Datasheet Middle Power Class-D Speaker Amplifier Series 17W+17W Class D Speaker Amplifier for Digital Input BD28623MUV General Description BD28623MUV is a Class D Speaker Amplifier designed for Flat-panel TVs in particular for space-saving and low-power consumption. This IC delivers an output power of 20W+20W. This IC employs state-of-the-art Bipolar, CMOS, and DMOS (BCD) process technology. With this technology, the IC can achieve high efficiency. In addition, the IC is packaged in a compact back-surface heat-sink type power package to achieve low power consumption and low heat generation and to eliminate need for external heat-sink. With this package, total output power is only 34W as compared to 40W total output power of package with external heat-sink This product satisfies all needs for drastic downsizing, low-profile structures and powerful high quality playback of sound systems. Key Specifications Supply Voltage: 8.5V to 24V Speaker Output Power: 17W+17W (Typ) (VCC=18V, RL=8, Gain=26dB) Total Harmonic Distortion: 0.08% (Typ) @PO=1W (VCC=12V, RL=8, Gain=20dB) Crosstalk: 90dB (Typ) PSRR: 60dB (Typ) Output Noise Voltage: 150Vrms (Typ) Standby Current: 33A (Typ) Operating Temperature Range: -25C to +85C Package W(Typ) x D(Typ) x H(Max) 4.00mm x 4.00mm x 1.00mm VQFN024V4040 Features BSP2N MCLK OUT2N BCLK LRCLK BSP2P OUT2P SDATA BSP1N OUT1N OUT1P BSP1P SP ch2 (Rch) ERROR Flat Panel TVs (LCD, Plasma) Home Audio (Sound Bar) Amusement Equipment Electronic Music Equipment Desktop PC, etc. SP ch1 (Lch) GAIN - Typical Application Circuit MUTE Applications VQFN024V4040 RSTX 1 Digital Audio Interface 2 I S format SDATA: 16 / 20 / 24bit LRCLK (fS): 32 kHz/ 44.1kHz / 48kHz BCLK: 64fS (fixed) MCLK: 256fS / 512fS Automatic Identification) Low supply current at RESET mode. Slew rate controller ; No need snubber circuit (Vcc22V) Output Feedback Circuitry which prevents decrease of sound quality caused by change of power supply voltage, achieves low noise and low distortion, So the large electrolytic-capacitors for Vcc bypass is able to be eliminated. Variable Gain (17dB / 20dB / 26dB) Wide power supply voltage range (8.5V to 24V) High efficiency, low heat Pop noise prevention at power supply on / off Soft Muting Technology High reliability design by built-in protection circuits - Overheat protection - Under voltage protection - Output short protection - Output DC voltage protection - Clock stop protection (MCLK, BCLK, LRCLK) Small package (VQFN024V4040) Digital Audio Source Figure 1. Typical Application Circuit Product structureSilicon monolithic integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0C1C0E900290-1-2 (c) 2015 ROHM Co., Ltd. All rights reserved. 1/49 TSZ2211114001 20.May.2016 Rev.002 BD28623MUV Pin Configuration 16 15 14 13 24 1 2 3 4 5 6 MCLK SDATA BCLK LRCLK GAIN RSTX 12 17 BSP1N 11 18 23 ERROR OUT1N 22 OUT2N VCCA 21 BSP2N GNDA GNDP1 10 20 GNDP2 REGD VCCP1 9 19 VCCP2 REGG BSP1P 8 OUT2P BSP2P OUT1P 7 (TOP VIEW) MUTEX Figure 2. Pin Configuration www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Pin Descriptions, I/O Equivalent Circuits (Provided pin voltages are typical values) Pin No. 1 2 3 4 7 Pin Name MCLK SDATA BCLK LRCLK Pin Voltage 0V MUTEX Pin Descriptions Digital sound signal input pin Internal Equivalent Circuit 14 1,2,3,4,7 Speaker output mute control pin 100k H: Mute OFF L: Mute ON 15 Gain setting pin 3k 5 5 PLIMT 33k 0V 15 Reset pin 14 H: Reset OFF L: Reset ON 6 RSTX 0V 6 57k 43k 15 8 OUT1P VCC to 0V Output pin of Ch1 positive PWM signal Please connect to output LPF. *If this pin is shorted to GND, the IC may be broken. 9 BSP1P - 10 VCCP1 - 11 GNDP1 0V 12 BSP1N - 13 OUT1N VCC to 0V 10 Boot-strap pin of Ch1 positive PWM signal Please connect a capacitor to OUT1P. Power supply pin for Ch1 PWM signal Please connect a capacitor. 17 12 9 GND pin for Ch1 PWM signal 13 8 Boot-strap pin of Ch1 negative PWM signal Please connect a capacitor to OUT1N. Output pin of Ch1 negative PWM signal Please connect to output LPF. 11 *If this pin is shorted to GND, the IC may be broken. 14 VCCA VCC 15 GNDA 0V Power supply pin for Analog signal Please connect a capacitor to GND. GND pin for Analog signal Internal power supply pin for Digital circuit Please connect a capacitor to GND. 16 REGD 5.0V 14 *The REGD terminal of BD28623MUV should not be used as external supply. Therefore, don't connect anything except for the capacitor for stabilization. 16 500K 15 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Pin Descriptions, I/O Equivalent Circuits - continued (Provided pin voltages are typical values) Pin No. 17 Pin Name REGG Pin Voltage 5.7V Internal Equivalent Circuit Pint Descriptions Internal power supply pin for Gate driver Please connect a capacitor to GND. 14 *The REGG terminal of BD28623MUV should not be used as external supply. Therefore, don't connect anything except for the capacitor for stabilization. 17 500k 15 18 19 BSP2P OUT2P - VCC to 0V Boot-strap pin of Ch2 positive PWM signal Please connect a capacitor to OUT2P. 20 Output pin of Ch2 positive PWM signal Please connect to output LPF. 17 18 22 *If this pin is shorted to GND, the IC may be broken. 20 VCCP2 VCC GNDP2 0V 22 BSP2N - 23 OUT2N VCC to 0V 21 Power supply pin for Ch2 PWM signal Please connect a capacitor to GND. GND pin for Ch2 PWM signal 19 23 Boot-strap pin of Ch2 negative PWM signal Please connect a capacitor to OUT2N. Output pin of Ch2 negative PWM signal Please connect to output LPF. 21 *If this pin is shorted to GND, the IC may be broken. Error flag pin Please connect pull-up resistor. 24 ERROR - 500 H: Normal L: Error 24 *An error flag is outputted when Output Short Protection, DC Voltage Protection in the speaker, and High Temperature Protection are operated. This flag shows IC condition during operation. 15 The numerical value of internal equivalent circuit is typical value, not guaranteed value. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 13 21 BSP2N 22 OUT2N Output Short Protection Output DC Voltage Protection High Temperature Protection Driver FET 2P Driver FET 1N Under Voltage Protection Clock Stop Protection 23 feedback Driver FET 2N PWM Modulator feedback Driver FET 1P x4 Over Sampling Digital Filter 24 I2S I/F Control I/F 1 2 3 4 5 6 MCLK SDATA BCLK LRCLK GAIN RSTX 12 OUT1N 14 BSP1N 11 VCCA 15 GNDP1 10 GNDA 16 VCCP1 9 GNDP2 ERROR REGD 17 BSP1P 8 20 VCCP2 REGG 18 19 OUT2P BSP2P OUT1P 7 Block Diagram MUTEX Figure 3. Block Diagram www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Absolute Maximum Ratings Parameter (Note 1) (Note 2) Supply Voltage Symbol VCCMAX Power Dissipation Pd (Note 1) Input Voltage1 Limit -0.3 to +30 2.21 (Note 3) 3.56 (Note 4) Unit V Conditions Pin10, 14, 20 W Please refer to Power Dissipation for details. VIN1 -0.3 to +3.7 V Pin1-7 Terminal Voltage 1 (Note 1) VPIN1 -0.3 to +7 V Pin16, 17 Terminal Voltage 2 (Note 1) (Note 5-1) VPIN2 -0.3 to +VCC V Pin8, 13, 19, 23 Terminal Voltage 3 (Note 1) (Note 5-2) VPIN3 -0.3 to OUTxx+7 V Pin9, 12, 18, 