DS36C278MX/NOPB - NATIONAL SEMICONDUCTOR

DS36C278

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SNLS096C –JULY 1998–REVISED APRIL 2013

DS36C278 Low Power Multipoint EIA-RS-485 Transceiver

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1FEATURES DESCRIPTION

The DS36C278 is a low power differential bus/line

2• 100% RS-485 Compliant transceiver designed to meet the requirements of RS-

– Guaranteed RS-485 Device Interoperation 485 standard for multipoint data transmission. In

• Low Power CMOS Design: ICC 500 μA Max addition it is compatible with TIA/EIA-422-B.

• Built-In Power Up/Down Glitch-Free Circuitry The CMOS design offers significant power savings

– Permits Live Transceiver over its bipolar and ALS counterparts without

sacrificing ruggedness against ESD damage. The

Insertion/Displacement device is ideal for use in battery powered or power

• PDIP and SOIC Packages Available conscious applications. ICC is specified at 500 μA

• Industrial Temperature Range: −40°C to maximum.

+85°C The driver and receiver outputs feature TRI-STATE

• On-Board Thermal Shutdown Circuitry capability. The driver outputs operate over the entire

– Prevents Damage to the Device in the Event common mode range of −7V to +12V. Bus contention

of Excessive Power Dissipation or fault situations that cause excessive power

dissipation within the device are handled by a thermal

• Wide Common Mode Range: −7V to +12V shutdown circuit, which forces the driver outputs into

• Receiver Open Input Fail-Safe (1) the high impedance state.

• ¼ Unit Load (DS36C278): ≥12 Nodes The receiver incorporates a fail safe circuit which

• ½ Unit Load (DS36C278T): ≥64 Nodes guarantees a high output state when the inputs are

• ESD (Human Body Model): ≥2 kV left open. (1)

• Drop in Replacement for: The DS36C278T is fully specified over the industrial

– LTC485, MAX485, DS75176, DS3695 temperature range (−40°C to +85°C).

(1) Non-terminated, open input only

Connection Diagram

Figure 1. 8-Pin PDIP or SOIC

Package Numbers D0008A and P0008E

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

DS36C278

SNLS096C –JULY 1998–REVISED APRIL 2013

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Pin Descriptions

Pin No. Name Description

1 RO Receiver Output: When RE (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥DO*/RI* by 200 mV, RO

will be HIGH. If DO/RI ≤DO*/RI* by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Non-terminated)

Inputs.

2 RE* Receiver Output Enable: When RE* is LOW the receiver output is enabled. When RE* is HIGH, the receiver output is in

TRI-STATE (OFF).

3 DE Driver Output Enable: When DE is HIGH, the driver outputs are enabled. When DE is LOW, the driver outputs are in

TRI-STATE (OFF).

4 DI Driver Input: When DE (Driver Enable) is HIGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and

DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW.

5 GND Ground Connection.

6 DO/RI Driver Output/Receiver Input, 485 Bus Pin.

7 DO*/RI* Driver Output/Receiver Input, 485 Bus Pin.

8 VCC Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V.

Table 1. Truth Table(1)

DRIVER SECTION

RE* DE DI DO/RI DO*/RI*

X H H H L

X H L L H

X L X Z Z

RECEIVER SECTION

RE* DE RI-RI* RO

L L ≥+0.2V H

L L ≤−0.2V L

H L X Z

L L OPEN (1) H

(1) Non-terminated, open input only

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings(1)(2)

Supply Voltage (VCC) +12V

Input Voltage (DE, RE*, & DI) −0.5V to (VCC +0.5V)

Common Mode (VCM)

Driver Output/Receiver Input ±15V

Input Voltage (DO/RI, DO*/RI*) ±14V

Receiver Output Voltage −0.5V to (VCC +0.5V)

Maximum Package Power Dissipation

@ +25°C

D0008A Package 1190 mW, derate 9.5 mW/°C above +25°C

P0008E Package 744 mW, derate 6.0 mW/°C above +25°C

Storage Temperature Range −65°C to +150°C

Lead Temperature

(Soldering 4 sec) +260°C

(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to

imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device

operation.

