Datashee
t
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
1/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
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TSZ22111・14・001
TSZ02201-0C1C0E900290-1-2
Middle Power Class-D Speaker Amplifier Series
17W+17W
Class D Speaker Amplifier for Digital Input
BD28623MUV
General Description
BD28623MUV is a Class D Speaker Amplifier designed for
Flat-panel TVs in particular for space-saving and
low-power consumption. This IC delivers an output power
of 20W+20W. This IC employs state-of-the-art Bipolar,
CMOS, and DMOS (BCD) process technology. With this
technology, the IC can achieve high efficiency. In addition,
the IC is packaged in a compact back-surface heat-sink
type power package to achieve low power consumption
and low heat generation and to eliminate need for external
heat-sink. With this package, total output power is only
34W as compared to 40W total output power of package
with external heat-sink This product satisfies all needs for
drastic downsizing, low-profile structures and powerful
high quality playback of sound systems.
Features
1 Digital Audio Interface
I2S format
SDATA: 16 / 20 / 24bit
LRCLK (fS): 32 kHz/ 44.1kHz / 48kHz
BCLK: 64fS (fixed)
MCLK: 256fS / 512fS Automatic Identification)
Low supply current at RESET mode.
Slew rate controller
; No need snubber circuit (Vcc≤22V)
Output Feedback Circuitry which prevents decrease of
sound quality caused by change of power supply
voltage, achieves low noise and low distortion, So
the large electrolytic-capacitors for Vcc bypass is able
to be eliminated.
Variable Gain (17dB / 20dB / 26dB)
Wide power supply voltage range (8.5V to 24V)
High efficiency, low heat
Pop noise prevention at power supply on / off
Soft Muting Technology
High reliability design by built-in protection circuits
- Overheat protection
- Under voltage protection
- Output short protection
- Output DC voltage protection
- Clock stop protection (MCLK, BCLK, LRCLK)
Small package (VQFN024V4040)
Applications
- Flat Panel TVs (LCD, Plasma)
- Home Audio (Sound Bar)
- Amusement Equipment
- Electronic Music Equipment
- Desktop PC, etc.
Key Specifications
Supply Voltage: 8.5V to 24V
Speaker Output Power: 17W+17W (Typ)
(VCC=18V, RL=8Ω, Gain=26dB)
Total Harmonic Distortion: 0.08% (Typ) @PO=1W
(VCC=12V, RL=8Ω, Gain=20dB)
Crosstalk: 90dB (Typ)
PSRR: 60dB (Typ)
Output Noise Voltage: 150μVrms (Typ)
Standby Current: 33μA (Typ)
Operating Temperature Range: -25°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
VQFN024V4040 4.00mm x 4.00mm x 1.00mm
Typical Application Circuit
GAIN
BCLK
LRCLK
RSTX
SDATA
Digital Audio Source
MUTEＸ
SP ch1
(Lch)
SP ch2
(Rch)
ERROR
OUT1P
OUT1N
OUT2P
OUT2N
MCLK
BSP2P
BSP1P
BSP1N
BSP2N
Figure 1. Typical Application Circuit
VQFN024V4040
2/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Pin Configuration
SDATA
GNDA
MUTEX
RSTX
LRCLKBCLKMCLK
ERROR
22 23 24
1 2 3 4 5 6
8 9 10 11 12
131415161718
BSP2P
OUT2P
OUT2N
GNDP2
VCCP2
BSP2N
BSP1N
OUT1N
OUT1P
VCCP1
GNDP1
BSP1P
GAIN
REGG REGD
7
19 20 21
VCCA
Figure 2. Pin Configuration
(TOP VIEW)
3/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Pin Descriptions, I/O Equivalent Circuits (Provided pin voltages are typical values)
Pin No.
Pin Name
Pin Voltage
Pin Descriptions
Internal Equivalent Circuit
1
2
3
4
MCLK
SDATA
BCLK
LRCLK
0V
Digital sound signal input pin
7
MUTEX
Speaker output mute control pin
H: Mute OFF
L: Mute ON
5
PLIMT
0V
Gain setting pin
33k
15
3k
5
6
RSTX
0V
Reset pin
H: Reset OFF
L: Reset ON
8
OUT1P
VCC to 0V
Output pin of Ch1 positive PWM signal
Please connect to output LPF.
