MCP23008/MCP23S08 8-Bit I/O Expander with Serial Interface Features * 8-bit remote bidirectional I/O port - I/O pins default to input * High-speed I2CTM interface (MCP23008) - 100 kHz - 400 kHz - 1.7 MHz * High-speed SPI interface (MCP23S08) - 10 MHz * Hardware address pins - Three for the MCP23008 to allow up to eight devices on the bus - Two for the MCP23S08 to allow up to four devices using the same chip-select * Configurable interrupt output pin - Configurable as active-high, active-low or open-drain * Configurable interrupt source - Interrupt-on-change from configured defaults or pin change * Polarity Inversion register to configure the polarity of the input port data * External reset input * Low standby current: 1 A (max.) * Operating voltage: - 1.8V to 5.5V @ -40C to +85C I2C @ 100 kHz SPI @ 5 MHz - 2.7V to 5.5V @ -40C to +85C I2C @ 400 kHz SPI @ 10 MHz - 4.5V to 5.5V @ -40C to +125C I2C @ 1.7 kHz SPI @ 10 MHz Packages * * * * 18-pin PDIP (300 mil) 18-pin SOIC (300 mil) 20-pin SSOP 20-pin QFN Block Diagram MCP23S08 SCK SI SO MCP23008 SCL SDA Serial Interface MCP23S08 A1:A0 A2:A0 3 Decode 8 GPIO Control RESET INT Serializer/ Deserializer Interrupt Logic GP0 GP1 GP2 GP3 GP4 GP5 GP6 GP7 8 VDD VSS (c) 2007 Microchip Technology Inc. POR Configuration/ Control Registers DS21919E-page 1 MCP23008/MCP23S08 Package Types MCP23008 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 SSOP SCL SDA A2 A1 A0 RESET NC INT VSS N/C VDD GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 1 2 3 4 5 6 7 8 9 10 MCP23008 SCL SDA A2 A1 A0 RESET NC INT VSS MCP23008 PDIP/SOIC 20 19 18 17 16 15 14 13 12 11 VDD GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 N/C DS21919E-page 2 SDA SCL VDD VSS GP7 20 19 18 17 16 QFN A2 1 15 GP6 A1 2 14 GP5 A0 3 13 GP4 RESET 4 12 GP3 NC 5 11 GP2 6 7 8 9 10 N/C INT N/C GP0 GP1 MCP23008 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 Package Types: (Continued) MCP23S08 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 SSOP SCK SI SO A1 A0 RESET CS INT VSS N/C VDD GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 1 2 3 4 5 6 7 8 9 10 MCP23S08 SCK SI SO A1 A0 RESET CS INT VSS MCP23S08 PDIP/SOIC 20 19 18 17 16 15 14 13 12 11 VDD GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 N/C (c) 2007 Microchip Technology Inc. A2 1 A1 2 SI SCK VDD VSS GP7 20 19 18 17 16 QFN MCP23S08 15 GP6 14 GP5 13 GP4 10 GP2 GP1 11 9 5 GP0 CS 8 GP3 N/C 12 7 4 INT RESET 6 3 N/C A0 DS21919E-page 3 MCP23008/MCP23S08 NOTES: DS21919E-page 4 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 1.0 DEVICE OVERVIEW The MCP23X08 device provides 8-bit, general purpose, parallel I/O expansion for I2C bus or SPI applications. The two devices differ in the number of hardware address pins and the serial interface: * MCP23008 - I2C interface; three address pins * MCP23S08 - SPI interface; two address pins 1. 2. The MCP23X08 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits. The data for each input or output is kept in the corresponding Input or Output register. The polarity of the Input Port register can be inverted with the Polarity Inversion register. All registers can be read by the system master. 1.1 The interrupt output can be configured to activate under two conditions (mutually exclusive): When any input state differs from its corresponding input port register state, this is used to indicate to the system master that an input state has changed. When an input state differs from a preconfigured register value (DEFVAL register). The Interrupt Capture register captures port values at the time of the interrupt, thereby saving the condition that caused the interrupt. The Power-on Reset (POR) sets the registers to their default values and initializes the device state machine. The hardware address pins are used to determine the device address. Pin Descriptions TABLE 1-1: PINOUT DESCRIPTION Pin Name PDIP/ SOIC QFN SSOP Pin Type SCL/SCK 1 19 1 I SDA/SI 2 20 2 I/O Serial data I/O (MCP23008)/Serial data input (MCP23S08). A2/SO 3 1 3 I/O Hardware address input (MCP23008)/ Serial data output (MCP23S08). A2 must be biased externally. A1 4 2 4 I Hardware address input. Must be biased externally. A0 5 3 5 I Hardware address input. Must be biased externally. RESET 6 4 6 I External reset input. Must be biased externally. Function Serial clock input. NC/CS 7 5 7 I No connect (MCP23008)/External chip select input (MCP23S08). INT 8 7 8 O Interrupt output. Can be configured for active-high, active-low or open-drain. VSS 9 17 9 P Ground. GP0 10 9 12 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or internal weak pull-up resistor. GP1 11 10 13 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or internal weak pull-up resistor. GP2 12 11 14 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or internal weak pull-up resistor. GP3 13 12 15 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or internal weak pull-up resistor. GP4 14 13 16 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or internal weak pull-up resistor. GP5 15 14 17 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or internal weak pull-up resistor. GP6 16 15 18 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or internal weak pull-up resistor. GP7 17 16 19 I/O Bidirectional I/O pin. Can be enabled for interrupt-on-change and/or internal weak pull-up resistor. VDD 18 18 20 P Power. N/C -- 6, 8 10, 11 -- -- (c) 2007 Microchip Technology Inc. DS21919E-page 5 MCP23008/MCP23S08 1.2 Power-on Reset (POR) The on-chip POR circuit holds the device in reset until VDD has reached a high enough voltage to deactivate the POR circuit (i.e., release the device from Reset). The maximum VDD rise time is specified in Section 2.0 "Electrical Characteristics". When the device exits the POR condition (releases reset), device operating parameters (i.e., voltage, temperature, serial bus frequency, etc.) must be met to ensure proper operation. 