1
FEATURES DESCRIPTION
FUNCTION
APPLICATIONS
GND
OUT
VDD
CD
VC4
VC1
VC3
1
2VC2
3
4 5
6
7
8
DCTPACKAGE
(TOPVIEW)
1
2
3
4
8
7
6
5
VC1
VC2
VC3
GND
OUT
VDD
CD
VC4
PWPACKAGE
(TOPVIEW)
bq29410, bq29411, bq29412, bq29413bq29414, bq29415, bq29419
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.................................................................................................................................................. SLUS669G AUGUST 2005 REVISED AUGUST 2008
VOLTAGE PROTECTION FOR 2-, 3-, OR 4-CELL Li-Ion BATTERIES(2
nd
-LEVEL PROTECTION)
2-, 3-, or 4-Cell Secondary Protection
The bq2941x is a secondary overvoltage protectionIC for 2-, 3-, or 4-cell lithium-ion battery packs thatLow Power Consumption I
CC
< 2 µ A
incorporates a high-accuracy precision overvoltage[VCELL
(ALL)
< V
(PROTECT)
]
detection circuit. It includes a programmable delayFixed High Accuracy Overvoltage Protection
circuit for overvoltage detection time.Threshold
bq29410 = 4.35 V bq29411 = 4.40 V
Each cell in a multiple-cell pack is compared to an bq29412 = 4.45 V
internal reference voltage. If one cell reaches anovervoltage condition, the protection sequence bq29413 = 4.50 V
begins. The bq2941x device starts charging an bq29414 = 4.55 V
external capacitor through the CD pin. When the CD bq29415 = 4.60 V
pin voltage reaches 1.2 V, the OUT pin changes from bq29419 = 4.30 V a low level to a high level.Programmable Delay Time of DetectionHigh Power Supply Ripple RejectionStable During Pulse Charge Operation
2
nd
-Level Overvoltage Protection in Li-IonBattery Packs in: Notebook Computers Portable Instrumentation
Portable Equipment
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
ABSOLUTE MAXIMUM RATINGS
PACKAGE DISSIPATION RATINGS
bq29410, bq29411, bq29412, bq29413bq29414, bq29415, bq29419
SLUS669G AUGUST 2005 REVISED AUGUST 2008 ..................................................................................................................................................
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
PACKAGE
(3)T
A
V
(PROTECT)
(2)
MSOP (DCT) SYMBOL SSOP (PW)
bq29419DCTR4.30 V CJQ bq29419PWG4 bq29419PWRG4bq29419DCTT
bq29410DCT3R
bq29410PW bq29410PWR4.35 V bq29410DCTR CJG
bq29410PWG4 bq29410PWRG4bq29410DCTT
bq29411DCT3R
bq29411PW bq29411PWR4.40 V bq29411DCTR CJH
bq29411PWG4 bq29411PWRG4bq29411DCTT 40 ° C to 110 ° C bq29412DCT3R
bq29412PW bq29412PWR4.45 V bq29412DCTR CJJ
bq29412PWG4 bq29412PWRG4bq29412DCTT
bq29413DCTR4.50 V CJk bq29413PW bq29413PWRbq29413DCTT
bq29414DCTR4.55 V CJL bq29414PW bq29414PWRbq29414DCTT
bq29415DCTR4.60 V CJM bq29415PW bq29415PWRbq29415DCTT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .(2) Contact your local Texas Instruments representative or sales office for alternative overvoltage threshold options.(3) The " R " suffix indicates tape-and-reel packaging.
over operating free-air temperature range unless otherwise noted
(1) (2)
UNIT
Supply voltage range VDD 0.3 V to 28 VVC1, VC2, VC3, VC4 0.3 V to 28 VInput voltage range
VC1 TO VC2, VC2 TO VC3, VC3 TO VC4, VC4 TO GND 0.3 V to 8 VOUT 0.3 V to 28 VOutput voltage range
CD 0.3 V to 28 VContinuous total power dissipation See Dissipation Rating TableStorage temperature range, T
stg
65 ° C to 150 ° CLead temperature (soldering, 10 s) 300 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to ground of this device except the differential voltage of VC1-VC2, VC2-VC3, VC3-VC4, and VC4-GND.