22 VERR -0.3 to +VCCMAX V Pin24 Open-drain Terminal Voltage (Note 1) Operating Temperature Range Topr -25 to +85 C Storage Temperature Range Tstg -55 to +150 C Tjmax +150 C Maximum Junction Temperature (Note 1) Voltage that can be applied with reference to GND (Pin11, 15, 21). (Note 2) Pd and Tjmax=150C must not be exceeded. (Note 3) 74.2mmx74.2mmx1.6mm, FR4, 4-layer glass epoxy board (Top and bottom layer back copper foil size: 20.2mm2, 2nd and 3rd layer back copper foil size: 5505mm2) Derate by 17.7mW/C when operating above Ta=25C. The board is provided with thermal via. (Note 4 74.2mmx74.2mmx1.6mm, FR4, 4-layer glass epoxy board (Top and bottom layer back copper foil size: 5505mm2) Derate by 28.5mW/C when operating above Ta=25C. The board is provided with thermal via. (Note 5-1) The chip should be used within AC peak limits at all conditions. Overshoot should be 30V with reference to GND. Undershoot should be 10nsec and 30V with reference to VCC. (Please refer to figure 4-1.) (Note 5-2) The chip should be used within AC peak limits at all conditions. Overshoot should be OUTxx+7V with reference to OUTxx. Undershoot should be 10nsec and OUTxx+7V with reference to OUTxx. (Please refer to figure 4-2.) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Overshoot to OUTxx 7V (Max.) Vcc Overshoot to GND 30V (Max.) Undershoot to Vcc 30V(Max.) BSPxx GND Undershoot to OUTxx 7V(Max.) OUTxx 10nsec 10nsec Figure 4-1 Figure 4-2 Recommended Operating Conditions Parameter (Note 1) (Note 2) Supply Voltage Minimum Load Impedance Symbol VCC (Note 6) RL Limit 8.5 to 24 6.4 4.8 3.6 Unit V Conditions Pin10, 14, 20 21V < VCC 24V 14V < VCC 21V VCC 14V (Note 6) Pd should not be exceeded. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Electrical Characteristics (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=8, RSTX=3.3V, MUTEX=3.3V, Gain= 20dB, fS=48kHz, MCLK=256fS, Output LC filter: L=10H, C=0.68F, Without Snubber circuit) Parameter Symbol Limit Min Typ Max Unit Conditions Total Circuit Circuit Current (Reset Mode) ICC1 - 33 200 A No load, RSTX=0V, MUTEX=0V Circuit Current (Mute Mode) ICC2 - 15 25 mA No load, RSTX=3.3V, MUTEX=0V Circuit Current (Active Mode) ICC3 - 40 80 mA No load, RSTX=3.3V, MUTEX=3.3V Open-drain Terminal Low Level Voltage Regulator Output Voltage 1 VERR - - 0.8 V IO=0.5mA VREGG 4.6 5.7 6.5 V RSTX=3.3V, MUTEX=3.3V Regulator Output Voltage 2 VREGD 4.2 5.0 5.7 V RSTX=3.3V, MUTEX=3.3V High level Input Voltage 1 VIH1 2.2 - 3.3 V Pin1-4,6-7 Low level Input Voltage 1 VIL1 0 - 0.8 V Pin1-4,6-7 High level Input Voltage 2 VIH2 2.6 - 3.3 V Pin5 Low level Input Voltage 2 VIL2 0 - 0.45 V Pin5 IIH 27.5 33 42 A VIN = 3.3V, Pin1-4,6-7 IIH2 65 100 135 A VIN = 3.3V, Pin5 PO1 - 15 - W PO2 10 12.5 - W PO3 5 6.3 - W GV26 25 26 27 dB GV20 19 20 21 dB GV17 16 17 18 dB THD1 - 0.08 - % CT 60 90 - dB PSRR - 60 - dB VNO - 150 250 Vrms - 512 - kHz GAIN=L VCC=12V, PO=1W BW=20 to 20kHz (AES17) GAIN=20dB, With snubber circuit PO=1W, 1kHz BPF, GAIN=20dB Vripple=1Vrms, f=1kHz, GAIN=20dB Input=-dBFS, BW=IHF-A, GAIN=20dB fS=32kHz - 705.6 - kHz fS=44.1kHz - 768 - kHz fS=48kHz Input Current1 (Input Pull-down Terminal) ]Input Current2 (Input Pull-down Terminal) Speaker Parts Maximum Output Power 1 (Note 7) Maximum Output Power 2 (Note 7) Maximum Output Power 3 (Note 7) Voltage Gain1 (Note 7) Voltage Gain2 (Note 7) Voltage Gain3 (Note 7) Total Harmonic Distortion1 Crosstalk PSRR (Note 7) (Note 7) (Note 7) Output Noise Voltage (Note 7) PWM (Pulse Width Modulation) Frequency fPWM VCC=16V, THD+N=10%, GAIN=26dB VCC=16V, THD+N<10%, GAIN=20dB VCC=16V, THD+N<10%, GAIN=17dB PO=1W, GAIN=H PO=1W , GAIN=Pull up(47k) PO=1W, (Note 7) The rated values of items above indicate average performances of the device, which largely depend on circuit layouts, components, and power supplies. The reference values are those applicable to the device and components directly installed on a board specified by ROHM during testing. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves (1/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=8, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=26dB, ROHM 4-layer Board) 80 60 RL=No load No signal "RESET" 60 RESET 40 ACTIVE 50 ICC [mA] Circuit Current : ICC [A] 50 RL=No load No signal "MUTE" "ACTIVE" 70 30 40 30 20 MUTE 20 w 10 10 0 6 8 10 12 14 16 18 20 22 Supply Voltage : VCC [V] 24 0 26 8 10 Figure 5. Circuit Current vs Supply Voltage (RESET) 14 16 18 VCC [V] 20 22 24 26 Figure 6. Circuit Current vs Supply Voltage (MUTE, ACTIVE) 3.0 100 GAIN=H 90 GAIN=H RL=8 2.5 80 RL=6 RL=6 70 2.0 RL=8 60 ICC [A] Efficiency [%] 12 50 40 1.5 1.0 30 20 0.5 10 0.0 0 0 5 10 15 0 20 Figure 7. Efficiency vs Output Power (8, 6) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10 15 20 Output Power [W/ch] Output Power [W/ch] 5 Figure 8. Circuit Current vs Output Power (8, 6) Dotted line means power dissipation is exceeded. 8/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (2/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=8, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=20dB, ROHM 4-layer Board) 100 3.5 GAIN=H VCC=12V 90 3.0 80 70 2.5 RL=4 RL=4 60 ICC [A] Efficiency [%] GAIN=H VCC=12V 50 40 30 2.0 1.5 1.0 20 0.5 10 0 0.0 0 5 10 15 20 0 Output Power [W/ch] 5 10 15 20 Output Power [W/ch] Figure 9. Efficiency vs Output Power (4) Figure 10. Circuit Current vs Output Power (4) Speaker output Speaker output MUTEX MUTEX Figure 11. Waveform of Soft Start www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 12. Waveform of Soft Mute 9/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (3/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=8, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=26dB, ROHM 4-layer Board) 35 3 GAIN=H RL=8 25 GAIN=H RL=8 2.5 THD+N=10% 20 15 THD+N=1% VCC=12V 1.5 VCC=24V 1 10 0.5 5 0 0 6 8 10 12 14 16 18 20 22 24 0 26 5 10 15 20 25 Output Power [W/ch] Supply Voltage : VCC [V] Figure 13. Output Power vs Supply Voltage (8) Figure 14. Circuit Current vs Output Power (8) 35 3 GAIN=H RL=6 30 25 GAIN=H RL=6 2.5 THD+N=10% 2 20 ICC [A] Output Power [W/ch] VCC=18V 2 ICC [A] Output Power [W/ch] 30 THD+N=1% 15 VCC=12V VCC=18V 1.5 1 10 0.5 5 0 0 6 8 10 12 14 16 18 20 22 24 26 0 Supply Voltage : VCC [V] www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10 15 20 25 Output Power [W/ch] Figure 15. Output Power vs Supply Voltage (6) 5 Figure 16. Circuit Current vs Output Power (6) Dotted line means power dissipation is exceeded. 10/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (4/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=8, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=20dB, ROHM 4-layer Board) 35 4 GAIN=H RL=4 GAIN=H RL=4 3.5 3 25 VCC=12V THD+N=10% 2.5 20 ICC [A] Output Power [W/ch] 30 15 VCC=14V 2 1.5 THD+N=1% 10 1 5 0.5 0 0 6 8 10 12 14 16 18 20 22 24 0 26 5 Supply Voltage : VCC [V] Figure 17. Output Power vs Supply Voltage (4) 15 20 Figure 18. Circuit Current vs Output Power (4) 35 3 GAIN=H RL=4.8 30 GAIN=H RL=4.8 2.5 25 2 THD+N=10% 20 ICC [A] Output Power [W/ch] 10 Output Power [W/ch] 15 THD+N=1% VCC=12V VCC=18V 1.5 1 10 0.5 5 0 0 6 8 10 12 14 16 18 20 22 24 0 26 Figure 19. Output Power vs Supply Voltage (4.8) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10 15 20 Output Power [W/ch] Supply Voltage : VCC [V] 5 Figure 20. Circuit Current vs Output Power (4.8) Dotted line means power dissipation is exceeded. 