Dual Channel 500mA Regulator + Reset IC
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
APL5525/5526
Low Quiescent Current : 130µA (No load)
Low Dropout Voltage :
VDROP1=550mV@500mA
VDROP2=630mV@500mA
Fixed Output Voltage :
VOUT1=3.3V/500mA
VOUT2=2.5V/500mA
Stable with 4.7µF Output Capacitor
Stable with Aluminum, Tantalum or Ceramic
Capacitors
Reverse Current Protection
No Protection Diodes Needed
Built in Thermal Protection
Fast Transient Response
Short Setting Time
SOP-8, SOP-8-P with Thermal Pad Packages
Adjustment-free Reset Detection Voltage :
3.9V or 4.2V typ
Easy to Set Delay Time from Voltage
Detection to Reset Release
Features General Description
The APL5525/6 is a dual-channel regulator with reset
function (specific voltage monitoring), and internal
delay circuit, set to detect 3.9V or 4.2V. Maximum
input voltage is 6V, output1 and output2 deliver up to
500mA. VOUT1 typical dropout voltage is 550mV at
500mA loading and VOUT2 typical dropout voltage is
630mV at 500mA loading. Design with an internal P-
channel MOSFET pass transistor, the APL5525/6
maintains a low supply current. Other features include,
thermal-shutdown protection, current limit protection
to ensure specified output current. The APL5525/6
come in miniature SOP-8 and SOP-8-P packages.
Applications
CD-ROM drive.
Pinouts
RESET GND
1
2
3
8
6
4
7
5
CONT
VIN
VDET
Cd
VOUT1
VOUT2
RESET GND
1
2
3
8
6
4
7
5
CONT
VIN
VDET
Cd
VOUT1
VOUT2
SOP-8 Top View
RESET GND
1
2
3
8
6
4
7
5
CONT
VIN
VDET
Cd
VOUT1
VOUT2
SOP-8-P Top View
APL5525 APL5526
= Thermal Pad
(connected to GND plane for better heat
dissipation)
RESET GND
1
2
3
8
6
4
7
5
CONT
VIN
VDET
Cd
VOUT1
VOUT2
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw2
APL5525/5526
Pin Description
PIN
No. Name I/O Description
1 Cd
Delay time capacitor pin, RESET pin output delay time can be set by
the capacitor connected to the Cd pin. tPLH = 130000C, tPLH :
transmission delay time (s), C:capacitor value (F)
RESET O Input voltage detection output pin , low = VDET<VS , high = VDET>VS
2 RESET O Input voltage detection output pin , high = VDET<VS , low = VDET>VS
3 VDET I Input pin of voltage detection.
4 VIN I Voltage supply input pin.
5 VOUT1 O Regulator output pin.
6 VOUT2 O Regulator output pin.
7 GND GND pin
8 CONT I VOUT1 on/off-control pin, VOUT1 will be turn off when CONT pull to low.
Symbol Parameter Rating Unit
VIN, V OUT Input Voltage or O ut Voltage 6.5 V
CONT VOUT1 Shutdown Control Pin 6.5 V
VDET RESET Pin Supply Voltage 6.5 V
RTH,JA T hermal R esistance – Junction to A m bient
SOP-8
SOP-8-P
160
80 °C/W
PD Pow er D issipation Internally Lim ited W
TJ O perating Junction Temperature
Control Section 0 to 125 °C
Power Transistor 0 to 150
TSTG Storage Tem perature Range -65 to +150 °C
TL Lead Temperature (Soldering, 10 second) 260 °C
Absolute Maximum Ratings
Package Code
K : SOP-8 KA : SOP-8-P
Temp. Range
C : 0 to 70 C
Ha ndling Co de
TR : Tape & R eel
D e te c tio n V o lta g e :
A : 3. 9V B : 4.2 V
Lead Free C ode
L : Lead Free Device
B la nk : O rigin a l De v ice
APL5525/6 -
APL5525/6X
XXXXX