1.3 Serial Interface 1.3.2 1.3.2.1 I2CTM INTERFACE I2C Write Operation The I2C Write operation includes the control byte and register address sequence, as shown in the bottom of Figure 1-1. This sequence is followed by eight bits of data from the master and an Acknowledge (ACK) from the MCP23008. The operation is ended with a STOP or RESTART condition being generated by the master. Data is written to the MCP23008 after every byte transfer. If a STOP or RESTART condition is generated during a data transfer, the data will not be written to the MCP23008. This block handles the functionality of the I2C (MCP23008) or SPI (MCP23S08) interface protocol. The MCP23X08 contains eleven registers that can be addressed through the serial interface block (Table 1-2): Byte writes and sequential writes are both supported by the MCP23008. The MCP23008 increments its address counter after each ACK during the data transfer. TABLE 1-2: 1.3.2.2 Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 1.3.1 REGISTER ADDRESSES Access to: IODIR IPOL GPINTEN DEFVAL INTCON IOCON GPPU INTF INTCAP (Read-only) GPIO OLAT SEQUENTIAL OPERATION BIT The Sequential Operation (SEQOP) bit (IOCON register) controls the operation of the address pointer. The address pointer can either be enabled (default) to allow the address pointer to increment automatically after each data transfer, or it can be disabled. When operating in Sequential mode (IOCON.SEQOP = 0), the address pointer automatically increments to the next address after each byte is clocked. When operating in Byte mode (IOCON.SEQOP = 1), the MCP23X08 does not increment its address counter after each byte during the data transfer. This gives the ability to continually read the same address by providing extra clocks (without additional control bytes). This is useful for polling the GPIO register for data changes. DS21919E-page 6 I2C Read Operation The I2C Read operation includes the control byte sequence, as shown in the bottom of Figure 1-1. This sequence is followed by another control byte (including the START condition and ACK) with the R/W bit equal to a logic 1 (R/W = 1). The MCP23008 then transmits the data contained in the addressed register. The sequence is ended with the master generating a STOP or RESTART condition. 1.3.2.3 I2C Sequential Write/Read For sequential operations (Write or Read), instead of transmitting a STOP or RESTART condition after the data transfer, the master clocks the next byte pointed to by the address pointer (see Section 1.3.1 "Sequential Operation Bit" for details regarding sequential operation control). The sequence ends with the master sending a STOP or RESTART condition. The MCP23008 address pointer will roll over to address zero after reaching the last register address. Refer to Figure 1-1. 1.3.3 1.3.3.1 SPI INTERFACE SPI Write Operation The SPI Write operation is started by lowering CS. The Write command (slave address with R/W bit cleared) is then clocked into the device. The opcode is followed by an address and at least one data byte. 1.3.3.2 SPI Read Operation The SPI Read operation is started by lowering CS. The SPI read command (slave address with R/W bit set) is then clocked into the device. The opcode is followed by an address, with at least one data byte being clocked out of the device. (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 MCP23008 I2CTM DEVICE PROTOCOL FIGURE 1-1: S - START SR - RESTART S OP DIN W ADDR DIN .... P P - STOP w - Write SR OP R DOUT .... DOUT P OP W DIN DIN P R - Read OP - Device opcode SR ADDR - Device address P DOUT - Data out from MCP23008 DIN .... - Data into MCP23008 OP S DOUT R SR SR OP W OP DOUT .... R ADDR P DOUT .... DOUT P DIN .... DIN P P Byte and Sequential Write Byte S OP W ADDR DIN Sequential S OP W ADDR DIN P DIN .... P Byte and Sequential Read 1.3.3.3 Byte S OP W SR OP R DOUT Sequential S OP W SR OP R DOUT SPI Sequential Write/Read For sequential operations, instead of deselecting the device by raising CS, the master clocks the next byte pointed to by the address pointer. 1.4 P .... DOUT P Hardware Address Decoder The sequence ends by the raising of CS. The hardware address pins are used to determine the device address. To address a device, the corresponding address bits in the control byte must match the pin state. The MCP23S08 address pointer will roll over to address zero after reaching the last register address. * MCP23008 has address pins A2, A1 and A0. * MCP23S08 has address pins A1 and A0. The pins must be biased externally. (c) 2007 Microchip Technology Inc. DS21919E-page 7 MCP23008/MCP23S08 1.4.1 ADDRESSING I2C DEVICES (MCP23008) The MCP23008 is a slave I2C device that supports 7-bit slave addressing, with the read/write bit filling out the control byte. The slave address contains four fixed bits and three user-defined hardware address bits (pins A2, A1 and A0). Figure 1-2 shows the control byte format. 