↔

25°C, 95%RH

↔

85°C, 95%RH [24h/1Cycle]

100 cycles

ESD(HBM)

R1 : 10

㏁

,R2 : 1.5

㏀

, C : 100

㎊

5times

(± 5

㎸

)

ESD(MM)

R1 : 10

㏁

,R2 : 0

㏀

, C : 200

㎊

5times

(± 0.5

㎸

)

Vibration

20~80

㎐

(Displacement:0.06inch, Max 20G)

80~2

㎑

(Max 20G)

Min. Frequency

↔

Max. Frequency 4min transfer

4times

Shock

1500G, 0.5ms, Every 6faces (3axis X 2faces)

5times

Salt Spray

35°C, salt water 5% 8h spray

→

16h leaving alone

2cycles

2) Criteria for Failure

* U.S.L. : Upper Standard Level L.S.L. : Lower Standard Level

Item Symbol Test Condition

= 25°C]

Limit

Min.Max.

Forward Voltage V

720 mA L.S.L. × 0.9 U.S.L. × 1.1

Luminous flux lm 720 mA L.S.L. × 0.7 U.S.L. × 1.3

http://www.samsungled.com 12/19

8. Label Structure

*Bag &Inner box *Box

[Box Label]

N.B) Denoted rank is the only example.

Rank Code

ⓐⓑ

:Forward Voltage (V

)Rank (refer to page. 3)

ⓒⓓ

:Chromaticity Coordinate Rank (refer to page. 5)

ⓔⓕ

:Luminous Flux (Φ

)Rank (refer to page. 3)

SPHCWTHDNC45YHRT2F YHRT2F 01

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▲▲▲

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▲▲▲

/XXX PCS

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Rank

Code

Rank

Code

YHRT2F

Lot

number

Tray

number

/Q'ty

http://www.samsungled.com 13/19

9. Lot Number

The Lot number is composed of the following characters

●◎◇◆□■△△△

/ I

▲▲▲

/xxx PCS

●

:Production Site (S:SAMSUNG ELECTRONICS, G:Gosin China,A:Aprosystems)

◎

: L (LED)

◇

:Product State (A:Normality, B: Bulk, C:First Production, R:reproduction, S:Sample)

◆

:Year (S:2008, T:2009, U:2010, V:2011...)

□

:Month (1 ~ 9, A~C)

■

:Day (1 ~ 9, A, B ~ V)

△

: SAMSUNG LED Product number (1 ~ 999)

▲

:Tray Number (1 ~ 999)

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10. Tray Dimension

11. Aluminum Bag Dimension

Silica gel &Humidity Indicator Card in Aluminum Bag

http://www.samsungled.com 15/19

12. Box &Pad Dimension

1) Out BOX

2) Inner BOX

3) Pe-foam PAD

http://www.samsungled.com 16/19

13. Packing Structure

1-1). Tray Packing (When 5Trays)

Max Amount(pcs)

Tray Al Bag Box

40 200 800

http://www.samsungled.com 17/19

1-2). Tray Packing (When Less than 5Trays)

EX) Module tray 2pcs :Pe-foam(10t) * 3pcs

Module tray 3pcs :Pe-foam(10t) * 2pcs

Module tray 4pcs :Pe-foam(10t) * 1pcs

http://www.samsungled.com 18/19

14. Precaution for use

1) Shelf life in sealed bag : 12 months at < 40

Cand < 90% relative humidity(RH)

2) Peak package body temperature : 240

3) After this bag is opened, devices that will be subjected to reflow solder

or other high temperature processes must be :

a. Mounted within 672 hours at factory conditions of equal to or

less than 30

C / 60% RH, or

b. Stored at < 10% RH

4) Devices require bake, before mounting, if :

a. Humidity Indicator Card is > 65% when read at 23 ± 5

C, or

b. 2a is not met.

5) If baking is required, devices must be baked for 1hours at 60 ± 5

Note :If device containers cannot be subjected to high temperature or

shorter bake times are desired, reference IPC /JEDEC J-STD-033

for bake procedure.

6) TheLEDs are sensitive to the static electricity and surge current.

It is recommended to use awrist band or anti-electrostatic glove when handling

the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs,

it may cause damage or even destruction to LED devices.

Damaged LEDs may show some unusual characteristics such as increase in

leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low

current.

7) Please do not following behavior in resin area.

(Handling, Pressing, Touching, Rubbing, Contacting tweezers, Cleaning)

But it's ok in handling area.

http://www.samsungled.com 19/19

Date Revision History Writer

Drawn Approved

2012.02.16 New Version SH.JUNG HG KIM

2012.03.29 1st Version SH.JUNG HK.KIM

2012.11.22 2nd Version HH.KIM HK.KIM

Revision History