DS04-27604-2E
FUJITSU SEMICONDUCTOR
DATA SHEET
ASSP For Power Supply Applications
Power Management 2-ch Switch IC
MB3842/MB3845
DESCRIPTION
The MB3842/3845 is a power management switch with built-in 2-channel low-on resistance (typ. 100m) switch.
Output control is by means of a control signal, and the MB3842 is designed for high-active operation (output on
when EN is Hi), while the MB3845 is designed for low-active operation (output on when EN is low.)
To provide adaptability to a variety of operations, the MB3842/3845 features low input voltage (VIN > 2.5V)
operation and stable low-on resistance independent of input voltage. The switching current limit can be set from
100mA to 600mA by using external resistance, and when overcurrent conditions are detected the OC output goes
low to provide an external notification signal.
VIN is divided between the two channels, which operate independently of each other.
In addition, an off-state reverse current prevention function is provided to ensure accurate on/off switching action.
FEATURES
Low on resistance switch (typ. 100m)
Low input voltage operation (2.5 V to 5.5 V)
Switch current (max. 0.6 A)
•UVLO :V
IN threshold 2.3V/2.1 V hysteresis 200 mV
ENABLE :EN threshold EN 1.4V/1.6 V for MB3842, EN 1/2 VIN f or MB3845
:Power supply current at output off = 0µA EN < 0.8V for MB3842, EN = VIN for MB3845
External setting for soft start time and switch current limit.
Over-temperature detection (switch latched off), over-current detection (not latched)
OC pin flag set following overcurrent detection, over-temperature detection, or UVLO detection.
Reverse current prevention at OFF (VIN 1.5 V)
Either channel may be operated alone.
PACKAGE
20-pin plastic SSOP
(FPT-20P-M03)
2
MB3842/MB3845
PIN ASSIGNMENT
20
19
18
17
16
15
14
13
12
11
GND
OC1
OUT1
OUT1
OUT1
OUT2
OUT2
OUT2
OC2
GND
1
2
3
4
5
6
7
8
9
10
EN1, EN1
SS1
CS1
VIN1
VIN1
VIN2
VIN2
CS2
SS2
EN2, EN2
SSOP-20P
(FPT-20P-M03)
EN Enable
CS Current Set OC Over Current
EN Enable SS Slow Start
The functions of pin 1 and pin 10 differ on the MB3842 and MB3845.
EN for MB3842/EN for MB3845
3
MB3842/MB3845
PIN DESCRIPTION
Pin no. Symbol Descriptions
1/10
EN
(MB3842)
Control signal input pin.
Set “H” to turn s witch on, “L” to turn toff. At 0.8 V or less , the chip is in STBY state
and current consumption is less than 1µA.
“L” level is 1.4V (typ), “H” level is 1.6V (typ), with 200mV (typ) hysteresis.
EN
(MB3845)
Control signal input pin.
Set “L” to turn switch on, “H” to turn off.
At “H” level = VIN, the chip is in STBY state and current consumption is less than
1µA.
Normally used as CMOS inverter input, so that recommended use is “L” level at
GND +0.5V or less, and “H” level is VIN -0.5V or greater.
2/9 SS Slow start setting pin. Used to adjust the switch on/off timing.
Add external capacitance to delay operation. Leave open when not in use.
In open mode v oltages up to 12 V are present. Care should be taken in mounting
to prevent leakage current generation because high impedance is required.
3/8 CS Current limit setting pin.
The limit current level is set by connecting this pin to external resistance.
4/5/6/7 VIN
Switch output pin.
An UVLO (VIN power monitor function) is provided so that when VIN reaches 2.3V
(typ .) or higher the OC pin v oltage goes to “H” le vel. Also if the VIN v oltage drops to
2.1 V (typ.) or lower the OC output goes to “L” state.
200mV (typ) hysteresis is provided.
11/20 GND Ground pin.
12/19 OC
External notification pin.
When the switch is in on mode this pin normally outputs a “H” level signal, but
changes to “L” level when an o vercurrent, overtemperature, or UVLO condition is
detected.
This is an open drain connection, and should be pulled up to high potential using
resistance.
13/14/15
16/17/18 OUT Switching output pin.(N-ch MOSFET source)
4
MB3842/MB3845
BLOCK DIAGRAM (for 1 channel)
SS1
EN1
VIN1
OSC1
BGR1
+
COMP
FF1
QS
R
OC1
OUT1
CS1
+
COMP
MB3842
SS1
EN1
VIN1
OSC1
BGR1
+
COMP
FF1
QS
R
OC1
OUT1
CS1
+
COMP
MB3845
Temperature
protection 1
Charge
pump1 Over current
detection 1
Charge
pump1 Over current
detection 1
Temperature
protection 1
5
MB3842/MB3845
ABSOLUTE MAXIMUM RATINGS
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
RECOMMENDED OPERATING CONDITIONS
* :For CSS, RLIM settings, see “TYPICAL CHARACTERISTICS” and “FUNCTIONAL DESCRIPTION”.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated within these ranges.
