5962-8865002RA - Maxim Integrated Products, Inc.

SCOPE: CMOS HIGHSPEED 8-BIT A/D CONVERTER WI TH TRACK AND HOLD

Device Type Generic Number

01 MX7820U(x)/883B

02 MX7820T(x)/883B

Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:

Outline Letter Mil-Std-1835 Case Outline Package Code

MAXIM SMD

Q R GDIP1-T20 or CDIP2-T20 20 LEAD CERDIP J20

E 2 CQCCI-N20 20 LEADLESS CHIP CARRIER L20

A bsolu te Maximum Ratings

Supply Voltage to GND ................................................................................... 0V, +7V

Digital Input Voltage ................................................................................... -0.3V, VDD

Digital Output Voltage ................................................................................. -0.3V, VDD

Positive Reference Voltage ..................................................................... VREF- to VDD

Negative Reference Voltage ..................................................................... 0V to VREF+

Input Voltage (VIN) .................................................................................... -0.3V to VDD

Lead Temperature (soldering, 10 seconds) ............................................................... +300°C

Storage Temperature .................................................................................. -65°C to +150 °C

Continuous Power Dissipation ............................................................................ TA=+70°C

20 pin CERDIP(derate 11.1mW/°C above +70°C) .................................................. 889mW

20 pin LCC(derate 9.1mW/°C above +70°C) ........................................................... 727mW

Junct ion Temper atur e TJ ........................................................................................ +150°C

Thermal Resista nce, J unction to Case, ΘJC

20 pin CERDIP.................................................................................................... 40°C/W

20 pin LCC ......................................................................................................... 20°C/W

Thermal Resistance, Junction to Ambient, ΘJA:

20 pin CERDIP................................................................................................... 90°C/W

20 pin LCC ...................................................................................................... 110°C/W

Recommended Operating Co ndit ions

Ambient Operating Range (TA) ......................................................…... -55°C to +125°C

Supply Voltage Range (VDD) ............................................................….. +4.75V to 5.25V

Positive Reference Voltage (VREF+) ................................................................….. +5.0V

Negative Reference Voltage (VREF-) ....................................................................….. 0V

Ground Potential (GND) .......................................................................................….... 0V

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those indicated in the operational section s of the sp ecifica tions is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

---------------------------- Electrical Characteristics of MX7820/883B 19-0072 Rev. C

for /883B and SMD 5962-88650 Page 2 of 7

TABLE 1. ELECTRICAL TE STS:

TEST Symbol

CONDITIONS

-55 °C ≤TA≤ +125°C 1/ 2/

Unless otherwise specified Group A

Subgroup Device

type Limits

Min Limits

Max Units

Resolution RES This is the mini mum resolution

for which no missing codes are

guaranteed.

1,2,3 All 8LSB

Total Unadjusted Error TUE Includes gain error, offset error

and linearity error. 1

2,3,12

1,2,3

±1.0

±0.5

±1.0

LSB

Analog Input Leakage

Current IIN 1,2,3 All ± 3.0 µA

Analog Input Capacitance CIA NOTE 3 4 All 60 pF

Reference Input Resistance RIN 1,2,3 All 1.0 4.0 kΩ

Digital Input High Level

Voltage VIH

__ ___ ___

CS, WR, and RD inputs

Mode Input (Pin 7) 1,2,3 All 2.4

3.5 V

Digital Input Low Level

Voltage VIL

__ ___ ___

CS, WR, and RD inputs

Mode Input (Pin 7) 1,2,3 All 0.8

1.5 V

Digital Input High Level

Current IIH

__ ___

CS and RD inputs

___

WR Inputs

Mode Input (Pin 7)

1,2,3 All

±1.0

±3.0

±200

µA

Digital Input Low Current IIL __ ___ ___

CS, WR, RD and mode inputs 1,2,3 All -1.0 µA

Digital Input Capacitance CID __ ___ ___ NOTE 3

CS, WR, RD and mode inputs 4All 8.0 pF

Digital O utput High Level

Voltage VOH ___ ___

DB0-DB7, OFL and INT outputs

ISOURCE=360µA

1,2,3 All 4.0 V

Digital Output Low Level

Voltage VOL ___ ___

DB0-DB7, OFL and INT outputs

ISINK=1.6mA

1,2,3 All 0.4 V

Floating State Leakage

Current IOUT DB0-DB7 1,2,3 All ±3.0 µA

Digital Output Capacitance COUT NOTE 3 4 All 8.0 pF

Supply Current from VDD IDD __ ___

CS=RD=0V 1,2,3 All 20.0 mA

Power Supply Sensitivity PSS VDD=5.0V±5% 1,2,3 All ±.25 LSB

__ __ ___

CS to RD/WR Setup Time tCSS NOTE 6 and 7 9,10,11 All 0ns

__ __ ___

CS to RD/WR Hold Time tCSH NOTE 6 and 7 9,10,11 All 0ns

CS to RDY delay tRDY NOTE 6 and 7, CL=50pF, pull-

up resistor=2.0kΩ9

10,11 All 70

100 ns

---------------------------- Electrical Characteristics of MX7820/883B 19-0072 Rev. C