APL5525/6 K / KA : X - Detec tion V o ltage
XXXXX - Date Code
Ha ndling Co de
Lead Free C ode
Temp. Range
Package Code
D e te c tio n V o lta g e
Ordering and Marking Information
°
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw3
APL5525/5526
APL5525/6
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VIN Input Voltage 6 V
Quiescent Current IOUT1 =0mA, IOUT2 =0mA 130 µA
IQ Shutdown Supply
Current CONT = low
IOUT2=0mA, VIN =6.0V 100 µA
ICONT Shutdown Input Bias
current VCONT =VIN 0.1 µA
High Threshold Voltage 1.6 VIN+0.3
VCONT Low Threshold Voltage -0.3 0.4 V
ICCQ VDET Input Current VDET =5V 20 40 µA
Regulator1
VOUT1 Output Voltage VIN=5V 3.234 3.3 3.366 V
ILIMIT Circuit Current Limit VIN=5V
950 mA
IOUT Load Current 500 mA
REGLINE Line Regulation VOUT+0.5V< VIN<6.0V, IOUT=10mA 4 6 mV
REGLOAD Load Regulation VIN =5V, 0mA< IOUT < IMAX 25 60 mV
VDROP Dropout Voltage(Note)
(VOUT(Nominal)=3.3V
Version) IOUT =500mA 550 650 mV
PSRR Ripple Rejection F1kHz, 1Vpp at IOUT=50mA 45 50 dB
Over Temperature
Shutdown 150 °C
OTS Over Temperature
Shutdown Hysteresis Hysteresis 10 °C
TC Output Voltage
Temperature
Coefficient Ta= -20 ~ 80°c 100 ppm/°C
Output Capacitor 4.7 µF
COUT ESR 0.01 1 Ohm
Regulator2
VOUT2 Output Voltage VIN=5V 2.45 2.5 2.55 V
ILIMIT Circuit Current Limit VIN=5V
950 mA
IOUT Load Current 500 mA
Unless otherwise noted these specifications apply over full temperature , VIN=5V, CIN=1µF,COUT1=4.7µF,
COUT2=4.7µF, CONT=VIN, TJ=0 to 125°C . Typical values refer to TJ=25°C .
Electrical Characteristics
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw4
APL5525/5526
Electrical Characteristics (Cont.)
APL5525/6
Symbol Parameter Test Conditions Min. Typ. Max. Unit
REGLINE Line Regulation VOUT+0.5V< VIN<6.0V, IOUT=10mA 4 6 mV
REGLOAD Load Regulation VIN =5V, 0mA< IOUT < IMAX 30 50 mV
VDROP Dropout Voltage(Note)
(VOUT(Nominal)=2.5V
Version) IOUT =500mA 630 750 mV
PSRR Ripple Rejection F1kHz, 1Vpp at IOUT=50mA 45 52 dB
Over Temperature
Shutdown 150 °C
OTS Over Temperature
Shutdown Hysteresis Hysteresis 10 °C
TC Output Voltage
Temperature
Coefficient Ta= -20 ~ 80°c 100 ppm/°C
Output Capacitor 4.7 µF
COUT ESR 0.01 1 Ohm
RESET / RESET VDET=H!L (APL5525/6A) 3.9
VS Detection Voltage VDET=H!L (APL5525/6B) 4.2 V
VS/T Vs Temperature
Coefficient Ta = -20~+80°C 100 ppm/°C
VS Hysteresis Voltage VDET = H!L 130 180 230 mV
VOL Low-level Output
Voltage VDET = 3.9V, RL = 4.7k 12 60 mV
IOH Output Leakage
Current VDET = 5V 0.5 1 µA
IOL1 Output Current1 VDET =3.9V, VRESET = 0.4V 25 30 mA
IOL2 Output Current2 VDET = 3.9V, VRESET = 0.4V
Ta = -20~+80°C 20 25 mA
tPLH “H” Transmission Delay
Time Cd = 0µF 42 90 µs
tPLH1 Reset Delay Time VDET = 3.7V!5V, Cd = 0.1µF 8 13 18 ms
tPHL “L” Transmission Delay
Time Cd = 0µF 4 90 µs
VOPL Threshold Operating
Voltage VRESET = 0.4V 0.95 1.25 V
Note : Dropout voltage definition : VIN- VOUT when VOUT is 2% below the value of VOUT for VIN=5V
Unless otherwise noted these specifications apply over full temperature , VIN=5V, CIN=1µF,COUT1=4.7µF,
COUT2=4.7µF, CONT=VIN, TJ=0 to 125°C . Typical values refer to TJ=25°C .