(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

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SNLS096C –JULY 1998–REVISED APRIL 2013

Recommended Operating Conditions Min Typ Max Units

Supply Voltage (VCC) +4.75 +5.0 +5.25 V

Bus Voltage −7 +12 V

Operating Free-Air Temperature (TA)

DS36C278T −40 25 +85 °C

DS36C278 0 25 +70 °C

Electrical Characteristics (1) (2)

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified

Parameter Test Conditions Reference Min Typ Max Units

DIFFERENTIAL DRIVER CHARACTERISTICS

VOD1 Differential Output Voltage IO= 0 mA (No Load) 1.5 5.0 V

(422)

VOD0 Output Voltage IO= 0 mA 0 5.0 V

(485)

VOD0* Output Voltage (Output to GND) 0 5.0 V

VOD2 Differential Output Voltage RL= 50Ω(422) Figure 2 2.0 2.8 V

(Termination Load) RL= 27Ω(485) 1.5 2.3 5.0 V

ΔVOD2 Balance of VOD2 RL= 27Ωor 50Ω(3) −0.2 0.1 +0.2 V

|VOD2 −V0D2*| (422, 485)

VOD3 Differential Output Voltage R1 = 54Ω, R2 = 375ΩFigure 3 1.5 2.0 5.0 V

(Full Load) VTEST =−7V to +12V

VOC Driver Common Mode RL= 27Ω(485) 0 3.0 V

Figure 2

Output Voltage RL= 50Ω(422) 0 3.0 V

ΔVOC Balance of VOC RL= 27Ωor (3) −0.2 +0.2 V

|VOC −VOC*| RL= 50Ω(422, 485)

IOSD Driver Output Short-Circuit VO= +12V (485) 200 +250 mA

Current VO=−7V (485) −190 −250 mA

RECEIVER CHARACTERISTICS

VTH Differential Input High VO= VOH, IO=−0.4V +0.035 +0.2 V

Threshold Voltage −7V ≤VCM ≤+12V (4)

(422, 485)

VTL Differential Input Low VO= VOL, IO= 0.4 mA −0.2 −0.035 V

Threshold Voltage −7V ≤VCM ≤+12V

VHST Hysteresis VCM = 0V (5) 70 mV

RIN Input Resistance −7V ≤VCM ≤+12V DS36C278T 24 68 kΩ

RIN Input Resistance −7V ≤VCM ≤+12V DS36C278 48 68 kΩ

IIN Line Input Current Other Input = 0V, DS36C278 VIN = +12V 0 0.19 0.25 mA

(6) DE = VIL, RE* = VIL, VIN =−7V 0 −0.1 −0.2 mA

VCC= 4.75 to 5.25 DS36C278T VIN = +12V 0 0.19 0.5 mA

or 0V VIN =−7V 0 −0.1 −0.4 mA

IING Line Input Current Glitch Other Input = 0V, DS36C278 VIN = +12V 0 0.19 0.25 mA

(6) DE = VIL, RE* = VIL, VIN =−7V 0 −0.1 −0.2 mA

VCC = +3.0V or 0V, DS36C278T VIN = +12V 0 0.19 0.5 mA

TA= 25°C VIN =−7V 0 −0.1 −0.4 mA

IBInput Balance Test RS = 500Ω(422) (7) ±400 mV

(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground

except VOD1 and VOD2.

(2) All typicals are given for: VCC = +5.0V, TA= + 25°C.

(3) Delta |VOD2| and Delta |VOC| are changes in magnitude of VOD2 and VOC, respectively, that occur when input changes state.

(4) Threshold parameter limits specified as an algebraic value rather than by magnitude.

(5) Hysteresis defined as VHST = VTH −VTL.

(6) IIN includes the receiver input current and driver TRI-STATE leakage current.

(7) For complete details of test, see RS-485.

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Electrical Characteristics (1) (2) (continued)

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified

Parameter Test Conditions Reference Min Typ Max Units

VOH High Level Output Voltage IOH =−4 mA, VID = +0.2V 3.5 4.6 V

Figure 12

VOL Low Level Output Voltage IOL = +4 mA, VID =−0.2V 0.3 0.5 V

IOSR Short Circuit Current VO= GND 7 35 85 mA

IOZR TRI-STATE Leakage Current VO= 0.4V to 2.4V ±1 μA

DEVICE CHARACTERISTICS

VIH High Level Input Voltage 2.0 VCC V

VIL Low Level Input Voltage GND 0.8 V

DE,

IIH High Level Input Current VIH = VCC RE*, 2 μA

IIL Low Level Input Current VCC = 5V −2μA

VIL = 0V

VCC = +3.0V −2μA

ICC Power Supply Current Driver and Receiver ON 200 500 μA

ICCR (No Load) Driver OFF, Receiver ON 200 500 μA

VCC

ICCD Driver ON, Receiver OFF 200 500 μA

ICCZ Driver and Receiver OFF 200 500 μA

Switching Characteristics(1)(2)

