05/2008
AWT6273
HELP3TM Cellular/WCDMA 3.4 V/29 dBm
Linear Power Amplier Module
Data Sheet - Rev 2.1
M20 Package
10 Pin 4 mm x 4 mm x 1 mm
Surface Mount Module
Figure 1: Block Diagram
FEATURES
• InGaP HBT Technology
• High Efciency:
43 % @ POUT = +29 dBm
20 % @ POUT = +16 dBm
8 % @ POUT = +8 dBm
• Low Quiescent Current: 7 mA
• Low Leakage Current in Shutdown Mode: <1 µA
• Internal Voltage Regulator Eliminates the
Need for External Reference Voltage (No VREF
Required)
• Optimized for a 50 Ω System
• Low Prole Miniature Surface Mount Package
• RoHS Compliant Package, 250 oC MSL-3
• HSDPA Compliant (no backoff)
APPLICATIONS
• Dual Band WCDMA Wireless Handsets
• Dual Mode 3GPP Wireless Handsets
PRODUCT DESCRIPTION
The AWT6273 HELP3TM PA is the 3rd generation
WCDMA product for UMTS handsets. This PA
incorporates ANADIGICS’ HELP3TM technology to
provide low power consumption without the need for an
external voltage regulator. The device is manufactured
on an advanced InGaP HBT MMIC technology offering
state-of-the-art reliability, temperature stability, and
ruggedness. There are three selectable bias modes
that optimize efciency for different output power
levels, and a shutdown mode with low leakage
current, increase handset talk and standby time. The
self-contained 4 mm x 4 mm x 1 mm surface mount
package incorporates matching networks optimized for
output power, efciency, and linearity in a 50 Ω system.
Bias Control
Voltage Regulation
VBATT
VENABLE
RFIN
RFOU
GND
VMODE1
1
7
5
8
10
6
GND at slug (pad)
3
9
4
2
VCC
GND
GND
VMODE2