SMM4FxxA 400 W TransilTM Datasheet - production data Description The SMM4F Transil serie has been designed to protect sensitive equipment against electro-static discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical over stress such as IEC 61000-4-4 and 5. They are generally for surges below 400 W 10/1000 s. A K This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. Their low clamping voltages provide a better safety margin to protect sensitive circuits with extended life time expectancy. STmite Flat (DO216-AA Flat) Features Typical peak pulse power: 400 W (10/1000 s) 2.4 kW (8/20 s) Stand-off voltage range: from 5 V to 33 V Unidirectional type Low leakage current: 0.2 A at 25 C 1 A at 85 C Operating Tj max: 175 C JEDEC registered package outline RoHS package Halogen free molding compound Packaged in STmite Flat, this minimizes PCB space consumption (footprint in accordance with IPC 7531 standard). Transil is a trademark of STMicroelectronics. Complies with the following standards IEC 61000-4-2 level 4: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G-Method 3015-7: class3 25 kV (human body model) January 2017 DocID14250 Rev 4 This is information on a product in full production. 1/12 www.st.com Characteristics 1 SMM4FxxA Characteristics Table 1: Absolute maximum ratings (Tamb = 25 C) Symbol Parameter Value Unit 30 kV VPP Peak pulse voltage (IEC 61000-4-2 contact discharge) PPP Peak pulse power dissipation Tj initial = Tamb 400 W Power dissipation on infinite heatsink Tamb = 125 C 2.5 W IFSM Non repetitive surge peak forward current for unidirectional types tp = 10 ms Tj initial = Tamb 30 A Tstg Storage temperature range -65 to +175 C Tj Operating junction temperature range -55 to +175 C TL Maximum lead temperature for soldering during 10 s 260 C Value Unit P Table 2: Thermal resistances Symbol Parameter Rth(j-l) Junction to leads 20 Rth(j-a) Junction to ambient on PCB with recommended pad layout 250 C/W Figure 1: Electrical characteristics - parameter definitions (Tamb = 25 C) 2/12 DocID14250 Rev 4 SMM4FxxA Characteristics Table 3: Electrical characteristics - parameter values (Tamb = 25 C) IRM max. at VRM VBR at IR(1) VCL at IPP 10/1000 s Typ. Max. Type 25 C 85 C A Min. V Max. V RD(2) 10/1000 s VCL at IPP 8/20 s RD 8/20 s(2) Max. T(3) Max. mA V A V A 10-4/C SMM4F5.0A 10 50 5.0 6.46 6.80 7.14 10 9.2 43.5 0.047 13.4 179 0.035 5.7 SMM4F6.0A 10 50 6.0 6.65 7.00 7.35 10 10.3 38.8 0.076 13.7 175 0.036 5.9 SMM4F6.5A 10 50 6.5 7.13 7.50 7.88 10 11.2 37.5 0.093 14.5 166 0.039 6.1 SMM4F8.5A 10 50 8.5 9.5 10.0 10.5 1 14.4 27.7 0.141 19.5 140 0.064 7.3 SMM4F10A 0.2 1 10 11.4 12.0 12.6 1 17.0 23.5 0.187 21.7 127 0.071 7.8 SMM4F12A 0.2 1 12 13.3 14.0 14.7 1 19.9 20.1 0.259 25.3 112 0.094 8.3 SMM4F13A 0.2 1 13 14.3 15.0 15.8 1 21.5 18.6 0.309 27.2 106 0.108 8.4 SMM4F15A 0.2 1 15 17.1 18.0 18.9 1 24.4 16.4 0.335 32.5 90 0.150 8.8 SMM4F18A 0.2 1 18 20.9 22.0 23.1 1 29.2 14.0 0.436 39.3 76 0.214 9.2 SMM4F20A 0.2 1 20 22.8 24.0 25.2 1 32.4 12.0 0.600 42.8 70 0.250 9.4 SMM4F24A 0.2 1 24 26.6 28.01 29.4 1 38.9 9.5 1.00 50 61 0.338 9.6 SMM4F26A 0.2 1 26 28.5 30.0 31.5 1 42.1 9.0 1.18 53.5 58 0.380 9.7 SMM4F28A 0.2 1 28 31.4 33.0 34.7 1 45.4 8.0 1.34 59.0 53 0.456 9.8 SMM4F33A 0.2 1 33 37.1 39.0 41.0 1 53.3 7.0 1.76 69.7 45 0.636 10.0 Notes: (1)Pulse (2)To test: tp < 50 ms. calculate maximum clamping voltage at other surge currents, use the following formula: VCLmax = RD x IPP + VBRmax (3)To calculate VBR versus junction temperature, use the following formula: VBR at Tj = VBR @ 25 C x (1 + T x (Tj - 25)) Figure 2: Definition of IPP pulse DocID14250 Rev 4 3/12 Characteristics 1.1 SMM4FxxA Characteristics (curves) Figure 3: Peak power dissipation versus initial junction temperature Figure 4: Peak pulse power versus exponential pulse duration (Tj initial = 25 C) PPP[Tj initial] / PPP[Tj initial = 25 C] 1.1 10.0 PPP(kW) Tj initial = 25 C 1.0 0.9 0.8 0.7 0.6 1.0 0.5 0.4 0.3 0.2 Tj initial (C) 0.1 t p (ms) 0.0 0 25 50 75 100 125 