SCOPE: CMOS HIGHSPEED 8-BIT A/D CONVERTER WITH TRACK AND HOLD Device Type 01 02 Generic Number MX7820U(x)/883B MX7820T(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Case Outline Package Code Outline Letter Mil-Std-1835 MAXIM SMD Q R GDIP1-T20 or CDIP2-T20 20 LEAD CERDIP J20 E 2 CQCCI-N20 20 LEADLESS CHIP CARRIER L20 Absolute Maximum Ratings Supply Voltage to GND ................................................................................... 0V, +7V Digital Input Voltage ................................................................................... -0.3V, VDD Digital Output Voltage ................................................................................. -0.3V, VDD Positive Reference Voltage ..................................................................... VREF- to VDD Negative Reference Voltage ..................................................................... 0V to VREF+ Input Voltage (VIN) .................................................................................... -0.3V to VDD Lead Temperature (soldering, 10 seconds) ............................................................... +300C Storage Temperature .................................................................................. -65C to +150C Continuous Power Dissipation ............................................................................ TA=+70C 20 pin CERDIP(derate 11.1mW/C above +70C) .................................................. 889mW 20 pin LCC(derate 9.1mW/C above +70C) ........................................................... 727mW Junction Temperature TJ ........................................................................................ +150C Thermal Resistance, Junction to Case, JC 20 pin CERDIP.................................................................................................... 40C/W 20 pin LCC ......................................................................................................... 20C/W Thermal Resistance, Junction to Ambient, JA: 20 pin CERDIP................................................................................................... 90C/W 20 pin LCC ...................................................................................................... 110C/W Recommended Operating Conditions Ambient Operating Range (TA) ............................................................ -55C to +125C Supply Voltage Range (VDD) ................................................................. +4.75V to 5.25V Positive Reference Voltage (VREF+) ..................................................................... +5.0V Negative Reference Voltage (VREF-) ......................................................................... 0V Ground Potential (GND) .............................................................................................. 0V Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ---------------------------- Electrical Characteristics of MX7820/883B for /883B and SMD 5962-88650 19-0072 Page 2 of Rev. C 7 TABLE 1. ELECTRICAL TESTS: TEST Symbol Resolution RES Total Unadjusted Error TUE Analog Input Leakage Current Analog Input Capacitance Reference Input Resistance Digital Input High Level Voltage Digital Input Low Level Voltage Digital Input High Level Current CONDITIONS -55 C TA +125C 1/ 2/ Unless otherwise specified This is the minimum resolution for which no missing codes are guaranteed. Includes gain error, offset error and linearity error. IIN CIA RIN NOTE 3 Group A Subgroup Device type 1 2,3,12 01 1.0 0.5 1,2,3 1,2,3 02 All 1.0 3.0 A 4 1,2,3 All All 60 4.0 pF k 1,2,3 All 8 1.0 LSB V 3.5 0.8 All V Mode Input (Pin 7) __ ___ CS and RD inputs 1.5 1.0 IIH Digital Input Low Current IIL Digital Input Capacitance CID Digital Output High Level Voltage VOH Digital Output Low Level Voltage VOL Floating State Leakage Current Digital Output Capacitance Supply Current from VDD IOUT Power Supply Sensitivity __ __ ___ CS to RD/WR Setup Time __ __ ___ CS to RD/WR Hold Time __ CS to RDY delay Mode Input (Pin 7) __ ___ ___ CS, WR, RD and mode inputs __ ___ ___ NOTE 3 CS, WR, RD and mode inputs ___ ___ DB0-DB7, OFL and INT outputs ISOURCE=360A ___ ___ DB0-DB7, OFL and INT outputs ISINK=1.6mA DB0-DB7 LSB 2.4 1,2,3 ___ WR Inputs Units All Mode Input (Pin 7) __ ___ ___ CS, WR, and RD inputs VIL Limits Max 1,2,3 __ ___ ___ CS, WR, and RD inputs VIH Limits Min 1,2,3 All 3.0 A 1,2,3 All 200 -1.0 A 4 All 8.0 pF 1,2,3 All 1,2,3 All 0.4 V 1,2,3 All 3.0 A 8.0 20.0 pF mA .25 4.0 V 4 1,2,3 All All PSS