1.4.2 I2CTM CONTROL BYTE FORMAT FIGURE 1-2: Control Byte S 0 1 0 0 A2 A1 A0 R/W ACK Slave Address R/W bit ACK bit Start bit ADDRESSING SPI DEVICES (MCP23S08) R/W = 0 = write R/W = 1 = read The MCP23S08 is a slave SPI device. The slave address contains five fixed bits and two user-defined hardware address bits (pins A1 and A0), with the read/ write bit filling out the control byte. Figure 1-3 shows the control byte format. FIGURE 1-3: SPI CONTROL BYTE FORMAT CS Control Byte 0 1 0 0 0 A1 A0 R/W Slave Address R/W bit R/W = 0 = write R/W = 1 = read I2CTM ADDRESSING REGISTERS FIGURE 1-4: S 0 1 0 0 A2 A1 A0 0 ACK A7 A6 A5 A4 A3 A2 A1 A0 A1 A0 ACK R/W = 0 Device Opcode Register Address The ACKs are provided by the MCP23008. FIGURE 1-5: SPI ADDRESSING REGISTERS CS 0 1 0 0 0 Device Opcode DS21919E-page 8 A1 A0 R/W A7 A6 A5 A4 A3 A2 Register Address (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 1.5 GPIO Port 1.6 The GPIO module contains the data port (GPIO), internal pull up resistors and the Output Latches (OLAT). Configuration and Control Registers The Configuration and Control blocks contain the registers as shown in Table 1-3. Reading the GPIO register reads the value on the port. Reading the OLAT register only reads the OLAT, not the actual value on the port. Writing to the GPIO register actually causes a write to the OLAT. Writing to the OLAT register forces the associated output drivers to drive to the level in OLAT. Pins configured as inputs turn off the associated output driver and put it in high-impedance. TABLE 1-3: Register Name IODIR CONFIGURATION AND CONTROL REGISTERS Address (hex) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 POR/RST value 00 IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0 1111 1111 IPOL 01 IP7 IP6 IP5 IP4 IP3 IP2 IP1 IP0 0000 0000 GPINTEN 02 GPINT7 GPINT6 GPINT5 GPINT4 GPINT3 GPINT2 GPINT1 GPINT0 0000 0000 DEFVAL 03 DEF7 DEF6 DEF5 DEF4 DEF3 DEF2 DEF1 DEF0 0000 0000 INTCON 04 IOC7 IOC6 IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 0000 0000 IOCON 05 -- -- SREAD DISSLW HAEN* ODR INTPOL -- --00 000- GPPU 06 PU7 PU6 PU5 PU4 PU3 PU2 PU1 PU0 0000 0000 INTF 07 INT7 INT6 INT5 INT4 INT3 INT2 INT1 INTO 0000 0000 INTCAP 08 ICP7 ICP6 ICP5 ICP4 ICP3 ICP2 ICP1 ICP0 0000 0000 GPIO 09 GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 0000 0000 OLAT 0A OL7 OL6 OL5 OL4 OL3 OL2 OL1 OL0 0000 0000 * Not used on the MCP23008. (c) 2007 Microchip Technology Inc. DS21919E-page 9 MCP23008/MCP23S08 1.6.1 I/O DIRECTION (IODIR) REGISTER Controls the direction of the data I/O. When a bit is set, the corresponding pin becomes an input. When a bit is clear, the corresponding pin becomes an output. REGISTER 1-1: IODIR - I/O DIRECTION REGISTER (ADDR 0x00) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown IO7:IO0: These bits control the direction of data I/O <7:0> 1 = Pin is configured as an input. 0 = Pin is configured as an output. DS21919E-page 10 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 1.6.2 INPUT POLARITY (IPOL) REGISTER The IPOL register allows the user to configure the polarity on the corresponding GPIO port bits. If a bit is set, the corresponding GPIO register bit will reflect the inverted value on the pin. REGISTER 1-2: IPOL - INPUT POLARITY PORT REGISTER (ADDR 0x01) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IP7 IP6 IP5 IP4 IP3 IP2 IP1 IP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown IP7:IP0: These bits control the polarity inversion of the input pins <7:0> 1 = GPIO register bit will reflect the opposite logic state of the input pin. 0 = GPIO register bit will reflect the same logic state of the input pin. (c) 2007 Microchip Technology Inc. DS21919E-page 11 MCP23008/MCP23S08 1.6.3 INTERRUPT-ON-CHANGE CONTROL (GPINTEN) REGISTER The GPINTEN register controls the interrupt-onchange feature for each pin. If a bit is set, the corresponding pin is enabled for interrupt-on-change. The DEFVAL and INTCON registers must also be configured if any pins are enabled for interrupt-on-change. REGISTER 1-3: GPINTEN - INTERRUPT-ON-CHANGE PINS (ADDR 0x02) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GPINT7 GPINT6 GPINT5 GPINT4 GPINT3 GPINT2 GPINT1 GPINT0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown GPINT7:GPINT0: General purpose I/O interrupt-on-change bits <7:0> 1 = Enable GPIO input pin for interrupt-on-change event. 