BCM20734UA1KFFB3GT - CYPRESS SEMICONDUCTOR

CYW20734

Single-Chip Bluetooth Transceiver for

Wireless Input Devices

Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600

Document Number: 002-14874 Rev. *S Revised Tuesday, October 4, 2016

The Cypress CYW20734 is a Bluetooth 4.1-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver.

Manufactured using the industry's most advanced 40 nm CMOS low-power process, the CYW20734 employs the highest level of

integration to eliminate all critical external components, thereby minimizing the device's footprint and the costs associated with

implementing Bluetooth solutions.

The CYW20734 is the optimal solution for applications in wireless input devices including game controllers, remote, keyboards, and

joysticks. Built-in firmware adheres to the Bluetooth Low Energy (BLE) profile and the BLE Human Interface Device (HID) profile.

Cypress Part Numbering Scheme

Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,

there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides

Cypress ordering part number that matches an existing IoT part number.

Applications

■Game controllers

■Wireless pointing devices (mice)

■Remote controls

■Wireless keyboards

■Joysticks

■Home automation

■Point-of-sale input devices

■3D glasses

■Blood pressure monitors

■“Find me” devices

■Heart rate monitors

■Proximity sensors

■Thermometers

Features

■Complies with Bluetooth Core Specification version 4.1

including BR/EDR/BLE

■BLE HID profile version 1.00 compliant

■Bluetooth Device ID profile version 1.3 compliant

■Supports Generic Access Profile (GAP)

■Supports Adaptive Frequency Hopping (AFH)

■Excellent receiver sensitivity

■Programmable output power control

■Integrated ARM Cortex-M3 microprocessor core

■On-chip power-on reset (POR)

■Support for EEPROM and serial flash interfaces

■Integrated low dropout regulator (LDO)

■On-chip software controlled power management unit

■Programmable key scan matrix interface, up to 8 × 20 key-

scanning matrix

■Three-axis quadrature signal decoder

■PCM/I2S Interface

■Infrared modulator

■IR learning

■Auxiliary ADC with up to 28 analog channels

■One mono microphone input

■On-chip support for serial peripheral interface (master and

slave modes)

■Broadcom Serial Communications interface (compatible with

NXP I2C slaves)

■Package type:

❐90-pin FBGA package (8.5 mm × 8.5 mm)

❐RoHS compliant

Table 1. Mapping Table for Part Number between Broadcom and Cypress

Broadcom Part Number Cypress Part Number

BCM20734 CYW20734

BCM20734UA1KFFB3G CYW20734UA1KFFB3G

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CYW20734

Figure 1. Functional Block Diagram

IoT Resources

Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your

design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of

information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software

updates. Customers can acquire technical documentation and software from the Cypress Support Community website

(http://community.cypress.com/).

Cortex‐M3 DMA ScanJTAG

Address

Decoder BusArb

Trap&Patch

AHB2APB

WDTimer Remap&

Pause

32‐bitAPB

32‐bitAHB

AHB2MEM

AHB2EBI

External

BusI/F

ROM

AHB2MEM

RAM

PMUControl

UART

Debug

UART

PTU

I/O

PortControl

PMU LPO POR

Buffer

APU

BTClk/

Hopper

BlueRFI/F

Rx/Tx

Buffer

Digital

Modulator

Calibration&

Control

DigitalDemod

BitSync

BluetoothRadio

FlashI/F

JTAG

DigitalI/O

I2C_Master

Interrupt

Controller

PCM

GPIO+Aux SW

Timers JTAGMaster

LCU

SPI

Master

LowPower

Scan

BlueRFRegisters

ADC MIC

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CYW20734

Contents

1. Functional Description .................................................4

1.1 Bluetooth Baseband Core ..................................... 4

1.2 Microprocessor Unit .............................................. 5

1.3 Integrated Radio Transceiver ................................ 6

1.4 Peripheral Transport Unit ...................................... 8

1.5 PCM Interface .....................................................10

1.6 Clock Frequencies ...............................................10

1.7 GPIO Ports ..........................................................12

1.8 Keyboard Scanner ............................................... 12

1.9 Mouse Quadrature Signal Decoder .....................13

1.10 ADC Port ........................................................... 13

1.11 Microphone Input ............................................... 13

1.12 PWM.................................................................. 14

1.13 Shutter Control for 3D Glasses ......................... 15

1.14 Triac Control ...................................................... 15

1.15 Serial Peripheral Interface ................................. 15

1.16 Infrared Modulator ............................................. 15

1.17 Infrared Learning............................................... 16

1.18 Power Management Unit................................... 16

2. Pin Assignments ........................................................ 17

2.1 Pin Descriptions .................................................. 17

2.2 Ball Map .............................................................. 24

3. Specifications ............................................................. 25

3.1 Electrical Characteristics ..................................... 25

3.2 RF Specifications ................................................ 30

3.3 Timing and AC Characteristics............................ 33

4. Mechanical Information ............................................. 44

4.1 Package Diagram ................................................ 44

4.2 Tape Reel and Packaging Specifications ............ 45

5. Ordering Information .................................................. 46

Document History .......................................................... 48

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CYW20734

1. Functional Description

1.1 Bluetooth Baseband Core

The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation.

The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it,

handles data flow control, schedules SCO/ACL and TX/RX transactions, monitors Bluetooth slot usage, optimally segments and

packages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition

to these functions, it independently handles HCI event types, and HCI command types.

The following transmit and receive functions are also implemented in the BBC hardware to increase reliability and security of the TX/

RX data before sending over the air:

■Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic redundancy check

(CRC), data decryption, and data dewhitening in the receiver.

■Data framing, FEC generation, HEC generation, CRC generation, key generation, data encryption, and data whitening in the

transmitter.

1.1.1 Bluetooth 4.0 Features

The BBC supports all Bluetooth 4.0 features, with the following benefits:

■Dual-mode Bluetooth low energy (BT and BLE operation).

■Extended inquiry response (EIR): Shortens the time to retrieve the device name, specific profile, and operating mode.

■Encryption pause resume (EPR): Enables the use of Bluetooth technology in a much more secure environment.

■Sniff subrating (SSR): Optimizes power consumption for low duty cycle asymmetric data flow, which subsequently extends battery

life.

■Secure simple pairing (SSP): Reduces the number of steps for connecting two devices, with minimal or no user interaction required.

■Link supervision time out (LSTO): Additional commands added to HCI and Link Management Protocol (LMP) for improved link

time-out supervision.

■Quality of service (QoS) enhancements: Changes to data traffic control, which results in better link performance. Audio, human

interface device (HID), bulk traffic, SCO, and enhanced SCO (eSCO) are improved with the erroneous data (ED) and packet

boundary flag (PBF) enhancements.

1.1.2 Bluetooth 4.1 Features

The CYW20734 supports the following Bluetooth v4.1 features.

■Secure connections (BR/EDR)

■Fast advertising interval

■Piconet clock adjust

■Connectionless broadcast

■LE privacy v1.1

■Low duty cycle directed advertising

■LE dual mode topology

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CYW20734

1.1.3 Link Control Layer

The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the link control unit (LCU).

This layer consists of the command controller that takes commands from the software, and other controllers that are activated or

configured by the command controller, to perform the link control tasks. Each task is performed in a different state or substate in the

Bluetooth Link Controller.

■Major states:

❐Standby

❐Connection

■Substates:

❐Page

❐Page Scan

❐Inquiry

❐Inquiry Scan

❐Sniff

1.1.4 Test Mode Support

The CYW20734 fully supports Bluetooth Test mode as described in Part I:1 of the Specification of the Bluetooth System Version 3.0.

This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence.

In addition to the standard Bluetooth Test Mode, the CYW20734 also supports enhanced testing features to simplify RF debugging

and qualification and type-approval testing. These features include:

■Fixed frequency carrier wave (unmodulated) transmission

❐Simplifies some type-approval measurements (Japan)

❐Aids in transmitter performance analysis

■Fixed frequency constant receiver mode

❐Receiver output directed to I/O pin

❐Allows for direct BER measurements using standard RF test equipment

❐Facilitates spurious emissions testing for receive mode

■Fixed frequency constant transmission

❐8-bit fixed pattern or PRBS-9

❐Enables modulated signal measurements with standard RF test equipment

1.1.5 Frequency Hopping Generator

The frequency hopping sequence generator selects the correct hopping channel number based on the link controller state, Bluetooth

clock, and device address.

1.2 Microprocessor Unit

The CYW20734 microprocessor unit runs software from the link control (LC) layer up to the host controller interface (HCI). The

microprocessor is based on the Cortex-M3 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The

microprocessor also includes 848 KB of ROM memory for program storage and boot ROM, 352 KB of RAM for data scratch-pad, and

patch RAM code.

The internal boot ROM provides flexibility during power-on reset to enable the same device to be used in various configurations. At

power-up, the lower layer protocol stack is executed from the internal ROM.

External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features additions. These patches

can be downloaded using external NVRAM. The device can also support the integration of user applications and profiles using an

external serial flash memory.

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CYW20734

1.2.1 NVRAM Configuration Data and Storage

NVRAM contains configuration information about the customer application, including the following:

■Fractional-N information

■BD_ADDR

■UART baud rate

■SDP service record

■File system information used for code, code patches, or data. The CYW20734 can use SPI Flash or I2C EEPROMs for NVRAM

storage.

1.2.2 External Reset

An external active-low reset signal, RESET_N, can be used to put the CYW20734 in the reset state. An external voltage detector

reset IC with 50 ms delay is needed on the RESET_N. The RESET_N should be released only after the VDDO supply voltage level

has been stabilized for 50 ms.

Figure 2. Reset Timing

1.3 Integrated Radio Transceiver

The CYW20734 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has

been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4 GHz

unlicensed ISM band. The CYW20734 is fully compliant with the Bluetooth Radio Specification and enhanced data rate (EDR)

specification and meets or exceeds the requirements to provide the highest communication link quality of service.

VDDIO POR

VDDIO

Reset

(External)

VDDC

50 ms

VDDC Reset (Internal)

XTAL_RESET

XTAL_BUF_PU

~2.4 ms

0.5 ms

~2.4 ms

10 LPO cycles

8 LPO cycles

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CYW20734

1.3.1 Transmit

The CYW20734 features a fully integrated zero-IF transmitter. The baseband transmit data is GFSK-modulated in the modem block

and upconverted to the 2.4 GHz ISM band in the transmitter path. The transmitter path consists of signal filtering, I/Q upconversion,

output power amplifier, and RF filtering. The transmitter path also incorporates /4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to

support EDR. The transmitter section is compatible to the Bluetooth Low Energy specification. The transmitter PA bias can also be

adjusted to provide Bluetooth class 1 or class 2 operation.