tCSS NOTE 3 __ ___ CS=RD=0V VDD=5.0V5% NOTE 6 and 7 1,2,3 9,10,11 All All 0 LSB ns tCSH NOTE 6 and 7 9,10,11 All 0 ns tRDY NOTE 6 and 7, CL=50pF, pullup resistor=2.0k 9 10,11 All COUT IDD ---------------------------- Electrical Characteristics of MX7820/883B for /883B and SMD 5962-88650 70 100 19-0072 Page 3 of Rev. C 7 ns TEST Symbol ___ Conversion Time (RD mode) ___ Data Access Time (RD mode) ___ ___ __ RD to INT Delay (RD mode) Data Hold Time tCRD Delay Time Between Conversion Write Pulse Width Delay Time between ___ ___ WR and RD Pulses Delay Access Time ___ __ WR/RD mode ___ ___ RD to INT delay ___ ___ WR to INT delay Data Access Time ___ ___ WR/RD mode ___ ___ WR to INT delay, Stand alone operation Data access time ___ after INT Stand alone operation CONDITIONS -55 C TA +125C 1/ 2/ Unless otherwise specified Group A Subgroup Device type 9 10,11 9 10,11 9 10,11 All 9 10,11 9 10,11 9,10,11 9 10,11 All tACCO See Figure 3 in Commercial Datasheet. NOTE 7 NOTE 4 and 7 tINTH NOTE 7, CL=50pF tDH NOTE 5, 6, 7 tP NOTE 6, 7 tWR tRD NOTE 6 NOTE 6 tACC1 NOTE 4, 6 9 10,11 tR1 NOTE 6 tINTL NOTE 6, CL=50pF tACC2 NOTE 4, 6 tIHWR tID Limits Min 1.6 2.5 1.62 2.55 175 225 All All All Limits Max 60 100 500 600 0.6 600 700 s s ns ns ns 50 s ns All 160 250 ns 9 10,11 9 10,11 9 10,11 All 140 225 1.0 1.7 70 110 ns NOTE 6, CL=50pF 9 10,11 All 100 150 ns NOTE 6 9 10,11 All 50 75 ns All All All All NOTE 1: VDD=+5V, VREF(+)=+5V; VREF(-)=GND=0V, unless otherwise specified.__ Specifications apply for RD mode (pin 7=0V). NOTE 2: All input control signals are specified with tr=tf=20ns (10 percent to 90 percent of +5.0V) and timed from a voltage level of 1.6V. NOTE 3: Tested at initial release and upon redesign. Sample size will be 116 units. NOTE 4: Measured with load circuits of Figure 2 in the Commercial Datasheet and defined as the time required for an output to cross 0.8V to 2.4V. NOTE 5: Defined as the time required for the data lines to change 0.5V when loaded with the circuits of Figures 2 in the Commercial Datasheet and is measured only for the initial test and after process or design changes which may affect tDH. NOTE 6: Refer to timing diagrams of Figure 3 of Commercial Datasheet. These parameters, if not tested, shall be guaranteed to the limits specified in Table 1. __ NOTE 7: Refer to timing diagram of Figure 3 (RD mode). These parameters are tested to Subgroup 9 under Group A test requirements. ---------------------------- Units Electrical Characteristics of MX7820/883B for /883B and SMD 5962-88650 19-0072 Page 4 of Rev. C 7 s ns TERMINAL CONNECTIONS J20, L20 J20, L20 1 VIN 11 VREF2 DB0(LSB) 12 VREF+ 3 DB1 13 CS 4 DB2 14 DB4 5 DB3 15 DB5 6 ___ 16 DB6 WR/RDY 7 Mode 17 DB7(MSB) 8 __ 18 ___ RD OFL 9 ___ 19 NC INT 10 GND 20 VDD 01 01 02 02 Package 20 pin CERDIP 20 pin LCC 20 pin CERDIP 20 pin LCC ---------------------------- ORDERING INFORMATION: MX7820UQ/883B MX7820UE/883B MX7820TQ/883B MX7820TE/883B Electrical Characteristics of MX7820/883B for /883B and SMD 5962-88650 SMD NUMBER 5962-8865001RA 5962-88650012C 5962-8865002RA 5962-88650022C 19-0072 Page 5 of Rev. C 7 QUALITY ASSURANCE Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in MilStd-883. Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015: 1. Test Condition, A, B, C, or D. 2. TA = +125C minimum. 3. Interim and final electrical test requirements shall be specified in Table 2. Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B, C, and D inspection. Group A inspection: 1. Tests as specified in Table 2. 2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted. Group C and D inspections: a. End-point electrical parameters shall be specified in Table 1. b. Steady-state life test, Method 1005 of Mil-Std-883: 1. Test condition A, B, C, D. 2. TA = +125C, minimum. 3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883. TABLE 2. ELECTRICAL TEST REQUIREMENTS Mil-Std-883 Test Requirements Interim Electric Parameters Method 5004 Final Electrical Parameters Method 5005 Group A Test Requirements Method 5005 Group C and D End-Point Electrical Parameters Method 5005 Subgroups per Method 5005, Table 1 1 1*, 2, 3, 4**, 9, 10, 11*** 1, 2, 3, 4**, 9, 10, 11*** 1 * ** PDA applies to Subgroup 1 only. Subgroup 4, Capacitance tests are performed at initial qual and upon redesign. Sample size will be 116 units. *** Subgroups 10 and 11 if not tested, are guaranteed to the limits specified in Table 1. ---------------------------- Electrical Characteristics of MX7820/883B for /883B and SMD 5962-88650 19-0072 Page 6 of Rev. C 7