0 = Disable GPIO input pin for interrupt-on-change event. Refer to INTCON and GPINTEN. DS21919E-page 12 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 1.6.4 DEFAULT COMPARE (DEFVAL) REGISTER FOR INTERRUPT-ONCHANGE The default comparison value is configured in the DEFVAL register. If enabled (via GPINTEN and INTCON) to compare against the DEFVAL register, an opposite value on the associated pin will cause an interrupt to occur. REGISTER 1-4: DEFVAL - DEFAULT VALUE REGISTER (ADDR 0x03) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DEF7 DEF6 DEF5 DEF4 DEF3 DEF2 DEF1 DEF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown DEF7:DEF0: These bits set the compare value for pins configured for interrupt-on-change from defaults <7:0>. Refer to INTCON. If the associated pin level is the opposite from the register bit, an interrupt occurs. Refer to INTCON and GPINTEN. (c) 2007 Microchip Technology Inc. DS21919E-page 13 MCP23008/MCP23S08 1.6.5 INTERRUPT CONTROL (INTCON) REGISTER The INTCON register controls how the associated pin value is compared for the interrupt-on-change feature. If a bit is set, the corresponding I/O pin is compared against the associated bit in the DEFVAL register. If a bit value is clear, the corresponding I/O pin is compared against the previous value. REGISTER 1-5: INTCON - INTERRUPT-ON-CHANGE CONTROL REGISTER (ADDR 0x04) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IOC7 IOC6 IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown IOC7:IOC0: These bits control how the associated pin value is compared for interrupt-on-change <7:0> 1 = Controls how the associated pin value is compared for interrupt-on-change. 0 = Pin value is compared against the previous pin value. Refer to INTCON and GPINTEN. DS21919E-page 14 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 1.6.6 CONFIGURATION (IOCON) REGISTER The IOCON register configuring the device: contains several bits for * The Sequential Operation (SEQOP) controls the incrementing function of the address pointer. If the address pointer is disabled, the address pointer does not automatically increment after each byte is clocked during a serial transfer. This feature is useful when it is desired to continuously poll (read) or modify (write) a register. * The Slew Rate (DISSLW) bit controls the slew rate function on the SDA pin. If enabled, the SDA slew rate will be controlled when driving from a high to a low. REGISTER 1-6: U-0 -- * The Hardware Address Enable (HAEN) control bit enables/disables the hardware address pins (A1, A0) on the MCP23S08. This bit is not used on the MCP23008. The address pins are always enabled on the MCP23008. * The Open-Drain (ODR) control bit enables/ disables the INT pin for open-drain configuration. * The Interrupt Polarity (INTPOL) control bit sets the polarity of the INT pin. This bit is functional only when the ODR bit is cleared, configuring the INT pin as active push-pull. IOCON - I/O EXPANDER CONFIGURATION REGISTER (ADDR 0x05) U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 -- SEQOP DISSLW HAEN ODR INTPOL -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0'. bit 5 SEQOP: Sequential Operation mode bit. 1 = Sequential operation disabled, address pointer does not increment. 0 = Sequential operation enabled, address pointer increments. bit 4 DISSLW: Slew Rate control bit for SDA output. 1 = Slew rate disabled. 0 = Slew rate enabled. bit 3 HAEN: Hardware Address Enable bit (MCP23S08 only). Address pins are always enabled on MCP23008. 1 = Enables the MCP23S08 address pins. 0 = Disables the MCP23S08 address pins. bit 2 ODR: This bit configures the INT pin as an open-drain output. 1 = Open-drain output (overrides the INTPOL bit). 0 = Active driver output (INTPOL bit sets the polarity). bit 1 INTPOL: This bit sets the polarity of the INT output pin. 1 = Active-high. 0 = Active-low. bit 0 Unimplemented: Read as `0'. (c) 2007 Microchip Technology Inc. x = Bit is unknown DS21919E-page 15 MCP23008/MCP23S08 1.6.7 PULL-UP RESISTOR CONFIGURATION (GPPU) REGISTER The GPPU register controls the pull-up resistors for the port pins. If a bit is set and the corresponding pin is configured as an input, the corresponding port pin is internally pulled up with a 100 k resistor. REGISTER 1-7: GPPU - GPIO PULL-UP RESISTOR REGISTER (ADDR 0x06) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PU7 PU6 PU5 PU4 PU3 PU2 PU1 PU0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown PU7:PU0: These bits control the weak pull-up resistors on each pin (when configured as an input) <7:0>. 1 = Pull-up enabled. 0 = Pull-up disabled. DS21919E-page 16 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 1.6.8 INTERRUPT FLAG (INTF) REGISTER Note: The INTF register reflects the interrupt condition on the port pins of any pin that is enabled for interrupts via the GPINTEN register. A `set' bit indicates that the associated pin caused the interrupt. This register is `read-only'. Writes to this register will be ignored. REGISTER 1-8: INTF will always reflect the pin(s) that have an interrupt condition. For example, one pin causes an interrupt to occur and is captured in INTCAP and INF. If before clearing the interrupt another pin changes, which would normally cause an interrupt, it will be reflected in INTF, but not INTCAP. INTF - INTERRUPT FLAG REGISTER (ADDR 0x07) R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 INT7 INT6 INT5 INT4 INT3 INT2 INT1 INT0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown INT7:INT0: These bits reflect the interrupt condition on the port. Will reflect the change only if interrupts are enabled (GPINTEN) <7:0>. 1 = Pin caused interrupt. 