for /883B and SMD 5962-88650 Page 3 of 7

TEST Symbol

CONDITIONS

-55 °C ≤TA≤ +125°C 1/ 2/

Unless otherwise specified Group A

Subgroup Device

type Limits

Min Limits

Max Units

___ Conversion Time

(RD mode) tCRD See Figure 3 in Commercial

Datasheet. NOTE 7 9

10,11 All 1.6

2.5 µs

___ Data Access Time

(RD mode) tACCO NOTE 4 and 7 9

10,11 All 1.62

2.55 µs

___ ___

__ RD to INT Delay

(RD mode)

tINTH NOTE 7, CL=50pF 9

10,11 All 175

225 ns

Data Hold Time tDH NOTE 5, 6, 7 9

10,11 All 60

100 ns

Delay Time Between

Conversion tPNOTE 6, 7 9

10,11 All 500

600 ns

Write Pulse Wid th tWR NOTE 6 9,10,11 All 0.6 50 µs

Delay Time between

___ ___

WR and RD Pulses

tRD NOTE 6 9

10,11 All 600

700 ns

Delay Access Time

___ __

WR/RD mode

tACC1 NOTE 4, 6 9

10,11 All 160

250 ns

___ ___

RD to INT d elay tR1 NOTE 6 9

10,11 All 140

225 ns

___ ___

WR to INT delay tINTL NOTE 6, CL=50pF 9

10,11 All 1.0

1.7 µs

Data Access Time

___ ___

WR/RD mode

tACC2 NOTE 4, 6 9

10,11 All 70

110 ns

___ ___

WR to INT delay, Stand

alone operation

tIHWR NOTE 6, CL=50pF 9

10,11 All 100

150 ns

Data access time ___

after INT

Stand alone operation

tID NOTE 6 9

10,11 All 50

75 ns

NOTE 1: VDD=+5V, VREF(+)=+5V; VREF(-)=GND=0V, unless other wise specified.__

Specifications apply for RD mode (pin 7=0V).

NOTE 2: All input control signals are specified with tr=tf=20ns (10 percent to 90 percent of +5.0V) and

timed from a voltage level of 1.6V.

NOTE 3: Tested at initial release and upon redesign. Sample size will be 116 units.

NOTE 4: Measured with load circuits of Figure 2 in the Commercial Datasheet and defined as the time

required for an output to cross 0.8V to 2.4V.

NOTE 5: Defined as the time required for the data lines to change 0.5V when loaded with the circuits of

Figures 2 in the Commercial Datasheet and is measured only for the initial test and after process

or design changes which may affect tDH.

NOTE 6: Refer to timing diagrams of Figure 3 of Commercial Datasheet. T hese parameters, if not tested,

shall be guaranteed to the limits specified in Table 1.

NOTE 7: Refer to timing diagram of Figure 3 (RD mode). These parameters are tested to Subgroup 9 under

Group A test requirements.

---------------------------- Electrical Characteristics of MX7820/883B 19-0072 Rev. C

for /883B and SMD 5962-88650 Page 4 of 7

TERMINAL CONNECTIONS

J20, L20 J20, L20

IN 11 VREF-

2 DB0(LSB) 12 VREF+

3DB1 13CS

4DB2 14DB4

5DB3 15DB5

6 ___

WR/RDY 16 DB6

7 Mode 17 DB7(MSB)

8__

RD 18 ___

OFL

9 ___

INT 19 NC

10 GND 20 VDD

Package ORDERING INFORMATION: SMD NUMBER

01 20 pin CERDIP MX7820UQ/883B 5962-8865001RA

01 20 pin LCC MX7820UE/883B 5962-88650012C

02 20 pin CERDIP MX7820TQ/883B 5962-8865002RA

02 20 pin LCC MX7820TE/883B 5962-88650022C

---------------------------- Electrical Characteristics of MX7820/883B 19-0072 Rev. C

for /883B and SMD 5962-88650 Page 5 of 7

QUALITY ASSURAN CE

Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-

Std-883.

Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:

1. Test Condition, A, B, C, or D.

2. TA = +125°C minimum.

3. Interim and final electrical test requirements shall be specified in Table 2.

Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,

C, and D inspection.

Group A inspection:

1. Tests as specified in Table 2.

2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.

Group C and D inspections:

a. End-point electrical parameters shall be specified in Table 1.

b. Steady-state life test, Method 1005 of Mil-Std-883:

1. Test condition A, B, C, D.

2. TA = +125°C, minimum.

3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.

TABLE 2. ELECTRICAL TEST REQUIR EMENTS

Mil-Std-883 Test Requirements Subgroups

per Method 5005, Table 1

Interim Electric Parameters

Method 5004 1

Final Electrical Parameters

Method 5005 1*, 2, 3, 4**, 9, 10, 11***

Group A Test Requirements

Method 5005 1, 2, 3, 4**, 9, 10, 11***

Group C and D End-Point Electrical Parameters

Method 5005 1

* PDA applies to Subgroup 1 only.

** Subgroup 4, Capacitance tests are performed at initial qual and upon redesign.

Sample size will be 116 units.

*** Subgroups 10 and 11 if not tested, are guaranteed to the limits specified in Table 1.

---------------------------- Electrical Characteristics of MX7820/883B 19-0072 Rev. C

for /883B and SMD 5962-88650 Page 6 of 7