Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201089D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • October 5, 2009 1
DATA SHEET
SKY65053-377LF: 0.45-6.0 GHz Low Noise Transistor
Applications
Wireless infrastructure: WLAN, WiMAX, broadband, cellular base
stations
Test instrumentation
LNA for GPS receivers
Satellite receivers
Features
Externally matched for wideband operation
Noise Figure = 0.6 dB @ 2.4 GHz of device only
Noise Figure = 0.8 dB @ 2.4 GHz including matching network
loss
Gain = 16.5 dB @ 2.4 GHz, 5 V, 55 mA
OIP3 = +33.5 dBm @ 2.4 GHz, 5 V, 55 mA
OP1dB = +15.5 dBm @ 2.4 GHz, 5 V, 55 mA
Adjustable supply current, 15 to 100 mA
Unconditionally stable to 18 GHz with reference design circuit
Small, QFN (4-pin, 2 x 2 mm) Pb-free package (MSL3, 260 C
per JEDEC J-STD-020)
Figure 1. SKY65053-377LF Block Diagram
Description
The SKY65053-377LF is a high performance, n-channel low-
noise transistor. The device is fabricated from Skyworks
advanced depletion mode pHEMT process and is provided in a 2 x
2 mm, 4-pin Quad Flat No-Lead (QFN) package.
The transistor’s low Noise Figure (NF), high gain, and excellent 3rd
Order Intercept Point (IP3) allow the device to be used in various
receiver and transmitter applications.
A functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
12
43
DRAIN
SOURCE
SOURCE
GATE
Figure 2. SKY65053-377LF Pinout – 4-Pin QFN
(Top View)
DATA SHEET • SKY65053-377LF LOW NOISE TRANSISTOR
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Table 1. SKY65053-377LF Signal Descriptions
Pin # Name Description Pin # Name Description
1 DRAIN RF output. Supply voltage required through
external RF choke.
3 GATE RF input
2 SOURCE Source lead. Provides DC self-biasing point
and AC ground.
4 SOURCE Source lead. Provides DC self-biasing point
and AC ground.
Functional Description
The SKY65053-377LF is a depletion mode pHEMT designed for
low noise, high frequency applications that demand high linearity.
The SKY65053-377LF has a typical NF of 0.8 dB tested at the
2.4 GHz wireless LAN frequency band. A gain of 16.5 dB typical is
achieved using the same circuit. The SKY65053-377LF can be
used for any application from 450 MHz up to 6 GHz.
Biasing
To properly bias a depletion mode pHEMT, both the gate and
drain of the device must be properly biased. At VGS = 0 V and VDS
≥ 2V, the device is in its saturated state and draws the maximum
amount of current, IDSS. Typically, the device achieves the best
balance of noise and linearity performance at VDS = 5V and
IDS = 55 mA. To control IDS, VGS must be biased with a negative
voltage supply.
To eliminate the need for a negative DC supply, self-biasing
should be used when a resistor is placed between one of the
source leads and ground. A bypass capacitor should be placed in
parallel to this resistor to provide an RF ground and to ensure
performance at the operating frequency remains unchanged.
When current flows from drain to source and through the resistor,
the source voltage becomes biased above DC ground. The gate
pin of the device should be left unbiased at 0 V, which creates the
desired negative VGS value. This greatly simplifies the design by
eliminating the need for a second DC supply.
RF Matching Networks
The circuit schematic (see Figure 12) shows the recommended RF
matching network used for the 2.4 GHz wireless LAN frequency
band. Components C1, C2, L1, and L2 provide the necessary
impedance match for NF and input return loss. Circuit board and
input matching structure losses on the input of the amplifier add
directly to the overall NF of the amplifier. It is critical to minimize
RF trace lengths and to use high-Q components to achieve
optimal NF performance.
Components R1 and C10 provide self-bias for the device and RF
grounding for one of the two source leads. Component C6 is
placed on the opposing source lead and is used to tune the
transistor’s internal source inductance.
The effect of source inductance varies with frequency. Too little
source inductance increases gain and high frequency stability, but
at the cost of decreased in-band stability. Too much source
inductance decreases high frequency stability and gain, but
increases in-band stability. It is very important to find the
optimum tuning of source inductance that balances all of these
variables.
