Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
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use http://www.nexperia.com
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- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
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- © Nexperia B.V. (year). All rights reserved.
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Team Nexperia
1. Product profile
1.1 General description
Single high-speed switching diode, fabricated in planar technology, and encapsulated in a
small Surface-Mounted Device (SMD) plastic package.
[1] /DG: halogen-free
1.2 Features
1.3 Applications
nHigh-speed switching
1.4 Quick reference data
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] When switched from IF= 10 mA to IR= 10 mA; RL= 100 Ω; measured at IR= 1 mA.
PMBD914
Single high-speed switching diode
Rev. 06 — 11 February 2009 Product data sheet
Table 1. Product overview
Type number[1] Package
NXP JEDEC
PMBD914 SOT23 TO-236AB
PMBD914/DG
nHigh switching speed: trr ≤4ns nLow capacitance: Cd≤1.5 pF
nLow leakage current nReverse voltage: VR≤100 V
nRepetitive peak reverse voltage:
VRRM ≤100 V
nSmall SMD plastic package
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current [1] - - 215 mA
VRreverse voltage - - 100 V
trr reverse recovery time [2] --4ns
PMBD914_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 11 February 2009 2 of 10
NXP Semiconductors PMBD914
Single high-speed switching diode
2. Pinning information
3. Ordering information
[1] /DG: halogen-free
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
1 anode
2 not connected
3 cathode
12
3
006aaa764
3
12
Table 4. Ordering information
Type number[1] Package
Name Description Version
PMBD914 - plastic surface-mounted package; 3 leads SOT23
PMBD914/DG
Table 5. Marking codes
Type number Marking code[1]
PMBD914 *5D
PMBD914/DG YB*
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse
voltage - 100 V
VRreverse voltage - 100 V
IFforward current [1] - 215 mA
IFRM repetitive peak forward
current - 500 mA
IFSM non-repetitive peak forward
current square wave [2]
tp=1µs-4A
tp=1ms - 1 A
tp= 1 s - 0.5 A
PMBD914_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 11 February 2009 3 of 10
NXP Semiconductors PMBD914
Single high-speed switching diode
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Tj=25°C prior to surge.
[3] Soldering point of cathode tab.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Soldering point of cathode tab.
7. Characteristics
[1] When switched from IF= 10 mA to IR= 10 mA; RL= 100 Ω; measured at IR= 1 mA.
[2] When switched from IF= 10 mA; tr=20ns.
Ptot total power dissipation Tamb ≤25 °C[1][3] - 250 mW
Tjjunction temperature - 150 °C
Tstg storage temperature −65 +150 °C
Table 6. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 500 K/W
Rth(j-t) thermal resistance from
junction to tie-point [2] - - 330 K/W
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF= 1 mA - - 715 mV
IF= 10 mA - - 855 mV
IF=50mA --1V
IF= 150 mA - - 1.25 V
IRreverse current VR=25V --25nA
VR=75V --1µA
VR= 25 V; Tj= 150 °C --30µA
VR= 75 V; Tj= 150 °C --50µA
Cddiode capacitance f = 1 MHz; VR= 0 V - - 1.5 pF
trr reverse recovery time [1] --4ns
VFR forward recovery voltage [2] - - 1.75 V
PMBD914_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 11 February 2009 4 of 10
NXP Semiconductors PMBD914
Single high-speed switching diode
(1) Tamb = 150 °C; typical values
(2) Tamb =25°C; typical values
(3) Tamb =25°C; maximum values
Based on square wave currents.
Tj=25°C; prior to surge
Fig 1. Forward current as a function of forward
voltage Fig 2. Non-repetitive peak forward current as a
function of pulse duration; maximum values
(1) VR= 75 V; maximum values
(2) VR= 75 V; typical values
(3) VR= 25 V; typical values
f = 1 MHz; Tamb =25°C
Fig 3. Reverse current as a function of junction
temperature Fig 4. Diode capacitance as a function of reverse
voltage; typical values
02
300
IF
(mA)
0
100
200
mbg382
1VF (V)
(1) (2) (3)
mbg704
10
1
102
IFSM
(A)
10−1
tp (µs)
110
4
103
10 102
105
104
10 200
0
mga884
100 Tj (°C)
IR
(nA)
103
102
(2)
(1)
(3)
0816124
0.8
0.6
0
0.4
0.2
mbg446
VR (V)
Cd
(pF)
PMBD914_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 11 February 2009 5 of 10
NXP Semiconductors PMBD914
Single high-speed switching diode
8. Test information
FR4 PCB, standard footprint
Fig 5. Forward current as a function of ambient temperature; derating curve
0 50 100 200
250
0
200
msa562
150
150
100
50
IF
(mA)
Tamb (°C)
(1) IR=1mA
Fig 6. Reverse recovery time test circuit and waveforms
Fig 7. Forward recovery voltage test circuit and waveforms
trr
(1)
+ IFt
output signal
trtpt
10 %
90 %
VR
input signal
V = VR + IF × RS
RS = 50 ΩIF
D.U.T.
Ri = 50 Ω
SAMPLING
OSCILLOSCOPE
mga881
trt
tp
10 %
90 %
I
input signal
RS = 50 Ω
I
Ri = 50 Ω
OSCILLOSCOPE
1 kΩ450 Ω
D.U.T.
mga882
VFR
t
output signal
V
PMBD914_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 11 February 2009 6 of 10
NXP Semiconductors PMBD914
Single high-speed switching diode
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] /DG: halogen-free
Fig 8. Package outline SOT23 (TO-236AB)
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number[2] Package Description Packing quantity
3000 10000
PMBD914 SOT23 4 mm pitch, 8 mm tape and reel -215 -235
PMBD914/DG
PMBD914_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 11 February 2009 7 of 10
NXP Semiconductors PMBD914
Single high-speed switching diode
11. Soldering
Fig 9. Reflow soldering footprint SOT23 (TO-236AB)
Fig 10. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
PMBD914_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 11 February 2009 8 of 10
NXP Semiconductors PMBD914
Single high-speed switching diode
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMBD914_6 20090211 Product data sheet - PMBD914_5
Modifications: •Type number PMBD914/DG added
•Section 13 “Legal information”: updated
PMBD914_5 20071126 Product data sheet - PMBD914_4
PMBD914_4 20040106 Product specification - PMBD914_3
PMBD914_3 19990511 Product specification - PMBD914_2
PMBD914_2 19960918 Product specification - PMBD914_1
PMBD914_1 19960404 Product specification - -
PMBD914_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 11 February 2009 9 of 10
NXP Semiconductors PMBD914
Single high-speed switching diode
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors PMBD914
Single high-speed switching diode
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 February 2009
Document identifier: PMBD914_6
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 6
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
