EMIF05-AUD02F3 EMI filter and ESD protection for audio interface Datasheet - production data Description The EMIF05-AUD02F3 chip is a highly integrated audio filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. Flip Chip (12 bumps) This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. Figure 1. Pin configuration (bump view) Features EMI low-pass filter High efficiency in EMI/ESD protection High reliability offered by monolithic integration 1 2 3 ear_L mic_p mic_m A Ear_L Mic_p Mic_m B Ear_R Ground Det C ear_R det Vreg D Very thin package High reduction of parasitic elements through integration and wafer level packaging Lead-free package Complies with the following standards: IEC 61000-4-2 level 4 (on B1, B2, B3, C1, C3 pins): - 15 kV (air discharge) - 8 kV (contact discharge) IEC 61000-4-2 level 1 (on A1, A2, A3, D1, D2, D3 pins): - 2 kV (air discharge) - 2 kV (contact discharge) Figure 2. Functional schematic D3 R6 C3 D2 R5 Level 4 GND R3, R4 B2 B3 A2 A3 Level 4 Applications Where EMI filtering in ESD sensitive equipment is required: Mobile phones and communication systems Computers, printers and MCU boards. C3, C4 GND GND A1 D1 R1, R2 B1 C1 C1, C2 Level 4 GND GND Pin C2 is ground TM: IPAD is a trademark of STMicroelectronics December 2013 This is information on a product in full production. DocID025579 Rev 1 1/8 www.st.com Characteristics 1 EMIF05-AUD02F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 C) Symbol Parameter Value External pins (B1, B2, B3, C1, C3): ESD discharge IEC 61000-4-2, level 4 Air discharge Contact discharge Internal pins (A1, A2, A3, D1, D2, D3): ESD discharge IEC 61000-4-2(1), level 1 Air discharge Contact discharge VPP Unit 15 8 kV 2 2 Top Operating temperature range - 40 to + 85 Tstg Storage temperature range - 55 to 150 C 1. Measurements done on IEC 61000-4-2 test bench.For further details see Application note AN3353, "IEC 61000-4-2 standard testing". Figure 3. Electrical characteristics (definitions) Symbol VBR = I RM = V RM = V CL = I PP = CX = RX = P arameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Peak pulse current Line capacitance Series resistance between input and ouptput VCL PP Table 2. Electrical characteristics (Tamb = 25 C) Symbol IRM VRM = 3 V VBR IR = 1 mA Min. Typ. Max. Unit 100 nA 6 V R1, R2 13.5 15 16.5 R3, R4 1980 2200 2420 R5 900 1000 1100 R6 18000 20000 22000 3 3.75 0.8 1 C1, C2 C3, C4 2/8 Test conditions Vline = 0 V, Vosc = 30 mV, F = 1 MHz (measured under zero light conditions) DocID025579 Rev 1 nF EMIF05-AUD02F3 Characteristics Figure 4. Attenuation versus frequency (MIC lines) Figure 5. Attenuation versus frequency (Ear lines) S21(dB) S21(dB) 0 0 -5 -10 -10 -20 -15 -30 -20 -25 -40 -30 -50 -35 -60 -40 -70 -45 F (Hz) F (Hz) -50 -80 100k 1M 10M 100M MicP 100k 1G 1M 10M EarL MicM 100M 1G EarR Figure 6. Analog crosstalk versus frequency XTalk (dB) 0 -10 -20 -30 -40 -50 -60 -70 -80 F (Hz) -90 100k 1M 10M 100M EarL-EarR Det-EarL MicP_EarL DocID025579 Rev 1 1G MicM-MicP Det-MicP 3/8 8 Characteristics EMIF05-AUD02F3 Figure 7. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 5.0 V / Div 1 2 3 4 VCL: Peak clamping voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 1 19.0 V 2 15.3 V 3 12.6 V 4 8.4 V 20 ns / Div Figure 8. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 5.0 V / Div 4 -7.8 V 3 -12.4 V 1 -18.7 V 1 2 3 4 2 -14.2 V VCL: Peak clamping voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 20 ns / Div 4/8 DocID025579 Rev 1 EMIF05-AUD02F3 2 Package information Package information Epoxy meets UL94, V0 Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 9. Package dimensions 255 40 m 500 m 50 400 30 m 1170 30 m 185 m 400 30 m 1570 30 m Figure 10. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Figure 11. Marking Dot, ST logo Solder mask opening: 300 m minimum ECOPACK(R) grade xx Marking characters Solder stencil opening: 220 m recommended DocID025579 Rev 1 xx 5/8 8 Package information EMIF05-AUD02F3 Figure 12. Tape and reel specification Dot identifying Pin A1 location O 1.50 2.0 4.0 8.0 3.5 1.65 1.75 0.20 xx All dimensions are typical values in mm 6/8 xx xx 1.28 0.59 4.0 User direction of unreeling DocID025579 Rev 1 EMIF05-AUD02F3 3 Ordering information Ordering information Figure 13. Ordering information scheme EMIF 05 - AUD 02 F3 EMI filter Number of lines Application 3 letters = AUD Version 2 digits = 02 Package F = Flip Chip x = 3: Lead-free pitch = 400 m, bump = 255 m Table 3. Ordering information Note: Order code Marking Package Weight Base qty Delivery mode EMIF05-AUD02F3 KY Flip Chip 2.0 mg 5000 Tape and reel 7" More information is available in the STmicroelectronics Application notes: AN2348: "Flip Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 4 Revision history Table 4. Document revision history Date Revision 12-Dec-2013 1 Changes First issue. DocID025579 Rev 1 7/8 8 EMIF05-AUD02F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER'S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR "AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL" INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 DocID025579 Rev 1