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw5
APL5525/5526
VOUT1
VIN
GND
RESET
APL5525/6
Cd CONT
4.7k
VDET
COUT1
4.7µF
(ceramic)
VOUT2 COUT2
4.7µF
(ceramic)
0.1µF
1µFRL
3.3V
2.5V
Application Circuit
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw6
APL5525/5526
Timing Chart
APL5525 APL5526
RESET
VIN. V DET
CONT
VOUT1
VOUT2
5V
Vs
5V
0V
H
L
5V
0V
0V
5V
Vs
tPLH + tPLH1 RESET
VIN. V DET
CONT
VOUT1
VOUT2
5V
Vs
5V
0V
H
L
5V
0V
0V
5V
Vs
tPLH + tPLH1
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw7
APL5525/5526
0
20
40
60
80
100
120
140
160
0123456
IOUT1=IOUT2=0mA
0
0.5
1
1.5
2
2.5
3
3.5
012345
3.280
3.285
3.290
3.295
3.300
3.305
3.310
-25 0 25 50 75 100 125
2.492
2.494
2.496
2.498
2.500
2.502
2.504
2.506
2.508
0
100
200
300
400
500
600
0100 200 300 400 500
Quiescent Current vs. Output Current
Output Current (mA)
VIN = 5V
Quiescent Current vs. Input V oltage
Quiescent Current (µA)
Input Voltage (V)
Quiescent Current (µA)
VOUT1
VOUT2
Input Voltage (V)
Output V oltage vs. Input V oltage
Output V oltage (V)
Output V oltage vs. Temperature
Temperature (°C)
VOUT1 (V)
IOUT1 = IOUT2 = 0mA
Typical Characteristics
VOUT1
VOUT2
VOUT2
VOUT1
VOUT2 (V)
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw8
APL5525/5526
-80
+0
-70
-60
-50
-40
-30
-20
-10
10 100k
100 1k 10k
0
100
200
300
400
500
600
700
0100 200 300 400 500
Dropout Voltage vs. Output Current PSRR vs. Frequency
Load-Transient Response
Load-Transient Response
Output Current (mA) Frequency (Hz)
Time(0.1m/div)
Time (0.1m/div)
Dropout V oltage (mV)
PSRR (dB)
VIN = 5V
IOUT1 = IOUT2 = 50mA
VOUT1(200mV/div)
VOUT1
VOUT2
VOUT2
VOUT1
IOUT1=1mA ~ 500mA
COUT1=4.7uF
Typical Characteristics
VOUT2(200mV/div)
IOUT2=1mA ~ 500mA
COUT2=4.7uF
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw9
APL5525/5526
Shutdown Response
T ime (1ms/div)
VOUT1 (2v/div)
VOUT2
CONT(2v/div)
Typical Characteristics
RLOAD = 100
Line-T ransient Response
VIN = 4.5 ~ 5.5V
VOUT1(20mV/div)
IOUT1=10mA
COUT1=4.7uF
VOUT2(20mV/div)
IOUT2=10mA
COUT2=4.7uF
Time(20µs/div)
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw10
APL5525/5526
Application Information
Capacitor Selection and Regulator Stabil-
ity
The APL5538 uses at least a 1uF capacitor on the
input. This capacitor can use Aluminum, Tantalum or
Ceramic capacitors. Input capacitor with large value
and low ESR provides better PSRR and line-transient
response. The output capacitor also can use
Aluminum, Tantalum or Ceramic capacitors, and it’s
minimum values is recommended 4.7uF, ESR muse
be above 0.01. Large output capacitor values can
reduce noise and improve load-transient response,
stability, and PSRR. Note that some ceramic dielec-
trics exhibit large capacitance and ESR variation with
Temperature. If use this capacitor, it may be neces-
sary to use 4.7uF or more to ensure stability at tem-
perature below -10°C.
Load-T ransient Considerations
The APL5538 load-transient response graphs in T ypi-
cal Characteristics show the transient response. A
step change in the load current from 1mA to 500mA
at 1u second will cause less than 300mV transient
spike. Large output capacitor’s value and low ESR
can reduce transient spike.