1.3.2 Digital Modulator

The digital modulator performs the data modulation and filtering required for the GFSK, /4-DQPSK, and

8-DPSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the trans-

mitted signal and is much more stable than direct VCO modulation schemes.

1.3.3 Digital Demodulator and Bit Synchronizer

The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit-

synchronization algorithm.

1.3.4 Power Amplifier

The fully integrated PA supports Class 1 or Class 2 output using a highly linearized, temperature-compensated design. This provides

greater flexibility in front-end matching and filtering. Due to the linear nature of the PA combined with some integrated filtering, external

filtering is required to meet the Bluetooth and regulatory harmonic and spurious requirements. For integrated mobile handset appli-

cations in which Bluetooth is integrated next to the cellular radio, external filtering can be applied to achieve near thermal noise levels

for spurious and radiated noise emissions. The transmitter features a sophisticated on-chip transmit signal strength indicator (TSSI)

block to keep the absolute output power variation within a tight range across process, voltage, and temperature.

1.3.5 Receiver

The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit

synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high-order on-chip channel

filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology, with built-in out-of-band attenuation,

enables the CYW20734 to be used in most applications with minimal off-chip filtering. For integrated handset operation, in which the

Bluetooth function is integrated close to the cellular transmitter, external filtering is required to eliminate the desensitization of the

receiver by the cellular transmit signal.

1.3.6 Digital Demodulator and Bit Synchronizer

The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit

synchronization algorithm.

1.3.7 Receiver Signal Strength Indicator

The radio portion of the CYW20734 provides a receiver signal strength indicator (RSSI) signal to the baseband, so that the controller

can take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the

transmitter should increase or decrease its output power.

1.3.8 Local Oscillator Generation

A local oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels.

The LO generation subblock employs an architecture for high immunity to LO pulling during PA operation. The CYW20734 uses an

internal RF and IF loop filter.

1.3.9 Calibration

The CYW20734 radio transceiver features an automated calibration scheme that is fully self-contained in the radio. No user interaction

is required during normal operation or during manufacturing to provide optimal performance. Calibration tunes the performance of all

the major blocks within the radio to within 2% of optimal conditions, including gain and phase characteristics of filters, matching

between key components, and key gain blocks. This takes into account process variation and temperature variation. Calibration occurs

transparently during normal operation during the settling time of the hops, and calibrates for temperature variations as the device

cools and heats during normal operation in its environment.

1.3.10 Internal LDO

The CYW20734 has a 1.2V internal LDO that supplies power to the baseband and the radio.

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CYW20734

1.4 Peripheral Transport Unit

1.4.1 Broadcom Serial Communications Interface

The CYW20734 provides a 2-pin master BSC interface, which can be used to retrieve configuration information from an external

EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse

devices. The BSC interface is compatible with I2C slave devices. BSC does not support multimaster capability or flexible wait-state

insertion by either master or slave devices.

The following transfer clock rates are supported by BSC:

■100 kHz

■400 kHz

■800 kHz (Not a standard I2C-compatible speed.)

■1 MHz (Compatibility with high-speed I2C-compatible devices is not guaranteed.)

The following transfer types are supported by BSC:

■Read (Up to 127 bytes can be read.)

■Write (Up to 127 bytes can be written.)

■Read-then-Write (Up to 127 bytes can be read and up to 127 bytes can be written.)

■Write-then-Read (Up to 127 bytes can be written and up to 127 bytes can be read.)

Hardware controls the transfers, requiring minimal firmware setup and supervision.

The clock pin (SCL) and data pin (SDA) are both open-drain I/O pins. Pull-up resistors external to the CYW20734 are required on

both the SCL and SDA pins for proper operation.

1.4.2 UART Interface

The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 6

Mbps. During initial boot, UART speeds may be limited to 750 kbps. The baud rate may be selected via a vendor-specific UART HCI

command. The CYW20734 has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support enhanced data rates. The

interface supports the Bluetooth UART HCI (H4) specification. The default baud rate for H4 is 115.2 kbaud.

The UART clock default setting is 24 MHz, and can be configured to run as high as 48 MHz to support up to 6 Mbps. The baud rate

of the CYW20734 UART is controlled by two values. The first is a UART clock divisor (set in the DLBR register) that divides the UART

clock by an integer multiple of 16. The second is a baud rate adjustment (set in the DHBR register) that is used to specify a number

of UART clock cycles to stuff in the first or second half of each bit time. Up to eight UART cycles can be inserted into the first half of

each bit time, and up to eight UART clock cycles can be inserted into the end of each bit time.

Tab l e 2 contains example values to generate common baud rates with a 24 MHz UART clock.

Table 2. Common Baud Rate Examples, 24 MHz Clock

Baud Rate (bps) Baud Rate Adjustment Mode Error (%)

High Nibble Low Nibble

3M 0xFF 0xF8 High rate 0.00

2M 0XFF 0XF4 High rate 0.00

1M 0X44 0XFF Normal 0.00

921600 0x05 0x05 Normal 0.16

460800 0x02 0x02 Normal 0.16

230400 0x04 0x04 Normal 0.16

115200 0x00 0x00 Normal 0.16

57600 0x00 0x00 Normal 0.16

38400 0x01 0x00 Normal 0.00

28800 0x00 0x00 Normal 0.16

19200 0x01 0x01 Normal 0.00

14400 0x00 0x00 Normal 0.16

9600 0x02 0x02 Normal 0.00

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CYW20734

Tab l e 3 contains example values to generate common baud rates with a 48 MHz UART clock.

Normally, the UART baud rate is set by a configuration record downloaded after reset. Support for changing the baud rate during

normal HCI UART operation is included through a vendor-specific command that allows the host to adjust the contents of the baud

rate registers.

The CYW20734 UART operates correctly with the host UART as long as the combined baud rate error of the two devices is within

±2.5%. This should include all temperature, voltage, and process variation dependent offsets.

1.4.3 Peripheral UART Interface

The CYW20734 has a second UART that may be used to interface to other peripherals. This peripheral UART is accessed through

the optional I/O ports, which can be configured individually and separately for each functional pin as shown in Table 4.

Table 3. Common Baud Rate Examples, 48 MHz Clock

Baud Rate (bps) High Rate Low Rate Mode Error (%)

6M 0xFF 0xF8 High rate 0

4M 0xFF 0xF4 High rate 0

3M 0x0 0xFF Normal 0

2M 0x44 0xFF Normal 0

1.5M 0x0 0xFE Normal 0

1M 0x0 0xFD Normal 0

921600 0x22 0xFD Normal 0.16

230400 0x0 0xF3 Normal 0.16

115200 0x1 0xE6 Normal –0.08

57600 0x1 0xCC Normal 0.04

38400 0x11 0xB2 Normal 0

19200 0x22 0x64 Normal 0

Table 4. CYW20734 Peripheral UART

Pin Name pUART_TX pUART_RX pUART_CTS_N pUART_RTS_N

Configured pin name P0 P2 P3 P1

P5 P4 P7 P6

P24 P25 P35 P30

P31 P33 – –

P32 P34 – –

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CYW20734

1.5 PCM Interface

The CYW20734 includes a PCM interface that shares pins with the I2S interface. The PCM Interface on the CYW20734 can connect

to linear PCM codec devices in master or slave mode. In master mode, the CYW20734 generates the PCM_CLK and PCM_SYNC

signals. In slave mode, these signals are provided by another master on the PCM interface and are inputs to the CYW20734.

The configuration of the PCM interface may be adjusted by the host through the use of vendor-specific HCI commands.

1.5.1 Slot Mapping

The CYW20734 supports up to three simultaneous full-duplex SCO or eSCO channels through the PCM interface. These three

channels are time-multiplexed onto the single PCM interface by using a time-slotting scheme where the 8 kHz or 16 kHz audio sample

interval is divided into as many as 16 slots. The number of slots is dependent on the selected interface rate (128 kHz, 512 kHz, or

1024 kHz). The corresponding number of slots for these interface rate is 1, 2, 4, 8, and 16, respectively. Transmit and receive PCM

data from an SCO channel is always mapped to the same slot. The PCM data output driver tristates its output on unused slots to allow

other devices to share the same PCM interface signals. The data output driver tristates its output after the falling edge of the PCM

clock during the last bit of the slot.

1.5.2 Frame Synchronization

The CYW20734 supports both short- and long-frame synchronization in both master and slave modes. In short-frame synchronization

mode, the frame synchronization signal is an active-high pulse at the audio frame rate that is a single-bit period in width and is

synchronized to the rising edge of the bit clock. The PCM slave looks for a high on the falling edge of the bit clock and expects the

first bit of the first slot to start at the next rising edge of the clock. In long-frame synchronization mode, the frame synchronization

signal is again an active-high pulse at the audio frame rate; however, the duration is three bit periods and the pulse starts coincident

with the first bit of the first slot.

1.5.3 Data Formatting

The CYW20734 may be configured to generate and accept several different data formats. For conventional narrowband speech mode,

the CYW20734 uses 13 of the 16 bits in each PCM frame. The location and order of these 13 bits can be configured to support various

data formats on the PCM interface. The remaining three bits are ignored on the input and may be filled with 0s, 1s, a sign bit, or a

programmed value on the output. The default format is 13-bit 2’s complement data, left justified, and clocked MSB first.

1.5.4 Burst PCM Mode

In this mode of operation, the PCM bus runs at a significantly higher rate of operation to allow the host to duty cycle its operation and

save current. In this mode of operation, the PCM bus can operate at a rate of up to 24 MHz. This mode of operation is initiated with

an HCI command from the host.

1.6 Clock Frequencies

The CYW20734 uses a 24 MHz crystal oscillator (XTAL).

1.6.1 Crystal Oscillator

The XTAL must have an accuracy of ±20 ppm as defined by the Bluetooth specification. Two external load capacitors in the range of

5 pF to 30 pF are required to work with the crystal oscillator. The selection of the load capacitors is XTAL-dependent (see Figure 3).