*If this pin is shorted to GND, the IC may be broken.
9
BSP1P
-
Boot-strap pin of Ch1 positive PWM signal
Please connect a capacitor to OUT1P.
10
VCCP1
-
Power supply pin for Ch1 PWM signal
Please connect a capacitor.
11
GNDP1
0V
GND pin for Ch1 PWM signal
12
BSP1N
-
Boot-strap pin of Ch1 negative PWM signal
Please connect a capacitor to OUT1N.
13
OUT1N
VCC to 0V
Output pin of Ch1 negative PWM signal
Please connect to output LPF.
*If this pin is shorted to GND, the IC may be broken.
14
VCCA
VCC
Power supply pin for Analog signal
Please connect a capacitor to GND.
－
15
GNDA
0V
GND pin for Analog signal
－
16
REGD
5.0V
Internal power supply pin for Digital circuit
Please connect a capacitor to GND.
*The REGD terminal of BD28623MUV should not be used as
external supply. Therefore, don't connect anything except for the
capacitor for stabilization.
14
15
1,2,3,4,7
100k
14
15
43k
6
57k
12
9
13
8
10
17
11
14
16
15
500K
4/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Pin Descriptions, I/O Equivalent Circuits – continued (Provided pin voltages are typical values)
Pin No.
Pin Name
Pin Voltage
Pint Descriptions
Internal Equivalent Circuit
17
REGG
5.7V
Internal power supply pin for Gate driver
Please connect a capacitor to GND.
*The REGG terminal of BD28623MUV should not be used as
external supply. Therefore, don't connect anything except for
the capacitor for stabilization.
14
17
15
500k
18
BSP2P
-
Boot-strap pin of Ch2 positive PWM signal
Please connect a capacitor to OUT2P.
19
OUT2P
VCC to 0V
Output pin of Ch2 positive PWM signal
Please connect to output LPF.
*If this pin is shorted to GND, the IC may be broken.
20
VCCP2
VCC
Power supply pin for Ch2 PWM signal
Please connect a capacitor to GND.
21
GNDP2
0V
GND pin for Ch2 PWM signal
22
BSP2N
-
Boot-strap pin of Ch2 negative PWM signal
Please connect a capacitor to OUT2N.
23
OUT2N
VCC to 0V
Output pin of Ch2 negative PWM signal
Please connect to output LPF.
*If this pin is shorted to GND, the IC may be broken.
24
ERROR
-
Error flag pin
Please connect pull-up resistor.
H: Normal
L: Error
*An error flag is outputted when Output Short Protection, DC
Voltage Protection in the speaker, and High Temperature
Protection are operated. This flag shows IC condition during
operation.
The numerical value of internal equivalent circuit is typical value, not guaranteed value.
18
22
19
23
20
17
21
24
15
500
5/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Block Diagram
SDATA
GNDA
MUTEX
RSTX
LRCLKBCLKMCLK
ERROR
22 23 24
123 4 5 6
8 9 10 11 12
131415161718
BSP2P
OUT2P
OUT2N
BSP2N
BSP1N
OUT1N
OUT1P
VCCP1
GNDP1
BSP1P
GAIN
REGG REGD
Control
I/FI2S I/F
Under Voltage Protection
Clock Stop Protection
Output Short Protection
Output DC Voltage Protection
High Temperature Protection
feedback
7
19 20 21
VCCA
×4 Over
Sampling Digital Filter
PWM
Modulator
Driver
FET
2P
Driver
FET
2N
Driver
FET
1N
Driver
FET
1P
feedback
GNDP2
VCCP2
Figure 3. Block Diagram
6/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Absolute Maximum Ratings
Parameter
Symbol
Limit
Unit
Conditions
Supply Voltage (Note 1) (Note 2)
VCCMAX
-0.3 to +30
V
Pin10, 14, 20
Power Dissipation
Pd
2.21(Note 3)
W
Please refer to Power
Dissipation for details.