0 = Interrupt not pending. (c) 2007 Microchip Technology Inc. DS21919E-page 17 MCP23008/MCP23S08 1.6.9 INTERRUPT CAPTURE (INTCAP) REGISTER The INTCAP register captures the GPIO port value at the time the interrupt occurred. The register is `readonly' and is updated only when an interrupt occurs. The register will remain unchanged until the interrupt is cleared via a read of INTCAP or GPIO. REGISTER 1-9: INTCAP - INTERRUPT CAPTURED VALUE FOR PORT REGISTER (ADDR 0x08) R-x R-x R-x R-x R-x R-x R-x R-x ICP7 ICP6 ICP5 ICP4 ICP3 ICP2 ICP1 ICP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown ICP7:ICP0: These bits reflect the logic level on the port pins at the time of interrupt due to pin change <7:0> 1 = Logic-high. 0 = Logic-low. DS21919E-page 18 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 1.6.10 PORT (GPIO) REGISTER The GPIO register reflects the value on the port. Reading from this register reads the port. Writing to this register modifies the Output Latch (OLAT) register. REGISTER 1-10: GPIO - GENERAL PURPOSE I/O PORT REGISTER (ADDR 0x09) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown GP7:GP0: These bits reflect the logic level on the pins <7:0> 1 = Logic-high. 0 = Logic-low. (c) 2007 Microchip Technology Inc. DS21919E-page 19 MCP23008/MCP23S08 1.6.11 OUTPUT LATCH REGISTER (OLAT) The OLAT register provides access to the output latches. A read from this register results in a read of the OLAT and not the port itself. A write to this register modifies the output latches that modify the pins configured as outputs. REGISTER 1-11: OLAT - OUTPUT LATCH REGISTER 0 (ADDR 0x0A) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OL7 OL6 OL5 OL4 OL3 OL2 OL1 OL0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown OL7:OL0: These bits reflect the logic level on the output latch <7:0> 1 = Logic-high. 0 = Logic-low. DS21919E-page 20 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 1.7 Interrupt Logic The interrupt output pin will activate if an internal interrupt occurs. The interrupt block is configured by the following registers: * GPINTEN - enables the individual inputs * DEFVAL - holds the values that are compared against the associated input port values * INTCON - controls if the input values are compared against DEFVAL or the previous values on the port * IOCON (ODR and INPOL) - configures the INT pin as push-pull, open-drain and active-level Only pins configured as inputs can cause interrupts. Pins configured as outputs have no affect on INT. Interrupt activity on the port will cause the port value to be captured and copied into INTCAP. The interrupt will remain active until the INTCAP or GPIO register is read. Writing to these registers will not affect the interrupt. The first interrupt event will cause the port contents to be copied into the INTCAP register. Subsequent interrupt conditions on the port will not cause an interrupt to occur as long as the interrupt is not cleared by a read of INTCAP or GPIO. 1.7.1 2. INTERRUPT-ON-PINCHANGE GPx INT ACTIVE Port value is captured into INTCAP ACTIVE Read GPIU or INTCAP FIGURE 1-7: Port value is captured into INTCAP INTERRUPT-ON-CHANGE FROM REGISTER DEFAULT DEFVAL GP: 7 6 5 4 3 2 1 0 X X X X X 0 X X GP2 INTERRUPT CONDITIONS There are two possible configurations to cause interrupts (configured via INTCON): 1. FIGURE 1-6: Pins configured for interrupt-on-pin-change will cause an interrupt to occur if a pin changes to the opposite state. The default state is reset after an interrupt occurs. For example, an interrupt occurs by an input changing from 1 to 0. The new initial state for the pin is a logic 0. Pins configured for interrupt-on-change from register value will cause an interrupt to occur if the corresponding input pin differs from the register bit. The interrupt condition will remain as long as the condition exists, regardless if the INTAP or GPIO is read. INT ACTIVE Port value is captured into INTCAP ACTIVE Read GPIU or INTCAP (INT clears only if interrupt condition does not exist.) See Figure 1-6 and Figure 1-7 for more information on interrupt operations. (c) 2007 Microchip Technology Inc. DS21919E-page 21 MCP23008/MCP23S08 NOTES: DS21919E-page 22 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 2.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Ambient temperature under bias.............................................................................................................-40C to +125C Storage temperature .............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V Voltage on all other pins with respect to VSS (except VDD)............................................................. -0.6V to (VDD + 0.6V) Total power dissipation (Note) .............................................................................................................................700 mW Maximum current out of VSS pin ...........................................................................................................................150 mA Maximum current into VDD pin ..............................................................................................................................125 mA Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... 