Figure 3. Recommended Oscillator Configuration—12 pF Load Crystal

22pF

20pF

Crystal

XIN

XOUT

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CYW20734

Tab l e 5showstherecommendedcrystalspecifications.

1.6.2 HID Peripheral Block

The peripheral blocks of the CYW20734 all run from a single 128 kHz low-power RC oscillator. The oscillator can be turned on at the

request of any of the peripherals. If the peripheral is not enabled, it shall not assert its clock request line.

The keyboard scanner is a special case, in that it may drop its clock request line even when enabled, and then reassert the clock

request line if a keypress is detected.

1.6.3 32 kHz Crystal Oscillator

Figure 4 shows the 32 kHz XTAL oscillator with external components and Table 6 lists the oscillator’s characteristics. It is a standard

Pierce oscillator using a comparator with hysteresis on the output to create a single-ended digital output. The hysteresis was added

to eliminate any chatter when the input is around the threshold of the comparator and is ~100 mV. This circuit can be operated with

a 32 kHz or 32.768 kHz crystal oscillator or be driven with a clock input at similar frequency. The default component values are: R1

= 10 MΩ and C1 = C2 = ~10 pF. The values of C1 and C2 are used to fine-tune the oscillator.

Figure 4. 32 kHz Oscillator Block Diagram

Table 5. Reference Crystal Electrical Specifications

Parameter Conditions Minimum Typical Maximum Unit

Nominal frequency – – 24.000 – MHz

Oscillation mode – Fundamental –

Frequency tolerance @25°C – ±10 – ppm

Tolerance stability over temp @0°C to +70°C – ±10 – ppm

Equivalent series resistance – – – 50 

Load capacitance – – 12 – pF

Operating temperature range – 0 – +70 °C

Storage temperature range – –40 – +125 °C

Drive level – – – 200 μW

Aging – – – ±10 ppm/year

Shunt capacitance – – – 2 pF

R1 32.768kHz

XTAL

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CYW20734

1.7 GPIO Ports

The CYW20734 has 40 general-purpose I/Os (GPIOs) in a 90-pin package. All GPIOs support programmable pull-ups and are capable

of driving up to 8 mA at 3.3V or 4 mA at 1.8V, except P26, P27, P28, and P29, which are capable of driving up to 16 mA at 3.3V or

8 mA at 1.8V.

Port 0–Port 1, Port 8–Port 19, Port 21–Port 23, and Port 28–Port 38

All of these pins can be programmed as ADC inputs.

Port 26–Port 29

P[26:29] consist of four pins. All pins are capable of sinking up to 16 mA for LEDs. These pins also have the PWM function, which

can be used for LED dimming.

1.8 Keyboard Scanner

The keyboard scanner is designed to autonomously sample keys and store them into buffer registers without the need for the host

microcontroller to intervene. The scanner has the following features:

■Ability to turn off its clock if no keys are pressed.

■Sequential scanning of up to 160 keys in an 8 × 20 matrix.

■Programmable number of columns from 1 to 20.

■Programmable number of rows from 1 to 8.

■16-byte key-code buffer (can be augmented by firmware).

■128 kHz clock that allows scanning of full 160-key matrix in about 1.2 ms.

■N-key rollover with selective 2-key lockout if ghost is detected.

■Keys are buffered until host microcontroller has a chance to read it, or until overflow occurs.

■Hardware debouncing and noise/glitch filtering.

■Low-power consumption. Single-digit µA-level sleep current.

1.8.1 Theory of Operation

The key scan block is controlled by a state machine with the following states:

1.8.2 Idle

The state machine begins in the idle state. In this state, all column outputs are driven high. If any key is pressed, a transition occurs

on one of the row inputs. This transition causes the 128 kHz clock to be enabled (if it is not already enabled by another peripheral)

and the state machine to enter the scan state. Also in this state, an

8-bit row-hit register and an 8-bit key-index counter is reset to 0.

Table 6. XTAL Oscillator Characteristics

Parameter Symbol Conditions Minimum Typical Maximum Unit

Output frequency Foscout – – 32.768 – kHz

Frequency tolerance – Crystal-dependent – 100 – ppm

Start-up time Tstartup –––500ms

XTAL drive level Pdrv For crystal selection 0.5 – – μW

XTAL series resistance Rseries For crystal selection – – 70 kΩ

XTAL shunt capacitance Cshunt For crystal selection – – 1.3 pF

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CYW20734

1.8.3 Scan

In the scan state, a row counter counts from 0 up to a programmable number of rows minus 1. After the last row is reached, the row

counter is reset and the column counter is incremented. This cycle repeats until the row and column counters are both at their

respective terminal count values. At that point, the state machine moves into the Scan-End state.

As the keys are being scanned, the key-index counter is incremented. This counter value is compared to the modifier key codes stored

in RAM, or in the key-code buffer if the key is not a modifier key. It can be used by the microprocessor as an index into a lookup table

of usage codes.

Also, as the nth row is scanned, the row-hit register is ORed with the current 8-bit row input values if the current column contains two

or more row hits. During the scan of any column, if a key is detected at the current row, and the row-hit register indicates that a hit

was detected in that same row on a previous column, then a ghost condition may have occurred, and a bit in the status register is set

to indicate this.

1.8.4 Scan End

This state determines whether any keys were detected while in the scan state. If yes, the state machine returns to the scan state. If

no, the state machine returns to the idle state, and the 128 kHz clock request signal is made inactive.

Note: The microcontroller can poll the key status register.

1.9 Mouse Quadrature Signal Decoder

The mouse signal decoder is designed to autonomously sample two quadrature signals commonly generated by an optomechanical

mouse. The decoder has the following features:

■Three pairs of inputs for X, Y, and Z (typical scroll wheel) axis signals. Each axis has two options:

❐For the X axis, choose P2 or P32 as X0 and P3 or P33 as X1.

❐For the Y axis, choose P4 or P34 as Y0 and P5 or P35 as Y1.

❐For the Z axis, choose P6 or P36 as Z0 and P7 or P37 as Z1.

■Control of up to four external high-current GPIOs to power external optoelectronics:

❐Turn-on and turn-off time can be staggered for each HC-GPIO to avoid simultaneous switching of high currents and having multiple

high-current devices on at the same time.

❐Sample time can be staggered for each axis.

❐Sense of the control signal can be active high or active low.

❐Control signal can be tristated for off condition or driven high or low, as appropriate.

1.9.1 Theory of Operation

The mouse decoder block has four 10-bit PWMs for controlling external quadrature devices and sampling the quadrature inputs at its

core.

The GPIO signals may be used to control such items as LEDs, external ICs that may emulate quadrature signals, photodiodes, and

photodetectors.

1.10 ADC Port

The ADC block is a single switched-cap Σ-∆ ADC core for audio and DC measurement. It operates at the 12 MHz clock rate and has

32 DC input channels, including 28 GPIO inputs. The internal bandgap reference has ±5% accuracy without calibration. Different

calibration and digital correction schemes can be applied to reduce ADC absolute error and improve measurement accuracy in DC

mode.

1.11 Microphone Input

The CYW20734 integrates support for a differential or single-ended mono microphone. This reduces the requirement on external

components because there is no need for a separate microphone amplifier. The microphone input has a user-programmable gain

range of 0–42 dB with 3 dB steps. A microphone bias output from the chip is provided that can be used to bias an electret condenser-

type microphone. The MIC Bias reference output voltage is 2.1V or 21/25 of the audio power supply. The MIC block can be powered

down when it is not in use.

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CYW20734

1.12 PWM

The CYW20734 has four internal PWMs. The PWM module consists of the following:

■PWM1–4

■Each of the four PWM channels, PWM1–4, contains the following registers:

❐10-bit initial value register (read/write)

❐10-bit toggle register (read/write)

❐10-bit PWM counter value register (read)

■PWM configuration register shared among PWM1–4 (read/write). This 12-bit register is used:

❐To configure each PWM channel

❐To select the clock of each PWM channel

❐To change the phase of each PWM channel

Figure 5 shows the structure of one PWM.

Figure 5. PWM Block Diagram

pwm_cfg_adrregister pwm#_init_val_adrregister pwm#_togg_val_adrregister

pwm#_cntr_adr

enable

cntrvalueisARMreadable

clk_sel

o_flip

10'H000

10'H3FF

10 10

Example:PWMcntrw/pwm#_init_val=0(dashedline)

PWMcntrw/pwm#_init_val=x(solidline)

10'Hx

pwm_out

pwm_togg_val_adr

pwm_out

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CYW20734

1.13 Shutter Control for 3D Glasses

The CYW20734, combined with the Cypress Bluetooth host device, provides full system support for 3D glasses on televisions. The

Cypress Bluetooth host device gets frame synchronization signals from the TV, converts them into proprietary timing control

messages, then passes the messages to the CYW20734. The CYW20734 uses these messages to synchronize the shutter control

for the 3D glasses with the television frames.

The CYW20734 can provide up to four synchronized control signals for left and right eye shutter control. These four lines can output

pulses with microsecond resolution for on and off timing. The total cycle time can be set for any period up to 65535 msec. The pulses

are synchronized to each other for left and right eye shutters.

The CYW20734 seamlessly adjusts the timing of the control signals based on control messages from the Cypress Bluetooth host

device, ensuring that the 3D glasses remain synchronized to the TV display frame.

3D hardware control on the CYW20734 works independently of the rest of the system. The CYW20734 negotiates sniff with the

Cypress Bluetooth host device and, except for sniff resynchronization periods, most of the CYW20734 circuitry remains in a low power

state while the 3D glasses subsystem continues to provide shutter timing and control pulses. This significantly reduces total system

power consumption.

1.14 Triac Control

The CYW20734 includes hardware support for zero-crossing detection and trigger control for up to four triacs. The CYW20734 detects

zero-crossing on the AC zero detection line and uses that to provide a pulse that is offset from the zero crossing. This allows the

CYW20734 to be used in dimmer applications, as well as any other applications that require a control signal that is offset from an

input event.

The zero-crossing hardware includes an option to suppress glitches.

1.15 Serial Peripheral Interface

The CYW20734 has two independent SPI interfaces. One is a master-only interface (SPI_2) and the other (SPI_1) can be either a

master or a slave. Each interface has a 64-byte transmit buffer and a 64-byte receive buffer. To support more flexibility for user

applications, the CYW20734 has optional I/O ports that can be configured individually and separately for each functional pin. The

CYW20734 acts as an SPI master device that supports 1.8V or 3.3V SPI slaves. The CYW20734 can also act as an SPI slave device

that supports a 1.8V or 3.3V SPI master.

