1 www.semtech.com
POWER MANAGEMENT
SC1302A/B/C/D/E/F
Dual High Speed Low-Side
MOSFET Driver
Revision: April 27, 2005
Description Features
Applications
+4.5V to +16.5V operation
Fast rise and fall times (20ns typical with 1000pf
load)
Dual MOSFET driver
2A peak drive current
40ns propagation delay
8-pin SOIC / MSOP packages
Enable/disable control
TTL-compatible input
Under voltage lockout with hysteresis
Low shutdown supply current
Over temperature protection
ESD protection
Dual inverting/non-inverting and inverting/non-invert-
ing configurations
Switch-mode power supplies
Battery powered applications
Solenoid and motor drives
Typical Application Circuit
SC1302A
6
2
4
5
1
VCC
IN A
OUTA
GND
EN
10uF 0.1uF
In p u tA
+12V
IN B
OUTB
SHDN
7
3
8
Load A Load B
Vload
In p u tB
The SC1302A/B/C/D/E/F family are low cost dual low-
side MOSFET drivers. These drivers accept TTL-compat-
ible inputs and are capable of supplying high current
outputs (> 2A peak) to external MOSFETs. Fast switch-
ing allows operation up to 1 MHz. The SC1302A/B/C is
available in six configurations: SC1302A is a dual non-
inverting, SC1302B is a dual inverting and SC1302C is a
one inverting plus one non-inverting output.
The SC1302D/E/F is the derivative part from SC1302A/
B/C with pin 1 (EN) and pin 8 (SHDN) internally tied to
VCC.
An under-voltage lockout circuit guarantees that the
driver outputs are low when Vcc is less than 4.5V (typ).
An internal temperature sensor shuts down the driver in
the event of over temperature.
22005 Semtech Corp. www.semtech.com
SC1302A/B/C/D/E/F
PRELIMINARYPOWER MANAGEMENT
Absolute Maximum Ratings
DC Electrical Characteristics
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Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified
in the Electrical Characteristics section is not implied. Exposure to Absolute Maximum rated conditions for extended periods of time may affect device
reliability.
Unless otherwise specified: -40°C < TA < 125°C, VCC = 12V, VIN = 5V, VEN = 5V (SC1302A/B/C) , VSHDN = 5V (SC1302A/B/C).
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32005 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC1302A/B/C/D/E/F
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AC Electrical Characteristics
Unless otherwise specified: TA = 25°C, VCC = 12V, VEN = 5V, CL = 1000pF
DC Electrical Characteristics (Cont.)
Notes:
(1) Guaranteed by design not tested in production.
(2) Negative sign indicates that the input current flows out of the device.
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Unless otherwise specified: -40°C < TA < 125°C, VCC = 12V, VIN = 5V, VEN = 5V (SC1302A/B/C) , VSHDN = 5V (SC1302A/B/C).
42005 Semtech Corp. www.semtech.com
SC1302A/B/C/D/E/F
PRELIMINARYPOWER MANAGEMENT
Pin Descriptions
Timing Diagram
90%
10%
90%
10%
90%
10% 10%
90%
10%
90%
t
R t
F
t
F t
R
t
D1 t
D2
Input
Non-inverting
Output
SC1302A
Inverting
Output
SC1302B
0V
5V
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52005 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC1302A/B/C/D/E/F
Pin Configuration Ordering Information
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A
)
TRTSIA2031CS
8-CIOSC°521+otC°04-
TRTSIB2031CS
TRTSIC2031CS
TRTSD2031CS
TRTSE2031CS
TRTSF2031CS
TRTSMIA2031CS
8-POSMC°521+otC°04-TRTSMIB2031CS
TRTSMIC2031CS
Notes:
(1) Only available in tape and reel packaging. A reel
contains 2500 devices.
(2) Lead free product.This product is fully WEEE and
RoHS compliant.