The output matching topology is typical for an RF amplifier.
Component L4 is the RF choke that prevents RF signals from
reaching the DC supply. Component C11 is the output DC
blocking capacitor. Components C12 and L6 provide the best
impedance match for best linearity performance.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY65053-377LF are
provided in Table 2. The recommended operating conditions are
specified in Table 3 and electrical specifications are provided in
Table 4.
Performance characteristics for the SKY65053-377LF are
illustrated in Figures 3 through 10.
DATA SHEET • SKY65053-377LF LOW NOISE TRANSISTOR
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201089D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • October 5, 2009 3
Table 2. SKY65053-377LF Absolute Maximum Ratings
Parameter Symbol Minimum Typical Maximum Units
Supply voltage VDD 6 V
Input power PIN +15 dBm
Gate to source voltage VGS –5.0 V
Gate to drain voltage VGD –5.0 V
Drain to source current IDS 110 mA
Gate to drain current IGD 100 μA
Power dissipation PDIS 240 mW
Junction temperature TJ 150 C
Storage temperature TSTG –65 +125 C
Operating temperature TOP –40 +85 C
Thermal resistance ΘJC 220 C/W
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65053-377LF Recommended Operating Conditions
Parameter Symbol Minimum Typical Maximum Units
Operating frequency f 0.45 6.0 GHz
Supply voltage VDD 2.00 5.00 5.25 V
Supply current IDD 15 55 100 mA
Table 4. SKY65053-377LF Electrical Specifications (Note 1) (1 of 2)
(TOP = +25 C, Characteristic Impedance [ZO] = 50 Ω, VDD = 5 V, IDD = 55 mA, Parameters Include Recommended Matching Networks,
Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Saturated drain current IDSS VDS = 6 V, VGS = 0 V 80 100 120 mA
Pinchoff voltage VP VDS = 6 V, IDS = 2.5% of
IDSS
–0.95 –0.80 –0.65 V
Transconductance gM VDS = 6 V,
gM = ΔIDS/ΔVGS,
measured at IDS = 20% of
IDSS
80 120 160 mS
Gate leakage current IGSS VGD = VGS = –3 V 1 200 μA
Noise Figure NF1 (Note 2)
NF2 (Note 3)
0.6
0.8
dB
dB
Gain |S21| 16.5 dB
Input return loss |S11| –12 dB
Output return loss |S22| –7 dB
DATA SHEET • SKY65053-377LF LOW NOISE TRANSISTOR
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4 October 5, 2009 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201089D
Table 4. SKY65053-377LF Electrical Specifications (Note 1) (2 of 2)
(TOP = +25 C, Characteristic Impedance [ZO] = 50 Ω, VDD = 5 V, IDD = 55 mA, Parameters Include Recommended Matching Networks,
Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Reverse isolation |S12| –25 dB
3rd Order Output Intercept Point OIP3 POUT = +5 dBm/tone,
1 MHz spacing
+33.5 dBm
3rd Order Input Intercept Point IIP3 POUT = +5 dBm/tone,
1 MHz spacing
+17 dBm
1 dB Output Compression Point OP1dB +15.5 dBm
1 dB Input Compression Point IP1dB 0 dBm
Stability Unconditionally stable up
to 18 GHz
>1 K
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Exceeding any of the conditions
listed here may result in permanent damage to the device. Operation at elevated temperatures may reduce reliability of the device.
Note 2: NF of device only. Input RF connector, board, and input matching network loss de-embedded from measurement.
Note 3: NF of device and matching network. Input RF connector and board loss de-embedded from measurement.
Typical Performance Characteristics
(TOP = +25 C, Characteristic Impedance [ZO] = 50 Ω, VDD = 5 V, IDD = 55 mA, Includes Recommended 2.4 GHz Matching Network, Unless
Otherwise Noted)
12
13
10
11
14
15
16
17
18
19
20
1.61.8 2.0 2.2 2.4 2.62.8 3.0
Frequency (GHz)
Small Signal Gain (dB)
–
40
o
C
+25
o
C
+85
o
C
Figure 3. Small Signal Gain vs Frequency Over Temperature
(PIN = –20 dBm)
–25
–20
–15
–10
–5
0
Input Return Loss (dB)
–
40
o
C
+25
o
C
+85
o
C
1.61.8 2.0 2.2 2.4 2.62.8 3.0
Frequency (GHz)
Figure 4. Input Return Loss vs Frequency Over Temperature
(PIN = –20 dBm)
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–30
–25
–20
–15
–50
–45
–40
–35
–10
–5
0
Recverse Isolation (dB)
1.61.8 2.0 2.2 2.4 2.62.8 3.0
Frequency (GHz)
–
40
o
C
+25
o
C
+85
o
C
Figure 5. Reverse Isolation vs Frequency Over Temperature
(PIN = –20 dBm)
0
0.2
0.4
0.6
0.8
1.0
1.2
Noise Figure (dB)
2.30 2.35 2.40 2.45 2.50 2.55 2.60
Frequency (GHz)
–
40
o
C
+25
o
C
+85
o
C
Figure 7. Noise Figure vs Frequency Over Temperature
14.5
15.0
14.0
15.5
16.0
16.5
17.0
17.5
Gain (dB)
–20 –15 –10 –5 0 +5
Input Power (dBm)
–
40
o
C
+25
o
C
+85
o
C
Figure 9. Gain vs Input Power Over Temperature
(f = 2.4 GHz)
–12
–10
–8
–6
–20
–18
–16
–14
–4
–2
0
Output Return Loss (dB)
1.61.8 2.0 2.2 2.4 2.62.8 3.0
Frequency (GHz)
–
40
o
C
+25
o
C
+85
o
C
Figure 6. Output Return Loss vs Frequency Over Temperature
(PIN = –20 dBm)
+10
+15
0
+5
+20
+25
+30
+35
+40
OIP3 (dBm)
4.0 4.2 4.4 4.64.8 5.0 5.2
Supply Voltage (V)
–40 oC
+25 oC
+85 oC
Figure 8. OIP3 vs Supply Voltage
(f = 2.4 GHz, Tone Spacing = 10 MHz, POUT = +5 dBm/Tone)
2
3
1
0
4
5
6
7
8
μ1, μ2
024681012141618
Frequency (GHz)
μ1 –
40
o
C
μ1
+25
o
C
μ1
+85
o
C
μ2 –
40
o
C
μ2
+25
o
C
μ2
+85
o
C
Figure 10. Stability vs Frequency Over Temperature
(PIN = –20 dBm)
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Evaluation Board Description
The SKY65053-377LF Evaluation Board is used to test the
performance of the SKY65053-377LF low noise transistor. An
assembly drawing for the Evaluation Board is shown in Figure 11.
The Evaluation Board schematic diagram is shown in Figure 12.
Table 5 provides the Bill of Materials (BOM) list for Evaluation
Board components.
Circuit Design Considerations
Input and output traces have been minimized to reduce losses. All
surface mount components are 0402-sized to reduce component
parasitics. Use of 0603 or larger components is not
recommended. Component spacing has also been minimized. The
board is provisioned with two RF connectors and a DC launch. RF
connector and board loss up to component C1 is approximately
0.1 dB at 2.4 GHz.
It is very important to place multiple ground vias as close to shunt
components as possible. This ensures proper grounding and
circuit performance.
Board material is 10 mil VT47 FR4 with 1 oz. copper cladding.
The RF traces are 50 Ω.
Caution: Do not ground the exposed pad.
Evaluation Board Test Procedure
Step 1: Connect RF test equipment to amplifier input/output SMA
connectors.
Step 2: Connect DC ground.
Step 3: Connect VDD to a +5 V supply with a current limit of
100 mA. Verify that the board draws approximately
55 mA.
Step 4: Apply RF signal or noise source.
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201089D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • October 5, 2009 7
S1512
Caution: Do not ground the exposed pad.