Note: SPI voltage depends on VDDO/VDDM; therefore, it defines the type of devices that can be supported.

1.16 Infrared Modulator

The CYW20734 includes hardware support for infrared TX. The hardware can transmit both modulated and unmodulated waveforms.

For modulated waveforms, hardware inserts the desired carrier frequency into all IR transmissions. IR TX can be sourced from

firmware-supplied descriptors, a programmable bit, or the peripheral UART transmitter.

If descriptors are used, they include IR on/off state and the duration between 1–32767 µsec. The CYW20734 IR TX firmware driver

inserts this information in a hardware FIFO and makes sure that all descriptors are played out without a glitch due to underrun (see

Figure 6).

Figure 6. Infrared TX

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CYW20734

1.17 Infrared Learning

The CYW20734 includes hardware support for infrared learning. The hardware can detect both modulated and unmodulated signals.

For modulated signals, the CYW20734 can detect carrier frequencies between 10 kHz and 500 kHz, and the duration that the signal

is present or absent. The CYW20734 firmware driver supports further analysis and compression of the learned signal. The learned

signal can then be played back through the CYW20734 IR TX subsystem (see Figure 7).

Figure 7. Infrared RX

1.18 Power Management Unit

The Power Management Unit (PMU) provides power management features that can be invoked by software through power

management registers or packet-handling in the baseband core.

1.18.1 RF Power Management

The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz trans-

ceiver, which then processes the power-down functions accordingly.

1.18.2 Host Controller Power Management

Power is automatically managed by the firmware based on input device activity. As a power-saving task, the firmware controls the

disabling of the on-chip regulator when in HIDOFF (deep sleep) mode.

1.18.3 BBC Power Management

There are several low-power operations for the BBC:

■Physical layer packet handling turns RF on and off dynamically within packet TX and RX.

■Bluetooth-specified low-power connection mode. While in these low-power connection modes, the CYW20734 runs on the Low

Power Oscillator and wakes up after a predefined time period.

The CYW20734 automatically adjusts its power dissipation based on user activity. The following power modes are supported:

■Active mode

■Idle mode

■Sleep mode

■HIDOFF (deep sleep) mode

The CYW20734 transitions to the next lower state after a programmable period of user inactivity. When user activity resumes, the

CYW20734 immediately enters Active mode.

In HIDOFF mode, the CYW20734 baseband and core are powered off by disabling power to VDDC_OUT and PAVDD. The VDDO

domain remains powered up and will turn the remainder of the chip on when it detects user events. This mode minimizes chip power

consumption and is intended for long periods of inactivity.

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CYW20734

2. Pin Assignments

2.1 Pin Descriptions

Table 7. Pin Descriptions

Pin Number Pin Name I/O Power Domain Description

Radio I/O

A1 RFOP I/O PAVDD RF antenna port

RF Power Supplies

D1 IFVDD1P2 I IFVDD1P2 IFPLL power supply

B1 LNAVDD1P2 I LNAVDD1P2 RF front-end supply

C1 VCOVDD1P2 I VCOVDD1P2 VCO supply

B2 PLLVDD1P2 I PLLVDD1P2 RFPLL and crystal oscillator supply

A3 PAVDD O PAVDD PA supply

Power Supplies

F1, G3 VDDC I VDDC Baseband core supply

A9, K1 VDDO I VDDO I/O pad and core supply

B6 MIC_AVDD I MIC_AVDD Microphone supply

A5 ADC_AVBAT I ADC_AVBAT ADC supply

A8 ADC_AVDDC I ADC_AVDDC ADC supply

Ground

A2, A10, B5, C2,

C3, D3, F2, J1, K10

VSS I VSS Ground

B8 AVSS I AVSS Analog ground

Clock Generator and Crystal Interface

B4 XTALI I PLLVDD1P2 Crystal oscillator input. See “Crystal Oscillator” on page 10

for options.

A4 XTALO O PLLVDD1P2 Crystal oscillator output.

E6 XTALI32K I PLLVDD1P2 Low-power oscillator input.

F6 XTALO32K O PLLVDD1P2 Low-power oscillator output.

Core

H3 RESET_N I/O PU VDDO Active-low system reset with open-drain output and internal

pull-up resistor.

F5 TM1 I VDDO Device test mode control.

Connect to GND for all applications.

E5 JTAG_SEL I VDDO ARM JTAG debug mode control.

Connect to GND for all applications.

Microphone

A7 MICP I MIC_AVDD Microphone positive input

B7 MICN I MIC_AVDD Microphone negative input

A6 MIC_BIAS O MIC_AVDD Microphone bias supply

PCM2/I2S

J3 PCM_SYNC I/O, PD VDDO Frame synchronization for PCM interface.

Alternate function:

I2S word select

K2 PCM_CLK I/O, PD VDDO Clock for PCM interface.

Alternate function:

I2S clock

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CYW20734

K3 PCM_IN I, PU VDDO Data input for PCM interface.

Alternate function:

I2S data input

SDA

J2 PCM_OUT O, PD VDDO Data output for PCM interface.

Alternate function:

I2S data output

SCL

UART

H5 UART_RXD I VDDO UART serial input – Serial data input for the HCI UART

interface.

H4 UART_TXD O, PU VDDO UART serial output – Serial data output for the HCI UART

interface.

J4 UART_RTS_N O, PU VDDO Request to send (RTS) for HCI UART interface. Leave

unconnected if not used.

J5 UART_CTS_N I, PU VDDO Clear to send (CTS) for HCI UART interface. Leave uncon-

nected if not used.

BSC/SPI

H1 SPI_MISO_SCL I/O VDDO BSC clock

G1 SPI_MOSI_SDA I/O VDDO BSC data

G2 SPI_CLK I/O VDDO Serial flash SPI clock

H2 SPI_CSN I/O VDDO Serial flash active-low chip select

LDO Regulator Power Supplies

B3 VBAT I VBAT 1.2V LDO input

E1 VDDC_OUT O VDDC_OUT 1.2V LDO output

Reserved

F4 Reserved0 I VDDO Reserved. Leave unconnected.

D5 Reserved1 I VDDO Reserved. Leave unconnected.

E3 Reserved2 I VDDO Reserved. Connect to GND.

E4 Reserved3 I VDDO Reserved. Leave unconnected.

D4 Reserved4 I VDDO Reserved. Connect to GND.

Table 7. Pin Descriptions (Cont.)

Pin Number Pin Name I/O Power Domain Description

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CYW20734

Table 8. GPIO Pin Descriptionsa

Number

Name

Default Di-

rection

POR

State

Post-Reset

StatebPower Do-

main Alternate Function Description

G7 P0 Input Floating Floating VDDO ■GPIO: P0

■Keyboard scan input (row): KSI0

■A/D converter input 29

■Peripheral UART: puart_tx

■SPI_1: MOSI (master and slave)

■IR_RX

■60Hz_main

Note: Not available during TM1 = 1.

G6 P1 Input Floating Floating VDDO ■GPIO: P1

■Keyboard scan input (row): KSI1

■A/D converter input 28

■Peripheral UART: puart_rts

■SPI_1: MISO (master and slave)

■IR_TX

C9 P2 Input Floating Floating VDDO ■GPIO: P2

■Keyboard scan input (row): KSI2

■Quadrature: QDX0

■Peripheral UART: puart_rx

■SPI_1: SPI_CS (slave only)

■SPI_1: MOSI (master only)

E9 P3 Input Floating Floating VDDO ■GPIO: P3

■Keyboard scan input (row): KSI3

■Quadrature: QDX1

■Peripheral UART: puart_cts

■SPI_1: SPI_CLK (master and slave)

G10 P4 Input Floating Floating VDDO ■GPIO: P4

■Keyboard scan input (row): KSI4

■Quadrature: QDY0

■Peripheral UART: puart_rx

■SPI_1: MOSI (master and slave)

■IR_TX

K4 P5 Input Floating Floating VDDO ■GPIO: P5

■Keyboard scan input (row): KSI5

■Quadrature: QDY1

■Peripheral UART: puart_tx

■SPI_1: MISO (master and slave)

■BSC: SDA

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CYW20734

G4 P6 Input Floating Floating VDDO ■GPIO: P6

■Keyboard scan input (row): KSI6

■Quadrature: QDZ0

■Peripheral UART: puart_rts

■SPI_1: SPI_CS (slave only)

■60Hz_main

B10 P7 Input Floating Floating VDDO ■GPIO: P7

■Keyboard scan input (row): KSI7

■Quadrature: QDZ1

■Peripheral UART: puart_cts

■SPI_1: SPI_CLK (master and slave)

■BSC: SCL

D7 P8 Input Floating Floating VDDO ■GPIO: P8

■Keyboard scan output (column): KSO0

■A/D converter input 27

■External T/R switch control: ~tx_pd

D9 P9 Input Floating Floating VDDO ■GPIO: P9

■Keyboard scan output (column): KSO1

■A/D converter input 26

■External T/R switch control: tx_pd

G8 P10 Input Floating Floating VDDO ■GPIO: P10

■Keyboard scan output (column): KSO2

■A/D converter input 25

■External PA ramp control: ~PA_Ramp

G9 P11 Input Floating Floating VDDO ■GPIO: P11

■Keyboard scan output (column): KSO3

■A/D converter input 24

C10 P12 Input Floating Floating VDDO ■GPIO: P12

■Keyboard scan output (column): KSO4

■A/D converter input 23

E8 P13 Input Floating Floating VDDO ■GPIO: P13

■Keyboard scan output (column): KSO5

■A/D converter input 22

■PWM3

■Triac control 3

Table 8. GPIO Pin Descriptionsa (Cont.)

