January 2017
DocID14250 Rev 4
1/12
This is information on a product in full production.
www.st.com
SMM4FxxA
400 W TransilTM
Datasheet - production data
Features
Typical peak pulse power:
400 W (10/1000 μs)
2.4 kW (8/20 μs)
Stand-off voltage range: from 5 V to 33 V
Unidirectional type
Low leakage current:
0.2 μA at 25 °C
1 μA at 85 °C
Operating Tj max: 175 °C
JEDEC registered package outline
RoHS package
Halogen free molding compound
Complies with the following standards
IEC 61000-4-2 level 4:
15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883G-Method 3015-7: class3
25 kV (human body model)
Description
The SMM4F Transil serie has been designed to
protect sensitive equipment against electro-static
discharges according to IEC 61000-4-2, MIL STD
883 Method 3015, and electrical over stress such
as IEC 61000-4-4 and 5. They are generally for
surges below 400 W 10/1000 μs.
This planar technology makes it compatible with
high-end equipment and SMPS where low
leakage current and high junction temperature
are required to provide reliability and stability
over time. Their low clamping voltages provide a
better safety margin to protect sensitive circuits
with extended life time expectancy.
Packaged in STmite Flat, this minimizes PCB
space consumption (footprint in accordance with
IPC 7531 standard). Transil is a trademark of
STMicroelectronics.
K
A
STmite Flat
(DO216-AA Flat)
SMM4FxxA
2/12
DocID14250 Rev 4
1 Characteristics
Table 1: Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
VPP
Peak pulse voltage
(IEC 61000-4-2 contact discharge)
30
kV
PPP
Peak pulse power dissipation
Tj initial = Tamb
400
W
P
Power dissipation on infinite heatsink
Tamb = 125 °C
2.5
W
IFSM
Non repetitive surge peak forward current for
unidirectional types
tp = 10 ms
Tj initial = Tamb
30
A
Tstg
Storage temperature range
-65 to +175
°C
Tj
Operating junction temperature range
-55 to +175
°C
TL
Maximum lead temperature for soldering during 10 s
260
°C
Table 2: Thermal resistances
Symbol
Parameter
Value
Unit
Rth(j-l)
Junction to leads
20
°C/W
Rth(j-a)
Junction to ambient on PCB with recommended pad layout
250
Figure 1: Electrical characteristics - parameter definitions (Tamb = 25 °C)
SMM4FxxA
Characteristics
DocID14250 Rev 4
3/12
Table 3: Electrical characteristics - parameter values (Tamb = 25 °C)
Type
IRM max. at VRM
VBR at IR(1)
VCL at IPP
10/1000 μs
RD(2)
10/1000
μs
VCL at IPP
8/20 μs
RD 8/20
µs(2)
αT(3)
25 °C
85 °C
Min.
Typ.
Max.
Max.
Max.
Max.
µA
V
V
mA
V
A
Ω
V
A
Ω
10-4/°C
SMM4F5.0A
10
50
5.0
6.46
6.80
7.14
10
9.2
43.5
0.047
13.4
179
0.035
5.7
SMM4F6.0A
10
50
6.0
6.65
7.00
7.35
10
10.3
38.8
0.076
13.7
175
0.036
5.9
SMM4F6.5A
10
50
6.5
7.13
7.50
7.88
10
11.2
37.5
0.093
14.5
166
0.039
6.1
SMM4F8.5A
10
50
8.5
9.5
10.0
10.5
1
14.4
27.7
0.141
19.5
140
0.064
7.3
SMM4F10A
0.2
1
10
11.4
12.0
12.6
1
17.0
23.5
0.187
21.7
127
0.071
7.8
SMM4F12A
0.2
1
12
13.3
14.0
14.7
1
19.9
20.1
0.259
25.3
112
0.094
8.3
SMM4F13A
0.2
1
13
14.3
15.0
15.8
1
21.5
18.6
0.309
27.2
106
0.108
8.4
SMM4F15A
0.2
1
15
17.1
18.0
18.9
1
24.4
16.4
0.335
32.5
90
0.150
8.8
SMM4F18A
0.2
1
18
20.9
22.0
23.1
1
29.2
14.0
0.436
39.3
76
0.214
9.2
SMM4F20A
0.2
1
20
22.8
24.0
25.2
1
32.4
12.0
0.600
42.8
70
0.250
9.4
SMM4F24A
0.2
1
24
26.6
28.01
29.4
1
38.9
9.5
1.00
50
61
0.338
9.6
SMM4F26A
0.2
1
26
28.5
30.0
31.5
1
42.1
9.0
1.18
53.5
58
0.380
9.7
SMM4F28A
0.2
1
28
31.4
33.0
34.7
1
45.4
8.0
1.34
59.0
53
0.456
9.8
SMM4F33A
0.2
1
33
37.1
39.0
41.0
1
53.3
7.0
1.76
69.7
45
0.636
10.0
Notes:
(1)Pulse test: tp < 50 ms.