Top View
SC1302A/D (Dual Non-Inverting)
(8-Pin SOIC (A/D)
or MSOP (A only)
Top View
SC1302C/F (Inverting + Non-Inverting)
Top View
SC1302B/E (Dual Inverting)
1
2
3
4
SHDN/NC
EN/NC
5
6
7
8
OUTA
INA
VCC
GND
OUTB
INB
1
2
3
4
SHDN/NC
EN/NC
5
6
7
8
OUTA
INA
VCC
GND
OUTB
INB
1
2
3
4
SHDN/NC
EN/NC
5
6
7
8
OUTA
INA
VCC
GND
OUTB
INB
(8-Pin SOIC (B/E)
or MSOP (B only)
(8-Pin SOIC (C/F)
or MSOP (C only)
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SC1302A/B/C/D/E/F
PRELIMINARYPOWER MANAGEMENT
Block Diagrams
SC1302A
BIAS
INA
EN
OUTA
VCC
BANDGAP
BIAS
INB OU TB
GND
PRE-
DRIVER
PRE-
DRIVER
SHDN
SC1302B
BIAS
INA
EN
OUTA
VCC
BANDGAP
BIAS
INB OUTB
GND
PRE-
DRIVER
PRE-
DRIVER
SHDN
SC1302C
BIAS
INA
EN
OUTA
VCC
BANDGAP
BIAS
INB OU TB
GND
PRE-
DRIVER
PRE-
DRIVER
SHDN
SC1302D
SC1302E SC1302F
72005 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC1302A/B/C/D/E/F
Supply Current vs. Capacitive Load
0
10
20
30
40
100 1000 10000
Capacitive Load (pF)
Supply Currnt (mA)
200K H z
100K Hz
VCC = 12V
One Driver Running
TA = 25°C
Rise and Fall Time vs. Supply Voltage
10
15
20
25
4 8 12 16
Supply Voltage (V)
Time (ns)
CL = 1000pF
TA = 25°C
tf
tr
Rise and Fall Time vs. Capacitive Load
0
20
40
60
80
100 1000 10000
Capacitive Load (pF)
Time (ns)
tf
tr
VCC = 12V
f = 200K H z
TA = 25°C
Input Pin Current
-10
-5
0
5
10
15
04812
Vin (V)
Iin (uA)
Inverting
Non-inverting
Typical Characteristics
82005 Semtech Corp. www.semtech.com
SC1302A/B/C/D/E/F
PRELIMINARYPOWER MANAGEMENT
Applications Information
The SC1302A/B/C/D/E/F is a high speed, high peak
current dual MOSFET driver. It is designed to drive power
MOSFETs with ultra-low rise/fall time and propagation
delays. As the switching frequency of PWM controllers is
increased to reduce power converters volume and cost,
fast rise and fall times are necessary to minimize switching
losses. While discrete solution can achieve reasonable
drive capability, implementing delay and other
housekeeping functions necessary for safe operation can
become cumbersome and costly. The SC1032A/B/C/
D/E/F presents a total solution for the high-speed, high
power density applications. Wide input supply range of
4.5V - 16.5V allows use in battery powered applications
as well as distributed power systems.
Supply Bypass and Layout
A 4.7µF to 10µF tantalum bypass capacitor with low ESR
(equivalent series resistance) and an additional 0.1µF
ceramic capacitor in parallel are recommended as supply
bypass to control switching and supply transients.
As with any high speed, high current circuit, proper layout
is critical in achieving optimum performance of the
SC1302A/B/C/D/E/F. Attention should be paid to the
proper placement of the driver, the switching MOSFET
and the bypass capacitors.
The driver should be placed as close as possible to the
external MOSFETs to eliminate the possibility of
oscillation caused by trace inductance and the MOSFET
gate capacitance. A resistor in the range of 10W could be
used in series with the gate drive to damp the ringing if
the drive output path is not short enough. The bypass
capacitors should also be placed closely between Vcc and
GND of the driver. A Schottky diode may be used to
connect the ground and the output pin to avoid latch-
ups in some applications.
Drive Capability and Power Dissipation
The SC1302A/B/C/D/E/F is able to deliver 1.6A peak
current for driving capacitive loads, such as MOSFETs.
Fast switching of the MOSFETs significantly reduces
switching losses for high frequency applications. Thermal
stress is reduced and system reliability is improved.
For simplicity, we assume that the gate capacitance of a
MOSFET is constant. The power delivered from the power
supply can be estimated based on this simplification. The
energy needed to charge the capacitor is given by:
2
ON VC
2
1
E⋅⋅=
where C is the load capacitance and V is the output
voltage swing of the driver.