11/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (5/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=8, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=20dB, ROHM 4-layer Board) 0 30 OUT1 OUT2 -20 25 Voltage Gain [dB] -40 Noise FFT [dBV] Po=1W RL=8 OUT1 OUT2 No Signal RL=8 -60 -80 -100 20 15 -120 -140 10 10 100 1k 10k 100k 10 100 1k Frequency [Hz] 10k 100k Frequency [Hz] Figure 22. Voltage Gain vs Frequency (8) Figure 21. FFT of output noise voltage (8) 10 10 f=1kHz f=100Hz f=6kHz OUT1 OUT2 BW 20 to 20kHz AES17 RL=8 BW 20 to 20kHz AES17 RL=8 1 1 THD+N [%] THD+N [%] f=6kHz f=1kHz OUT1 0.1 0.1 f=100Hz OUT2 0.01 0.01 0.01 0.1 1 10 10 100 1k 10k 100k Frequency [Hz] Output Power [W/ch] Figure 24. THD+N vs Frequency (8) Figure 23. THD+N vs Output Power (8) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100 12/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (6/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL= 8/6, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=20dB, ROHM 4-layer Board) 0 0 OUT1 OUT2 RL=8 -40 OUT2 -60 -80 -100 OUT1 OUT2 -20 Crosstalk [dB] Crosstalk [dB] -20 RL=8 -40 -60 OUT1 -80 -100 OUT1 OUT2 -120 0.01 -120 0.1 1 10 10 100 100 Output Power [W/ch] Figure 25. Crosstalk vs Output Power (8) 10k 100k Figure 26. Crosstalk vs Frequency (8) 0 30 OUT1 OUT2 -20 OUT1 OUT2 No Signal RL=6 PO=1W RL=6 25 Voltage Gain [dB] -40 Noise FFT [dBV] 1k Frequency [Hz] -60 -80 -100 20 15 -120 -140 10 10 100 1k 10k 100k Frequency [Hz] 100 1k 10k 100k Frequency [Hz] Figure 27. FFT of output noise voltage (6) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10 Figure 28. Voltage Gain vs Frequency (6) 13/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (7/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=6, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=20dB, ROHM 4-layer Board) 10 10 f=1kHz f=100Hz f=6kHz BW 20 to 20kHz AES17 RL=6 1 OUT1 OUT2 1 THD+N [%] f=6kHz THD+N [%] BW 20 to 20kHz AES17 RL=6 f=1kHz OUT1 0.1 0.1 f=100Hz OUT2 0.01 0.01 0.01 0.1 1 10 10 100 100 Figure 29. THD+N vs Output Power (6) 0 OUT1 OUT2 RL=6 -40 -60 -80 OUT1 RL=6 OUT1 OUT2 -20 Crosstalk [dB] Crosstalk [dB] 100k Figure 30. THD+N vs Frequency (6) 0 -40 -60 OUT1 -80 -100 -100 OUT2 -120 0.01 10k Frequency [Hz] Output Power [W/ch] -20 1k OUT2 -120 0.1 1 10 10 100 Figure 31. Crosstalk vs Output Power (6) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100 1k 10k 100k Freq [Hz] Output Power [W/ch] Figure 32. Crosstalk vs Frequency (6) 14/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (8/11) (Unless otherwise specified, Ta=25C, VCC=12V, f=1kHz, RL=4, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=20dB, ROHM 4-layer Board) 0 30 -20 OUT1 OUT2 25 Voltage Gain [dB] Noise FFT [dBV] -40 PO=1W RL=4 VCC=12V OUT1 OUT2 No Signal RL=4 VCC=12V -60 -80 -100 20 15 -120 -140 10 10 100 1k 10k 100k 10 100 1k Frequency [Hz] 100k Frequency [Hz] Figure 33. FFT of output noise voltage (4) Figure 34. Voltage Gain vs Frequency (4) 10 10 BW 20 to 20kHz AES17 RL=4 VCC=12V OUT1 OUT2 f=6kHz BW 20 to 20kHz AES17 RL=4 VCC=12V 1 THD+N [%] 1 THD+N [%] 10k f=1kHz 0.1 OUT1 0.1 f=1kHz f=100Hz f=6kHz 0.01 0.01 0.1 f=100Hz 1 10 OUT2 100 Output Power [W/ch] 10 100 1k 10k 100k Frequency [Hz] Figure 35. THD+N vs Output Power (4) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0.01 Figure 36. THD+N vs Frequency (4) 15/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (9/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL= 4/4.8, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=20dB, ROHM 4-layer Board) 0 0 OUT1 OUT2 -40 -60 -80 OUT1 OUT2 -20 RL=4 VCC=12V -60 OUT1 -80 OUT1 -100 -100 OUT2 OUT2 -120 0.01 -120 0.1 1 10 10 100 100 1k 10k 100k Frequency [Hz] Output Power [W/ch] Figure 37. Crosstalk vs Output Power (4) Figure 38. Crosstalk vs Frequency (4) 0 30 OUT1 OUT2 -20 OUT1 OUT2 No Signal RL=4.8 PO=1W RL=4.8 25 Voltage Gain [dB] -40 Noise FFT [dBV] RL=4 VCC=12V -40 Crosstalk [dB] Crosstalk [dB] -20 -60 -80 -100 20 15 -120 -140 10 10 100 1k 10k 100k Frequency [Hz] 100 1k 10k 100k Frequency [Hz] Figure 39. FFT of output noise voltage (4.8) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10 Figure 40. Voltage Gain vs Frequency (4.8) 16/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (10/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=4.8, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, Gain=20dB, ROHM 4-layer Board) 10 f=1kHz f=100Hz f=6kHz 1 10 BW 20 to 20kHz AES17 RL=4.8 OUT1 OUT2 1 THD+N [%] THD+N [%] f=6kHz f=1kHz 0.1 BW 20 to 20kHz AES17 RL=4.8 OUT2 0.1 f=100Hz OUT1 0.01 0.01 0.01 0.1 1 10 100 10 100 Output Power [W/ch] 0 -20 RL=4.8 OUT1 OUT2 -40 -60 Crosstalk [dB] Crosstalk [dB] 100k Figure 42. THD+N vs Frequency (4.8) 0 OUT1 -80 RL=4.8 OUT1 OUT2 -40 -60 OUT1 -80 -100 -100 OUT2 OUT2 -120 0.01 10k Frequency [Hz] Figure 41. THD+N vs Output Power (4.8) -20 1k -120 0.1 1 10 100 Figure 43. Crosstalk vs Output Power (4.8) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10 100 1k 10k 100k Frequency [Hz] Output Power [W/ch] Figure 44. Crosstalk vs Frequency (4.8) 17/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Typical Performance Curves - continued (11/11) (Unless otherwise specified, Ta=25C, VCC=18V, f=1kHz, RL=8/6, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS, ROHM 4-layer Board) 30 26dB RL=8 BW 20 to 20kHz AES17 THD+N<1% 25 20 20dB 15 10 17dB 5 Maximum Output Power [W/ch] Maximum Output Power [W/ch] 30 RL=6 BW 20 to 20kHz AES17 THD+N<1% 25 20 26dB 20dB 15 17dB 10 5 0 0 6 8 6 10 12 14 16 18 20 22 24 26 Figure 45. Supply Voltage vs Maximum Output Power (8) PC 8 10 12 14 16 18 20 22 24 26 Supply Voltage : VCC [V] Supply Voltage : VCC [V] Figure 46. Supply Voltage vs Maximum Output Power (6) Power Supply Audio Precision Ammeter I2S INPUT AP AUX-0025 (passive filter) LC filter BD28623MUV Voltmeter OUTPUT Dummy Resister (RL= 4, 6 or 8 ) Figure 47. Audio Characteristics Measurement Environment www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Dotted line means power dissipation is exceeded. 