(2)To calculate maximum clamping voltage at other surge currents, use the following formula:
VCLmax = RD x IPP + VBRmax
(3)To calculate VBR versus junction temperature, use the following formula:
VBR at Tj = VBR @ 25 °C x (1 + αT x (Tj - 25))
Figure 2: Definition of IPP pulse
SMM4FxxA
4/12
DocID14250 Rev 4
1.1 Characteristics (curves)
Figure 3: Peak power dissipation versus initial
junction temperature
Figure 4: Peak pulse power versus exponential
pulse duration (Tj initial = 25 °C)
Figure 5: Clamping voltage versus peak pulse
current (exponential waveform, maximum values)
Figure 6: Junction capacitance versus reverse
applied voltage
Figure 7: Peak forward voltage drop versus peak
forward current
Figure 8: Relative variation of thermal impedance
junction to ambient versus pulse duration (printed
circuit board FR4, SCu = 1 cm2)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0 25 50 75 100 125 150 175 200
T (°C)
j initial
PPP[Tjinitial] / PPP[Tjinitial = 25 °C]
0.1
1.0
10.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
Tjinitial = 25 °C
t (ms)
p
P (kW)
PP
0.1
1
10
100
1000
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70
IPP (A)
VCL (V)
Tjinitial = 25 °C
tp= 8/20 µs
tp= 10/1000 µs
SMM4F5.0A
SMM4F15A SMM4F24A SMM4F33A
10
100
1000
10000
1 10 100
F = 1 MHz
VOSC = 30 mVRMS
Tj= 25°C
SMM4F5.0A
SMM4F15A
SMM4F24A
SMM4F33A
C(pF)
V (V)
R
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Tj= 25°C
Tj= 125°C
I (A)
FM
V (V)
FM
0.00
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
On recommended pad
layout
Zth(j-a)/Rth(j-a)
t (S)
p
SMM4FxxA
Characteristics
DocID14250 Rev 4
5/12
Figure 9: Thermal resistance junction to ambient
versus copper surface under each lead
(printed circuit board FR4, eCu = 35 μm)
Figure 10: Leakage current versus junction
temperature (typical values)
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
Rth(j-a)(°C/W)
S(cm²)
CU
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
25 50 75 100 125 150 175
VR= VRM
VBR ≤11.7 V
VBR >11.7 V
T (°C)
j
I (nA)
R
SMM4FxxA
6/12
DocID14250 Rev 4
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Case: JEDEC DO216-AA Flat molded plastic over planar junction
Terminals: solder plated, solderable per MIL-STD-750, method 2026
Polarity: for unidirectional types the band indicates cathode.
Flammability: epoxy is rated UL94V-0
RoHS package
SMM4FxxA
Package information
DocID14250 Rev 4
7/12
2.1 STmite Flat package information
Figure 11: STmite Flat package outline
Table 4: STmite Flat mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.80
0.85
0.95
0.031
0.033
0.037
b
0.40
0.55
0.65
0.016
0.022
0.026
b2
0.70
0.85
1.00
0.027
0.033
0.039
c
0.10
0.15
0.25
0.004
0.006
0.009
D
1.75
1.90
2.05
0.069
0.075
0.081
E
3.60
3.80
3.90
0.142
0.150
0.154
E1
2.80
2.95
3.10
0.110
0.116
0.122
L
0.50
0.55
0.80
0.020
0.022
0.031
L1
2.10
2.40
2.60
0.083
0.094
0.102
L2
0.45
0.60
0.75
0.018
0.024
0.030
L3
0.20
0.35
0.50
0.008
0.014
0.020
SMM4FxxA
8/12
DocID14250 Rev 4
Figure 12: Footprint recommendations,
dimensions in mm (inches)
Figure 13: Marking layout (refer to ordering
information table for marking)
Figure 14: Package orientation in reel
Figure 15: Tape and reel orientation
Figure 16: Reel dimensions (mm)
Figure 17: Inner box dimensions (mm)
SMM4FxxA
Package information
DocID14250 Rev 4
9/12
Figure 18: Tape and reel outline
Table 5: Tape and reel mechanical data
Ref.
Dimensions
Millimeters
Min.
Typ.
Max.
P0
3.9
4
4.1
P1
3.9
4
4.1
P2
1.9
2
2.1
ØD0
1.5
1.55
1.6
ØD1
1.5
F
5.2
5.25
5.3
K0
1.2
1.3
1.4
W
11.7
12
12.3
SMM4FxxA
10/12
DocID14250 Rev 4
3 Ordering information
Figure 19: Ordering information scheme
Table 6: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
SMM4FxxA-TR
See Table 6.
STmite Flat
16 mg
12000
Tape and reel
Table 7: Marking
Type
Marking
SMM4F5.0A-TR
4UA
SMM4F6.0A-TR
4UB
SMM4F6.5A-TR
4UC
SMM4F8.5A-TR
4UD
SMM4F10A-TR
4UE
SMM4F12A-TR
4UF
SMM4F13A-TR
4UG
SMM4F15A-TR
4UH
SMM4F18A-TR
4UJ
SMM4F20A-TR
4UK
SMM4F24A-TR
4UM
SMM4F26A-TR
4UN
SMM4F28A-TR
4UO
SMM4F33A-TR
4UQ
SM M 4F xx A - TR
Surface Mount
Package
Surge rating
M = STmite package
4F = 400 W in flat package
Stand off voltage
12 = 12 V
Type
A = Unidirectional
Packaging
TR = Tape and reel
SMM4FxxA
Revision history
DocID14250 Rev 4
11/12
4 Revision history
Table 8: Document revision history
Date
Revision
Changes
29-Nov-2007
1
First issue.
19-Dec-2007
2
Updated IPP and RD parameters in columns 10 and 11 of Table 4.
19-Aug-2014
3
Updated package name.
19-Jan-2017
4
Updated cover page and Table 4.
SMM4FxxA
12/12
DocID14250 Rev 4
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the
design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved