Board Level Heat Sinks P/N: 825502B03453 TO-220 PRODUCT SPECIFICATIONS * Includes Spring Clip for Quick Device Attachment * Curled Flow Fins * Vertical Mounting via Solderable Tabs * RoHS Compliant 0 400 600 800 1000 80 8 60 6 40 4 20 2 C 10 0 0 0 CUSTOMIZED HEATSINKS 200 100 2 4 6 Heat Dissipated - Watts * Specialized Tabs, Plating * Specialized Body Configurations * Contact Applications Engineering COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 8 10 Thermal Resistance - oC / Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM o Devices: TO-220 Size: 25.4 x 12.7 x 30.0 mm Material: Aluminum, 1.2 mm Type: Stamped IC Mounting: Integrated Spring PCB Mounting: Solderable Tabs Finish: Black Anodized Package: Bulk Optional Hardware: Thermal Interface Material Temp Rise Above Ambient (Mounting Surface) * * * * * * * * *