3.56(Note 4)
Input Voltage1(Note 1)
VIN1
-0.3 to +3.7
V
Pin1-7
Terminal Voltage 1(Note 1)
VPIN1
-0.3 to +7
V
Pin16, 17
Terminal Voltage 2(Note 1) (Note 5-1)
VPIN2
-0.3 to +VCC
V
Pin8, 13, 19, 23
Terminal Voltage 3(Note 1) (Note 5-2)
VPIN3
-0.3 to OUTxx+7
V
Pin9, 12, 18, 22
Open-drain Terminal Voltage(Note 1)
VERR
-0.3 to +VCCMAX
V
Pin24
Operating Temperature Range
Topr
-25 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Maximum Junction Temperature
Tjmax
+150
°C
(Note 1) Voltage that can be applied with reference to GND (Pin11, 15, 21).
(Note 2) Pd and Tjmax=150°C must not be exceeded.
(Note 3) 74.2mm×74.2mm×1.6mm, FR4, 4-layer glass epoxy board
(Top and bottom layer back copper foil size: 20.2mm2, 2nd and 3rd layer back copper foil size: 5505mm2)
Derate by 17.7mW/°C when operating above Ta=25°C. The board is provided with thermal via.
(Note 4 74.2mm×74.2mm×1.6mm, FR4, 4-layer glass epoxy board
(Top and bottom layer back copper foil size: 5505mm2)
Derate by 28.5mW/°C when operating above Ta=25°C. The board is provided with thermal via.
(Note 5-1) The chip should be used within AC peak limits at all conditions. Overshoot should be ≤30V with reference to GND.
Undershoot should be ≤10nsec and ≤30V with reference to VCC. (Please refer to figure 4-1.)
(Note 5-2) The chip should be used within AC peak limits at all conditions. Overshoot should be ≤OUTxx+7V with reference to OUTxx.
Undershoot should be ≤10nsec and ≤OUTxx+7V with reference to OUTxx. (Please refer to figure 4-2.)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Figure 4-1 Figure 4-2
Recommended Operating Conditions
Parameter
Symbol
Limit
Unit
Conditions
Supply Voltage (Note 1) (Note 2)
VCC
8.5 to 24
V
Pin10, 14, 20
Minimum Load Impedance (Note 6)
RL
6.4
Ω
21V < VCC ≤ 24V
4.8
14V < VCC ≤ 21V
3.6
VCC ≤14V
(Note 6) Pd should not be exceeded.
GND
Vcc
≦10nsec
Overshoot to GND
30V (Max.) Undershoot to Vcc
30V(Max.)
OUTxx
≦10nsec
Overshoot to OUTxx
7V (Max.)
Undershoot to OUTxx
7V(Max.)
BSPxx
7/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Electrical Characteristics
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, Gain= 20dB, fS=48kHz,
MCLK=256fS, Output LC filter: L=10µH, C=0.68µF, Without Snubber circuit)
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
Total Circuit
Circuit Current (Reset Mode)
ICC1
-
33
200
µA
No load, RSTX=0V, MUTEX=0V
Circuit Current (Mute Mode)
ICC2
-
15
25
mA
No load, RSTX=3.3V,
MUTEX=0V
Circuit Current (Active Mode)
ICC3
-
40
80
mA
No load, RSTX=3.3V,
MUTEX=3.3V
Open-drain Terminal Low Level
Voltage
VERR
-
-
0.8
V
IO=0.5mA
Regulator Output Voltage 1
VREGG
4.6
5.7
6.5
V
RSTX=3.3V, MUTEX=3.3V
Regulator Output Voltage 2
VREGD
4.2
5.0
5.7
V
RSTX=3.3V, MUTEX=3.3V
High level Input Voltage 1
VIH1
2.2
-
3.3
V
Pin1-4,6-7
Low level Input Voltage 1
VIL1
0
-
0.8
V
Pin1-4,6-7
High level Input Voltage 2
VIH2
2.6
-
3.3
V
Pin5
Low level Input Voltage 2
VIL2
0
-
0.45
V
Pin5
Input Current1
(Input Pull-down Terminal)
IIH
27.5
33
42
µA
VIN = 3.3V, Pin1-4,6-7
]Input Current2
(Input Pull-down Terminal)
IIH2
65
100
135
µA
VIN = 3.3V, Pin5
Speaker Parts
Maximum Output Power 1(Note 7)
PO1
-
15
-
W
VCC=16V, THD+N=10%,
GAIN=26dB
Maximum Output Power 2(Note 7)
PO2
10
12.5
-
W
VCC=16V, THD+N<10%,
GAIN=20dB
Maximum Output Power 3(Note 7)
PO3
5
6.3
-
W
VCC=16V, THD+N<10%,
GAIN=17dB
Voltage Gain1(Note 7)
GV26
25
26
27
dB
PO=1W,
