DIMENSION
INCHES MM DIM MIN MAX MIN MAX NOTE
A .130 .146 3.30 3.70
B .008 .016 0.20 0.40
C .055 .059 1.40 1.50
Features
l High-Speed Switching and High Reverse Breakdown Voltage
l Moisture Sensitivity Level 1
Mechanical Data
l Case: MiniMELF, Glass
l Terminals: Solderable per MIL-STD-202, Method 208
l Polarity: Indicated by Cathode Band
l Weight: 0.05 grams ( approx.)
Maximum Ratings @ 25oC Unless Otherwise Specified
Characteristic Symbol Min Max Unit
Peak Repetitive Reverse Voltage VRRM 75 V
Continuous reverse Voltage VR75 V
Continuous forward current IF200 mA
Repetitive peak Forward Current IFRM 450 mA
Non-rep. Peak Forward Current
t=1 us
t=1 ms
t= 1 s
IFSM
4
1
0.5
A
Power Dissipation Pd500 mW
Thermal Resistance(Note 2) R 350 K/W
Operation/Storage Temp. Range Tj, TSTG -65 200 oC
Electrical Characteristics @ 25oC Unless Otherwise Specified
Charateristic Symbol Min Max Unit Test Cond.
(BR)R
R
Reverse Current IR-----
25
5
50
100
nA
uA
uA
uA
R
VR=75V
VR=20V;Tj=150oC
R
j
o
Forward Voltage VF620
---
---
750
1000
930
mV
mV
mV
IF=5mA
IF=100mA
IF=100mA; Tj=100oC
Junction Capacitance Cj ----- 2.0 pF VR=0V, f=1.0MHz
Reverse Recovery Time trr ----- 4ns
F
R
Irr=1mA
L
2. Valid provided that electrodes are kept at ambient temperature
BAS32L
High Speed
Switching Diode
MINIMELF
SUGGESTED SOLDER
PAD LAYOUT
A
B
C
h
.165
.075
.030
omponents
20736 Marilla Street Chatsworth
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MCC
Revision: A 2011/01/01
TM
Micro Commercial Components
www.mccsemi.com
1 of 4
l Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Note: 1. Lead in Glass Exemption Applied, see EU Directive Annex 5.
3. Device mounted on an FR4 printed-circuit board.