Shutdown/Enable
The APL5538 has an active high enable function. Force
CONT high (>1.6V) enables the VOUT1 , CONT low (<0.
4V) disables the VOUT1 and VOUT2 can not be affected
by CONT. Enter the shutdown mode, it also causes
the output voltage to discharge through a 500 resis-
tance to ground. In shutdown mode, the quiescent
current can reduce to 100uA. The CONT pin cannot
be floating, a floating CONT pin may cause an inde-
terminate state on the output. If it is no use, connect
to VIN for normal operation.
RESET
The RESET pin is asserted whenever VDET falls below
the reset threshold voltage or if CONT is forced low at
some special IC(refer timing chart and pin description).
The reset function ensures the microprocessor is prop-
erly reset and powers up into a known condition after
a power failure. RESET will remain valid with VIN as
low as 0.95V. The RESET output is a simple open-
drain N channel MOSET structure. A pull-up resistor
must be used to pull this output up to some voltage.
For most application, this voltage will be the same
power supply that supplies VIN to the APL5538. The
APL5538 is relatively immune to negative-going
glitches below the reset threshold. Typically reset delay
time is 13ms while using o.1uF at Cd pin. If more
transient immunity is needed, a Cd capacitor can be
placed as larger as possible.
Input-Output (Dropout)V oltage
The minimun input-output voltage differential (dropout)
determines the lowest usable supply voltage. The drop-
out voltage is a function of drain-to-source on resis-
tance multiplied by the load current.
Current Limit
APL5538 includes two separate current-limit circuitry
for each linear regulator. The current limit protection,
which sense the current flows the P-channel MOSFET,
and controls the output voltage. The point where limit-
ing occurs is IOUT=950mA. The output can be shorted
to ground for an indefinite amount of time without dam-
aging to the part.
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw11
APL5525/5526
Application Information
Thermal Protection
Thermal protection limits total power dissipation in the
APL5538. When the junction temperature exceeds
TJ=+150°C, the thermal sensor generate a logic sig-
nal to turn off the pass transistor and let IC to cool.
When the IC’s junction temperature cools by 10°C,
the thermal sensor will turn the pass transistor on again,
resulting in a pulsed output during continuous thermal
protection. Thermal protection is designed to protect
the IC in the event of fault conditions. For continual
operation, do not exceed the absolute maximum junc-
tion temperature rating of TJ=+150°C.
Operating Region and Power Dissipation
The thermal resistance of the case and circuit board,
ambient and junction air temperature, and the rate of
air flow all control the APL5538 maximum power
dissipation. The power dissipation across the device
is P = IOUT (VIN-VOUT). The maximum power dissipation
is:
PMAX = (TJ-TA) / (θJB +θBA )
where TJ-TA is the temperature difference between the
junction and ambient air.
θJB is the thermal resistance of the package, θBA is the
thermal resistance through the printed circuit board,
copper traces, and other materials to the surrounding
air. The GND pin provides an electrical connection to
ground and channeling heat away. Connect the GND
pin to ground using a large pad or ground plane as a
heat sink, it can improve maximize thermal dissipation.
See figure 1. The SOP-8-P utilizes a bottom thermal
pad to minimize the thermal resistance of the package,
making the package suitable for high current
applications. The thermal pad is soldered to the top
ground pad and is connected to the internal or bottom
ground plane by several vias. The printed circuit board
(PCB) forms a heat sink and dissipates most of the
heat into ambient air. The vias are recommended to
have proper size to retain solder, helping heat
conduction.
Thermal
pad
Die Top
ground
pad
Printed
circuit
board
Internal
ground
plane
Vias
Ambient
Air
118 mil
102 mil
SOP-8-P
Figure 1
Figure 2 shows a board layout using the SOP-8-P
package. The demo board is made of FR-4 material
and is a two-layer PCB.
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw12
APL5525/5526
Application Information
Top layer
Bottom layer
Figure 2
The data in Table1 was taken using 1/16” FR-4 board
with 2OZ. Copper foil.
