CY62167EV30 MoBL®
16-Mbit (1M x 16 / 2M x 8) Static RAM
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document #: 38-05446 Rev. *F Revised June 17, 2009
Features
■TSOP I Package Configurable as 1M x 16 or 2M x 8 SRAM
■Very High Speed: 45 ns
■Temperature Ranges
❐Industrial: –40°C to +85°C
❐Automotive-A: –40°C to +85°C
■Wide Voltage Range: 2.20V to 3.60V
■Ultra Low Standby Power
❐Typical standby current: 1.5 μA
❐Maximum standby current: 12 μA
■Ultra Low Active Power
❐ Typical active current: 2.2 mA at f = 1 MHz
■Easy Memory Expansion with CE1, CE2, and OE Features
■Automatic Power Down when Deselected
■CMOS for Optimum Speed and Power
■Offered in Pb-free 48-Ball VFBGA and 48-Pin TSOP I
Packages
Functional Description
The CY62167EV30 is a high performance CMOS static RAM
organized as 1M words by 16 bits or 2M words by 8 bits. This
device features an advanced circuit design that provides an ultra
low active current. Ultra low active current is ideal for providing
More Battery Life™ (MoBL®) in portable applications such as
cellular telephones. The device also has an automatic power
down feature that reduces power consumption by 99 percent
when addresses are not toggling. Place the device into standby
mode when deselected (CE1 HIGH or CE2 LOW or both BHE and
BLE are HIGH). The input and output pins (I/O0 through I/O15)
are placed in a high impedance state when: the device is
deselected (CE1 HIGH or CE2 LOW), outputs are disabled (OE
HIGH), both Byte High Enable and Byte Low Enable are disabled
(BHE, BLE HIGH), or a write operation is in progress (CE1 LOW,
CE2 HIGH and WE LOW).
To write to the device, take Chip Enables (CE1 LOW and CE2
HIGH) and Write Enable (WE) input LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7) is
written into the location specified on the address pins (A0 through
A19). If Byte High Enable (BHE) is LOW, then data from the I/O
pins (I/O8 through I/O15) is written into the location specified on
the address pins (A0 through A19).
To read from the device, take Chip Enables (CE1 LOW and CE2
HIGH) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins appears
on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from
memory appears on I/O8 to I/O15. See the “Truth Table” on
page 9 for a complete description of read and write modes.
For best practice recommendations, refer to the Cypress
application note AN1064, SRAM System Guidelines.
1M × 16 / 2M x 8
RAM Array IO0–IO7
ROW DECODER
A 8
A 7
A 6
A 5
A 2
COLUMN DECODER
A11
A12
A13
A14
A15
SENSE AMPS
DATA IN DRIVERS
OE
A 4
A 3IO8–IO15
WE
BLE
BHE
A16
A 0
A 1
A17
A 9
A18
A10
CE2
CE1
A19
BYTE
Power Down
Circuit BHE
BLE
CE2
CE1
Logic Block Diagram
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 2 of 14
Pin Configuration
Figure 1. 48-Ball VFBGA (6 x 7 x 1mm) / (6 x 8 x 1mm) Top View [1, 2, 3]
Figure 2. 48-Pin TSOP I Top View [3, 4]
Product Portfolio
Product Range VCC Range (V) Speed
(ns)
Power Dissipation
Operating ICC (mA) Standby ISB2
(μA)
f = 1 MHz f = fmax
Min Typ[5] Max Typ[5] Max Typ[5] Max Typ[5] Max
CY62167EV30LL Industrial/Auto-A 2.2 3.0 3.6 45 2.2 4.0 25 30 1.5 12
WE
A11
A10
A6
A0
CE1
I/O
10
I/O
8
I/O
9
A4
A5
I/O
11
I/O
13
I/O
12
I/O
14
I/O
15
V
SS
A9
A8
OE
Vss
A7
I/O
0
BHE
CE2
A17
BLE
V
CC
I/O
2
I/O
1
I/O
3
I/O
4
I/O
5I/O
6
I/O
7
A15
A14
A13
A
12
A19
A18 NC
3
26
5
4
1
D
E
B
A
C
F
G
H
A16
NC
VCC
A1A2
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A15
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE
CE
2
NC
BHE
BLE
A18
A17
A7
A6
A5
A4
A3
A2
A1
A16
BYTE
Vss
IO15/A20
IO7
IO14
IO6
IO13
IO5
IO12
IO4
Vcc
IO11
IO3
IO10
IO2
IO9
IO1
IO8
IO0
OE
Vss
CE
1
A0
Notes
1. The information related to 6 x 7 x 1 mm VFBGA package is preliminary.
2. Ball H6 for the VFBGA package can be used to upgrade to a 32M density.
3. NC pins are not connected on the die.
4. The BYTE pin in the 48-TSOPI package has to be tied to VCC to use the device as a 1M X 16 SRAM. The 48-TSOPI package can also be used as a 2M X 8 SRAM
by tying the BYTE signal to VSS. In the 2M x 8 configuration, Pin 45 is A20, while BHE, BLE and IO8 to IO14 pins are not used.
5. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C.
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 3 of 14
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................ –65°C to + 150°C
Ambient Temperature with
Power Applied ........................................... –55°C to + 125°C
Supply Voltage to Ground
Potential .................................–0.3V to 3.9V VCC(max) + 0.3V
DC Voltage Applied to Outputs
in High Z State[6, 7]..................–0.3V to 3.9V VCC(max) + 0.3V
DC Input Voltage[6, 7] ...........–0.3V to 3.9V (VCC(max) + 0.3V
Output Current into Outputs (LOW) ............................ 20 mA
Static Discharge Voltage........................................... >2001V
(MIL-STD-883, Method 3015)
Latch up Current...................................................... >200 mA
Operating Range
Device Range Ambient
Temperature VCC[8]
CY62167EV30LL Industrial/
Auto-A –40°C to +85°C 2.2V to 3.6V
Electrical Characteristics
Over the Operating Range
Parameter Description Test Conditions 45 ns (Industrial/Auto-A) Unit
Min Typ[5] Max
VOH Output HIGH Voltage 2.2 < VCC < 2.7 IOH = –0.1 mA 2.0 V
2.7 < VCC < 3.6 IOH = –1.0 mA 2.4 V
VOL Output LOW Voltage 2.2 < VCC < 2.7 IOL = 0.1 mA 0.4 V
2.7 < VCC < 3.6 IOL = 2.1mA 0.4 V
VIH Input HIGH Voltage 2.2 < VCC < 2.7 1.8 VCC + 0.3V V
2.7 < VCC < 3.6 2.2 VCC + 0.3V V
VIL Input LOW Voltage 2.2 < VCC < 2.7 –0.3 0.6 V
2.7 < VCC < 3.6 For VFBGA package –0.3 0.8 V
For TSOP I package –0.3 0.7[9] V
IIX Input Leakage Current GND < VI < VCC –1 +1 μA
IOZ Output Leakage Current GND < VO < VCC, Output Disabled –1 +1 μA
ICC VCC Operating Supply
Current
f = fMAX = 1/tRC VCC = VCC(max)
IOUT = 0 mA
CMOS levels
25 30 mA
f = 1 MHz 2.2 4.0 mA
ISB1 Automatic CE Power Down
Current—CMOS Inputs CE1 > VCC − 0.2V or CE2 < 0.2V
VIN > VCC − 0.2V, VIN < 0.2V,
f = fMAX (Address and Data Only),
f = 0 (OE, WE, BHE and BLE), VCC =3.60V
1.5 12 μA
ISB2[10] Automatic CE Power Down
Current—CMOS Inputs CE1 > VCC − 0.2V or CE2 < 0.2V,
VIN > VCC − 0.2V or VIN < 0.2V,
f = 0, VCC = 3.60V
1.5 12 μA
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions Max Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VCC = VCC(typ)
10 pF
COUT Output Capacitance 10 pF
Notes
6. VIL(min) = –2.0V for pulse durations less than 20 ns.
7. VIH(max) = VCC + 0.75V for pulse durations less than 20 ns.
8. Full Device AC operation assumes a 100 μs ramp time from 0 to VCC (min) and 200 μs wait time after VCC stabilization.
9. Under DC conditions the device meets a VIL of 0.8V. However, in dynamic conditions Input LOW Voltage applied to the device must not be higher than 0.7V. This is
applicable to TSOP I package only.
10. Only chip enables (CE1 and CE2), byte enables (BHE and BLE) and BYTE must be tied to CMOS levels to meet the ISB2 / ICCDR spec. Other inputs can be left floating
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 4 of 14
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions VFBGA
(6 x 7 x 1mm)
VFBGA
(6 x 8 x 1mm) TSOP I Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
27.74 55 60 °C/W
ΘJC Thermal Resistance
(Junction to Case)
9.84 16 4.3 °C/W
Shaded areas contain preliminary information.