GAIN=H
Voltage Gain2(Note 7)
GV20
19
20
21
dB
PO=1W ,
GAIN=Pull up(47kΩ)
Voltage Gain3(Note 7)
GV17
16
17
18
dB
PO=1W,
GAIN=L
Total Harmonic Distortion1(Note 7)
THD1
-
0.08
-
%
VCC=12V, PO=1W
BW=20 to 20kHz (AES17)
GAIN=20dB, With snubber circuit
Crosstalk (Note 7)
CT
60
90
-
dB
PO=1W, 1kHz BPF,
GAIN=20dB
PSRR (Note 7)
PSRR
-
60
-
dB
Vripple=1Vrms, f=1kHz,
GAIN=20dB
Output Noise Voltage (Note 7)
VNO
-
150
250
μVrms
Input=-∞dBFS, BW=IHF-A,
GAIN=20dB
PWM (Pulse Width Modulation)
Frequency
-
512
-
kHz
fS=32kHz
fPWM
-
705.6
-
kHz
fS=44.1kHz
-
768
-
kHz
fS=48kHz
(Note 7) The rated values of items above indicate average performances of the device, which largely depend on circuit layouts, components, and power supplies.
The reference values are those applicable to the device and components directly installed on a board specified by ROHM during testing.
8/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Typical Performance Curves (1/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=26dB, ROHM 4-layer Board)
ｗw
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20
Output Power [W/ch]
Efficiency [%]
※ Dotted line means power dissipation is exceeded.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20
Output Power [W/ch]
ICC [A]
0
10
20
30
40
50
60
70
80
810 12 14 16 18 20 22 24 26
VCC [V]
ICC [mA]
0
10
20
30
40
50
60
6 8 10 12 14 16 18 20 22 24 26
Supply Voltage : VCC [V]
Circuit Current : ICC [µA]
Figure 5. Circuit Current vs Supply Voltage
(RESET)
Figure 6. Circuit Current vs Supply Voltage
(MUTE, ACTIVE)
Figure 7. Efficiency vs Output Power
(8Ω, 6Ω)
Figure 8. Circuit Current vs Output Power
(8Ω, 6Ω)
RL=No load
No signal
“RESET”
RL=8Ω
RL=6Ω
RL=8Ω
RL=6Ω
MUTE
RESET
ACTIVE
RL=No load
No signal
“MUTE”
“ACTIVE”
GAIN=H
GAIN=H
9/49
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Typical Performance Curves – continued (2/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 5 10 15 20
Output Power [W/ch]
ICC [A]
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20
Output Power [W/ch]
Efficiency [%]
RL=4Ω
Figure 11. Waveform of Soft Start
MUTEX
Speaker output
Figure 12. Waveform of Soft Mute
MUTEX
Speaker output
Figure 9. Efficiency vs Output Power
(4Ω)
Figure 10. Circuit Current vs Output Power
(4Ω)
RL=4Ω
GAIN=H
VCC=12V
GAIN=H
VCC=12V
10/49
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Typical Performance Curves - continued (3/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=26dB, ROHM 4-layer Board)
※ Dotted line means power dissipation is exceeded.
0
0.5
1
1.5
2
2.5
3
0 5 10 15 20 25
Output Power [W/ch]
ICC [A]
0
0.5
1
1.5
2
2.5
3
0 5 10 15 20 25
Output Power [W/ch]
ICC [A]
0
5
10
15
20
25
30
35
6 8 10 12 14 16 18 20 22 24 26
Supply Voltage : VCC [V]
Output Power [W/ch]
Figure 16. Circuit Current vs Output Power
(6Ω)
VCC=12V
VCC=18V
Figure 14. Circuit Current vs Output Power
(8Ω)
VCC=24V
VCC=12V
VCC=18V
0
5
10
15
20
25
30
35
6 8 10 12 14 16 18 20 22 24 26
Supply Voltage : VCC [V]
Output Power [W/ch]
THD+N=10%
THD+N=1%
Figure 13. Output Power vs Supply Voltage
(8Ω)
THD+N=10%
THD+N=1%
Figure 15. Output Power vs Supply Voltage
(6Ω)
GAIN=H
RL=6Ω
GAIN=H
RL=6Ω
GAIN=H
RL=8Ω
GAIN=H
RL=8Ω
11/49
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Typical Performance Curves - continued (4/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
※ Dotted line means power dissipation is exceeded.
