Glass passivated junction chip
For surface mounted application
Low profile package
Built-in strain rellef
Ideal for automated placement
Easy pick and place
Super fast recovery time for high efficiency
Glass passivated chip junction
ES2A SMB 850 / 7" REEL R5
Maxi mum Ratings and Electrical Characteristics
Rating at 25 ℃ ambient temperature unless otherwise specified.
Symbol ES
2
ES
2B ES
2C ES
2D ES
2F ES
2G ES
2H ES
2J Units
V
RRM
50 100 150 200 300 400 500 600 V
V
RMS
35 70 105 140 210 280 350 420 V
V
DC
50 100 150 200 300 400 500 600 V
I
F(AV)
A
uA
uA
Trr nS
Cj pF
T
JO
C
T
STG O
C
Version:G13
ES2A - ES2J
2.0AMPS. Surface Mount Super Fast Rectifiers
SMB/DO-214AA
Features
High temperature soldering:
260℃/10 seconds at terminals
Plastic material used carries Underwriters
Laboratory Classification 94V-0
Meet MSL level 1, per J-STD-020D,
lead free maximum peak of 260℃
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
Cases: Molded plastic
Terminals: Pure tin plated, lead free
Polarity: Indicated by cathode band
Packing: 12mm tape per EIA STD RS-481
Weight: 0.093 grams
Parameter
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
R5G
2
Peak Forward Surge Current, 8.3 ms Single Half Sine-wave
Superimposed on Rated Load (JEDEC method) I
FSM
50 A
Maximum Instantaneous Forward Voltage (Note 1)
@ 2 A V
F
0.95 1.3 1.7 V
Maximum DC Reverse Current @ T
A
=25 ℃
at Rated DC Blocking Voltage @ T
A
=125 ℃I
R
10
350
Maximum Reverse Recovery Time (Note 2) 35
Typical Junction Capacitance (Note 3) 25 20
Maximum Thermal Resistance R
θJA
R
θJL
75
20
O
C/W
Operating Temperature Range - 55 to + 150
Storage Temperature Range - 55 to + 150
Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Ordering Information (example)
Part No. Package Packing Packing code Packing code
(Green)