T
A
= 25 ° C DERATING FACTOR T
A
= 70 ° C T
A
= 85 ° CPACKAGE
POWER RATING ABOVE T
A
= 25 ° C POWER RATING POWER RATING
DCT 412 mW 3.3 mW/ ° C 264 mW 214 mWPW 525 mW 4.2 mW/ ° C 336 mW 273 mW
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Product Folder Link(s): bq29410, bq29411, bq29412, bq29413 bq29414, bq29415, bq29419
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
bq29410, bq29411, bq29412, bq29413bq29414, bq29415, bq29419
www.ti.com
.................................................................................................................................................. SLUS669G AUGUST 2005 REVISED AUGUST 2008
MIN NOM MAX UNIT
V
DD
Supply voltage 4 25 VVC1, VC2, VC3, VC4 0 25V
I
Input voltage range VVCn VC (n=1), (n=1, 2, 3), VC4 GND 0 5t
d(CD)
Delay time capacitance 0.22 µ FR
IN
Voltage-monitor filter resistance 100 1k
C
IN
Voltage-monitor filter capacitance 0.01 0.1 µ FR
VD
Supply-voltage filter resistance 0 1 k
C
VD
Supply-voltage filter capacitance 0.1 µ FT
A
Operating ambient temperature range 40 110 ° C
over recommended operating free-air temperature range, T
A
= 25 ° C (unless otherwise noted)
PARAMETER TEST CONDITION MIN NOM MAX UNIT
T
A
= 25 ° C 25 35Overvoltage detectionV
(OA)
T
A
= 20 ° C to 85 ° C 25 50 mVaccuracy
T
A
= 40 ° C to 110 ° C 80bq29410 4.35bq29411 4.40bq29412 4.45OvervoltageV
(PROTECT)
bq29413 4.50 Vdetection voltage
bq29414 4.55bq29415 4.60bq29419 4.30bq29410/11/12/13/14/15 320Overvoltage detectionV
hys
mVhysteresis
bq29419 250 320 450V2, V3 , VC4 input ,V
DD
= VC1I
IN
Input current 0.3 µ AVC1 = VC2 = VC3 = VC4 = 3.5 V (see Figure 1 )Overvoltage detection delayt
D1
V
DD
= VC1, CD = 0.22 µ F 1 1.5 2 StimeI
(CD_dis)
CD GND clamp current V
DD
= VC1, CD = 1 V 5 12 µ AV
DD
= VC1,VC1 VC2 = VC2 VC3 = VC3 VC4 = VC4 GND = 3.5 V 2 3(see Figure 1 )I
CC
Supply current µ AV
DD
= VC1,VC1 VC2 = VC2 VC3 = VC3 VC4 = VC4 GND = 2.3 V 1.5 2.5(see Figure 1 )VC1 VC2 = VC2 VC3 = VC3 VC4 = VC4 GND =
7V
(PROTECT)
Max, V
DD
= 14 V, I
OH
= 0 mAV
(OUT)
OUT pin drive voltage VVC1 = VC2 = VC3 = VC4 = V
(PROTECT)
Max,
1.5 2 2.5V
DD
= 4.3 V, T
A
= 0 ° C to 70 ° C, I
OH
= 40 µAOUT = 3 V,I
OH
High-level output current VC1 VC2 = VC2 VC3 = VC3 VC4 = VC4 GND = 1 mAV
(PROTECT)
Max, V
DD
= 14 VOUT = 0.1 V, V
DD
= VC1,I
OL
Low-level output current 5 µ AVC1 VC2 = VC2 VC3 = VC3 VC4 = VC4 GND = 3.5 V
Copyright © 2005 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): bq29410, bq29411, bq29412, bq29413 bq29414, bq29415, bq29419
1
2
6
5
8
1
2
6
5
8
1
2
6
5
8
3
4
887
GNDVC4
OUT VC1
VC2
VC3
VDD
CD
GND
VC4
OUT VC1
VC2
VC3
VDD
CD
bq29410, bq29411, bq29412, bq29413bq29414, bq29415, bq29419
SLUS669G AUGUST 2005 REVISED AUGUST 2008 ..................................................................................................................................................