Figure 11. SKY65053-377LF Evaluation Board Assembly Diagram
C1
C2
C4
C5
L1
L2
L5
L4
L3
RF Output
VDD
RF Input
R1
R2
S1509
C11
C6
C12
L6
C3
C13
C14
C10 C7
C15
Figure 12. SKY65053-377LF Evaluation Board Schematic
DATA SHEET • SKY65053-377LF LOW NOISE TRANSISTOR
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Table 5. SKY65053-377LF Evaluation Board Bill of Materials
Component Value Size Manufacturer/Part Series
C1 33 pF 0402 Murata GRM015
C2 1.2 pF 0402 Murata GJM015
C3 0.3 pF 0402 Murata GJM015
C4, C5, C7, C8, C9, C14 DNP
C6 10000 pF 0402 Murata GRM015
C10 10000 pF 0402 Murata GRM015
C11 3.6 pF 0402 Murata GJM015
C12 0.3 pF 0402 Murata GJM015
C13 3.9 pF 0402 Murata GRM015
C15 1000 pF 0402 Murata GRM015
L1 12 nH 0402 Coilcraft HP
L2 2 nH 0402 Coilcraft HP
L3 DNP
L4 5.6 nH 0402 Coilcraft HP
L5 0 Ω 0402 Panasonic
L6 6.8 nH 0402 Taiyo Yuden HK
R1 4.7 Ω 0402 Panasonic
R2 39 Ω 0402 Panasonic
Package Dimensions
The PCB layout footprint for the SKY65053-377LF is shown in
Figure 13. Typical case markings are shown in Figure 14.
Package dimensions for the 4-pin QFN are shown in Figure 15,
and tape and reel dimensions are provided in Figure 16.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
THE SKY65053-377LF is rated to Moisture Sensitivity Level 3
(MSL3) at 260 C. It can be used for lead or lead-free soldering.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
DATA SHEET • SKY65053-377LF LOW NOISE TRANSISTOR
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201089D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • October 5, 2009 9
4X 0.600
2X 0.300
2X 0.600
0.600
Detail B Detail A (3X)
0.650
0.55
0.55
0.40
0.30
1.300
Pin 1
Package Outline
1.250
See Detail A for
Solderable Area
See Detail B for
Solderable Area
S1416
Caution: Do not ground the exposed pad.
Figure 13. SKY65053-377LF PCB Layout Footprint
Pin 1
Indicator
Skyworks Part #
S53
Figure 14. Typical Case Markings
(Top View)
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S1411
2.00
0.02+0.03/–0.02
0.6+0.1/–0.15
1.2+0.1/–0.15
0.55+0.05/–0.04
0.4 ± 0.1
0.4 ± 0.1
0.4 ± 0.05 0.3 ± 0.05
R 0.15
(0.600)
(0.300)
A
B
C
2.00
2X Pin 1
Indicator
1.25 1.30
2X 0.65
Detail B
4X 0.20 Min
Detail A
Exposed Pad
0.10 C
2X
0.10 C
0.10 C0.08
3
5
C
4X
0.10 CAB
M
Top View Side View Bottom View
Detail B
(3 Places)
Detail A
All measurements are in millimeters.
Dimensioning and tolerancing according to ASME Y14.5M-1994.
Figure 15. SKY65053-377LF 4-Pin QFN Package Dimensions
DATA SHEET • SKY65053-377LF LOW NOISE TRANSISTOR
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201089D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • October 5, 2009 11
Notes:
1. Carrier tape: black conductive polystyrene.
2. Cover tape material: transparent conductive HSA.
3. Cover tape size: 5.40 mm width.
4. Ten sprocket hole pitch cumulative tolerance ±0.20 mm.
5. Ao and Bo measurement point to be 0.30 mm from bottom pocket.
6. All measurements are in millimeters.
2.30 (Ao)
2.30 (Bo)
8.00 +0.30/–0.10
4.00 (Note 4)4.00 ± 0.10
3.50 ± 0.05
2.00 ± 0.05 1.75 ± 0.10
0.30 ± 0.05 (T)
A
B
1.00 (Ko)
A
B
B
A
Pin #1
∅1.50+ 0.10/–0.00
∅1.00 Min.
R0.30 Typ.
S1555
Figure 16. SKY65053-377LF Tape and Reel Dimensions
DATA SHEET • SKY65053-377LF LOW NOISE TRANSISTOR
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Ordering Information
Model Name Manufacturing Part Number Evaluation Board Part Number
SKY65053-377LF Low Noise Transistor SKY65053-377LF SKY65053-377LF-EVB
Copyright © 2009 Skyworks Solutions, Inc. All Rights Reserved.
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
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