Alwa ys use semiconductor de vices within their recommended oper ating condition ranges. Oper ation
outside these ranges may adversely affect reliability and could result in device failure.
No warr anty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
Parameter Symbol Condition Rating Unit
Max. Min.
Input voltage VIN –0.3 7.0 V
ENABLE voltage VEN –0.3 7.0 V
Switch current ISW ——1.8A
Power dissipation PDTa = +85°C 216 mW
Storage temperature TSTG –55 +125 °C
Parameter Symbol Condition Value Unit
Min. Typ. Max.
Input voltage VIN —2.55.05.5V
ENABLE voltage VEN VEN VIN 0—5.5V
Switch current ISW VIN = 2.5 V to 5.5 V 0.6 A
SS pin capacitance CSS* 10 nF
OC sink current IOCS VIN = 5.0 V, VOC = 0.4 V 2.0 5.0 mA
Current limit
resistance RLIM*VIN = 5.0 V (ISW = 0.6 A) 1.4 2.0 2.6 k
VIN = 5.0 V (ISW = 0.1 A) 3.6 6.2 9.1 k
Operating
temperature TOP –20 +85 °C
6
MB3842/MB3845
ELECTRICAL CHARACTERISTICS (per 1 ch)
MB3842/MB3845 (VIN = 5 V, Ta = +25°C)
MB3842 (VIN = 5 V, Ta = +25°C)
MB3845 (VIN = 5 V, Ta = +25°C)
Parameter Symbol Condition Value Unit
Min. Typ. Max.
Switch resistance RON ISW =0.6A 100 150 m
IN pin input current
IIN1 ISW = 0 A 350 550 µA
IIN2 ISW = 0.6 A 1.0 1.5 mA
IIN3 EN < 0.8V for MB3842,
EN = VIN for MB3845 ——1.0µA
UVLO threshold VIUH VIN at OC = L H 2.1 2.3 2.5 V
VIUL VIN at OC = H L 1.9 2.1 2.3 V
UVLO hysteresis width VIUHY VIUHY = VIUH – VIUL 100 200 300 mV
Switch current limit ISWH RLIM = 2.0 k0.42 0.6 0.78 A
ISWL RLIM = 6.2 k0.06 0.1 0.14 A
OC sink current IOCS VOC = 0.4 V at OC active 2.0 5.0 mA
IOCL VOC = 5.0 V at OC non-active 1.0 µA
Temperature protection (Tj)T
LIM +125 °C
OUT pin rise time tON SS pin: Open
OUT pin: 100 k pull down 100 200 µs
OUT pin fall time tOFF SS pin: Open
OUT pin: 100 k pull down —50120µs
Parameter Symbol Condition Value Unit
Min. Typ. Max.
ENABLE pin input current IENH VEN = 5 V, ISW = 0 A 5 10 µA
IENL VEN = 0 V, ISW = 0 A 0.0 µA
ENABLE pin threshold
voltage VTHEN 1.45 1.60 1.75 V
VTLEN 1.25 1.40 1.55 V
ENABLE hysteresis width VENHY VENHY = VTHEN – VTLEN 100 200 300 mV
Parameter Symbol Condition Value Unit
Min. Typ. Max.
ENABLE pin input current IENH VEN = 5 V, ISW = 0 A 0.0 µA
IENL VEN = 0 V, ISW = 0 A 0.0 µA
ENABLE pin input voltage VILEN —00.8V
VIHEN —3.05.0V
7
MB3842/MB3845
DIAGRAM
(Continued)
VIN
EN
EN
VOUT
IOUT
OC
SW OFF
Overcurrent does not occur
SW ON SW ON
5 V
Hi
Low
5 V
5 V
Normal operation
SW ONSW ONSW ON
2.3 V
2.1 V
5 V
Hi
Low
5 V
5 V
= 0 V
VIN
EN
EN
V
OUT
I
OUT
OC
Overcurrent does not occur
•At V
IN fall
Note: The OC pin should be pulled up using a separate power supply and resistance.
(This illustration shows pull-up with a separate 5V source.)
8
MB3842/MB3845
(Continued)
SW ON OFF ON OFF
VIN
EN
EN
VOUT
IOUT
OC
5 V
Hi
Low
5 V
5 V
= 0 V
At overcurrent detection
SW ON
Over-temperature corrected
Over-temperature
occurs
SW OFF
VIN
EN
EN
V
OUT
I
OUT
OC
5 V
Hi
Low
5 V
5 V
= 0 V
Overcurrent does not
occur
Latch set Latch released
At over-temperature occurrence
Note: The OC pin should be pulled up using a separate power supply and resistance.
