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LP2992
SNVS171J –NOVEMBER 2001–REVISED JANUARY 2017
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Product Folder Links: LP2992
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 7
7 Detailed Description............................................ 13
7.1 Overview................................................................. 13
7.2 Functional Block Diagram....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 14
8 Application and Implementation ........................ 15
8.1 Application Information............................................ 15
8.2 Typical Application ................................................. 15
9 Power Supply Recommendations...................... 20
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Examples................................................... 21
10.3 WSON Mounting................................................... 21
11 Device and Documentation Support................. 22
11.1 Documentation Support ........................................ 22
11.2 Receiving Notification of Documentation Updates 22
11.3 Community Resources.......................................... 22
11.4 Trademarks........................................................... 22
11.5 Electrostatic Discharge Caution............................ 22
11.6 Glossary................................................................ 22
12 Mechanical, Packaging, and Orderable
Information........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (November 2015) to Revision J Page
• Deleted specific values from capacitors in Simplified Schematic drawing ............................................................................ 1
• Added Receiving Notification of Documentation Updates ................................................................................................... 22
Changes from Revision H (January 2015) to Revision I Page
• Added top navigator icon for TI Design ................................................................................................................................. 1
• Changed "174.2°C/W" to "169.7°C/W" in footnote 3 to Abs Max table. ................................................................................ 4
• Changed ESD Ratings table to differentiate different values for different pins/packages. .................................................... 4
• Added new footnotes 2 and 3 to Thermal Information table; update thermal values for DBV (SOT-23) package................ 5
• Added Power Dissipation and Estimating Junction Temperature subsections ................................................................... 18
• Added additional related document links ............................................................................................................................. 22
Changes from Revision G (March 2013) to Revision H Page
• Added Device Information and ESD Ratings tables, Pin Configuration and Functions,Feature Description ,Device
Functional Modes,Application and Implementation,Power Supply Recommendations,Layout ,Device and
Documentation Support , and Mechanical, Packaging, and Orderable Information sections; update Thermal Values
and pin names........................................................................................................................................................................ 1
Changes from Revision F (March 2013) to Revision G Page
• Changed Changed layout of National Semiconductor data sheet to TI format ..................................................................... 1