Figure 3. AC Test Loads and Waveforms
Parameters 2.2V to 2.7V 2.7V to 3.6V Unit
R1 16667 1103 Ω
R2 15385 1554 Ω
RTH 8000 645 Ω
VTH 1.20 1.75 V
Data Retention Characteristics
Over the Operating Range
Parameter Description Conditions Min Typ[5] Max Unit
VDR VCC for Data Retention 1.5 V
ICCDR[10] Data Retention Current VCC = 1.5V to 3.0V, CE1 > VCC − 0.2V, CE2
< 0.2V, VIN > VCC − 0.2V or VIN < 0.2V
Industrial/
Auto-A
-45ZXI
(TSOP I)
8μA
VCC = 1.5V, CE1 > VCC − 0.2V, CE2 < 0.2V,
VIN > VCC − 0.2V or VIN < 0.2V
Industrial -45BAXI/
-45BVXI/
-45BVI
(VFBGA)
10 μA
tCDR[11] Chip Deselect to Data
Retention Time
0ns
tR[12] Operation Recovery Time tRC ns
Figure 4. Data Retention Waveform
V
CC
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10% 90%
10%
Rise Time = 1 V/ns Fall Time = 1 V/ns
OUTPUT V
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
Notes
11. Tested initially and after any design or process changes that may affect these parameters.
12. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 μs or stable at VCC(min) > 100 μs.
13. BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling the chip enable signals or by disabling both BHE and BLE.
VCC(min)
VCC(min)
tCDR
VDR >1.5 V
DATA RETENTION MODE
tR
CE1 or
VCC
BHE.BLE
CE2
or
[13]
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 5 of 14
Switching Characteristics
Over the Operating Range[14, 15]
Parameter Description 45 ns (Industrial/Auto-A) Unit
Min Max
READ CYCLE
tRC Read Cycle Time 45 ns
tAA Address to Data Valid 45 ns
tOHA Data Hold from Address Change 10 ns
tACE CE1 LOW and CE2 HIGH to Data Valid 45 ns
tDOE OE LOW to Data Valid 22 ns
tLZOE OE LOW to LOW Z[16] 5ns
tHZOE OE HIGH to High Z[16, 17] 18 ns
tLZCE CE1 LOW and CE2 HIGH to Low Z[16] 10 ns
tHZCE CE1 HIGH and CE2 LOW to High Z[16, 17] 18 ns
tPU CE1 LOW and CE2 HIGH to Power Up 0 ns
tPD CE1 HIGH and CE2 LOW to Power Down 45 ns
tDBE BLE / BHE LOW to Data Valid 45 ns
tLZBE BLE / BHE LOW to Low Z[16] 10 ns
tHZBE BLE / BHE HIGH to HIGH Z[16, 17] 18 ns
WRITE CYCLE[18]
tWC Write Cycle Time 45 ns
tSCE CE1 LOW and CE2 HIGH to Write End 35 ns
tAW Address Setup to Write End 35 ns
tHA Address Hold from Write End 0 ns
tSA Address Setup to Write Start 0 ns
tPWE WE Pulse Width 35 ns
tBW BLE / BHE LOW to Write End 35 ns
tSD Data Setup to Write End 25 ns
tHD Data Hold from Write End 0 ns
tHZWE WE LOW to High-Z[16, 17] 18 ns
tLZWE WE HIGH to Low-Z[16] 10 ns
Notes
14. Test conditions for all parameters other than tri-state parameters assume signal transition time of 1 V/ns, timing reference levels of VCC(typ)/2, input pulse levels of 0
to VCC(typ), and output loading of the specified IOL/IOH as shown in “AC Test Loads and Waveforms” on page 4.
15. AC timing parameters are subject to byte enable signals (BHE or BLE) not switching when chip is disabled. See application note AN13842 for further clarification.
16. At any temperature and voltage condition, tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any device.
17. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high impedance state.
18. The internal write time of the memory is defined by the overlap of WE, CE1 = VIL, BHE or BLE or both = VIL, and CE2 = VIH. All signals must be ACTIVE to initiate a
write and any of these signals can terminate a write by going INACTIVE. The data input setup and hold timing must refer to the edge of the signal that terminates the write.