Number

Name

Default Di-

rection

POR

State

Post-Reset

StatebPower Do-

main Alternate Function Description

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CYW20734

J7 P14 Input Floating Input enable,

pull-down

VDDO ■GPIO: P14

■Keyboard scan output (column): KSO6

■A/D converter input 21

■PWM2

■Triac control 4

J8 P15 Input Floating Input enable,

pull-up

VDDO ■GPIO: P15

■Keyboard scan output (column): KSO7

■A/D converter input 20

■IR_RX

■60Hz_main

B9 P16 Input Floating Floating VDDO ■GPIO: P16

■Keyboard scan output (column): KSO8

■A/D converter input 19

J10 P17 Input Floating Floating VDDO ■GPIO: P17

■Keyboard scan output (column): KSO9

■A/D converter input 18

F9 P18 Input Floating Floating VDDO ■GPIO: P18

■Keyboard scan output (column): KSO10

■A/D converter input 17

H7 P19 Input Floating Floating VDDO ■GPIO: P19

■Keyboard scan output (column): KSO11

■A/D converter input 16

F10 P20 Input Floating Floating VDDO ■GPIO: P20

■Keyboard scan output (column): KSO12

D10 P21 Input Floating Floating VDDO ■GPIO: P21

■Keyboard scan output (column): KSO13

■A/D converter input 14

■Triac control 3

E6 P22 Input Floating Floating VDDO ■GPIO: P22

■Keyboard scan output (column): KSO14

■A/D converter input 13

■Triac control 4

■XTALO32K

F6 P23 Input Floating Floating VDDO ■GPIO: P23

■Keyboard scan output (column): KSO15

■A/D converter input 12

■XTALI32K

Table 8. GPIO Pin Descriptionsa (Cont.)

Number

Name

Default Di-

rection

POR

State

Post-Reset

StatebPower Do-

main Alternate Function Description

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CYW20734

G5 P24 Input Floating Floating VDDO ■GPIO: P24

■Keyboard scan output (column): KSO16

■SPI_1: SPI_CLK (master and slave)

■Peripheral UART: puart_tx

F7 P25 Input Floating Floating VDDO ■GPIO: P25

■Keyboard scan output (column): KSO17

■SPI_1: MISO (master and slave)

■Peripheral UART: puart_rx

K8 P26

PWM0

Input Floating Input enable,

pull-down

VDDO ■GPIO: P26

■Keyboard scan output (column): KSO18

■SPI_1: SPI_CS (slave only)

■Optical control output: QOC0

■Triac control 1

■Current: 16 mA sink

K9 P27

PWM1

Input Floating Floating VDDO ■GPIO: P27

■Keyboard scan output (column): KSO19

■SPI_1: MOSI (master and slave)

■Optical control output: QOC1

■Triac control 2

■Current: 16 mA sink

K7 P28

PWM2

Input Floating Input enable,

pull-up

VDDO ■GPIO: P28

■Optical control output: QOC2

■A/D converter input 11

■LED1

■Current: 16 mA sink

K6 P29

PWM3

Input Floating Floating VDDO ■GPIO: P29

■Optical control output: QOC3

■A/D converter input 10

■LED2

■Current: 16 mA sink

J9 P30 Input Floating Floating VDDO ■GPIO: P30

■A/D converter input 9

■Peripheral UART: puart_rts

H6 P31 Input Floating Floating VDDO ■GPIO: P31

■A/D converter input 8

■Peripheral UART: puart_tx

Table 8. GPIO Pin Descriptionsa (Cont.)

Number

Name

Default Di-

rection

POR

State

Post-Reset

StatebPower Do-

main Alternate Function Description

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CYW20734

H9 P32 Input Floating Floating VDDO ■GPIO: P32

■A/D converter input 7

■Quadrature: QDX0

■SPI_1: SPI_CS (slave only)

■Auxiliary clock output: ACLK0

■Peripheral UART: puart_tx

H10 P33 Input Floating Floating VDDO ■GPIO: P33

■A/D converter input 6

■Quadrature: QDX1

■SPI_1: MOSI (slave only)

■Auxiliary clock output: ACLK1

■Peripheral UART: puart_rx

H8 P34 Input Floating Floating VDDO ■GPIO: P34

■A/D converter input 5

■Quadrature: QDY0

■Peripheral UART: puart_rx

■External T/R switch control: tx_pd

F8 P35 Input Floating Floating VDDO ■GPIO: P35

■A/D converter input 4

■Quadrature: QDY1

■Peripheral UART: puart_cts

■BSC: SDA

D8 P36 Input Floating Floating VDDO ■GPIO: P36

■A/D converter input 3

■Quadrature: QDZ0

■SPI_1: SPI_CLK (master and slave)

■Auxiliary Clock Output: ACLK0

■External T/R switch control: ~tx_pd

E7 P37 Input Floating Floating VDDO ■GPIO: P37

■A/D converter input 2

■Quadrature: QDZ1

■SPI_1: MISO (slave only)

■Auxiliary clock output: ACLK1

■BSC: SCL

Table 8. GPIO Pin Descriptionsa (Cont.)

Number

Name

Default Di-

rection

POR

State

Post-Reset

StatebPower Do-

main Alternate Function Description

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CYW20734

2.2 Ball Map

The CYW20734 ball map is shown in Figure 8.

Figure 8. CYW20734 Ball Map

D6 P38 Input Floating Floating VDDO ■GPIO: P38

■A/D converter input 1

■SPI_1: MOSI (master and slave)

■IR_TX

J6 P39 Input Floating Floating VDDO ■GPIO: P39

■SPI_1: SPI_CS (slave only)

■Infrared control: IR_RX

■External PA ramp control: PA_Ramp

■60Hz_main

a. During power-on reset, all inputs are disabled.

b. The post-reset state is the GPIO state just after a power-on reset before firmware gets loaded.

Table 8. GPIO Pin Descriptionsa (Cont.)

Number

Name

Default Di-

rection

POR

State

Post-Reset

StatebPower Do-

main Alternate Function Description

123 45678910

ARFOP VSS PAVDD XTALO ADC_

AVBAT

MICBIAS MICP ADC_

AVDDC

VDDO VSS A

BLNAVDD1P2 PLLVDD1P2 VBAT XTALI VSS MIC_AVDD MICN AVSS P16 P7 B

CVCOVDD1P2 VSS VSS P2 P12 C

DIFVDD1P2 VSS RESERVED4 RESERVED1 P38 P8 P36 P9 P21 D

EVDDC_OUT RESERVED2 RESERVED3 JTAG_SEL P22/

XTALI32K

P37 P13 P3 E

FVDDC VSS RESERVED0 TM1 P23/

XTALO32K

P25 P35 P18 P20 F

GSPI_MOSI_

SDA

SPI_CLK VDDC P6 P24 P1 P0 P10 P11 P4 G

HSPI_MISO_

SCL

SPI_CSN RESET_N UART_TXD UART_RXD P31 P19 P34 P32 P33 H

JVSS PCM_OUT PCM_SYNC UART_

RTS_N

UART_

CTS_N

P39 P14 P15 P30 P17 J

KVDDO PCM_CLK PCM_IN P5 P29 P28 P26 P27 VSS K

123 45678910

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CYW20734

3. Specifications

3.1 Electrical Characteristics

Tab l e 9 shows the maximum electrical rating for voltages referenced to VDD pin.

Tab l e 10 shows the power supply characteristics for the range TJ = 0°C to 125°C.

Table 9. Absolute Maximum Voltages

Requirement Parameter Specification Unit

Minimum Nominal Maximum

Ambient Temperature of Operation –30 25 85 °C

Storage temperature –40 – 150 °C

ESD Tolerance HBM –2000 – 2000 V

ESD Tolerance MM –100 – 100 V

ESD Tolerance CDM –500 – 500 V

Latch-up – 200 – mA

VDD Core 1.14 1.2 1.26 V

VDD IO 1.62 3.3 3.6 V

VDD RF (excluding class 1 PA) 1.14 1.2 1.26 V

Table 10. Power Supply Specifications

Parameter Conditions Min. Typical Max. Unit

VBAT input – 1.62 3.3 3.6 V

Operating temperature Junction temperature –40 50 125 °C

Total system leakage Max value is defined at

temp = 85°C

–0.51.3μA

PMU turn-on time VBAT is ready. TBD – 300 μs

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CYW20734

Tab l e 11showsthedigitallevelcharacteristicsfor(VSS=0V).

Table 11. VDDC LDO Electrical Specifications

Parameter Conditions Min. Typical Max. Unit

Input Voltage – 1.62 3.3 3.6 V

Nominal Output

Voltage

––1.2V

DC Accuracy Accuracy at any step, including bandgap reference. –5 – 5 %

Output Voltage

Programmability

Range 0.89 – 1.34 V

Step Size – 30 – mV

Load Current – – – 40 mA

Dropout Voltage Iload = 40 mA – – 200 mV

Line Regulation Vin from 1.62V to 3.6V, Iload = 40 mA – – 0.2 %Vo/V

Load Regulation Iload = 1 mA to 40 mA, Vout = 1.2V, Package + PCB

R=0.3Ω

– 0.02 0.05 %Vo/mA

Quiescent Current No load @Vin = 3.3V – 18 23 μA

Max load @Vin = 3.3V – – 0.56 0.65 mA

Power down Current Vin = 3.3V @25C – 0.2 – μA

Vin = 3.6 @80C – TBD – –

Output Noise Iload = 15 mA, 100 kHz – 40 nV/sqrtHz

Iload = 15 mA, 2 MHz – 14 nV/sqrtHz

PSRR Vin = 3.3, Vout = 1.2V,

Iload = 40 mA

1 kHz 65 – – dB

10 kHz 60 – – dB

100 kHz 55 – – dB

Over Current Limit – 100 – – mA

Turn-on Time VBAT = 3.3V, BG already on,

LDO OFF to ON, Co = 1 μF, 90% of Vout

––100μs

In-rush current

during turn-on

During start-up, Co = 1 μF––60mA

Transient Perfor-

mance

Iload = 1 mA to 15 mA and

15 mA to 1 mA in 1 μs

––40mV

Iload = 15 mA to 40 mA and

40 mA to 15 mA in 1 μs

––25–

External Output

Capacitor

Ceramic cap with ESR ≤0.5Ω0.8 1 4.7 μF

External Input

Capacitor

Ceramic, X5R, 0402, ±20%, 10V. – 1 – μF

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Table 12. ADC Microphone Specifications

Parameter Symbol Conditions/Comments Min. Typical Max. Unit

Analog supply voltage AVBAT Battery and I/O supply 1.62 3.3 3.6 V

Analog core supply AVDDC ±10% 1.08 1.2 1.32 V

Audio supply Mic_avdd Only available for audio applications

when audio supply is separated from

battery supply

1.8 2.5 3.3 V

Current consumption ITOT ––1.2–mA

Power down current – – – 0.5 – µA

ADC reference voltage VREF From BG with ±3% accuracy – .85 V

Input clock frequency – From XTALOSC – 24 26 MHz

ADC sampling clock – – – 12 MHz

Absolute error – Includes gain error, offset, and

distortion.