20 mA Output clamp current, IOK (VO < 0 or VO > VDD) .............................................................................................................. 20 mA Maximum output current sunk by any output pin ....................................................................................................25 mA Maximum output current sourced by any output pin ...............................................................................................25 mA Note: Power dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL) NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. (c) 2007 Microchip Technology Inc. DS21919E-page 23 MCP23008/MCP23S08 2.1 DC Characteristics DC Characteristics Param No. Operating Conditions (unless otherwise indicated): 1.8V VDD 5.5V at -40C TA +85C (I-Temp) 4.5V VDD 5.5V at -40C TA +125C (E-Temp) (Note 1) Characteristic Sym Min Typ Max Units Conditions D001 Supply Voltage VDD 1.8 -- 5.5 V D002 VDD Start Voltage to Ensure Power-on Reset VPOR -- VSS -- V D003 VDD Rise Rate to Ensure Power-on Reset SVDD 0.05 -- -- V/ms D004 Supply Current IDD -- -- 1 mA D005 Standby current IDDS -- -- 1 A -- -- 2 A VSS -- 0.15 VDD V VSS -- 0.2 VDD V 0.25 VDD + 0.8 -- VDD V 0.8 VDD -- VDD V For entire VDD range. IIL -- -- 1 A VSS VPIN VDD Design guidance only. Not tested. SCL/SCK = 1 MHz 4.5V - 5.5V @ +125C (Note 1) Input Low-Voltage D030 A0, A1 (TTL buffer) D031 CS, GPIO, SCL/SCK, SDA, A2, RESET (Schmitt Trigger) VIL Input High-Voltage D040 A0, A1 (TTL buffer) D041 CS, GPIO, SCL/SCK, SDA, A2, RESET (Schmitt Trigger) VIH Input Leakage Current D060 I/O port pins Output Leakage Current D065 I/O port pins ILO -- -- 1 A VSS VPIN VDD D070 GPIO weak pull-up current IPU 40 75 115 A VDD = 5V, GP Pins = VSS -40C TA +85C VOL -- -- 0.6 V IOL = 8.5 mA, VDD = 4.5V -- -- 0.6 V IOL = 1.6 mA, VDD = 4.5V Output Low-Voltage D080 GPIO INT SO, SDA -- -- 0.6 V IOL = 3.0 mA, VDD = 1.8V SDA -- -- 0.8 V IOL = 3.0 mA, VDD = 4.5V VDD - 0.7 -- -- V IOH = -3.0 mA, VDD = 4.5V VDD - 0.7 -- -- Output High-Voltage D090 GPIO, INT, SO VOH IOH = -400 A, VDD = 1.8V Capacitive Loading Specs on Output Pins D101 GPIO, SO, INT CIO -- -- 50 pF D102 SDA CB -- -- 400 pF Note 1: This parameter is characterized, not 100% tested. DS21919E-page 24 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 FIGURE 2-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS VDD Pin 1 k SCL and SDA pin MCP23008 50 pF 135 pF FIGURE 2-2: RESET AND DEVICE RESET TIMER TIMING VDD RESET 30 32 Internal RESET 34 Output pin (c) 2007 Microchip Technology Inc. DS21919E-page 25 MCP23008/MCP23S08 TABLE 2-1: DEVICE RESET SPECIFICATIONS Operating Conditions (unless otherwise indicated): 1.8V VDD 5.5V at -40C TA +85C (I-Temp) 4.5V VDD 5.5V at -40C TA +125C (E-Temp) (Note 1) AC Characteristics Param No. Characteristic Sym Min Typ(1) Max Units 30 RESET Pulse Width (Low) TRSTL 1 -- -- s 32 Device Active After RESET high THLD -- 0 -- s 34 Output High-Impedance From RESET Low TIOZ -- -- 1 s Note 1: Conditions VDD = 5.0V This parameter is characterized, not 100% tested. FIGURE 2-3: I2CTM BUS START/STOP BITS TIMING SCL 93 91 90 92 SDA STOP Condition START Condition FIGURE 2-4: I2CTM BUS DATA TIMING 103 102 100 101 SCL 90 106 91 107 SDA In 109 109 92 110 SDA Out DS21919E-page 26 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 TABLE 2-2: I2CTM BUS DATA REQUIREMENTS 2 I CTM AC Characteristics Param No. 100 101 Characteristic Operating Conditions (unless otherwise indicated): 1.8V VDD 5.5V at -40C TA +85C (I-Temp) 4.5V VDD 5.5V at -40C TA +125C (E-Temp) (Note 1) RPU (SCL, SDA) = 1 k, CL (SCL, SDA) = 135 pF Min Typ Max 100 kHz mode 4.0 -- -- s 1.8V - 5.5V (I-Temp) 400 kHz mode 0.6 -- -- s 2.7V - 5.5V (I-Temp) 1.7 MHz mode 0.12 -- -- s 4.5V - 5.5V (E-Temp) 100 kHz mode 4.7 -- -- s 1.8V - 5.5V (I-Temp) 400 kHz mode 1.3 -- -- s 2.7V - 5.5V (I-Temp) 0.32 -- -- s 4.5V - 5.5V (E-Temp) -- -- 1000 ns 1.8V - 5.5V (I-Temp) Clock High Time: Clock Low Time: Sym THIGH TLOW 1.7 MHz mode 102 SDA and SCL Rise Time: 100 kHz mode 103 20 + 0.1 1.7 MHz mode 20 100 kHz mode 90 TR (Note 1) 400 kHz mode SDA and SCL Fall Time: TF (Note 1) 107 ns 2.7V - 5.5V (I-Temp) ns 4.5V - 5.5V (E-Temp) 1.8V - 5.5V (I-Temp) -- 300 ns -- 300 ns 2.7V - 5.5V (I-Temp) 1.7 MHz mode 20 -- 80 ns 4.5V - 5.5V (E-Temp) 100 kHz mode 4.7 -- -- s 1.8V - 5.5V (I-Temp) 400 kHz mode 0.6 -- -- s 2.7V - 5.5V (I-Temp) 0.16 -- -- s 4.5V - 5.5V (E-Temp) 4.0 -- -- s 1.8V - 5.5V (I-Temp) START Condition Setup Time: START Condition Hold Time: TSU:STA THD:STA 400 kHz mode 0.6 -- -- s 2.7V - 5.5V (I-Temp) 1.7 MHz mode 0.16 -- -- s 4.5V - 5.5V (E-Temp) Data Input Hold Time: THD:DAT 100 kHz mode 0 -- 3.45 s 1.8V - 5.5V (I-Temp) 400 kHz mode 0 -- 0.9 s 2.7V - 5.5V (I-Temp) 1.7 MHz mode 0 -- 0.15 s 4.5V - 5.5V (E-Temp) 100 kHz mode 250 -- -- ns 1.8V - 5.5V (I-Temp) 400 kHz mode 100 -- -- ns 2.7V - 5.5V (I-Temp) 0.01 -- -- s 4.5V - 5.5V (E-Temp) 4.0 -- -- s 1.8V - 5.5V (I-Temp) Data Input Setup Time: STOP Condition Setup Time: 100 kHz mode Note 1: 2: 300 160 -- TSU:DAT 1.7 MHz mode 92 -- -- 20 + 0.1 CB(2) 100 kHz mode 106 CB(2) 400 kHz mode 1.7 MHz mode 91 Units Conditions TSU:STO 400 kHz mode 0.6 -- -- s 2.7V - 5.5V (I-Temp) 1.7 MHz mode 0.16 -- -- s 4.5V - 5.5V (E-Temp) This parameter is characterized, not 