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 6 of 14
Switching Waveforms
Figure 5 shows address transition controlled read cycle waveforms.[19, 20]
Figure 5. Read Cycle No. 1
Figure 6 shows OE controlled read cycle waveforms.[20, 21]
Figure 6. Read Cycle No. 2
PREVIOUS DATA VALID DATA VALID
RC
tAA
tOHA
tRC
ADDRESS
DATA OUT
50%
50%
DATA VALID
tRC
tACE
tDOE
tLZOE
tLZCE
tPU
HIGH IMPEDANCE
tHZOE
tPD
tHZBE
tLZBE
t
HZCE
tDBE
OE
CE1
ADDRESS
CE2
BHE/BLE
DATA OUT
VCC
SUPPLY
CURRENT
HIGH
ICC
ISB
IMPEDANCE
Notes
19. The device is continuously selected. OE, CE1 = VIL, BHE, BLE or both = VIL, and CE2 = VIH.
20. WE is HIGH for read cycle.
21. Address valid before or similar to CE1, BHE, BLE transition LOW and CE2 transition HIGH.
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 7 of 14
Figure 7 shows WE controlled write cycle waveforms.[18, 22, 23]
Figure 7. Write Cycle No. 1
Switching Waveforms (continued)
tHD
tSD
tPWE
tSA
tHA
tAW
tSCE
tWC
tHZOE
VALID DATA
tBW
NOTE 24
CE1
ADDRESS
CE2
WE
DATA I/O
OE
BHE/BLE
Notes
22. Data IO is high impedance if OE = VIH.
23. If CE1 goes HIGH and CE2 goes LOW simultaneously with WE = VIH, the output remains in a high impedance state.
24. During this period the I/Os are in output state. Do not apply input signals.
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 8 of 14
Figure 8 shows CE1 or CE2 controlled write cycle waveforms.[18, 22, 23]
Figure 8. Write Cycle No. 2
Figure 9 shows WE controlled, OE LOW write cycle waveforms.[23]
Figure 9. Write Cycle No. 3
Switching Waveforms (continued)
tHD
tSD
tPWE
tHA
tAW
tSCE
tWC
tHZOE
VALID DATA
tBW
tSA
NOTE 24
CE1
ADDRESS
CE2
WE
DATA I/O
OE
BHE/BLE
VALID DATA
tHD
tSD
tLZWE
tPWE
tSA
tHA
tAW
tSCE
tWC
tHZWE
tBW
NOTE 24
CE
1
ADDRESS
CE
2
WE
DATA I/O
BHE
/BLE
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 9 of 14
Figure 10 shows BHE/BLE controlled, OE LOW write cycle waveforms.[23]
Figure 10. Write Cycle No. 4
Truth Table
CE1CE2WE OE BHE BLE Inputs/Outputs Mode Power
HXXXXXHigh Z Deselect / Power Down Standby (ISB)
XLXXXXHigh Z Deselect / Power Down Standby (ISB)
XXXXHHHigh Z Deselect / Power Down Standby (ISB)
L H H L L L Data Out (I/O0–I/O15) Read Active (ICC)
L H H L H L Data Out (I/O0–I/O7);
High Z (I/O8–I/O15)
Read Active (ICC)
LHHLLHHigh Z (I/O
0–I/O7);
Data Out (I/O8–I/O15)
Read Active (ICC)
L H H H L H High Z Output Disabled Active (ICC)
LHHHHLHigh Z Output Disabled Active (I
CC)
L H H H L L High Z Output Disabled Active (ICC)
L H L X L L Data In (I/O0–I/O15) Write Active (ICC)
L H L X H L Data In (I/O0–I/O7);
High Z (I/O8–I/O15)Write Active (ICC)
LHLXLHHigh Z (I/O
0–I/O7);
Data In (I/O8–I/O15)
Write Active (ICC)
Switching Waveforms (continued)
tHD
tSD
tSA
tHA
tAW
tWC
VALID DATA
tBW
tSCE
tPWE
NOTE 24
CE
1
ADDRESS
CE
2
WE
DATA IO
BHE
/BLE
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 10 of 14
Ordering Information
Speed
(ns) Ordering Code
Package
Diagram Package Type Operating
Range
45 CY62167EV30LL-45BAXI 001-13297 48-ball VFBGA (6 x 7 x 1 mm) (Pb-free) Industrial
CY62167EV30LL-45BVI 51-85150 48-ball VFBGA (6 x 8 x 1 mm)
CY62167EV30LL-45BVXI 51-85150 48-ball VFBGA (6 x 8 x 1 mm) (Pb-free)
CY62167EV30LL-45ZXI 51-85183 48-pin TSOP I (Pb-free)
CY62167EV30LL-45BVXA 51-85150 48-ball VFBGA (6 x 8 x 1 mm) (Pb-free) Automotive-A
CY62167EV30LL-45ZXA 51-85183 48-pin TSOP I (Pb-free)
Shaded areas contain preliminary information. Contact your local Cypress sales representative for availability of these parts.