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Figure 1. I
CC
, I
IN
Measurement (DCT Package)
Terminal Functions
TERMINAL
DESCRIPTIONMSOP TSSOP
NAME(DCT) (PW)
8 1 VC1 Sense voltage input for most positive cell7 2 VC2 Sense voltage input for second most positive cell6 3 VC3 Sense voltage input for third most positive cell5 4 GND Ground pin4 5 VC4 Sense voltage input for least positive cell3 6 CD An external capacitor is connected to determine the programmable delay time2 7 VDD Power supply1 8 OUT Output
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Product Folder Link(s): bq29410, bq29411, bq29412, bq29413 bq29414, bq29415, bq29419
VC1
VC2
VC4
VC3
GND
VDD
OUT
CD
1.2V(TYP)
RVD
CVD
ICD =0.2 A(TYP)
CIN
RIN
RIN
RIN
RIN
CIN
CIN
CIN
C(DELAY)
OVERVOLTAGE PROTECTION
DELAY TIME CALCULATION
td+ƪ1.2 V C(DELAY)ƫ
ICD
C(DELAY) +ƪtd ICDƫ
1.2 V
bq29410, bq29411, bq29412, bq29413bq29414, bq29415, bq29419
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.................................................................................................................................................. SLUS669G AUGUST 2005 REVISED AUGUST 2008
FUNCTIONAL BLOCK DIAGRAM
When one of the cell voltages exceeds V
(PROTECT)
, an internal current source begins to charge the capacitor,C
(DELAY)
, connected to the CD pin. If the voltage at the CD pin, V
CD,
reaches 1.2 V, the OUT pin is activated andtransitions high. An externally connected NCH FET is activiated and blows the external fuse in the positivebattery rail; see the functional block diagram.
If all cell voltages fall below V
(PROTECT)
before the voltage at pin CD reaches 1.2 V, the delay time does not runout. An internal switch clamps the CD pin to GND and discharges the capacitor, C
(DELAY)
, and secures the fulldelay time for the next occurring overvoltage event.
Once the pin OUT is activated, it transitions back from high to low after all battery cells reach V
(PROTECT)
V
hys.
The delay time is calculated as follows:
Where I
(CD)
= CD current source = 0.18 µ A
Copyright © 2005 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): bq29410, bq29411, bq29412, bq29413 bq29414, bq29415, bq29419
V(PROTECT)
Cell Voltage
(VCn - VC(n-1),
VC4 - GND)
CD
OUT
1.2 V
tDELAY
V(PROTECT) - Vhys
td = (1.2 V x CDELAY)/ICD
APPLICATION INFORMATION
BATTERY CONNECTIONS
224
223
222
111
GNDVC4
OUT VC1
VC2
VC3
VDD
CD 6
5
8
GNDVC4
OUT VC1
VC2
VC3
VDD
CD 6
5
8
GNDVC4
OUT VC1
VC2
VC3
VDD
CD 6
5
8
887
1
2
6
5
8
1
2
6
5
8
1
2
6
5
8
3
4
887
GNDVC4
OUT VC1
VC2
VC3
VDD
CD
GND
VC4
OUT VC1
VC2
VC3
VDD
CD
bq29410, bq29411, bq29412, bq29413bq29414, bq29415, bq29419
SLUS669G AUGUST 2005 REVISED AUGUST 2008 ..................................................................................................................................................
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Figure 2. Timing for Overvoltage Sensing
The following diagrams show the DCT package device in different cell configurations.