100% tested. CB is specified to be from 10 to 400 pF. (c) 2007 Microchip Technology Inc. DS21919E-page 27 MCP23008/MCP23S08 I2CTM BUS DATA REQUIREMENTS (CONTINUED) TABLE 2-2: Operating Conditions (unless otherwise indicated): 1.8V VDD 5.5V at -40C TA +85C (I-Temp) 4.5V VDD 5.5V at -40C TA +125C (E-Temp) (Note 1) RPU (SCL, SDA) = 1 k, CL (SCL, SDA) = 135 pF 2 I CTM AC Characteristics Param No. 109 Characteristic Sym Min Typ Max Output Valid From Clock: TAA 100 kHz mode -- -- 3.45 s 1.8V - 5.5V (I-Temp) 400 kHz mode -- -- 0.9 s 2.7V - 5.5V (I-Temp) -- -- 0.18 s 4.5V - 5.5V (E-Temp) 100 kHz mode 4.7 -- -- s 1.8V - 5.5V (I-Temp) 400 kHz mode 1.3 -- -- s 2.7V - 5.5V (I-Temp) N/A -- N/A s 4.5V - 5.5V (E-Temp) 100 kHz and 400 kHz -- -- 400 pF (Note 1) 1.7 MHz -- -- 100 pF (Note 1) 100 kHz and 400 kHz -- -- 50 ns 1.7 MHz -- -- 10 ns 1.7 MHz mode 110 Bus Free Time: TBUF 1.7 MHz mode Bus Capacitive Loading: CB Input Filter Spike Suppression: (SDA and SCL) Note 1: 2: Units Conditions TSP Spike suppression off This parameter is characterized, not 100% tested. CB is specified to be from 10 to 400 pF. FIGURE 2-5: SPI INPUT TIMING 3 CS 11 6 1 Mode 1,1 7 10 2 SCK Mode 0,0 4 5 SI MSb in SO DS21919E-page 28 LSb in high-impedance (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 FIGURE 2-6: SPI OUTPUT TIMING CS 8 SCK 2 9 Mode 1,1 Mode 0,0 12 SO MSb out LSb out don't care SI TABLE 2-3: SPI INTERFACE AC CHARACTERISTICS SPI Interface AC Characteristics Param No. 14 13 Characteristic Clock Frequency Operating Conditions (unless otherwise indicated): 1.8V VDD 5.5V at -40C TA +85C (I-Temp) 4.5V VDD 5.5V at -40C TA +125C (E-Temp) (Note 1) Sym Min Typ Max Units Conditions FCLK -- -- 5 MHz 1.8V - 5.5V (I-Temp) -- -- 10 MHz 2.7V - 5.5V (I-Temp) 4.5V - 5.5V (E-Temp) -- -- 10 MHz 1 CS Setup Time TCSS 50 -- -- ns 2 CS Hold Time TCSH 100 -- -- ns 1.8V - 5.5V (I-Temp) 50 -- -- ns 2.7V - 5.5V (I-Temp) 3 4 5 CS Disable Time Data Setup Time Data Hold Time TCSD TSU THD 50 -- -- ns 4.5V - 5.5V (E-Temp) 100 -- -- ns 1.8V - 5.5V (I-Temp) 50 -- -- ns 2.7V - 5.5V (I-Temp) 50 -- -- ns 4.5V - 5.5V (E-Temp) 20 -- -- ns 1.8V - 5.5V (I-Temp) 10 -- -- ns 2.7V - 5.5V (I-Temp) 10 -- -- ns 4.5V - 5.5V (E-Temp) 20 -- -- ns 1.8V - 5.5V (I-Temp) 10 -- -- ns 2.7V - 5.5V (I-Temp) 10 -- -- ns 4.5V - 5.5V (E-Temp) 6 CLK Rise Time TR -- -- 2 s Note 1 7 CLK Fall Time TF -- -- 2 s Note 1 8 Clock High Time THI 90 -- -- ns 1.8V - 5.5V (I-Temp) 45 -- -- ns 2.7V - 5.5V (I-Temp) 45 -- -- ns 4.5V - 5.5V (E-Temp) Note 1: 2: This parameter is characterized, not 100% tested. TV = 90 ns (max) when address pointer rolls over from address 0x0A to 0x00. (c) 2007 Microchip Technology Inc. DS21919E-page 29 MCP23008/MCP23S08 TABLE 2-3: SPI INTERFACE AC CHARACTERISTICS (CONTINUED) Operating Conditions (unless otherwise indicated): 1.8V VDD 5.5V at -40C TA +85C (I-Temp) 4.5V VDD 5.5V at -40C TA +125C (E-Temp) (Note 1) SPI Interface AC Characteristics Param No. 9 Characteristic Clock Low Time Sym Min Typ Max Units TLO 90 -- -- ns Conditions 1.8V - 5.5V (I-Temp) 45 -- -- ns 2.7V - 5.5V (I-Temp) 45 -- -- ns 4.5V - 5.5V (E-Temp) 10 Clock Delay Time TCLD 50 -- -- ns 11 Clock Enable Time TCLE 50 -- -- ns TV -- -- 90 ns 1.8V - 5.5V (I-Temp) -- -- 45 ns 2.7V - 5.5V (I-Temp) -- -- 45 ns 4.5V - 5.5V (E-Temp) (2) Output Valid from Clock Low 12 13 Output Hold Time THO 0 -- -- ns 14 Output Disable Time TDIS -- -- 100 ns Note 1: 2: This parameter is characterized, not 100% tested. TV = 90 ns (max) when address pointer rolls over from address 0x0A to 0x00. FIGURE 2-7: GPIO AND INT TIMING SCL/SCK SDA/SI In D1 D0 LSb of data byte zero during a write or read command, depending on parameter. 50 GPn Output Pin 51 INT Pin GPn Input Pin INT pin active inactive 53 52 Register Loaded DS21919E-page 30 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 TABLE 2-4: GP AND INT PINS AC Characteristics Param No. Characteristic Operating Conditions (unless otherwise indicated): 1.8V VDD 5.5V at -40C TA +85C (I-Temp) 4.5V VDD 5.5V at -40C TA +125C (E-Temp) (Note 1) Sym Min Typ Max Units 50 Serial data to output valid TGPOV -- -- 500 ns 51 Interrupt pin disable time TINTD -- -- 600 ns 52 GP input change to register valid TGPIV -- -- 450 ns 53 IOC event to INT active TGPINT -- -- 600 ns Glitch Filter on GP Pins TGLITCH -- -- 150 ns Note 1: Conditions This parameter is characterized, not 100% tested (c) 2007 Microchip Technology Inc. DS21919E-page 31 MCP23008/MCP23S08 NOTES: DS21919E-page 32 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 3.0 PACKAGING INFORMATION 3.1 Package Marking Information 18-Lead PDIP (300 mil) Example: XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN 18-Lead SOIC (300 mil) MCP23008-E/P^^ e3 0634256 Example: XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN 20-Lead QFN 0634256 Example XXXXX XXXXXX XXXXXX YWWNNN 23S08 e3 E/ML^^ 0637 256 20-Lead SSOP Example: XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: MCP23008 E/SO^^ e3 MCP23S08 e3 E/SS^^ XXXXXXXXXXXX 0634256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2007 Microchip Technology Inc. DS21919E-page 33 MCP23008/MCP23S08 18-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 3 D E A2 A L c A1 b1 b e eB Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 18 Pitch e Top to Seating Plane A - - .