(This illustration shows pull-up with a separate 5V source.)
9
MB3842/MB3845
TYPICAL CHARACTERISTICS
(Continued)
VIN = 5.0 V
VIN = 3.3 V
VIN = 2.5 V
10
1
0.1
0.01100 1000 10000 100000
RLIM ()
ISW(A)
•R
LIM vs. limit current characteristics
VIN = 5.0 V
VIN = 3.3 V
VIN = 2.5 V
100
10
1
0.1 10 100 1000 10000 100000
CSS (pF)
tON(ms)
•C
SS vs. TON (SS) characteristics
These are the limiting value characteristics for CS pin-to-GND
external resistance and output current (OC flag).
There are the characteristics for SS pin-to-GND external
capacitance and output ON time.
10
MB3842/MB3845
(Continued)
(Continued)
150
140
130
120
110
100
90
80
70
60
5060 40 20 0 20 40 60 80 100 120
at 0.1 A
at 0.6 A
at 1 A
40 °C
25 °C
100 °C
150
140
130
120
110
100
90
80
70
60
50 234567
SW resistance vs. temperature characteristics
Temperature-depended SW resistance vs. VIN (V) characteristics
SW resistance (m)
Temperature Ta (°C)
SW resistance (m)
VIN voltage (V)
11
MB3842/MB3845
(Continued)
(Continued)
5 V
5 V
100 k
2
VIN
ISW
VSW
RLIM
GND
EN, EN OC
OUT
SS
CS
VIL/VIH
A
1600
1400
1200
1000
800
600
400
200
00234561
ISW (mA)
6.2 k (0.1 A)
2 k (0.6 A)
VSW (V)
Measurement circuit
These are the output saturation current characteristics in
overcurrent state.(when not controlled by the OC pin warning flag)
RLIM not limited (CS GND)
RLIM set to 2.0k, 0.6A
Temperature protection
range
RLIM set to 6.2k, 0.1A Overcurrent flag set
(when set for 0.1A)
Overcurrent flag set
(when set for 0.6A)
Unlimited
Output power (ISW) saturation characteristics
“Open”
12
MB3842/MB3845
(Continued)
Power derating characteristics
Power dissipation PD (W)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
20 0 20 40 60 80 100
1 V / 500 NS 50 k
Temperature Ta (°C)
1 V / 500 NS 1 k
GND
1 V / 500 NS 10 k1 V / 500 NS 100 k
OC pin flag pull-up resistance (pull-up power 5V) dependant overcurrent operation
13
MB3842/MB3845
FUNCTIONAL DESCRIPTION
Current Limit Setting
By placing resistance between the CS and GND pins, the current limit can be set between 100mA and 600mA
within ±30% accuracy (VIN = 5 V, current limit at 600mA). Because the setting value is dependent on VIN voltage,
the user should select the optimum resistance value for the value of VIN voltage . When the switching current
exceeds the set value, the OC pin goes to “L” level as an external notification signal, but there is no latching
function. To hold operation on “off” state, the input signal to the EN and EN pins should be used.
When a direct connection to GND is used, there is no current limitation.
When the connection is open, the switch is in a state of continuously held current limits.
Thermal Shutdown
The MB3842/MB3845 has a thermal shutdown function which turns the switch off and sets the latch to protect
the device when junction temperature exceeds 125°C.
At the same time the OC output signal goes to “L” level to notify external systems.
The latch function can be reset by sending a low signal to the EN input of the MB3842, or a high signal to the
EN input of the MB3845.
Slow Start
The on/off switching time can be delayed by applying capacitance between the SS and GND pins. Controlling
the on time can soften surge current to the load side capacitance when power is turned on.
For details, see “Css vs. tON (SS) characteristics” on p. 9.
UVLO
A VIN voltage monitoring function is provided, so that when VIN voltage exceeds 2.3 V (typ) the OC pin voltage
goes to “H” level. When VIN voltage falls below 2.1V (typ), the OC output goes to “L” state.
Error Flag OC Pin
The OC pin produces a “L” signal in case of a UVLO, overcurrent, or over-temperature condition. In case of
overcurrent, the output has a pulse waveform. See P12.