During turn off, the same amount of energy is dumped to
the ground. Therefore, the energy dissipated in one
switching cycle is:
The power dissipation due to the gate driving actions is
given by:
2
GATE VCfP ⋅⋅=
where, f is the switching frequency.
with VCC= 12V, C = 1nF and f = 200kHz, the power
dissipation per output is:
()()()
mW2912nF1kHz200P 2
GATE =⋅⋅=
The corresponding supply current is:
mA4.2
V12
mW29
V
P
I
CC
GATE ===
Thermal Information
The driver’s junction temperature must be kept within the
rated limit at any time. The application system has to
effectively remove the heat generated in the driver in order
for proper functions and performance. If the junction
temperature reaches 150oC, the internal protection
circuit will be triggered to shut down the gate driver.
The power dissipation of the SC1302A/B/C/D/E/F should
be derated according to the following formula:
where T
A
= ambient temperature.
2
TOTAL VCE ⋅=
jA
TC125
nDissipatio Power A
θ
−°
<
92005 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC1302A/B/C/D/E/F
Outline Drawing - MSOP-8
Land Pattern - MSOP-8
0°
.010
.004
-
.016
.003
.024
(.037)
-
.000
.030
-
-
-
-
0.25
0.10
8° 0° -8°
0.60
(.95)
.032
.009
0.40
0.08
.043
.006
.037 0.75
0.00
-
0.80
0.23
-
0.95
1.10
0.15
-
-
-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
-B-
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
DATUMS AND TO BE DETERMINED AT DATUM PLANE
NOTES:
1.
2. -A- -H-
SIDE VIEW
A
B
C
e
H
e/2
D
PLANE
DETAIL
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.026 BSC
aaa C
SEATING
ccc C
2X N/2 TIPS
INDICATOR
E/2
PIN 1
2X
8
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SEE DETAIL
A1
A
A2
bxN
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0.25
A
PLANE
GAGE
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E1
12
N
.114
.114
.118
.118
.009 -
8
01
c
(L1)
L
A
0.13
3.00
3.00
4.90 BSC
0.65 BSC
.122
.122
2.90
2.90
.015 0.22
3.10
3.10
0.38
-
REFERENCE JEDEC STD MO-187
,
VARIATION AA.4.
DIM
ccc
A1
e
bbb
aaa
01
L1
N
L
D
E1
E
A2
b
c
A
MILLIMETERS
NOM
DIMENSIONS
INCHES
MIN NOM MAX MIN MAX
E
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
P
X
(C)
Y
Z
G
.224
.063
.016
.026
(.161)
.098
(4.10)
5.70
1.60
0.40
0.65
2.50
MILLIMETERS
DIMENSIONS
DIM INCHES
X
Z
Y
C
P
G
102005 Semtech Corp. www.semtech.com
SC1302A/B/C/D/E/F
PRELIMINARYPOWER MANAGEMENT
Outline Drawing - SO-8
Contact Information
Land Pattern - SO-8
SEE DETAIL
DETAIL A
A
.050 BSC
.236 BSC
8
.010
.150
.189
.154
.193
.012 -
8
0.25
1.27 BSC
6.00 BSC
3.90
4.90
-
.157
.197
3.80
4.80
.020 0.31
4.00
5.00
0.51
bxN
2X N/2 TIPS
SEATING
aaa C
E/2
2X
12
N
A
D
A1
E1
bbb C A-B D
ccc C
e/2
A2
(.041)
.004
.008
-
.028
-
-
-
-
0°
.016
.007
.049
.004
.053
8° 0°
0.20
0.10
-8°
0.40
0.17
1.25
0.10
.041
.010
.069
.065
.010
1.35
(1.04)
0.72
-
1.04
0.25
-
-
-1.75
1.65
0.25
0.25
-
.010 .020 0.50
-
c
L
(L1) 01
0.25
GAGE
PLANE
h
h
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
-B-
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
DATUMS AND TO BE DETERMINED AT DATUM PLANE
NOTES:
1.
2. -A- -H-
SIDE VIEW
A
B
C
D
e
H
PLANE
REFERENCE JEDEC STD MS-012, VARIATION AA.
4.
L1
N
01
bbb
aaa
ccc
A
b
A2
A1
D
E
E1
L
h
e
c
DIM MIN
MILLIMETERS
NOM
DIMENSIONS
INCHES
MIN MAX MAXNOM
E
(.205) (5.20)
Z
G
Y
P
(C) 3.00
.118
1.27
.050
0.60.024
2.20.087
7.40.291
X
INCHES
DIMENSIONS
Z
P
Y
X
DIM
C
G
MILLIMETERS
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
REFERENCE IPC-SM-782A, RLP NO. 300A.
2.
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Contact Information for Semtech International AG