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 - - Shoulder to Shoulder Width E .300 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .880 .900 .920 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .014 b1 .045 .060 .070 b .014 .018 .022 eB - - Upper Lead Width Lower Lead Width Overall Row Spacing .100 BSC .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-007B DS21919E-page 34 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 18-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 3 b e h h c A2 A A1 L L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 18 Pitch e Overall Height A - 1.27 BSC - Molded Package Thickness A2 2.05 - - Standoff A1 0.10 - 0.30 Overall Width E Molded Package Width E1 7.50 BSC Overall Length D 11.55 BSC 2.65 10.30 BSC Chamfer (optional) h 0.25 - 0.75 Foot Length L 0.40 - 1.27 Footprint L1 1.40 REF Foot Angle 0 - 8 Lead Thickness c 0.20 - 0.33 Lead Width b 0.31 - 0.51 Mold Draft Angle Top 5 - 15 Mold Draft Angle Bottom 5 - 15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-051B (c) 2007 Microchip Technology Inc. DS21919E-page 35 MCP23008/MCP23S08 20-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D2 EXPOSED PAD e E2 2 E b 2 1 1 K N N NOTE 1 TOP VIEW L BOTTOM VIEW A A1 A3 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 20 Pitch e Overall Height A 0.80 0.50 BSC 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 2.60 2.70 2.80 b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 - - Contact Width 4.00 BSC 2.60 2.70 2.80 4.00 BSC Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-126B DS21919E-page 36 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 20-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 b e c A2 A A1 L1 Units Dimension Limits Number of Pins L MILLIMETERS MIN N NOM MAX 20 Pitch e Overall Height A - 0.65 BSC - 2.00 Molded Package Thickness A2 1.65 1.75 1.85 Standoff A1 0.05 - - Overall Width E 7.40 7.80 8.20 Molded Package Width E1 5.00 5.30 5.60 Overall Length D 6.90 7.20 7.50 Foot Length L 0.55 0.75 0.95 Footprint L1 1.25 REF Lead Thickness c 0.09 - Foot Angle 0 4 0.25 8 Lead Width b 0.22 - 0.38 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-072B (c) 2007 Microchip Technology Inc. DS21919E-page 37 MCP23008/MCP23S08 NOTES: DS21919E-page 38 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 APPENDIX A: REVISION HISTORY Revision E (August 2007) 1. Section 3.0 "Packaging Information": Updated package outline drawings. Revision D (February 2007) 1. 2. 3. 4. Changed Byte and Sequential Read in Figure 1-1 from "R" to "W". Table 2-4, Param No. 51 and 53: Changed from 450 to 600 and 500 to 600, respecively. Added disclaimer to package outline drawings. Updated package outline drawings. Revision C (October 2006) 1. 2. Added 20-pin QFN package information throughout document. Added disclaimer to package outline drawings. Revision B (February 2005) The following is the list of modifications: 1. 2. Section 1.6 "Configuration and Control Registers". Added Hardware Address Enable (HAEN) bit to Table 1-3. Section 1.6.6 "Configuration (IOCON) Register". Added Hardware Address Enable (HAEN) bit to Register 1-6. Revision A (December 2004) * Original Release of this Document. (c) 2007 Microchip Technology Inc. DS21919E-page 39 MCP23008/MCP23S08 NOTES: DS21919E-page 40 (c) 2007 Microchip Technology Inc. MCP23008/MCP23S08 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device Device X /XX Temperature Range Package - MCP23008: MCP23008T: E = 8-Bit I/O Expander w/ I2CTM Interface 8-Bit I/O Expander w/ I2C Interface (Tape and Reel) 8-Bit I/O Expander w/ SPI Interface 8-Bit I/O Expander w/ SPI Interface (Tape and Reel) -40C to +125C (Extended) * * While these devices are only offered in the "E" temperature range, the device will operate at different voltages and temperatures as identified in the Section 2.0 "Electrical Characteristics". Package ML = P SO SS = = = a) b) MCP23S08: MCP23S08T: Temperature Range Examples: Plastic Quad Flat, No Lead Package 4x4x0.9 mm Body (QFN), 20-Lead Plastic DIP (300 mil Body), 18-Lead Plastic SOIC (300 mil Body), 18-Lead SSOP, (209 mil Body, 5.30 mm), 20-Lead (c) 2007 Microchip Technology Inc. c) d) e) f) MCP23008-E/P: Extended Temp., 18LD PDIP package. MCP23008-E/SO: Extended Temp., 18LD SOIC package. MCP23008T-E/SO: Tape and Reel, Extended Temp., 18LD SOIC package. MCP23008-E/SS: Extended Temp., 20LD SSOP package. MCP23008T-E/SS: Tape and Reel, Extended Temp., 20LD SSOP package. MCP23008-E/ML: Extended Temp., 20LD QFN package. a) MCP23S08-E/P: b) MCP23S08-E/SO: c) MCP23S08T-E/SO: d) MCP23S08-E/SS: e) MCP23S08T-E/SS: f) MCP23S08T-E/MF: Extended Temp., 18LD PDIP package. Extended Temp., 18LD SOIC package. Tape and Reel, Extended Temp., 18LD SOIC package. Extended Temp., 20LD SSOP package. Tape and Reel, Extended Temp., 20LD SSOP package. Tape and Reel, Extended Temp., 20LD QFN package. DS21919E-page 41 MCP23008/MCP23S08 NOTES: DS21919E-page 42 (c) 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2007 Microchip Technology Inc. DS21919E-page 43 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 06/25/07 DS21919E-page 44 (c) 2007 Microchip Technology Inc.