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified

Parameter Test Conditions Reference Min Typ Max Units

DRIVER CHARACTERISTICS

tPHLD Differential Propagation RL= 54Ω, CL= 100 pF 10 39 80 ns

Delay High to Low

tPLHD Differential Propagation 10 40 80 ns

Delay Low to High Figure 7

tSKD Differential Skew 0 1 10 ns

|tPHLD −tPLHD|

trRise Time 3 25 50 ns

tfFall Time 3 25 50 ns

tPHZ Disable Time High to Z CL= 15 pF Figure 8,Figure 9 — 80 200 ns

tPLZ Disable Time Low to Z RE * = L Figure 10,Figure 11 — 80 200 ns

tPZH Enable Time Z to High CL= 100 pF Figure 8,Figure 9 — 50 200 ns

tPZL Enable Time Z to Low RE * = L Figure 10,Figure 11 — 65 200 ns

RECEIVER CHARACTERISTICS

tPHL Propagation Delay CL= 15 pF 30 210 400 ns

High to Low

tPLH Propagation Delay Figure 13,Figure 14 30 190 400 ns

Low to High

tSK Skew, |tPHL −tPLH| 0 20 50 ns

tPLZ Output Disable Time CL= 15 pF — 50 150 ns

tPHZ — 55 150 ns

Figure 15,Figure 16,

Figure 17

tPZL Output Enable Time — 40 150 ns

tPZH — 45 150 ns

(1) All typicals are given for: VCC = +5.0V, TA= + 25°C.

(2) CLincludes probe and jig capacitance.

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SNLS096C –JULY 1998–REVISED APRIL 2013

PARAMETER MEASUREMENT INFORMATION

Figure 2. Driver VOD2 and VOC Figure 3. Driver VOD3

Figure 4. Driver VOH and VOL

Vtest = −7V to +12V

Figure 5. Driver IOSD

Figure 6. Driver Differential Propagation Delay Test Circuit

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Figure 7. Driver Differential Propagation Delays and Differential Rise and Fall Times

Figure 8. TRI-STATE Test Circuit (tPZH , tPHZ)

Figure 9. TRI-STATE Waveforms (tPZH, tPHZ)

Figure 10. TRI-STATE Test Circuit (tPZL, tPLZ)

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SNLS096C –JULY 1998–REVISED APRIL 2013

Figure 11. TRI-STATE Waveforms (tPZL, tPLZ)

Figure 12. Receiver VOH and VOL

Figure 13. Receiver Differential Propagation Delay Test Circuit

Figure 14. Receiver Differential Propagation Delay Waveforms

Figure 15. Receiver TRI-STATE Test Circuit

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Figure 16. Receiver Enable and Disable Waveforms (tPLZ, tPZL)

Figure 17. Receiver Enable and Disable Waveforms (tPHZ, tPZH)

Typical Application Information

Figure 18. Typical RS-485 Bus Interface

Unit Load

A unit load for an RS-485 receiver is defined by the input current versus the input voltage curve. The gray

shaded region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to

+12V at +1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at

−0.8 mA is also defined as one unit load (see Figure 19). An RS-485 driver is capable of driving up to 32 unit

loads. This allows up to 32 nodes on a single bus. Although sufficient for many applications, it is sometimes

desirable to have even more nodes. For example, an aircraft that has 32 rows with 4 seats per row would benefit

from having 128 nodes on one bus. This would allow signals to be transferred to and from each individual seat to

1 main station. Usually there is one or two less seats in the last row of the aircraft near the restrooms and food

storage area. This frees the node for the main station.

The DS36C278, the DS36C279, and the DS36C280 all have ½ unit load and ¼ unit load (UL) options available.

These devices will allow up to 64 nodes or 128 nodes guaranteed over temperature depending upon which

option is selected. The ½ UL option is available in industrial temperature and the ¼ UL is available in commercial

temperature.

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SNLS096C –JULY 1998–REVISED APRIL 2013

First, for a ½ UL device the top and bottom borders shown in Figure 19 are scaled. Both 0 mA reference points

at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at

−0.4 mA for the bottom border (see Figure 19). Second, for a ¼ UL device the top and bottom borders shown in

Figure 19 are scaled also. Again, both 0 mA reference points at +5V and −3V stay the same. The other

reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see

Figure 19).

The advantage of the ½ UL and ¼ UL devices is the increased number of nodes on one bus. In a single master

multi-slave type of application where the number of slaves exceeds 32, the DS36C278/279/280 may save in the

cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors.

The DS36C279 and DS36C280 have an additional feature which offers more advantages. The DS36C279 has

an automatic sleep mode function for power conscious applications. The DS36C280 has a slew rate control for

EMI conscious applications. Refer to the sleep mode and slew rate control portion of the application information

section in the corresponding datasheet for more information on these features.

Figure 19. Input Current vs Input Voltage Operating Range

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REVISION HISTORY

Changes from Revision B (April 2013) to Revision C Page

• Changed layout of National Data Sheet to TI format ............................................................................................................ 9

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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

DS36C278MX/NOPB OBSOLETE SOIC D 8 TBD Call TI Call TI 0 to 70 DS36C

278M

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

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