Package Diagrams
Figure 11. 48-Ball VFBGA (6 x 7 x 1 mm), 001-13297
NOTES:
1. ALL DIMENSION ARE IN MM [MAX/MIN]
2. JEDEC REFERENCE : MO-216
3. PACKAGE WEIGHT : 0.03g 001-13297-*A
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 11 of 14
Figure 12. 48-Ball VFBGA (6 x 8 x 1 mm), 51-85150
Package Diagrams (continued)
A
1
A1 CORNER
0.75
0.75
Ø0.30±0.05(48X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
0.21±0.05
1.00 MAX
C
SEATING PLANE
0.55 MAX.
0.25 C
0.10 C
A1 CORNER
TOP VIEW BOTTOM VIEW
234
3.75
5.25
B
C
D
E
F
G
H
65
465231
D
H
F
G
E
C
B
A
6.00±0.10
8.00±0.10
A
8.00±0.10
6.00±0.10
B
1.875
2.625
0.26 MAX.
51-85150-*D
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 12 of 14
Figure 13. 48-Pin TSOP I (12 mm x 18.4 mm x 1.0 mm), 51-85183
Package Diagrams (continued)
1N
0.020[0.50]
0.007[0.17]
0.037[0.95]
0.002[0.05]
0°-5°
MAX.
0.028[0.70]
0.010[0.25]
0.004[0.10]
0.011[0.27]
0.041[1.05]
0.047[1.20]
0.472[12.00]
0.724 [18.40]
0.787[20.00]
0.006[0.15]
TYP.
0.020[0.50]
0.008[0.21] GAUGE PLANE
SEATING PLANE
0.004[0.10]
DIMENSIONS IN INCHES[MM] MIN.
MAX.
JEDEC # MO-142
51-85183-*A
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CY62167EV30 MoBL®
Document #: 38-05446 Rev. *F Page 13 of 14
Document History Page
Document Title: CY62167EV30 MoBL® 16-Mbit (1M x 16 / 2M x 8) Static RAM
Document Number: 38-05446
REV. ECN NO. Orig. of
Change
Submission
Date Description of Change
** 202600 AJU 01/23/2004 New Data Sheet
*A 463674 NXR See ECN Converted from Advance Information to Preliminary
Removed ‘L’ bin and 35 ns speed bin from product offering
Modified Data sheet to include x8 configurability.
Changed ball E3 in FBGA pinout from DNU to NC
Changed the ISB2(Typ) value from 1.3 μA to 1.5 μA
Changed the ICC(Max) value from 40 mA to 25 mA
Changed Vcc stabilization time in footnote #9 from 100 µs to 200 µs
Changed the AC Test Load Capacitance value from 50 pF to 30 pF
Corrected typo in Data Retention Characteristics (tR) from 100 µs to tRC ns
Changed tOHA, tLZCE, tLZBE, and tLZWE from 6 ns to 10 ns
Changed tLZOE from 3 ns to 5 ns.
Changed tHZOE, tHZCE, tHZBE, and tHZWE from 15 ns to 18 ns
Changed tSCE, tAW, and tBW from 40 ns to 35 ns
Changed tPE from 30 ns to 35 ns
Changed tSD from 20 ns to 25 ns
Updated 48 ball FBGA Package Information.
Updated the Ordering Information table
*B 469169 NSI See ECN Minor Change: Moved to external web
*C 1130323 VKN See ECN Converted from preliminary to final
Changed ICC max spec from 2.8 mA to 4.0 mA for f=1MHz
Changed ICC typ spec from 22 mA to 25 mA for f=fmax
Changed ICC max spec from 25 mA to 30 mA for f=fmax
Added VIL spec for TSOP I package and footnote# 9
Added footnote# 10 related to ISB2 and ICCDR
Changed ISB1 and ISB2 spec from 8.5 μA to 12 μA
Changed ICCDR spec from 8 μA to 10 μA
Added footnote# 15 related to AC timing parameters
*D 1323984 VKN/AESA See ECN Modified ICCDR spec for TSOP I package
Added 48-Ball VFBGA (6 x 7 x 1mm) package
Added footnote# 1 related to VFBGA (6 x 7 x 1mm) package
Updated Ordering Information table
*E 2678799 VKN/PYRS 03/25/2009 Added Automotive-A information
*F 2720234 VKN/AESA 06/17/2009 Included -45BVXA part in the Ordering information table
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Document #: 38-05446 Rev. *F Revised June 17, 2009 Page 14 of 14
MoBL is a registered trademark and More Battery Life is a trademark of Cypress Semiconductor. All product and company names mentioned in this document are the trademarks of their respective holders.
CY62167EV30 MoBL®
© Cypress Semiconductor Corporation, 2004-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
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Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
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