Figure 3. 4-Series Cell Configuration Figure 4. 3-Series Cell Configuration(Connect together VC1 and VC2)
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Product Folder Link(s): bq29410, bq29411, bq29412, bq29413 bq29414, bq29415, bq29419
1
2
6
3
4
7
GND
VC4
OUT VC1
VC2
VC3
VDD
CD 6
5
8
7
CELL CONNECTIONS
bq29410, bq29411, bq29412, bq29413bq29414, bq29415, bq29419
www.ti.com
.................................................................................................................................................. SLUS669G AUGUST 2005 REVISED AUGUST 2008
Figure 5. 2-Series Cell Configuration
To prevent incorrect output activation, the following connection sequences must be used.
4-Series Cell ConfigurationVC1(=VDD) VC2 VC3 VC4 GND orGND VC4 VC3 VC2 VC1(=VDD)
3-Series Cell ConfigurationVC1(=VC2=VDD) VC3 VC4 GND orGND VC4 VC3 VC1(=VC2=VDD)
2-Series Cell ConfigurationVC1(=VC2=VC3=VDD) VC4 GND orGND VC4 VC1(=VC2=VC3=VDD)
Copyright © 2005 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): bq29410, bq29411, bq29412, bq29413 bq29414, bq29415, bq29419
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ29410DCT3R SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29410DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29410DCTT SM8 DCT 8 250 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29410PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29410PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29411DCT3R SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29411DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29411DCTT SM8 DCT 8 250 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29411PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29411PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29412DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29412DCTT SM8 DCT 8 250 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29412PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29412PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29413DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29413DCTT SM8 DCT 8 250 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29413PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29414DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ29414DCTT SM8 DCT 8 250 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29414PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29415DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29415DCTT SM8 DCT 8 250 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
BQ29415PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
BQ29419PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ29410DCT3R SM8 DCT 8 3000 182.0 182.0 20.0
BQ29410DCTR SM8 DCT 8 3000 182.0 182.0 20.0
BQ29410DCTT SM8 DCT 8 250 182.0 182.0 20.0
BQ29410PWR TSSOP PW 8 2000 367.0 367.0 35.0
BQ29410PWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
BQ29411DCT3R SM8 DCT 8 3000 182.0 182.0 20.0
BQ29411DCTR SM8 DCT 8 3000 182.0 182.0 20.0
BQ29411DCTT SM8 DCT 8 250 182.0 182.0 20.0
BQ29411PWR TSSOP PW 8 2000 367.0 367.0 35.0
BQ29411PWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
BQ29412DCTR SM8 DCT 8 3000 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ29412DCTT SM8 DCT 8 250 182.0 182.0 20.0
BQ29412PWR TSSOP PW 8 2000 367.0 367.0 35.0
BQ29412PWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
BQ29413DCTR SM8 DCT 8 3000 182.0 182.0 20.0
BQ29413DCTT SM8 DCT 8 250 182.0 182.0 20.0
BQ29413PWR TSSOP PW 8 2000 367.0 367.0 35.0
BQ29414DCTR SM8 DCT 8 3000 182.0 182.0 20.0
BQ29414DCTT SM8 DCT 8 250 182.0 182.0 20.0
BQ29414PWR TSSOP PW 8 2000 367.0 367.0 35.0
BQ29415DCTR SM8 DCT 8 3000 182.0 182.0 20.0
BQ29415DCTT SM8 DCT 8 250 182.0 182.0 20.0
BQ29415PWR TSSOP PW 8 2000 367.0 367.0 35.0
BQ29419PWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 3
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
0,60
0,20
0,25
0°– 8°
0,15 NOM
Gage Plane
4188781/C 09/02
4,25
5
0,30
0,15
2,90 3,75
2,70
8
4
3,15
2,75
1
0,10
0,00
1,30 MAX
Seating Plane
0,10
M
0,13
0,65
PIN 1
INDEX AREA
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
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