Note: Before factory calibration

––5%

– Includes gain error, offset, and

distortion.

Note: After factory calibration

––2%

Effective number of bits (ENOB) – For static measurements 10 – – Bit

For audio applications 12 – –

ADC input full scale FS For audio applications – 1.7 – Vpp

For static measurements 1.8 – 3.6

Conversion rate – For audio applications 16 48 – kHz

For static measurements 50 100 –

Signal bandwidth – For audio applications 20 – 8K Hz

For static measurements – DC –

Input impedance Rin For audio applications 10 – – kΩ

For static measurements 500 – –

Startup time – For audio applications – 10 – ms

For static measurements – 20 – µs

MIC PGA gain range – – 0 18 dB

MIC PGA gain step – – 3 dB

MIC PGA gain error – Include part-to-part gain variation –3 ±1 3 dB

PGA input reference noise – ■@ 18 dB PGA gain

■A-weighted

––15µV

Passband gain flatness – ■PGA + ADC

■100Hz–4kHz

–0.5 – 0.5 dB

MIC bias output voltage – @2.5Vsupply – 2.1 – V

MIC bias loading current – – – – 3 mA

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Note:

In Table 13, current consumption measurements are taken at VBAT with the assumption that VBAT is connected to VDDIO and LDOIN.

MIC bias noise – ■PGA input referred. 6 dB attenuation

is assumed from MIC bias output to

PGA input.

■20 Hz to 8 kHz

■A-weighted

––3µV

ADC SNR – ■A-weighted

■0 dB PGA gain

78 – – dB

ADC THD + N – ■–3 dBFS input

■0 dB PGA gain

74 – – dB

GPIO input voltage – Must be lower than VBAT – – 3.6 V

GPIO source impedancea–Resistance ––1kΩ

– Capacitance – – 10 pF

a. Conditional requirement for the measurement time of 10 µs. Relaxed with longer measurement time for each GPIO input channel.

Table 13. Digital I/O Characteristics

Characteristics Symbol Minimum Typical Maximum Unit

Input low voltage (VDDO = 3.3V) VIL ––0.8V

Input high voltage (VDDO = 3.3V) VIH 2.0 – – V

Input low voltage (VDDO = 1.8V) VIL ––0.6V

Input high voltage (VDDO = 1.8V) VIH 1.1 – – V

Output low voltage VOL ––0.4V

Output high voltage VOH VDDO – 0.4V – – V

Input low current IIL ––1.0μA

Input high current IIH ––1.0μA

Output low current

(VDDO = 3.3V, VOL = 0.4V)

IOL ––8.0mA

Output high current

(VDDO = 3.3V, VOH = 2.9V)

IOH ––8.0mA

Output high current

(VDDO = 1.8V, VOH = 1.4V)

IOH ––4.0mA

Input capacitance CIN ––0.4pF

Table 12. ADC Microphone Specifications (Cont.)

Parameter Symbol Conditions/Comments Min. Typical Max. Unit

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Table 14. Bluetooth and BLE Current Consumption, Class 1

Operating Mode Typical Unit

DM1/DH1 32.15 mA

DM3/DH3 38.14 mA

DM5/DH5 38.46 mA

3DH5/3DH5 37.10 mA

Page scan 486 μA

Sniff slave (495 ms) 254 μA

Sniff slave (22.5 ms) 2.6 mA

Sniff slave (11.25 ms) 4.95 mA

HIDOFF (deep sleep) 2.69 μA

BLE scana355 μA

BLE ADV unconnectable 1.00 sec 176 μA

BLE connected 600 ms interval 211 μA

a.No devices present. A 1.28 second interval with a scan window of 11.25 ms.

Table 15. Bluetooth and BLE Current Consumption, Class 2 (0 dBm)

Operating Mode Typical Unit

DM1/DH1 27.5 mA

DM3/DH3 31.34 mA

DM5/DH5 32.36 mA

3DH5/3DH5 31.57 mA

HIDOFF (deep sleep) 2.69 μA

BLE scana

a.No devices present. A 1.28 second interval with a scan window of 11.25 ms.

368 μA

BLE ADV unconnectable 1.00 sec 174 μA

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3.2 RF Specifications

Note:

■All specifications in Ta b l e 1 6 are for industrial temperatures.

■All specifications in Ta b l e 1 6 are single-ended. Unused inputs are left open.

Table 16. Receiver RF Specifications

Parameter Conditions Minimum Typical aMaximum Unit

General

Frequency range – 2402 – 2480 MHz

RX sensitivity bGFSK, 0.1% BER, 1 Mbps – –93.5 – dBm

LE GFSK, 0.1% BER, 1 Mbps – –96.5 – dBm

/4-DQPSK, 0.01% BER, 2 Mbps – –95.5 – dBm

8-DPSK, 0.01% BER, 3 Mbps – –89.5 – dBm

Maximum input GFSK, 1 Mbps – – –20 dBm

Maximum input /4-DQPSK, 8-DPSK, 2/3 Mbps – – –20 dBm

Interference Performance

C/I cochannel GFSK, 0.1% BER – 9.5 11 dB

C/I 1 MHz adjacent channel GFSK, 0.1% BER – –5 0 dB

C/I 2 MHz adjacent channel GFSK, 0.1% BER – –40 –30.0 dB

C/I > 3 MHz adjacent channel GFSK, 0.1% BER – –49 –40.0 dB

C/I image channel GFSK, 0.1% BER – –27 –9.0 dB

C/I 1 MHz adjacent to image channel GFSK, 0.1% BER – –37 –20.0 dB

C/I cochannel /4-DQPSK, 0.1% BER – 11 13 dB

C/I 1 MHz adjacent channel /4-DQPSK, 0.1% BER – –8 0 dB

C/I 2 MHz adjacent channel /4-DQPSK, 0.1% BER – –40 –30.0 dB

C/I > 3 MHz adjacent channel 8-DPSK, 0.1% BER – –50 –40.0 dB

C/I image channel /4-DQPSK, 0.1% BER – –27 –7.0 dB

C/I 1 MHz adjacent to image channel /4-DQPSK, 0.1% BER – –40 –20.0 dB

C/I cochannel 8-DPSK, 0.1% BER – 17 21 dB

C/I 1 MHz adjacent channel 8-DPSK, 0.1% BER – –5 5 dB

C/I 2 MHz adjacent channel 8-DPSK, 0.1% BER – –40 –25.0 dB

C/I > 3 MHz adjacent channel 8-DPSK, 0.1% BER – –47 –33.0 dB

C/I Image channel 8-DPSK, 0.1% BER – –20 0 dB

C/I 1 MHz adjacent to image channel 8-DPSK, 0.1% BER – –35 –13.0 dB

Out-of-Band Blocking Performance (CW)c

30 MHz–2000 MHz 0.1% BER – –10.0 – dBm

2000–2399 MHz 0.1% BER – –27 – dBm

2498–3000 MHz 0.1% BER – –27 – dBm

3000 MHz–12.75 GHz 0.1% BER – –10.0 – dBm

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Out-of-Band Blocking Performance, Modulated Interferer

776–764 MHz CDMA – –10d–dBm

824–849 MHz CDMA – –10d–dBm

1850–1910 MHz CDMA – –23d–dBm

824–849 MHz EDGE/GSM – –10d–dBm

880–915 MHz EDGE/GSM – –10d–dBm

1710–1785 MHz EDGE/GSM – –23d–dBm

1850–1910 MHz EDGE/GSM – –23d–dBm

1850–1910 MHz WCDMA – –23d–dBm

1920–1980 MHz WCDMA – –23d–dBm

Intermodulation Performancee

BT, Df = 5 MHz – –39.0 – – dBm

Spurious Emissionsf

30 MHz to 1 GHz – – – –62 dBm

1 GHz to 12.75 GHz – – – –47 dBm

65 MHz to 108 MHz FM RX – –147 – dBm/Hz

746 MHz to 764 MHz CDMA – –147 – dBm/Hz

851–894 MHz CDMA – –147 – dBm/Hz

925–960 MHz EDGE/GSM – –147 – dBm/Hz

1805–1880 MHz EDGE/GSM – –147 – dBm/Hz

1930–1990 MHz PCS – –147 – dBm/Hz

2110–2170 MHz WCDMA – –147 – dBm/Hz

a. Typical operating conditions are 1.22V operating voltage and 25°C ambient temperature.

b. The receiver sensitivity is measured at BER of 0.1% on the device interface.

c. Meets this specification using front-end band pass filter.

d. Numbers are referred to the pin output with an external BPF filter.

e. f0 = -64 dBm Bluetooth-modulated signal, f1 = –39 dBm sine wave, f2 = –39 dBm Bluetooth-modulated signal, f0 = 2f1 – f2, and |f2 – f1| = n*1 MHz, where n is 3, 4, or

5. For the typical case, n = 4.

f. Includes baseband radiated emissions.

Table 16. Receiver RF Specifications (Cont.)

Parameter Conditions Minimum Typical aMaximum Unit

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Note:

■All specifications in Ta b l e 1 7 are for industrial temperatures.

■All specifications in Ta b l e 1 7 are single-ended. Unused inputs are left open.

Table 17. Transmitter RF Specifications

Parameter Conditions Minimum Typical Maximum Unit

General

Frequency range – 2402 – 2480 MHz

Class1: GFSK TX powera

a. TBD dBm output for GFSK measured with PAVDD = 2.5V.

––12–dBm

Class1: EDR TX powerb

b. TBD dBm output for EDR measured with PAVDD = 2.5V.

– –9–dBm

Class 2: GFSK TX power – – 2 – dBm

Power control step – 2 4 8 dB

Modulation Accuracy

/4-DQPSK Frequency Stability – –10 – 10 kHz

/4-DQPSK RMS DEVM – – – 20 %

/4-QPSK Peak DEVM – – – 35 %

/4-DQPSK 99% DEVM – – – 30 %

8-DPSK frequency stability – –10 – 10 kHz

8-DPSK RMS DEVM – – – 13 %

8-DPSK Peak DEVM – – – 25 %

8-DPSK 99% DEVM – – – 20 %

In-Band Spurious Emissions

1.0 MHz < |M – N| < 1.5 MHz – – – –26 dBc

1.5 MHz < |M – N| < 2.5 MHz – – – –20 dBm

|M – N| > 2.5 MHz – – – –40 dBm

Out-of-Band Spurious Emissions

30 MHz to 1 GHz – – – –36.0c

c. Maximum value is the value required for Bluetooth qualification.

dBm

1 GHz to 12.75 GHz – – – –30.0c, d

d. Meets this spec using a front-end band-pass filter.

dBm

1.8 GHz to 1.9 GHz – – – –47.0 dBm

5.15 GHz to 5.3 GHz – – – –47.0 dBm

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3.3 Timing and AC Characteristics

In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams.