18/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Timing Chart 1. Power Supply Start-up Sequence Power up VCCA, VCCP1, VCCP2 simultaneously. VCCA VCCP1 VCCP2 t RSTX Set RSTX to High after power up. t REGG REGD REGG REGD t MCLK SDATA BCLK LRCLK Digital audio data communication. t MUTEX After RSTX=LH wait more than TWAIT to MUTEX=LH More than TWAIT t Soft-start 21.5msec(fS=48kHz) Speaker Output t Figure 48. Power Supply Start-up Sequence Caution: To eliminate pop noise when power supply is turned ON, RSTX and MUTEX should always be set Low. And also, all power supply terminals should start up together. Order of and can be interchange BSP Capacitor Value (C9, C12, C19, C22) 3.3F Min 300 4.7F 400 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Limit of TWAIT Typ Max - - 19/49 Unit msec msec TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 2. Power Supply Shutdown Sequence Power down VCCA, VCCP1, VCCP2, simultaneously. VCCA VCCP1 VCCP2 t REGG REGD REGG REGD t Set RSTX to Low RSTX t After stopping speaker output, Turn off the transmission of digital audio signal. MCLK SDATA BCLK LRCLK t MUTEX Set MUTEX to Low t Soft-mute 21.5msec(fS=48kHz) Speaker Output t Figure 49. Power Supply Shutdown Sequence Caution: To eliminate pop noise when power supply is turned OFF, RSTX and MUTEX should always be set Low first. And also, all power supply terminals should shut down together. Order of and can be interchanged www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 3. About Changing Audio Signal Output PWM frequency is sixteen times the sampling frequency "fS". Therefore, output PWM frequency will also become unstable if MCLK becomes unstable when switching channel or switching input. During unstable period, LC resonance may occur and short protection function may work. MCLKunstableperiod MCLK AUDIODATA MUTEX OUTX ERROR Figure 50. Action at MCLK Unstable 1 To prevent "MCLK unstable condition", please obey the following process. (1) Mute "AUDIODATA" from scaler IC. (A) (2) After muting "AUDIODATA" (B), set MUTEX=L (C). (3) After MCLK goes to stable state, set MUTEX=H (D). (4) Release mute "AUDIODATA" (E). MCLK unstable period MCLK AUDIODATA Soft-Mute 21.5msec(fs=48kHz.) Soft-start 21.5msec(fs=48kHz.) MUTEX OUTX PWM STOP A B C D E F Order of E and F can be interchanged Figure 51. Action at MCLK Unstable 2 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Especially, if the "twice and more frequency compared with normality" is entered, for some timing, the incorrect data is set to the IC's internal resistor and it generates noises continuously. In case the "twice and more frequency compared with normality" is entered, please follow the timing chart bellow and add a reset sequence. (Please release reset after MCLK (BCLK) becomes stable, then release mute of BD28623MUV.) MCLK(BCLK) unstable period (Twice and more frequency compared with normality.) MCLK (BCLK) AUDIODATA Soft-Mute 21.5msec(fs=48kHz.) Soft-start 21.5msec(fs=48kHz.) MUTEX More than TWAIT* RESETX OUTX PWM STOP A B C D E F G Order of F and G can be interchanged *TWAIT: Refer to P.19 Figure 52. Action at MCLK Unstable 3 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 22/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 4. Recovery Sequence from the Instantaneous Power Supply Interruption VCCA VCCP1 VCCP2 Instantaneous power interruotion occurs. Power recovery VCC under 7V =>UVLO Function ON (Stop speaker out) t REGG REGD t RSTX t MCLK BCLK LRCLK SDATA Degital audio data communication t Please set MUTEX "L" and stop digital audio data. MUTEX Please set MUTEX "H" Wait over TWAIT* t Soft Start 21.5msec(fs=48kHz) Speaker Output t Figure 53. Instantaneous Power Interruption Recovery Sequence *TWAIT: Refer to P.19 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Application Information 1. About digital audio input (1) Input digital audio signal sampling frequency (fS) PWM frequency, Soft-start time, Soft-mute time, and the detection time of the DC voltage protection in the speaker depend on the sampling frequency (fS) of the digital audio input. Sampling Frequency of the Digital Audio Input (fS) 32kHz PWM Frequency (fPWM) 512kHz 44.1kHz 48kHz (2) 32msec DC Voltage Protection in the Speaker Detection Time 1.02sec 705.6kHz 23msec 0.74sec 768kHz 21.5msec 0.68sec Soft-start / Soft-mute Time Format of digital audio input MCLK: System Clock input signal It will input LRCLK, BCLK, SDATA that synchronizes with this clock. MCLK frequency is 256 times the sampling frequency (256fS) or 512 times the sampling frequency (512fS). LRCLK: L/R Clock input signal It corresponds to 32kHz/44.1kHz/48kHz clock (fS) which are same to the sampling frequency (fS). The audio data of left and right channel for one sample is input to this section. BCLK: Bit Clock input signal It is used to latch data per bit using 64 times the sampling frequency (64fS). SDATA: Data input signal It is amplitude data. The data length is different according to the resolution of the input digital audio data. It corresponds to 16/ 20/ 24 bits. 2 (3) I S Data Format LRCLK 1/64fs Lch Rch BCLK SDATA MSB 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 MSB 22 21 20 19 18 17 16 15 14 13 12 11 10 1 LSB 32 clocks 9 8 7 6 5 4 3 2 1 LSB 32 clocks Figure 54. I2S Data Format 64fs, 24bit Data LRCLK Lch Rch BCLK SDATA MSB 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 MSB 18 17 16 15 14 13 12 11 10 1 LSB 9 8 7 6 5 4 3 2 1 LSB Figure 55. I2S Data Format 64fs, 20bit Data LRCLK Lch Rch BCLK SDATA MSB 14 13 12 11 10 9 8 7 6 5 4 3 2 MSB 14 13 12 11 10 1 LSB 9 8 7 6 5 4 3 2 1 LSB Figure 56. I2S Data Format 64fs, 16bit Data The Low section of LRCLK becomes Lch and the High section of LRCLK becomes Rch. After changing LRCLK, second bit becomes MSB. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (4) Audio Interface Format and Timing Recommended timing and operating condition (MCLK, BCLK, LRCLK and SDATA) 1/ / MCLK MCLK 1/fLRCLK LRCLK 1/fBCLK BCLK Figure 57. Clock Timing LRCLK tSU;LR tSU;LR ttHD;LR HD;LR BCLK ; SD tSU tSU;SD ; SD tHD tHD;SD SDATA Figure 58. Audio Interface Timing Limit No. Parameter (Note 8-1) 1 MCLK Frequency 2 LRCLK Frequency 3 BCLK Frequency 4 5 6 7 8 9 10 (Note 8-1) (Note 8-1) (Note 8-2) Setup Time, LRCLK (Note 8-2) Hold Time, LRCLK Setup Time, SDATA Hold Time, SDATA MCLK, DUTY LRCLK, DUTY BCLK, DUTY Symbol fMCLK fLRCLK fBCLK tSU;LR tHD;LR tSU;SD tHD;SD dMCLK dLRCLK dBCLK MCLK=256fS Min Max 8.192 12.288 10% 10% 32 48 10% 10% 2.048 3.072 10% 10% 20 20 20 20 40 60 40 60 40 60 MCLK=512fS Min Max 16.384 24.576 10% 10% 32 48 10% 10% 2.048 3.072 10% 10% 20 20 20 20 40 60 40 60 40 60 Unit MHz kHz MHz ns ns ns ns % % % (Note 8-1) Must be synchronized with BCLK, LRCK (Note 8-2) This regulation is to keep rising edge of LRCK and rising edge of BCLK from overlapping. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 25/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 1. Terminal Setting 1) RSTX Pin, MUTEX Pin Function Condition Normal PWM Outputs (OUT1P, 1N, 2P, 2N) (Note 10) High-Z_Low (Reset mode) Error Detection PWM Outputs ERROR (OUT1P, 1N, 2P, 2N) High-Z_Low H (Reset mode) RSTX MUTEX L L/H "MUTE" H L High-Z_Low (MUTE_ON) H High-Z_Low (MUTE_ON) L "ACTIVE" H H Active (MUTE_OFF) H High-Z_Low (MUTE_ON) L "RESET" (Note 9) (Note 10) (Note 9) ERROR H 2 If RSTX is set Low, internal registers (I S / I/F part, x8 over sampling digital filter part, latch circuit when detecting ERROR) are initialized. This means that all power transistors are OFF and output terminals are pulled down by 40k (Typ). www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 26/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 2) GAIN Pin Function GAIN terminal sets the gain. Gain setting limits maximum output power. GAIN setting depends on the value of speaker load, because maximum output power depends on speaker load. Please set GAIN after setting MUTE to L. Pop noise may be occur if GAIN is set while MUTE=H. GAIN L Pull-up (3.3V) to 47k (1/16W, J (5%)) H Gain Setting (BTL) 17dB Output Power Min 5 W (at 8) 20dB Min 10 W (at 8) 26dB - V CC Vcc VCC Vcc VO_DF=1.1 Vrms VO_SP=VO_DF x GBTL VO_DF=1.1Vrms 0V Digital Filter Output Signal (Changed into Analog signal) VO_SP=VO_DFxGBTL Driver Output Signal (converted in the analog signal) Maximum output Depends on a setup of Gain Figure 59. -Vcc -VCC Speaker Output Signal (BTL Output Signal) VCC VCC ON rDS rL OFF rL RL rDS OFF Cg ON Cg Figure 60. Schematic of Output Equivalent VO _ SP IN V20 10 PO (THD1%) GBTL RL 10 20 rDS 2rDC RL VIN 10 20 10 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 GBTL 20 rDS [Vrms] RL 2rDC RL RL 27/49 2 [W] where: 2 VIN is the I S input level [dBFS] GBTL is the gain setting [dB] RL is the load resistance [] rDS is the resistance of FET [] (Typ=0.23) rDC is the DC resistance of inductor [] TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 2. About the Protection Function Protection Function Output Short Protection DC Voltage Protection in the Speaker Overheat Protection Under Voltage Protection Detecting & Releasing Condition PWM Output OUT1P,1N,2P,2N ERROR Detecting condition Detecting current = 8A (Typ) /5A (Min. Tj=85C) High-Z_Low (Latch) L (Latch) Detecting condition At speaker output, impressed DC voltage over 0.68sec (fS=48kHz) Over 3.5V (Gain=26dB) Over 1.75V (Gain=20dB) Over 1.225V (Gain=17dB) High-Z_Low (Latch) L (Latch) Chip temperature above 150C(Min.) High-Z_Low Chip temperature below 120C(Min.) Normal operation Power supply voltage below 7V (Typ) High-Z_Low Detecting condition Releasing condition Detecting condition Releasing condition Normal operation Power supply voltage above 7.5V (Typ) L H No change in MCLK for more than 1sec (Typ) or Clock Stop Protection Detecting condition No change in BCLK for more than 1sec (Typ) or High-Z_Low H No change in LRCLK for more than 21sec (at fS=48kHz.). Releasing condition Normal input to MCLK, BCLK and LRCLK. Normal operation (Note) The ERROR pin is Nch open-drain output. ERROR pin is pulled up by 100k resistor. (Note) Once an IC is latched, the circuit is not released automatically even after the detecting status is removed. Procedure or is needed for recovery. MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to High again. Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the internal power ON reset circuit activates. (Note) Please remove the DC component in SCALER IC of the preceding paragraph of this IC so that DC voltage protection feature not to aim at does not operate. The High pass filter function for the DC component removal is not to BD28623MUV. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 28/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (1) Output Short Protection (Short to Power Supply) This IC has PWM output short protection circuit that stops the PWM output when the Speaker output (after LC-filter) is short-circuited to the power supply due to wrong condition. Detecting condition - It will detect when MUTEX pin is set High and the current that flows in the PWM output pin becomes 8A(Typ) or more. The PWM output instantaneously enters the state of High-Z_Low if detected, and the IC is latched. Releasing method - After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to High again. Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the internal power ON reset circuit activates. Short to VCC Release from short to VCC OUT1P OUT1N OUT2P OUT2N t PWM out : IC latches with High-Z_Low. Released from latch state. Over-current 8A(Typ) t ERROR t About 0.3sec MUTEX Latch release t 10msec(Min) Figure 61. Output Short Protection (Short to Power Supply) Sequence www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 29/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (2) Output Short Protection6 (Short to GND) This IC has PWM output short protection circuit that stops the PWM output when the Speaker output (after LC-filter) is short-circuited to GND due to wrong condition. Detecting condition - It will detect when MUTEX pin is set High and the current that flows in the PWM output terminal becomes 8A(Typ) or more. The PWM output instantaneously enters the state of High-Z_Low if detected, and the IC is latched. Releasing method - After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to High again. Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the internal power ON reset circuit activates. Short to GND Release from short to GND OUT1P OUT1N OUT2P OUT2N t Released from latch state. PWM out : IC latches with High-Z_Low. Over-current 8A(Typ) t ERROR t About 0.4sec MUTEX Latch release t 10msec(Min) Figure 62. Output Short Protection (Short to GND) Sequence www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 30/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (3) DC Voltage Protection When DC voltage is applied to the speaker due to wrong condition, this IC has protection circuit where the speaker is protected from destruction. Detecting condition - It will detect when MUTEX pin is set High and speaker output is more than 3.5V (TYP, Gain=26dB setting), 1.75V (TYP, Gain=20dB setting), 1.225V (TYP, Gain=17dB setting), 0.68sec (fS=48kHz) or above. Once detected, the PWM output instantaneously enters the state of High-Z_Low, and the IC is latched. Releasing method - After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to High again. Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the internal power ON reset circuit activates. Abnormal condition Impress DC voltage to speaker output ever 3.5V OUT1P OUT1N OUT2P OUT2N Release abnormal condition PWM out IC latches with High-Z_Low t Latch release 3.5V Speaker Output t -3.5V Soft-start 21.5msec(fS=48kHz) Protection start about 0.68sec(fS=48kHz) impress DC voltage to speaker output ERROR t MUTEX Latch release t 10msec(Min) (GAIN=26dB settings) Figure 63. DC Voltage Protection Sequence (Note) Please remove the DC component in SCALER IC of the preceding paragraph of this IC so that DC voltage protection feature not to aim at does not operate. The High pass filter function for the DC component removal is not to BD28623MUV. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 31/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (4) Overheat Protection This IC has the overheat protection circuit that prevents thermal runaway when the temperature of the chip exceeds Tjmax=150C. Detecting condition - It will detect when MUTEX pin is set High and the temperature of the chip becomes 150C (Min) or more. Speaker output turns MUTE immediately when high temperature protection is detected. Releasing condition - It will release when MUTEX pin is set High and the temperature of the chip becomes 120C (Min) or less. The speaker output is outputted through a soft-start when released. (Auto recovery) Tj 150 120 t OUT1P OUT1N OUT2P OUT2N High-Z_Low t Soft-Start(Auto recovery) 21.5msec(fS=48kHz) Speaker Output ERROR t 3.3V t Figure 64. Overheat Protection Sequence www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 32/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (5) Under Voltage Protection This IC has under voltage protection circuit that mutes the speaker output mute once it detects extreme drop of the power supply voltage. Detecting condition - It will detect when MUTEX pin is set High and the power supply voltage becomes lower than 7V (Typ). Speaker output turns MUTE immediately when under voltage protection is detected. Releasing condition - It will release when MUTEX pin is set High and the power supply voltage becomes more than 7.5V (Typ). The speaker output is outputted through a soft-start when released. (Auto recovery) VCCA VCCP1 VCCP2 7.5V 7V t OUT1P OUT1N OUT2P OUT2N High-Z_Low t Soft-start(Auto recovery) 21.5msec(fS=48kHz) Speaker Output ERROR t 3.3V t Figure 65. Under Voltage Protection Sequence www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 33/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (6) Clock Stop Protection (MCLK) This IC has clock stop protection circuit that mutes the speaker output when the MCLK signal of the digital audio input stops. Detecting condition - It will detect when MUTEX pin is set High and the MCLK signal stops for about 1sec or more. Speaker output turns MUTE immediately when clock stop protection is detected. Releasing condition - It will release when MUTEX pin is set High and the MCLK signal returns to the normal clock operation. The speaker output is outputted through a soft-start when released. (Auto recovery) Clock stop Clock recover MCLK t Protection start with About 1sec clock stop OUT1P OUT1N OUT2P OUT2N High-Z_Low t Soft-start(Auto recovery) 21.5msec(fS=48kHz) Speaker Output t 3.3V ERROR t Figure 66. Clock Stop Protection (MCLK) Sequence www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 34/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (7) Clock Stop Protection (BCLK) This IC has clock stop protection circuit that mutes the speaker output when the BCLK signal of the digital audio input stops. Detecting condition - It will detect when MUTEX pin is set High and the BCLK signal stops for about 1sec or more. Speaker output turns MUTE immediately when clock stop protection is detected. Releasing condition - It will release when MUTEX pin is set High and the BCLK signal returns to the normal clock operation. The speaker output is outputted through a soft-start when released. (Auto recovery) Clock stop Clock recover BCLK t Protection start with about 1sec clock stop OUT1P OUT1N OUT2P OUT2N High-Z_Low t Soft-start(Auto recovery) 21.5msec(fS=48kHz) Speaker Output t 3.3V ERROR t Figure 67. Clock Stop Protection (BCLK) Sequence www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 35/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (8) Clock Stop Protection (LRCLK) This IC has clock stop protection circuit that mutes the speaker output when the LRCLK signal of the digital audio input stops. Detecting condition - It will detect when MUTEX pin is set High and the LRCLK signal stops for about 21sec (at fS=48kHz) or more. Speaker output turns MUTE immediately when clock stop protection is detected. Releasing condition - It will release when MUTEX pin is set High and the LRCLK signal returns to the normal clock operation. The speaker output is outputted through a soft-start when released. (Auto recovery) Clock stop Clock recover LRCLK t Protection start about 21sec(fs=48kHz) clock stop OUT1P OUT1N OUT2P OUT2N High-Z_Low t Soft-start(Auto recovery) 21.5msec(fS=48kHz) Speaker Output t 3.3V ERROR t Figure 68. Clock Stop Protection (LRCLK) Sequence www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 36/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 3. Application Circuit Example Stereo BTL Output, RL=8/6, Vcc22V GNDA GNDA L18 10uH C17 10uF C19 3.3uF BSP2P L13 10uH C16 0.1uF REGG 18 VCCA GNDA 17 16 OUT1N C14 10uF GNDA REGD 15 VCCA 14 13 20 Under Voltage Protection Clock Stop Protection C20 10uF BSP1N GNDP1 feedback GNDP2 C8 0.68uF VCCP1 GNDP2 SP 2ch (Rch) C13 0.68uF GNDP1 C10 10uF PWM Modulator feedback 21 C23 0.68uF Driver FET 1N 11 VCCP2 GNDP2 Output Short Protection Output DC Voltage Protection High Temperature Protection Driver FET 2P 10 VCCP2 19 OUT2P C18 0.68uF 12 C12 3.3uF VCCP1 SP 1ch (Lch) GNDP2 Driver FET 2N C22 3.3uF 8 C9 3.3uF I2S I/F Control I/F OUT1P L8 10uH 3.3V 7 ERROR 24 To SCALER IC 23 OUT2N L23 10uH Driver FET 1P x4 Over Sampling Digital Filter 9 22 BSP2N BSP1P MUTEX R24 100k 1 2 3 4 MCLK SDATA BCLK LRCLK R1 0 R2 0 R3 0 R4 0 5 GAIN 6 RSTX 3.3V 3.3V Digital Audio Source 3.3V 3.3V R5 47k Figure 69. Application Circuit Parts Qty Parts No. Inductor 4 L8, L13, L18, L23 1 R5 Resistor Caution2: Caution3: Caution4: Caution5: Product No. 10H / 3.8A / (20%) / 7.6mmx7.6mm TOKO B1047DS-100M 10H / 3.1A / (20%) / 6.0mmx6.0mm Taiyo Yuden NRS6045T-100MMGK 47k / 1/16W / J(5%) / 1.0mmx0.5mm MCR01MZPJ473 ROHM R1, R2, R3, R4 0 / 1/10W / J(5%) / 1.6mmx0.8mm 1 100k / 1/16W / J(5%) / 1.0mmx0.5mm MCR01MZPJ104 0.68F / 50V / B(10% / 2.0mmx1.25mm GRM21BB31H684KAC4 1 R24 C8, C13, C18, C23, C9, C12, C19, C22 C16 0.1F / 16V / B(10% / 1.6mmx0.8mm GRM188B11C104KA01 1 C17 10F / 16V / B(10%) / 2.0mmx1.25mm GRM21BB31C106KE15 3 C10, C14, C20 10F / 35V / B(10%) / 3.2mmx2.5mm 4 Caution1: Company 4 4 Capacitor Description 3.3F / 16V / B(10% / 1.6mmx0.8mm MURATA MURATA MCR03EZPJ000 GRM21BB31E335KA75 GRM32EB3YA106KA12 If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker. Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur which sometimes leads to IC destruction. The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the magnetic saturation behavior, it instantaneously pass the heavy-current to IC. Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute maximum ratings. If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page. When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P.42 page, and must change LC filter value to suppress the influence of the LRC resonance.. This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry out enough evaluations. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 37/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Application Circuit Example Stereo BTL Output, RL=8/6, Vcc=22V to 24V GNDA GNDA L18 15uH C17 10uF C19 3.3uF BSP2P 17 L13 15uH C16 0.1uF REGG 18 VCCA GNDA 16 OUT1N C14 10uF GNDA REGD 15 VCCA 14 13 C12 3.3uF 20 C20 10uF feedback GNDP2 VCCP1 VCCP1 GNDP2 Driver FET 2N C22 3.3uF ERROR Control I/F C8A 680pF SP 1ch (Lch) C9 3.3uF 8 I2S I/F 24 To SCALER IC 23 OUT2N L23 15uH Driver FET 1P x4 Over Sampling Digital Filter C8 0.47uF R8 5.6 BSP1P 9 22 BSP2N C13 0.47uF GNDP1 GNDP2 C23A 680pF R13 5.6 C10 10uF PWM Modulator feedback 21 R23 5.6 SP 2ch (Rch) Under Voltage Protection Clock Stop Protection BSP1N GNDP1 OUT1P L8 15uH 3.3V 7 C23 0.47uF Driver FET 1N C13A 680pF 11 VCCP2 GNDP2 Output Short Protection Output DC Voltage Protection High Temperature Protection Driver FET 2P 10 VCCP1 19 OUT2P R18 5.6 C18 0.47uF 12 C18A 680pF MUTEX R24 100k 1 2 3 4 MCLK SDATA BCLK LRCLK R1 0 R2 0 R3 0 R4 0 5 GAIN 6 RSTX 3.3V 3.3V Digital Audio Source 3.3V 3.3V R5 47k Figure 70. Application Circuit Parts Qty Parts No. Inductor 4 L8, L13, L18, L23 1 R5 47k / 1/16W / J(5%) / 1.0mmx0.5mm 4 R1, R2, R3, R4 0 / 1/10W / J(5%) / 1.6mmx0.8mm 4 R8, R13, R18, R23 5.6 / 1/4W / J(5%) / 1.6mmx0.8mm ESR03EZPJ5R6 1 100k / 1/16W / J(5%) / 1.0mmx0.5mm MCR01MZPJ104 680pF / 50V / CH(5% / 1.0mmx0.5mm GRM1552C1H681JA01 0.47F / 50V / B(10% / 2.0mmx1.25mm 1 R24 C8A, C13A, C18A, C23A C8, C13, C18, C23, C9, C12, C19, C22 C16 1 C17 10F / 16V / B(10%) / 2.0mmx1.25mm 3 C10, C14, C20 10F / 35V / B(10%) / 3.2mmx2.5mm Resistor 4 4 Capacitor Caution1: Caution2: Caution3: Caution4: Caution5: 4 Description Company Product No. 15H / 2.9A / (20%) / 7.6mmx7.6mm TOKO B1047DS-150M 15H / 2.5A / (20%) / 6.0mmx6.0mm Taiyo Yuden NRS6045T-150MMGK 3.3F / 16V / B(10% / 1.6mmx0.8mm MCR01MZPJ473 ROHM MCR03EZPJ000 GRM21BB31H474KA87 MURATA 0.1F / 16V / B(10% / 1.6mmx0.8mm GRM21BB31E335KA75 GRM188B11C104KA01 GRM21BB31C106KE15 MURATA GRM32EB3YA106KA12 If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker. Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur which sometimes leads to IC destruction. The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the magnetic saturation behavior, it instantaneously pass the heavy-current to IC. Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute maximum ratings. If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page. When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P42 page, and must change LC filter value to suppress the influence of the LRC resonance.. This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry out enough evaluations. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 38/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Application Circuit Example Monaural BTL Output, RL=4 GNDA GNDA C17 10uF BSP2P 17 L13 10uH C16 0.1uF REGG 18 VCCA GNDA REGD 16 OUT1N C14 10uF GNDA 15 VCCA 14 13 VCCP2 20 Driver FET 1N Under Voltage Protection Clock Stop Protection C13 1uF GNDP1 C10 10uF PWM Modulator 21 feedback BSP1N GNDP1 11 Output Short Protection Output DC Voltage Protection High Temperature Protection Driver FET 2P feedback 10 19 OUT2P 12 C12 3.3uF GNDP2 GNDP2 C8 1uF VCCP1 VCCP1 SP 1ch (Lch) 8 I2S I/F Control I/F BSP1P C9 3.3uF 7 ERROR Driver FET 1P x4 Over Sampling Digital Filter 24 To SCALER IC Driver FET 2N 23 OUT2N 22 BSP2N 9 GNDP2 OUT1P L8 10uH 3.3V MUTEX R24 100k 1 2 3 4 MCLK SDATA BCLK LRCLK R1 0 R2 0 R3 0 R4 0 5 GAIN 6 RSTX 3.3V 3.3V Digital Audio Source 3.3V 3.3V R5 47k Figure 71. Application Circuit Parts Qty Parts No. Inductor 4 L8, L13, L18, L23 1 R5 Resistor Caution2: Caution3: Caution4: Caution5: Product No. 10H / 3.8A / (20%) / 7.6mmx7.6mm TOKO B1047DS-100M 10H / 3.1A / (20%) / 6.0mmx6.0mm Taiyo Yuden NRS6045T-100MMGK 47k / 1/16W / J(5%) / 1.0mmx0.5mm MCR01MZPJ473 ROHM R1, R2, R3, R4 0 / 1/10W / J(5%) / 1.6mmx0.8mm 1 100k / 1/16W / J(5%) / 1.0mmx0.5mm MCR01MZPJ104 1F / 50V / B(10% / 2.0mmx1.25mm GRM21BB31H105KA12 1 R24 C8, C13, C18, C23 C9, C12, C19, C22 C16 0.1F / 16V / B(10% / 1.6mmx0.8mm GRM188B11C104KA01 1 C17 10F / 16V / B(10%) / 2.0mmx1.25mm GRM21BB31C106KE15 3 C10, C14, C20 10F / 35V / B(10%) / 3.2mmx2.5mm 4 Caution1: Company 4 4 Capacitor Description 3.3F / 16V / B(10% / 1.6mmx0.8mm MURATA MURATA MCR03EZPJ000 GRM21BB31E335KA75 GRM32EB3YA106KA12 If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker. Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur which sometimes leads to IC destruction. The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the magnetic saturation behavior, it instantaneously pass the heavy-current to IC. Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute maximum ratings. If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page. When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P42 page, and must change LC filter value to suppress the influence of the LRC resonance.. This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry out enough evaluations. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 39/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 1. About Using BD28623MUV ICs for 2.1ch or 2.2ch audio Be careful when using two BD28623MUVs at the same time for 2.1ch or 2.2ch audio. BD28623MUV doesn't have the function that synchronizes both PWM frequencies of the two BD28623MUVs. Beat noise may occur due to the difference between PWM frequencies. Switching current flows to the GND of LC-Filter and only a small part to the speaker which lowers emission noise. When you have two BD28623MUVs used at the same time with synchronized PWM output, there is common impedance in the GND of the filter. The GND electric potential becomes higher which also causes noise to become higher. The GND of the filter is shorted at one point when you use two BD28623MUVs at the same time. (Figure 73.) BSP1P BSP2P DRIVER OUT1P OUT2P OUT1N OUT2N DRIVER BSP1N BSP2N Figure 72. Output LC Filter MAIN SPEAKER One point GND SUB WOOFER Figure 73. Circuit Using Two ICs to 2.1ch audio www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 40/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 2. Selecting External Components (1) Output LC Filter Circuit An output filter is required to eliminate radio-frequency components exceeding the audio-frequency region supplied to a load (speaker). Because this IC uses sampling clock frequencies from 512kHz (fS=32kHz) to 768kHz (fS=48kHz) in the output PWM signals, the high-frequency components must be appropriately removed. This section takes an example of an LC type LPF shown below, in which coil L and capacitor C compose a differential filter with an attenuation property of -12dB/oct. A large part of switching currents of PWM signal flow to capacitor C, and only a small part of the currents flow to speaker RL. This filter reduces unwanted emission this way. In addition, coil L and capacitor C compose a filter against in-phase components, reducing unwanted emission further. . L OUT_P C RL C OUT_N L Figure 74. Output LC Filter The following shows output LC filter constants with typical load impedances. RL L C 4 6, 8 (Vcc22V) 6, 8 (Vcc22V) 10H 1F 10H 0.68F 15H 0.47F The inductors must be use with low ESR and with sufficient margin of rated DC current (saturation current). Power loss will increase if inductors with high ESR are used. When the short-circuit of the speaker output (After the LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the magnetic saturation behavior, it instantaneously pass the heavy-current to IC. (The coil of the rated DC current: 7.2A or more will be recommended when using it by 22V or more.) Select a closed magnetic circuit type product in normal cases to prevent emission noise. Use capacitors with low equivalent series resistance, and good impedance characteristics at high frequency ranges (100kHz or higher). Also, select an item with sufficient voltage rating because massive amount of high-frequency current flow is expected. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 41/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV (2) Snubber circuit constant When overshoot of PWM Output exceeds absolute maximum rating, or when overshoot of PWM output negatively affects EMC, or when ringing deteriorates the audio characteristic of the PWM output, snubber circuit is used as shown below. (a) Measure the spike resonance frequency "f1" of PWM output waveform (when rising) by using Low capacitance Probe (e.g. FET probe) at the OUT terminal. (Figure 75) Shorten GND lead of FET probe and monitor as near as possible to output pin. (b) Measure the resonance frequency "f2" of the spike as the snubber-circuit R value equals 0 (capacitor "C" is connected to GND) Adjust the value of the capacitor "C" until it becomes (2 x f2 = f1) The value of "C" that becomes (2xf2=f1) is 3 times of the parasitic capacity "Cp" that a spike is formed. (C=3Cp) (c) Parasitic inductance "Lp" is calculated using the next formula. Lp 1 2f1 2 C p (d) The character impedance Z of resonance is calculated from the parasitic capacity "Cp" and the parasitic inductance Lp using the next formula. Z Lp Cp (e) Set snubber circuit "R" same as the character impedance "Z". Set snubber circuit "C" 4 to 10 times of the parasitic capacity "Cp". If "C" is set larger than 10Cp, switching current will possibly increase. VCC P Snubb er Spike resonance frequency LCfilte r Driver 5nsec/div OU T C R GND P Figure 75. PWM Output Waveform Measure of Spike Resonance Frequency) Figure76. Snubber Schematic The following table shows ROHM recommended value of "Snubber filter constants" when using ROHM 4 layer board. (Vcc=22V to 24V, RL=8, Po=10W+10W) C R 470pF to 820pF, 50V CH(5%) Murata GRM1552C1H Series 5.6, 1/4W J(5%) ROHM ESR03EZPJ5R6 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 42/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV 3) Operating condition with the application component Limit Parameter Parts No. Tolerance of Coupling capacitor for Power supply C10, C14, C20 1 Tolerance of Capacitor for REGG C17 1 Tolerance of Capacitor for REGD C16 0.05 C9, C12, C19, C22 2.0 (Note 11) Tolerance of Capacitor for BSP 2.0 (Note 11) 4.7 Tolerance of GAIN Terminal Pull up resistor R5 43 47 Min Unit Typ Max (Note 11) 10 - F (Note 11) 10 - F 0.1 - F (Note 11) 3.3 Conditions 4.5 (Note 12) F 6.3 (Note 12) F B characteristics Ceramic type capacitor recommended B characteristics, 16V Ceramic type capacitor recommended B characteristics, 16V Ceramic type capacitor recommended B characteristics, 16V Ceramic type capacitor recommended 51 k 1/16W J(5%) recommended (Note 11) Should use the capacity of the capacitor not to be less than a minimum in consideration of temperature characteristics and dc-bias characteristics. (Note 12) It is value in consideration of +/-10% of capacity unevenness, capacity rate of change 22%. Please use the capacitor within this limit. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 43/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Power Dissipation VQFN024V4040 4 PCB 3.56W Power Dissipation Pd [W] : Pd [W] 3.5 3 2.5 PCB 2.21W 2 1.5 1 0.5 0 0 25 50 75 100 125 150 Temperature Ta [:]Ta [C] Figure 77. Power Dissipation Curve VCC Measuring instrument : TH-156 (Shibukawa Kuwano Electrical Instruments Co., Ltd.) Measuring conditions : Installation on ROHM's board Board size : 74.2mm x 74.2mm x 1.6mm (with thermal via on board) MaterialFR4 The board and exposed heat sink on the back of package are connected by soldering. PCB4- layer board (Top and bottom layer back copper foil size: 10.29mm2, 2nd and 3rd layer back copper foil size: 5505mm2), ja = 56.6C/W PCB4-layer boardback copper foil size: 5505mm2), ja = 35.1C/W Use a thermal design that has sufficient margin so as not to exceed allowable power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is used to provide heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible heat dissipation pattern not only on the board surface but also the backside. Class D speaker amplifier has high efficiency and low heat generation in comparison with conventional analog power amplifier. However, in case it is operated continuously by maximum output power, power dissipation (Pdiss) may exceed package dissipation. Please consider heat design that power dissipation (Pdiss) does not exceed package dissipation (Pd) in average power (Poav). Package dissipation : PdW Tj max Ta / ja Power dissipation : PdissW Poav 1/ 1 where: Tjmax is the maximum junction temperature=150C Ta is the peripheral temperature[C], ja is the thermal resistance of package[C/W], Poav is the average power [W], is the efficiency www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 44/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 45/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Operational Notes - continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B GND Parasitic Elements GND GND N Region close-by GND Figure 78. Example of Monolithic IC Structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over-Current Protection Circuit (OCP) This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 46/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Ordering Information B D 2 8 6 Part Number 2 3 M U V - Package MUV: VQFN024V4040 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN024V4040 (TOP VIEW) Part Number Marking 2 8 6 2 3 LOT Number 1PIN MARK www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 47/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 VQFN024V4040 48/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 BD28623MUV Revision History Date Revision 20.Aug.2015 001 First revision 002 P.3 Pin Descriptions, I/O Equivalent Circuits Pin No. 5 P.4 Pin Descriptions, I/O Equivalent Circuits Pin No. 17 P.7 Electrical Characteristics High level Input Voltage 1, Low level Input Voltage 1 Conditions P.19 Timing Chart/ Power Supply Start-up Sequence P.22 Timing Chart/ Action at MCLK Unstable 3 P.23 Timing Chart/ Instantaneous Power Interruption Recovery Sequence P.38 Application Circuit Example/Product No. P.39 Application Circuit Example /Description. P.40 Output LC Filter P.43 Operating condition with the application component 20.May.2016 Changes www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 49/49 TSZ02201-0C1C0E900290-1-2 20.May.2016 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD28623MUV - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD28623MUV VQFN024V4040 2500 2500 Taping inquiry Yes