150 175 200 0.1 1.0E-03 Figure 5: Clamping voltage versus peak pulse current (exponential waveform, maximum values) 1000 IPP (A) 1.0E-02 1.0E-01 1.0E+00 Figure 6: Junction capacitance versus reverse applied voltage 10000 C(pF) F = 1 MHz VOSC = 30 mVRMS Tj = 25 C Tj initial = 25 C SMM4F5.0A 1.0E+01 SMM4F15A SMM4F24A 100 SMM4F33A 1000 SMM4F5.0A 10 SMM4F15A SMM4F24A 100 SMM4F33A 1 tp = 8/20 s tp = 10/1000 s V R (V) V CL (V) 0.1 10 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 Figure 7: Peak forward voltage drop versus peak forward current 1.0E+02 IFM(A) 1 10 100 Figure 8: Relative variation of thermal impedance junction to ambient versus pulse duration (printed circuit board FR4, SCu = 1 cm2) 1.00 Zth(j-a) /Rth(j-a) On recommended pad layout 1.0E+01 0.10 Tj = 125 C 1.0E+00 0.01 Tj = 25 C 1.0E-01 V FM (V) 1.0E-02 0.0 4/12 0.5 1.0 1.5 t p (S) 2.0 2.5 3.0 0.00 1.0E-03 DocID14250 Rev 4 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 SMM4FxxA Characteristics Figure 10: Leakage current versus junction temperature (typical values) Figure 9: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, eCu = 35 m) 200 R th(j-a) (C/W) 1.E+04 I R(nA) 180 1.E+03 160 VBR 11.7 V 140 1.E+02 120 VBR >11.7 V 1.E+01 100 80 1.E+00 60 T j (C) S CU (cm) 40 0.0 VR = VRM 1.E-01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 DocID14250 Rev 4 25 50 75 100 125 150 5/12 175 Package information 2 SMM4FxxA Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK (R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 6/12 Case: JEDEC DO216-AA Flat molded plastic over planar junction Terminals: solder plated, solderable per MIL-STD-750, method 2026 Polarity: for unidirectional types the band indicates cathode. Flammability: epoxy is rated UL94V-0 RoHS package DocID14250 Rev 4 SMM4FxxA 2.1 Package information STmite Flat package information Figure 11: STmite Flat package outline Table 4: STmite Flat mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 D 1.75 1.90 2.05 0.069 0.075 0.081 E 3.60 3.80 3.90 0.142 0.150 0.154 E1 2.80 2.95 3.10 0.110 0.116 0.122 L 0.50 0.55 0.80 0.020 0.022 0.031 L1 2.10 2.40 2.60 0.083 0.094 0.102 L2 0.45 0.60 0.75 0.018 0.024 0.030 L3 0.20 0.35 0.50 0.008 0.014 0.020 DocID14250 Rev 4 7/12 Package information SMM4FxxA Figure 12: Footprint recommendations, dimensions in mm (inches) Figure 13: Marking layout (refer to ordering information table for marking) Figure 14: Package orientation in reel Figure 15: Tape and reel orientation Figure 16: Reel dimensions (mm) 8/12 DocID14250 Rev 4 Figure 17: Inner box dimensions (mm) SMM4FxxA Package information Figure 18: Tape and reel outline Table 5: Tape and reel mechanical data Dimensions Ref. Millimeters Min. Typ. Max. P0 3.9 4 4.1 P1 3.9 4 4.1 P2 1.9 2 2.1 OD0 1.5 1.55 1.6 OD1 1.5 F 5.2 5.25 5.3 K0 1.2 1.3 1.4 W 11.7 12 12.3 DocID14250 Rev 4 9/12 Ordering information 3 SMM4FxxA Ordering information Figure 19: Ordering information scheme SM M 4F xx A - TR Surface Mount Package M = STmite package Surge rating 4F = 400 W in flat package Stand off voltage 12 = 12 V Type A = Unidirectional Packaging TR = Tape and reel Table 6: Ordering information Order code Marking Package Weight Base qty. Delivery mode SMM4FxxA-TR See Table 6. STmite Flat 16 mg 12000 Tape and reel Table 7: Marking 10/12 Type Marking SMM4F5.0A-TR 4UA SMM4F6.0A-TR 4UB SMM4F6.5A-TR 4UC SMM4F8.5A-TR 4UD SMM4F10A-TR 4UE SMM4F12A-TR 4UF SMM4F13A-TR 4UG SMM4F15A-TR 4UH SMM4F18A-TR 4UJ SMM4F20A-TR 4UK SMM4F24A-TR 4UM SMM4F26A-TR 4UN SMM4F28A-TR 4UO SMM4F33A-TR 4UQ DocID14250 Rev 4 SMM4FxxA 4 Revision history Revision history Table 8: Document revision history Date Revision Changes 29-Nov-2007 1 First issue. 19-Dec-2007 2 Updated IPP and RD parameters in columns 10 and 11 of Table 4. 19-Aug-2014 3 Updated package name. 19-Jan-2017 4 Updated cover page and Table 4. DocID14250 Rev 4 11/12 SMM4FxxA IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2017 STMicroelectronics - All rights reserved 12/12 DocID14250 Rev 4