1. General description
HITAG 1 based transponders are highly integrated and do not need any additional
components beside the external coil.
Data between Key (RWD) and transponder is transmitted bidirectionally, in Half Duplex
Mode. The HITAG 1 transponder IC offers also an encrypted data transmission.
The AntiCollision (AC) Mode, which is used mainly in long range operation, allows to
handle several transponders that are at the same time in the communication field of the
antenna, thus achieving highest operating reliability and permitting to handle several
transponders quickly and simultaneously.
The HITAG 1 transponder IC provides two protocol modes, Standard and Advanced
Mode. The Advanced Protocol Mode operates compared to the Standard Protocol Mode
with an increased number of Startbits and a 8-bit Cyclic Redundancy Check (CRC) sent
by the transponder IC at read operations.
HITAG 1 transponder IC offer a memory of 2 kbit.
2. Features and benefits
Identification transponder for use in contactless applications
Operating frequency 125 kHz
Data transmission and energy supply via RF link, no internal battery
Non-volatile memory of 2 kbit
Organized in 64 pages, 4 bytes each
10 years non-volatile data retention
100000 erase/write cycles
Selective read/write protection of memory content
Mutual authentication function
3. Applications
Logistics
Asset tracking
Gas cylinder ID
Industrial automation
HT1x
HITAG 1 transponder IC
Rev. 3.0 — 16 September 2011
210530 Product short data sheet
COMPANY PUBLIC
HT1X_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC Rev. 3.0 — 16 September 2011
210530 2 of 9
NXP Semiconductors HT1x
HITAG 1 transponder IC
4. Quick reference data
5. Ordering information
[1] This package is also known as MOA2
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Wafer EEPROM characteristics
tret retention time Tamb 55 C10 - - year
Nendu(W) write endurance 100000 - - cycle
Interface characteristics
Ciinput capacitance between LA and LB
HT1ICS3002W/V6F 189 210 231 pF
Table 2. Ordering information
Type number Package
Name Description Version
HT1ICS3002W/V6F W afer sawn wafer on FFC, 150 m, 8 inch, UV, inkless -
HT1MOA2S30/E/3 PLLMC plastic leadless module carrier package; 35 mm
wide tape SOT500-2[1]
HT1X_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC Rev. 3.0 — 16 September 2011
210530 3 of 9
NXP Semiconductors HT1x
HITAG 1 transponder IC
6. Block diagram
The HITAG 1 transponder IC require s no external power supply. The contactless interface
generates the power supply and the system clock via the resonant circuitry by inductive
coupling to the RWD. The interface also demodulates data transmitted from the RWD to
the HITAG 1 transponder IC, and modula tes the mag netic field for data transm ission from
the HITAG 1 transponder IC to the RWD.
Data are stored in a non-volatile memory (EEPROM). The memory has a capacity of
2 kbit and is organized in blocks.
Fig 1. Block diag ram of HITAG 1 transponder IC
001aai334
CLK
MOD
DEMOD
VREG
VDD
data
in
data
out
clock
R/W
ANALOGUE
RF INTERFACE
PAD
PAD
RECT
Cres
DIGITAL CONTROL
TRANSPONDER
ANTICOLLISION
READ/WRITE
CONTROL
ACCESS CONTROL
EEPROM INTERFACE
CONTROL
RF INTERFACE
CONTROL
EEPROM
SEQUENCER
CHARGE PUMP
HT1X_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC Rev. 3.0 — 16 September 2011
210530 4 of 9
NXP Semiconductors HT1x
HITAG 1 transponder IC
7. Functional description
7.1 Memory map
The 2 kbit memory area of the HITAG 1 transponder IC is divided into 16 blocks. Each
block comprises 4 pages with 4 bytes (1 byte = 8 bits) each. A page is the smalle st access
unit.
Addressing is done p agewise (p age 0 to 63) whereas acce ss is gained eith er pa gewise or
blockwise by entering the respective start address.
Block access is only available for blocks 2 to 15, page access is available for pages 0 to
63.
Areas (or settings) with light dark background can be configured by the customer within
the Configuration Page (page 1 of block 0).
Fig 2. Memory map
aaa-000324
read only
read/write
write only
one time programmable
neither read nor write
Serial Number ro
r/w or ro
Logdata 1B
Logdata 0A
Logdata 1A
Logdata 0B
Configuration
Key A
Key B
Block 1
Block 4
Block 7
Block 8
Block 15
user data
user data
user data
Block 0
Configuration of the memory is
done in the configuration page
secret
secret
or
public
public
public
r/w
or
OTP
r/w
or
0
wo or 0
r/w
secret
ro
r/w
wo
OTP
0
HT1X_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC Rev. 3.0 — 16 September 2011
210530 5 of 9
NXP Semiconductors HT1x
HITAG 1 transponder IC
8. Limiting values
[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical
Characteristics section of this specification is not implied.
[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical
Characteristics section of this specification is not implied.
9. Abbreviations
Table 3. Limiting values - HT1ICS3002W/V6F[1]
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 6.5 V
VESD electrostatic discharge voltage MIL-STD 883D, Method
3015.7, Human Body 2- kV
Ilu latch-up current MIL-STD 883D, Method 3023 100 - mA
Ii(max) maximum input current IN1-IN2 - 30 mA
Tjjunction temperature 55 +140 C
Table 4. Limiting values - HT1MOA2S30/E/3[1]
Symbol Parameter Conditions Min Max Unit
Tstg storage temperature 55 +125 C
Tamb ambient temperature Rth(j-a) 30 K/W @ Iin = 30 mA 25 +85 C
Table 5. Abbreviations
Acronym Description
AC AntiCollision
CRC Cyclic Redundancy Check
EEPROM Electrically Erasable Programmable Read-Only Memory
IC Integrated Circuit
RF Radio Frequency
RWD Read Write Device
HT1X_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC Rev. 3.0 — 16 September 2011
210530 6 of 9
NXP Semiconductors HT1x
HITAG 1 transponder IC
10. Revision history
Table 6. Revision history
Document ID Release date Data sheet status Change notice Supersedes
HT1X_SDS v.3.0 20110916 Product short data sheet - -
HT1X_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC Rev. 3.0 — 16 September 2011
210530 7 of 9
NXP Semiconductors HT1x
HITAG 1 transponder IC
11. Legal information
11.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device (s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ionThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
11.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liabili ty towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Te rms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by cust omer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
HT1X_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC Rev. 3.0 — 16 September 2011
210530 8 of 9
NXP Semiconductors HT1x
HITAG 1 transponder IC
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for aut omotive use. It i s neither qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive appl ications beyond NXP Semi conductors’
standard warrant y and NXP Semiconductors’ product specifications.
11.4 Licenses
11.5 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
HITAG — is a trademark of NXP B.V.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
ICs with HITAG functionality
NXP Semiconductors owns a worldwide perpetual license for the patents
US 5214409, US 5499017, US 5235326 and for any foreign counterparts
or equivalents of t hese patents. The license is granted for the Field-of-Use
covering: (a) all non-animal applicat ions, and (b) any application for animals
raised for human consumption (includin g but not limited to dairy animals),
including without limitation livestock and f i sh.
Please note that the license doe s not include rights outside the specified
Field-of-Use, and that NXP Semiconduc tors does not provide indemnity for
the foregoing patents outside the Field-of -Use.
NXP Semiconductors HT1x
HITAG 1 transponder IC
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 September 2011
210530
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
13. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Functional description . . . . . . . . . . . . . . . . . . . 4
7.1 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
11.4 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11.5 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9