This is information on a product in full production.
December 2013 DocID025579 Rev 1 1/8
EMIF05-AUD02F3
EMI filter and ESD protection for audio interface
Datasheet - production data
Features
EMI low-pass filter
High efficiency in EMI/ESD protection
High reliability offered by monolithic integration
Very thin package
High reduction of parasitic elements through
integration and wafer level packaging
Lead-free package
Complies with the following standards:
IEC 61000-4-2 level 4 (on B1, B2, B3, C1, C3
pins):
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
IEC 61000-4-2 level 1 (on A1, A2, A3, D1, D2,
D3 pins):
– ±2 kV (air discharge)
– ±2 kV (contact discharge)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
Mobile phones and communication systems
Computers, printers and MCU boards.
TM: IPAD is a trademark of STMicroelectronics
Description
The EMIF05-AUD02F3 chip is a highly integra ted
audio filter device designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interference.
This filter includes ESD protection circuitry, which
prevents damage to the pro tected device whe n
subjected to ESD surges up to 15 kV.
Figure 1. Pin configuration (bump view)
Figure 2. Functional schematic
Flip Chip
(12 bumps)
ear_L
123
A
B
C
D
Ear_L
Ear_R
ear_R
mic_p
Mic_p
Ground
det
mic_m
Mic_m
Det
Vreg
D3
A1
D1
D2
C3
B2 A2
B1
B3 A3
C1
C3, C4
C1, C2
Pin C2 is ground
R6
R5
Level 4
Level 4
Level 4
R3, R4
R1, R2
GND
GND GND
GND
GND
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Characteristics EMIF05-AUD02F3
2/8 DocID025579 Rev 1
1 Characteristics
Figure 3. Electrical characte ristics (definitions)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP
External pins (B1, B2, B3, C1, C3):
ESD discharge IEC 61000-4-2, level 4
Air discharge
Contact discharge
Internal pins (A1, A2, A3, D1, D2, D3):
ESD discharge IEC 61000-4-2(1), level 1
Air discharge
Contact discharge
1. Measurements done on IEC 61000-4-2 test bench.For further details see Application note AN3353,
“IEC 61000-4-2 standard testing”.
15
8
2
2
kV
Top Operating temperature range - 40 to + 85 °C
Tstg Storage temperature range - 55 to 150
Table 2. Electrical characteristics (Tamb = 25 °C)
Symbol Test conditi ons Min. Typ. Max. Unit
IRM VRM = 3 V 100 nA
VBR IR = 1 mA 6 V
R1, R2 13.51516.5
R3, R4 1980 2200 2420
R5 900 1000 1100
R6 18000 20000 22000
C1, C2 Vline = 0 V, Vosc = 30 mV, F = 1 MHz
(measured under zero light conditions) 33.75 nF
C3, C4 0.8 1
Symbol Parameter
V= Breakdown voltage
I= Leakage current @ V
V= Stand-off voltage
V= Clamping voltage
I
C
X
R=
X
= P
= Line capacitance
eak pulse current
BR
RM
RM
RM
CL
PP
VCL
PP
Series resistance between
input and ouptput
DocID025579 Rev 1 3/8
EMIF05-AUD02F3 Characteristics
8
Figure 6. Analog crosstalk versus frequency
Figure 4. Attenuation versus frequency
(MIC lines) Figure 5. Attenuation versus frequency
(Ear lines)
100k 1M 10M 100M 1G
-80
-70
-60
-50
-40
-30
-20
-10
0
MicP MicM
F (Hz)
S21(dB)
100k 1M 10M 100M 1G
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
EarL EarR
F (Hz)
S21(dB)
XTalk (dB)
100k 1M 10M 100M 1G
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
EarL-EarR MicM-MicP
Det-EarL Det-MicP
MicP_EarL
F (Hz)
Characteristics EMIF05-AUD02F3
4/8 DocID025579 Rev 1
Figure 7. ESD response to IEC 61000-4-2 (+8 kV contact discharge)
Figure 8. ESD response to IEC 61000- 4-2 (-8 kV contact discharge)
5.0 V / Div
V : Peak clamping voltage
CL
V :clamping voltage @ 30 ns
CL
V :clamping voltage @ 60 ns
CL
V :clamping voltage @ 100 ns
CL
1
2
3
4
19.0 V
15.3 V 12.6 V
8.4 V
1
2
4
3
20 ns / Div
DocID025579 Rev 1 5/8
EMIF05-AUD02F3 Package information
8
2 Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 9. Package dimensions
Figure 10. Footprint Figure 11. Marking
1170 ± 30 µm
400 ± 30 µm
400 ± 30 µm
1570 ± 30 µm
185 µm
∅255 ± 40 µm 500 µm ± 50
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening:
Copper pad Diameter:
Solder mask opening:
300 µm minimum
xx
Dot, ST logo
ECOPACK®grade
xx Marking characters
Package information EMIF05-AUD02F3
6/8 DocID025579 Rev 1
Figure 12. Tape and reel specification
8.0
4.0
1.75
3.5
1.28
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are typical values in mm
4.0
2.0 Ø 1.50
0.59
0.20
1.65
xx
xx
xx
DocID025579 Rev 1 7/8
EMIF05-AUD02F3 Ordering information
8
3 Ordering information
Figure 13. Ordering information scheme
Note: More information is available in the STmicroelectronics Application notes:
AN2348: “Flip Chip: Package description and recommend ations for use”
AN1751: “EMI Filters: Recommendations and measurements”
4 Revision history
Table 3. Ordering information
Order code Marking Package Weight Base qty Delivery mode
EMIF05-AUD02F3 KY Flip Chip 2.0 mg 5000 Tape and reel 7”
EMIF 05 - AUD 02 F3
EMI filter
Number of lines
Application
3 letters = AUD
Version
2 digits = 02
Package
F = Flip Chip
x = 3: Lead-free pitch = 400 µm, bump = 255 µm
Table 4. Document revision history
Date Revision Changes
12-Dec-2013 1First issue.
EMIF05-AUD02F3
8/8 DocID025579 Rev 1
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