(note) Output current limit setting resistance values are shown on P9, and in the following table. (CS pin-to-GND)
Standard Values
VIN/ISW 0.1 A 0.2 A 0.3 A 0.4 A 0.5 A 0.6 A 0.7 A 0.8 A 0.9 A 1.0 A
VIN 5.0V 6.2 k4.3 k3.3 k2.7 k2.2 k2.0 k1.8 k1.6 k1.4 k1.3 k
VIN 3.3V 9.1 k5.6 k4.3 k3.3 k2.7 k2.4 k2.0 k1.8 k1.6 k1.5 k
VIN 2.5V 13 k7.5 k5.1 k3.9 k3.0 k2.7 k2.2 k2.0 k1.8 k1.6 k
14
MB3842/MB3845
TYPICAL APPLICATION
CSS
RLIM
RLIM
CSS
EN1
EN1
SS1
CS1
VIN1
VIN1
VIN2
VIN2
CS2
SS2
EN2
EN2
GND
OC1
OUT1
OUT1
OUT1
OUT2
OUT2
OUT2
OC2
GND
MB3842/MB3845 Top View
Control signal
Control signal
Pull-up resistance
Load
Load
Pull-up resistance
15
MB3842/MB3845
APPLICATION EXAMPLE
(1) Dual-Port Self-Powered Hub Application (NON-GANG Mode Connection)
5 V
USB 5 V Controller
Overcurrent
ON/OFF
Power Supply
USB
Port 1
USB
Port 2
MB3842/MB3845
EN1,EN1
SS1
CS1
VIN1
VIN1
VIN2
VIN2
CS2
SS2
EN2,EN2
GND
OC1
OUT1
OUT1
OUT1
OUT2
OUT2
OUT2
OC2
GND
*The MB3842 can also be adapted for use with 3.3V controllers.
USB Port 500mA MAX Par Port
Smoothing capacitors should be placed between VIN and GND, or between OUT and GND as required.
16
MB3842/MB3845
(2) Dual-Port Bus Powered Hub Application (GANG Mode Connection)
USB
Overcurrent
ON/OFF
5 V
Upstream Port
MB3842/MB3845
USB Port1(×4)
USB Port2(×4)
400 mA MAX
(100 mA ×4)
400 mA MAX
(100 mA ×4)
EN1,EN1
SS1
CS1
VIN1
VIN1
VIN2
VIN2
CS2
SS2
EN2,EN2
GND
OC1
OUT1
OUT1
OUT1
OUT2
OUT2
OUT2
OC2
GND
USB Port 100mA MAX Par Port
Smoothing capacitors should be placed between VIN and GND, or between OUT and GND as required.
17
MB3842/MB3845
USAGE PRECAUTION
1. Never use settings exceeding maximum rated conditions.
Exceeding maximum rated conditions may cause permanent damage to the LSI.
Also, it is recommended that recommended operating conditions be observed in normal use.
Exceeding recommended operating conditions may adversely affect LSI reliability.
2. Use this device within recommended operating conditions.
Recommended operating conditions are values within which normal LSI operation is warranted.
Standard electrical characteristics are warranted within the range of recommended operating conditions and
within the listed conditions for each parameter.
3. Printed circuit board ground lines should be set up with consideration for common
impedance.
4. Take appropriate static electricity measures.
Containers f or semiconductor materials should ha ve anti-static protection or be made of conductive material.
After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
Work platforms, tools, and instruments should be properly grounded.
Working personnel should be grounded with resistance of 250 k to 1 M between body and ground.
5. Do not apply negative voltages.
The use of negative voltages below –0.3 V may create parasitic transistors on LSI lines, which can cause
abnormal operation.
6. Reverse Current Prevention Function
Current cannot flow back to the VIN pin with the switch off, even when the OUT pin voltage is higher than the
VIN pin (OUT VIN), however when VIN pin voltage is lower than 1.5 V circuit functions are lost, so that in this
case there is danger of reverse current flow. For applications in which reverse flow is not acceptable, set
VIN 1.5 V.
ORDERING INFORMATION
Part number Package Remarks
MB3842PFV
MB3845PFV
MB3845PFV-ER 20-pin Plastic SSOP
(FPT-20P-M03)
18
MB3842/MB3845
PACKAGE DIMENSION
C
1994 FUJITSU LIMITED F20012S-2C-4
0.50±0.20
(.020±.008)
0.10±0.10(.004±.004)
(STAND OFF)
0 10°
Details of "A" part
5.85(.230)REF
6.50±0.10(.256±.004)
*
0.65±0.12
5.40(.213)4.40±0.10 6.40±0.20 NOM(.252±.008)(.173±.004)
*
(.0256±.0047) .006 –.001
+.002
–0.02
+0.05
0.15
.009 –.002
+.004
–0.05
+0.10
0.22
.049 –.004
+.008
–0.10
+0.20
1.25
0.10(.004)
"A"
INDEX
(Mounting height)
Dimensions in mm (inches).
20-pin plastic SSOP
(FPT-20P-M03) *: These dimensions do not include resin protrusion.
MB3842/MB3845
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications, and
are not intended to be incorporated in devices for actual use. Also,
FUJITSU is unable to assume responsibility for infringement of
any patent rights or other rights of third parties arising from the use
of this information or circuit diagrams.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
F0001
FUJITSU LIMITED Printed in Japan