3.3.1 UART Timing

Figure 9. UART Timing

Table 18. BLE RF Specifications

Parameter Conditions Minimum Typical Maximum Unit

Frequency range N/A 2402 – 2480 MHz

RX senseaGFSK, 0.1% BER, 1 Mbps – –96.5 – dBm

TX powerbN/A –9–dBm

Mod Char: Delta F1 average N/A 225 255 275 kHz

Mod Char: Delta F2 maxcN/A 99.9 – – %

Mod Char: Ratio N/A 0.8 0.95 – %

a. Dirty TX is Off.

b. The BLE TX power can be increased to compensate for front-end losses such as BPF, diplexer, switch, etc. The output is capped at 12 dBm

out. The BLE TX power at the antenna port cannot exceed the 10 dBm EIRP specification limit.

c. At least 99.9% of all delta F2 max frequency values recorded over 10 packets must be greater than 185 kHz.

Table 19. UART Timing Specifications

Reference Characteristics Min. Max. Unit

1 Delay time, UART_CTS_N low to UART_TXD valid – 24 Baud out

cycles

2 Setup time, UART_CTS_N high before midpoint of stop bit – 10 ns

3 Delay time, midpoint of stop bit to UART_RTS_N high – 2 Baud out

cycles

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3.3.2 SPI Timing

The SPI interface can be clocked up to 24 MHz.

Tab l e 20 and Figure 10 show the timing requirements when operating in SPI Mode 0 and 2.

Figure 10. SPI Timing, Mode 0 and 2

Table 20. SPI Mode 0 and 2

Reference Characteristics Minimum Maximum Unit

1 Time from slave assert SPI_INT to master assert SPI_CSN (DirectRead) 0 ∞ns

2 Time from master assert SPI_CSN to slave assert SPI_INT (DirectWrite) 0 ∞ns

3 Time from master assert SPI_CSN to first clock edge 20 ∞ns

4 Setup time for MOSI data lines 8 1/2 SCK ns

5 Hold time for MOSI data lines 8 1/2 SCK ns

6 Time from last sample on MOSI/MISO to slave deassert SPI_INT 0 100 ns

7 Time from slave deassert SPI_INT to master deassert SPI_CSN 0 ∞ns

8 Idle time between subsequent SPI transactions 1 SCK ∞ns

SPI_CSN

SPI_INT

(DirectWrite)

SPI_CLK

(Mode0)

SPI_MOSI ‐FirstBit

SPI_MISO NotDriven FirstBit

SecondBit

Lastbit

SPI_CLK

(Mode2)

SPI_INT

(DirectRead) 1

NotDriven

‐

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Tab l e 21 and Figure 11 show the timing requirements when operating in SPI Mode 0 and 2.

Figure 11. SPI Timing, Mode 1 and 3

Table 21. SPI Mode 1 and 3

Reference Characteristics Minimum Maximum Unit

1 Time from slave assert SPI_INT to master assert

SPI_CSN (DirectRead)

0∞ns

2 Time from master assert SPI_CSN to slave assert

SPI_INT (DirectWrite)

0∞ns

3 Time from master assert SPI_CSN to first clock edge 20 ∞ns

4 Setup time for MOSI data lines 8 1/2 SCK ns

5 Hold time for MOSI data lines 8 1/2 SCK ns

6 Time from last sample on MOSI/MISO to slave

deassert SPI_INT

0 100 ns

7 Time from slave deassert SPI_INT to master

deassert SPI_CSN

0∞ns

8 Idle time between subsequent SPI transactions 1 SCK ∞ns

SPI_CSN

SPI_INT

(DirectWrite)

SPI_CLK

(Mode1)

SPI_MOSI ‐Invalidbit

SPI_MISO NotDriven Invalidbit

Firstbit

Lastbit

‐

NotDriven

SPI_CLK

(Mode3)

SPI_INT

(DirectRead) 1

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3.3.3 BSC Interface Timing

The specifications in Table 22 references Figure 12.

Figure 12. BSC Interface Timing Diagram

Table 22. BSC Interface Timing Specifications (up to 1 MHz)

Reference Characteristics Minimum Maximum Unit

1 Clock frequency

–

100

kHz

400

800

1000

2 START condition setup time 650 – ns

3 START condition hold time 280 – ns

4 Clock low time 650 – ns

5 Clock high time 280 – ns

6 Data input hold timea

a. As a transmitter, 125 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START

or STOP conditions.

0 – ns

7 Data input setup time 100 – ns

8 STOP condition setup time 280 – ns

9 Output valid from clock – 400 ns

10 Bus free timeb

b. Time that the CBUS must be free before a new transaction can start.

650 – ns

SCL

SDA

OUT

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3.3.4 PCM Interface Timing

Short Frame Sync, Master Mode

Figure 13. PCM Timing Diagram (Short Frame Sync, Master Mode)

Table 23. PCM Interface Timing Specifications (Short Frame Sync, Master Mode)

Reference Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency – – 12 MHz

2 PCM bit clock LOW 41 – – ns

3 PCM bit clock HIGH 41 – – ns

4 PCM_SYNC delay 0 – 25 ns

5 PCM_OUT delay 0 – 25 ns

6 PCM_IN setup 8 – – ns

7 PCM_IN hold 8 – – ns

8 Delay from rising edge of PCM_BCLK during last bit period to

PCM_OUT becoming high impedance

0 – 25 ns

PCM_BCLK

PCM_SYNC

PCM_OUT

123

PCM_IN

HIGHIM PEDANCE

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Short Frame Sync, Slave Mode

Figure 14. PCM Timing Diagram (Short Frame Sync, Slave Mode)

Table 24. PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)

Reference Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency – – 12 MHz

2 PCM bit clock LOW 41 – – ns

3 PCM bit clock HIGH 41 – – ns

4 PCM_SYNC setup 8 – – ns

5 PCM_SYNC hold 8 – – ns

6 PCM_OUT delay 0 – 25 ns

7 PCM_IN setup 8 – – ns

8 PCM_IN hold 8 – – ns

9 Delay from rising edge of PCM_BCLK during last bit period to

PCM_OUT becoming high impedance

0 – 25 ns

PCM_BCLK

PCM_SYNC

PCM_OUT

123

PCM_IN

HIGHIM PED AN CE

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Long Frame Sync, Master Mode

Figure 15. PCM Timing Diagram (Long Frame Sync, Master Mode)

Table 25. PCM Interface Timing Specifications (Long Frame Sync, Master Mode)

Reference Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency – – 12 MHz

2 PCM bit clock LOW 41 – – ns

3 PCM bit clock HIGH 41 – – ns

4 PCM_SYNC delay 0 – 25 ns

5 PCM_OUT delay 0 – 25 ns

6 PCM_IN setup 8 – – ns

7 PCM_IN hold 8 – – ns

8 Delay from rising edge of PCM_BCLK during last bit period to

PCM_OUT becoming high impedance

0 – 25 ns

PCM_BCLK

PCM_SYNC

PCM_OUT

123

PCM_IN

HIGHIMPEDANCE

Bit0

Bit1

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Long Frame Sync, Slave Mode

Figure 16. PCM Timing Diagram (Long Frame Sync, Slave Mode)

Table 26. PCM Interface Timing Specifications (Long Frame Sync, Slave Mode)

Reference Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency – – 12 MHz

2 PCM bit clock LOW 41 – – ns

3 PCM bit clock HIGH 41 – – ns

4 PCM_SYNC setup 8 – – ns

5 PCM_SYNC hold 8 – – ns

6 PCM_OUT delay 0 – 25 ns

7 PCM_IN setup 8 – – ns

8 PCM_IN hold 8 – – ns

9 Delay from rising edge of PCM_BCLK during last bit period to

PCM_OUT becoming high impedance

0–25ns

PCM_BCLK

PCM_SYNC

PCM_OUT

123

PCM_IN

HIGHIMPEDANCE

Bit0

Bit1

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3.3.5 I2S Timing

The CYW20734 supports two independent I2S digital audio ports. The I2S interface supports both master and slave modes. The I2S

signals are:

■I2S clock: I2S SCK

■I2S Word Select: I2S WS

■I2S Data Out: I2S SDO

■I2S Data In: I2S SDI

I2S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO always stays as an output. The channel

word length is 16 bits and the data is justified so that the MSB of the left-channel data is aligned with the MSB of the I2S bus, per the

I2S specification. The MSB of each data word is transmitted one bit clock cycle after the I2S WS transition, synchronous with the falling

edge of bit clock. Left-channel data is transmitted when I2S WS is low, and right-channel data is transmitted when I2S WS is high.

Data bits sent by the CYW20734 are synchronized with the falling edge of I2S_SCK and should be sampled by the receiver on the

rising edge of I2S_SSCK.

The clock rate in master mode is either of the following:

48 kHz x 32 bits per frame = 1.536 MHz

48 kHz x 50 bits per frame = 2.400 MHz

The master clock is generated from the input reference clock using a N/M clock divider.

In the slave mode, any clock rate is supported to a maximum of 3.072 MHz.

Note: Timing values specified in Table 27 are relative to high and low threshold levels.

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Note:

The time periods specified in Figure 17 and Figure 18 are defined by the transmitter speed. The receiver specifications must match

transmitter performance.

