Technical Data July, 2010 3MTM Thermally Conductive Interface Pads 5595 and 5595S Product Description 3MTM Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. * The specialized silicone chemistry of Interfacel Pads 5595 and 5595S provides for good thermal stability of the base polymer with excellent softness of the thermal pad. * Interface Pad 5595 offers good thermal conductivity in a soft silicone polymer base. * Interface Pad 5595S has a permanent PEN film 9 micrometer thick on one side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework. * Interface Pads 5595 and 5595S have a tacky feel. The product tack is such that a mechanical means to support the pad in a final assembly is required. Product Construction 3MTM Thermally Conductive Interface Pads 5595 and 5595S Color Pad Type Pad Thickness Primary Filler Type Grey Filled Silicone Polymer 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm (> 2 mm thickness available. Please inquire.) Ceramic Top Liner / Film Type Interface Pad 5595 - Silicone Coated Polyester removable Liner / Interface Pad 5595S - 9 m PEN Film Base Liner Thickness Base Liner 3 mils (75 m) Polyethylene Naphthalate (PEN) film (9 m) = Interface Pad 5595S or Interface Pad 5595 with release liner Filled Silicone Elastomer Release Liner 3 3MTM Thermally Conductive Interface Pads 5595 and 5595S Typical Physical Properties and Performance Characteristics Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Property Product Number* Method Value 3MTM Thermally Conductive Interface Pads 5595 and 5595S Thermal Conductivity (W/m-K) 1.6 W/m-K 3M Test Method with low pressure (<10 psi) -60 to 125C 3M Test Method Shelf Life Product shelf life is 24 months from date of manufacture when stored at room temperature conditions (23-25C & 50% RH) and in the products original packaging. 3M Test Method Hardness Shore 00** Shore 00 results depend on test method and thickness of the sample tested. Typical results are in the 50-60 Shore 00 range @ 6 mm test thickness without the PEN film. Ask 3M for more details on pad softness. Modified ASTM D2240 Dielectric Breakdown 400 V/mil AC (Interface Pad 5595S tested) 3M TM (ASTM D149) Volume Resistivity 5 x 1012 Ohms (Interface Pad 5595S tested) ASTM D257 UL-94-V0 (3M tested.) UL-94-V0 TM Operating Temperature Range**** Flammability Rating*** Note: *Interface Pad 5595S has a 9 micrometer PEN Film added to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework. **Interface Pad 5595 tested with-out PET film on product. ***9 m PEN film is a non-FR version. ****Potential Operating Temperature Range (C). End use application testing will determine final temperature range based on final design and other environmental conditions. Suggested Temperature range is based on a 3M Test Method. Application Guidelines Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance. A clean surface can improve the thermal performance of an application. 1.) Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or fingerprints. Do not use "denatured alcohol" or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above. Note: Be sure to read and follow the manufacturers' precautions and directions when using solvents. 2.) Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner before application. 3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat. Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates during application. (2) 3MTM Thermally Conductive Interface Pads 5595 and 5595S General Information Product selection table for 3MTM Thermally Conductive Materials. Product Thickness (mm) Bulk Thermal Conductivity (W/m-K) Typical Applications 0.6 Applications requiring thin bonding with good thermal transfer; CPU, flex circuit and power transformer bonding to heat sinks and other cooling devices. Superior tack and wetting properties. 3MTM Thermally Conductive Tapes 8805 0.127 8810 0.25 8815 0.375 8820 0.50 9889FR 1.0 0.5 Applications requiring gap filling and bonding with good thermal transfer; IC packages and PCB bonding to heat sinks, metal cases and other cooling devices. 3MTM Thermally Conductive Adhesives TC-2707 -- 0.7 TC-2810 -- 1.0 - 1.4 Applications requiring high adhesive strength, good surface wetting, gap filling and good thermal transfer. IC package and PCB thermal interfacing with heat sinks or other cooling devices. 3MTM Thermally Conductive Interface Pads 5506 0.5 to 2.0 2.3 5509 0.5 to 2.0 5.0 Applications requiring gap filling and superior thermal performance without bonding. IC package and PCB thermal interfacing with heat sinks or other cooling devices and metal cases. 3MTM Thermally Conductive Interface Pads (silicone based) 5591S 0.5 to 2.0 1.0 5592 1.0 to 2.0 1.1 5592S 0.5 to 2.0 -- 5595 1.0 to 2.0 1.6 5595S 0.5 to 2.0 -- Applications requiring gap filling and superior thermal performance without bonding. IC package and PCB thermal interfacing with heat sinks or other cooling devices and metal cases. 3MTM Thermally Conductive Interface Pads (acrylic) 5590H 0.5 to 1.5 3.0 Applications requiring gap filling and superior thermal performance without bonding. IC package and PCB thermal interfacing with heat sinks or other cooling devices and metal cases. Application Ideas * 3MTM Thermally Conductive Interface Thermal Pads are designed to provide a preferential heat-transfer path between heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks). (3) 3MTM Thermally Conductive Interface Pads 5595 and 5595S Certification/Recognition MSDS: 3M has not prepared a MSDS for these products which is are subject to the MSDS requirements of the Occupational Safety and Health Administration's Hazard Communication Standard, 29 C.F.R. 1910.1200(b)(6)(v). When used under reasonable conditions or in accordance with the 3M directions for use, these products should not present a health and safety hazard. However, use or processing of these products in a manner not in accordance with the directions for use may affect their performance and present potential health and safety hazards. TSCA: These products are defined as an article under the Toxic Substances Control Act and therefore, are exempt from inventory listing requirements. RoHs Complaint/REACH Compliant: These products comply with the European Union's "Restriction of Hazardous Substances" (RoHs) initiative and with European REACH regulations 2002/95/EC and 2005/618/EC. 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Any statements related to the product which are not contained in 3M's current publications, or any contrary statements contained on your purchase order shall have no force or effect unless expressly agreed upon, in writing, by an authorized officer of 3M. Warranty; Limited Remedy; Limited Liability. This product will be free from defects in material and manufacture at the time of purchase. 3M MAKES NO OTHER WARRANTIES INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within the warranty period stated above, your exclusive remedy shall be, at 3M's option, to replace or repair the 3M product or refund the purchase price of the 3M product. Except where prohibited by law, 3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of the legal theory asserted. 3 Electronics Markets Materials Division 3M Center, Building 225-3S-06 St. Paul, MN 55144-1000 1-866-599-4227 phone 651-778-4244 fax www.3M.com/electronics 3M is a trademark of 3M Company. Please recycle. Printed in U.S.A. (c) 3M 2010. All rights reserved. 60-5002-0133-4 (4) 3 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: 3M: 5595-1.0 5595-1.5 5595-2.0 5595S-0.5 5595S-1.0 5595S-1.5