COPPER AREA
TOPSIDE BACKSIDE BOARD
AREA
HEA T
SINK
AREA PD(max)
JUNCTION
RESISTANCE
(JUNCTION-TO-
AMBIENT)
825
Sq. mm
4125
Sq. mm
5200
Sq. mm
24
Sq. mm 2.2W 57 /w
0 3750
Sq. mm
5600
Sq. mm 0 1.3W 96 /w
Table-1
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw13
APL5525/5526
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
HE
e1 e2
0.015X45
D
A
A1
0.004max.
1
L
Millimeters Inches
Dim Min. Max. Min. Max.
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
D 4.80 5.00 0.189 0.197
E 3.80 4.00 0.150 0.157
H 5.80 6.20 0.228 0.244
L 0.40 1.27 0.016 0.050
e1 0.33 0.51 0.013 0.020
e2 1.27BSC 0.50BSC
φ 1 8° 8°
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw14
APL5525/5526
SOP-8-P pin ( Reference JEDEC Registration MS-012)
Packaging Information
HE
e1 e2
0.015X45
D
A
A1
0.004max.
1
L
E1
D1
Millimeters Inches
Dim Min. Max. Min. Max.
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
D 4.80 5.00 0.189 0.197
D1 3.00REF 0.118REF
E 3.80 4.00 0.150 0.157
E1 2.60REF 0.102REF
H 5.80 6.20 0.228 0.244
L 0.40 1.27 0.016 0.050
e1 0.33 0.51 0.013 0.020
e2 1.27BSC 0.50BSC
φ 18°8°
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw15
APL5525/5526
Physical Specifications
Terminal Material Solder-P lated Cop per (S o lder Ma terial : 90/10 or 63/37 SnP b), 100%S n
Le a d S o lde r ab ility M e e ts EI A S p ec if ic a tion R S I8 6- 9 1 , AN S I/J - S T D- 00 2 C a teg o ry 3.
Reflow Condition (IR/Convection or VPR Reflow)
t 2 5 C to Pe a k
tp
Ramp-up
tL
Ramp-down
ts
Preheat
Tsmax
Tsmin
TL
TP
25
Temperature
Time
Critical Z one
TL to TP
°
Classificatin Reflow Profiles
Sn-Pb Eutectic Assembly Pb-Free Assembly
Profile Feature Large Body Small Body Large Body Small Body
Average ramp-up rate
(TL to TP) 3°C/second max. 3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Tsmax to TL
- Ramp-up Rate 3°C/second max
Tsmax to TL
- Temperature(TL)
- Time (tL)
183°C
60-150 seconds
217°C
60-150 seconds
Peak Temperature(Tp) 225 +0/-5°C 240 +0/-5°C 245 +0/-5°C 250 +0/-5°C
Time within 5°C of actual Peak
Temperature(tp) 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature
6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw16
APL5525/5526
Test item Me th o d Desc ription
SOLDERABILITY MIL-STD-883D-2003
245°C, 5 SEC
HOLT MIL-STD-883D-1005.7
1000 H rs B ias @ 1 25°C
PCT JESD-22-B,A102
168 H rs, 100%RH, 121°C
TST MIL-STD-883D-1011.9
-65°C~150°C, 200 C ycles
ESD MIL-STD-883D- 301 5.7 VH BM > 2KV, VMM > 200V
Latch-Up JESD 7 8 10ms, 1tr > 100mA
Carrier Tape
A
J
B
T2
T1
C
t
Ao
E
W
Po P
Ko
Bo
D1
D
F
P1
Reliability Test Program
Copyright ANPEC Electronics Corp.
Rev. A.4 - Feb., 2004 www.anpec.com.tw17
APL5525/5526
A pplication A B C J T1 T2 W P E
330 ± 1 62 +1.5 12.75+
0.15 2 ± 0.5 12.4 ± 0.2 2 ± 0.2 12± 0. 3 8± 0.1 1.75±0.1
F D D1 Po P1 Ao Bo Ko t
SOP - 8/-P
5.5± 1 1.55 +0.1 1.55+ 0.25
4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0. 1
2.1± 0.1 0.3±0.013
Application Carrier Width Cover Tape Width Devices Per Reel
SOP- 8/-P 12 9.3 2500
Cover Tape Dimensions
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin T ien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Customer Service
Reel Dimensions
(mm)