Table 27. Timing for I2S Transmitters and Receivers

Transmitter Receiver

NotesLower LImit Upper Limit Lower Limit Upper Limit

Min Max Min Max Min Max Min Max

Clock Period T Ttr –––T

r–––

Master Mode: Clock generated by transmitter or receiver

HIGH tHC 0.35Ttr –––0.35T

tr –––

LOWtLC 0.35Ttr –––0.35T

tr –––

Slave Mode: Clock accepted by transmitter or receiver

HIGH tHC –0.35T

tr –––0.35T

tr ––

LOW tLC –0.35T

tr –––0.35T

tr ––

Rise time tRC – – 0.15Ttr ––– –

Transmitter

Delay tdtr –––0.8T––––

Hold time thtr 0–––––––

Receiver

Setup time tsr –––––0.2T

r––

Hold time thr –––––0––

a. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be able to handle the data transfer

rate.

b. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space ratio. For this reason, tHC and

tLC are specified with respect to T.

c. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that they can detect the signal. So

long as the minimum periods are greater than 0.35Tr, any clock that meets the requirements can be used.

d. Because the delay (tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven by a slow clock edge can

result in tdtr not exceeding tRC which means thtr becomes zero or negative. Therefore, the transmitter has to guarantee that thtr is greater than

or equal to zero, so long as the clock rise-time tRC is not more than tRCmax, where tRCmax is not less than 0.15Ttr.

e. To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the clock signal and T, always giving

the receiver sufficient setup time.

f. The data setup and hold time must not be less than the specified receiver setup and hold time.

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Figure 17. I2S Transmitter Timing

Figure 18. I2S Receiver Timing

SDandWS

SCK

VL=0.8V

tLC >0.35T

tRC*tHC >0.35T

VH=2.0V

thtr >0

totr <0.8T

T=Clockperiod

Ttr =Minimumallowedclockperiodfortransmitter

T=Ttr

*tRC isonlyrelevantfortransmittersinslavemode.

SDandWS

SCK

VL=0.8V

tLC >0.35T tHC >0.35

VH=2.0V

thr >0tsr >0.2T

T=Clockperiod

Tr=Minimumallowedclockperiodfortransmitter

T>Tr

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4. Mechanical Information

4.1 Package Diagram

Figure 19. CYW20734 8.5 mm × 8.5 mm 90-Pin FBGA Package

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4.2 Tape Reel and Packaging Specifications

The top-left corner of the CYW20734 package is situated near the sprocket holes, as shown in Figure 20.

Figure 20. Pin 1 Orientation

Table 28. CYW20734 Tape Reel Specifications

Parameter Value

Quantity per reel 2500

Reel diameter 13 inches

Hub diameter 4 inches

Tape width 16 mm

Tape pitch 12 mm

Pin 1: Top left corner of package toward sprocket holes

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5. Ordering Information

Table 29. Ordering Information

Part Number Package Ambient Operating Temperature

CYW20734UA1KFFB3G 90-pin FBGA 0°C to 70°C

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Appendix A: Acronyms and Abbreviations

The following list of acronyms and abbreviations may appear in this document.

Term Description

ADC analog-to-digital converter

AFH adaptive frequency hopping

AHB advanced high-performance bus

APB advanced peripheral bus

APU audio processing unit

ARM7TDMI-S™Acorn RISC Machine 7 Thumb instruction, Debugger, Multiplier, Ice, Synthesizable

BSC Broadcom Serial Control

BTC Bluetooth controller

COEX coexistence

DFU device firmware update

DMA direct memory access

EBI external bus interface

HCI Host Control Interface

HV high voltage

IDC initial digital calibration

IF intermediate frequency

IRQ interrupt request

JTAG Joint Test Action Group

LCU link control unit

LDO low drop-out

LHL lean high land

LPO low power oscillator

LV LogicVision™

MIA multiple interface agent

PCM pulse code modulation

PLL phase locked loop

PMU power management unit

POR power-on reset

PWM pulse width modulation

QD quadrature decoder

RAM random access memory

RC oscillator A resistor-capacitor oscillator is a circuit composed of an amplifier, which provides the output signal, and a

resistor-capacitor network, which controls the frequency of the signal.

RF radio frequency

ROM read-only memory

RX/TX receive, transmit

SPI serial peripheral interface

SW software

UART universal asynchronous receiver/transmitter

UPI µ-processor interface

WD watchdog

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Document History

Document Title: CYW20734 Single-Chip Bluetooth Transceiver for Wireless Input Devices

Document Number: 002-14874

Revision ECN Orig. of

Change

Submission

Date Description of Change

** – – 10/28/13 20734-DS100-R

Initial release.

*A – – 11/12/13

20734-DS101-R

Updated:

• The CYW20734 is Bluetooth 4.1-compliant. The current version of

the CYW20734 does not support HS.

• Adaptive Frequency Hopping is not supported in the current version

of the CYW20734.

• “Microprocessor Unit” on page 13.

• “UART Interface” on page 17: Baud rates up to 6 Mbps are now

supported.

• Table 1: “Common Baud Rate Examples, 24 MHz Clock,” on page 18.

• Table 12: “ADC Microphone Specifications,” on page 43.

Added:

• Table 2: “Common Baud Rate Examples, 48 MHz Clock,” on page 18.

• Table 15: “Current Consumption For BR and EDR, Class 1,” on

page 46.

• Table 16: “Current Consumption For BR and EDR, Class 2 (0dBm),”

on page 47.

*B – – 01/27/14

20734-DS102-R

Updated:

• The CYW20734 now supports Generic Access Profile (GAP).

• The CYW0734 now supports a single 1.2V internal LDO.

• CYW20734 package information on page 1.

• “NVRAM Configuration Data and Storage” on page 14.

• “BBC Power Management” on page 29: VDD2P5_OUT replaced with

PAVDD.

• Table 6: “Pin Descriptions,” on page 30.

• Table 7: “GPIO Pin Descriptions,” on page 32.

• Table 9: “Power Supply Specifications,” on page 39: removed 2.5V

LDO input.

• Table 11: “ADC Microphone Specifications,” on page 41: Effective

number of bits.

Removed

• “Bluetooth Low Energy” on page 12.

• Figure 2: “LDO Functional Block,” on page 16.

• “Wideband Speech Support” on page 20.

• All references to VDD2P5_OUT were removed.

• Table 11: “BTLDO_2P5 Electrical Specifications,” on page 42.

*C – – 02/25/14

20734-DS103-R

Updated:

• Reserved pins in Table 6: “Pin Descriptions,” on page 30: Changed

D3 to E3.

• “Ball Maps” on page 38.

• Section 4: “Mechanical Information,” on page 63.

*D – – 03/25/14

20734-DS104-R

Updated:

• Table 16: “Receiver RF Specifications,” on page 46.

• Table 31: “Ordering Information,” on page 65

*E – – 04/21/14

20734-DS105-R

Updated:

• Table 8: “Absolute Maximum Voltages,” on page 39

• Table 11: “ADC Microphone Specifications,” on page 41.

• Figure 1: “Functional Block Diagram,” on page 2

• Table 17: “Transmitter RF Specifications,” on page 48

*F ––

05/19/14

20734-DS106-R

Updated:

• “GPIO Ports” on page 23: replaced “TBD-pin package” with “90-pin

package.”

• Section 5: “Ordering Information,” on page 66

Document Number: 002-14874 Rev. *S Page 49 of 51

CYW20734

*G – – 06/26/14

20734-DS107-R

Updated:

• “External Reset” on page 14.

• Table 12: “Digital I/O Characteristics,” on page 42.

• Table 14: “Current Consumption For BR and EDR, Class 1,” on

page 44.

• Table 15: “Current Consumption For BR and EDR, Class 2 (0 dBm),”

on page 45.

• Table 16: “Receiver RF Specifications,” on page 46.

• Table 17: “Transmitter RF Specifications,” on page 48.

• “BSC Interface Timing” on page 53.

• Table 31: “Ordering Information,” on page 65.

Added:

• Table 18: “BLE RF Specifications,” on page 49.

*H – – 09/25/14

20734-DS108-R

Updated:

• Table 8: “Absolute Maximum Voltages,” on page 38.

• Table 14: “Current Consumption For BR and EDR, Class 1,” on

page 42.

• Table 15: “Current Consumption For BR and EDR, Class 2 (0 dBm),”

on page 43.

• Table 16: “Receiver RF Specifications,” on page 44.

• Table 23: “PCM Interface Timing Specifications (Short Frame Sync,

Master Mode),” on page 52.

• “PCM Interface Timing” on page 52.

*I – – 10/21/14

20734-DS109-R

Updated:

• “External Reset” on page 13

*J – – 12/08/14

20734-DS110-R

Updated:

• “External Reset” on page 14

• “ADC Port” on page 25

*K – – 03/02/15

20734-DS111-R

Updated:

• Table 13: “Bluetooth and BLE Current Consumption, Class 1,” on

page 44

• “Bluetooth and BLE Current Consumption, Class 2 (0 dBm)” on

page 44

*L – – 03/02/15

20734-DS112-R

Updated:

• Table 13: “Bluetooth and BLE Current Consumption, Class 1,” on

page 44

• “Bluetooth and BLE Current Consumption, Class 2 (0 dBm)” on page

*M – – 06/26/15

20734-DS113-R

Updated:

• Table 12: “Digital I/O Characteristics,” on page 43

*N – – 08/17/15

20734-DS114-R

Updated:

• “GPIO Ports” on page 23

• Table 22: “PCM Interface Timing Specifications (Short Frame Sync,

Master Mode),” on page 53

• Table 23: “PCM Interface Timing Specifications (Short Frame Sync,

Slave Mode),” on page 54

• Table 24: “PCM Interface Timing Specifications (Long Frame Sync,

Master Mode),” on page 55

• Table 25: “PCM Interface Timing Specifications (Long Frame Sync,

Slave Mode),” on page 56

*O – – 12/09/15

20734-DS115-R

Updated:

• Table 7: “GPIO Pin Descriptions,” on page 33 by adding a column for

the post-reset state of each GPIO

*P – – 02/09/16

20734-DS116-R

Updated:

• Changed “SPI Timing” on page 50 from 12 MHz to 24 MHz

Document Title: CYW20734 Single-Chip Bluetooth Transceiver for Wireless Input Devices

Document Number: 002-14874

Document Number: 002-14874 Rev. *S Page 50 of 51

CYW20734

*Q – – 03/15/16

20734-DS117-R

Updated:

• “Combined baud rate error of the two devices is within ±2.5%”

*R – – 04/25/16

20734-DS118-R

Deleted:

• “Supports Broadcom proprietary LE data rate up to 2 Mbps”.

*S 5452885 UTSV 10/04/2016 Converted to Cypress template

Document Title: CYW20734 Single-Chip Bluetooth Transceiver for Wireless Input Devices

Document Number: 002-14874

Document Number: 002-14874 Rev. *S Revised October 4, 2016 Page 51 of 51

CYW20734

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