0
0.5
1
1.5
2
2.5
3
0 5 10 15 20
Output Power [W/ch]
ICC [A]
0
0.5
1
1.5
2
2.5
3
3.5
4
0 5 10 15 20
Output Power [W/ch]
ICC [A]
Figure 18. Circuit Current vs Output Power
(4Ω)
0
5
10
15
20
25
30
35
6 8 10 12 14 16 18 20 22 24 26
Supply Voltage : VCC [V]
Output Power [W/ch]
THD+N=10%
THD+N=1%
Figure 17. Output Power vs Supply Voltage
(4Ω)
GAIN=H
RL=4Ω
VCC=12V
GAIN=H
RL=4Ω
VCC=14V
Figure 20. Circuit Current vs Output Power
(4.8Ω)
0
5
10
15
20
25
30
35
6 8 10 12 14 16 18 20 22 24 26
Supply Voltage : VCC [V]
Output Power [W/ch]
THD+N=10%
THD+N=1%
Figure 19. Output Power vs Supply Voltage
(4.8Ω)
GAIN=H
RL=4.8Ω
VCC=12V
GAIN=H
RL=4.8Ω
VCC=18V
12/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Typical Performance Curves - continued (5/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
0.01
0.1
1
10
10 100 1k 10k 100k
Frequency [Hz]
THD+N [%]
0.01
0.1
1
10
0.01 0.1 1 10 100
Output Power [W/ch]
THD+N [%]
10
15
20
25
30
10 100 1k 10k 100k
Frequency [Hz]
Voltage Gain [dB]
-140
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
Noise FFT [dBV]
Figure 23. THD+N vs Output Power (8Ω)
Figure 24. THD+N vs Frequency (8Ω)
Figure 21. FFT of output noise voltage (8Ω)
Figure 22. Voltage Gain vs Frequency (8Ω)
No Signal
RL=8Ω
OUT1
OUT2
Po=1W
RL=8Ω
OUT1
OUT2
BW 20 to 20kHz
AES17
RL=8Ω
f=1kHz
f=100Hz
f=6kHz
BW 20 to 20kHz
AES17
RL=8Ω
OUT1
OUT2
OUT1
OUT2
f=6kHz
f=100Hz
f=1kHz
13/49
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Typical Performance Curves - continued (6/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL= 8Ω/6Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
10
15
20
25
30
10 100 1k 10k 100k
Frequency [Hz]
Voltage Gain [dB]
-140
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
Noise FFT [dBV]
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
Crosstalk [dB]
-120
-100
-80
-60
-40
-20
0
0.01 0.1 110 100
Output Power [W/ch]
Crosstalk [dB]
Figure 25. Crosstalk vs Output Power (8Ω)
Figure 26. Crosstalk vs Frequency (8Ω)
Figure 27. FFT of output noise voltage (6Ω)
Figure 28. Voltage Gain vs Frequency (6Ω)
No Signal
RL=6Ω
OUT1
OUT2
PO=1W
RL=6Ω
OUT1
OUT2
RL=8Ω
OUT1
OUT2
OUT2
OUT1
RL=8Ω
OUT1
OUT2
OUT1
OUT2
14/49
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Typical Performance Curves – continued (7/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=6Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Freq [Hz]
Crosstalk [dB]
-120
-100
-80
-60
-40
-20
0
0.01 0.1 1 10 100
Output Power [W/ch]
Crosstalk [dB]
0.01
0.1
1
10
10 100 1k 10k 100k
Frequency [Hz]
THD+N [%]
0.01
0.1
1
10
0.01 0.1 1 10 100
Output Power [W/ch]
THD+N [%]
Figure 29. THD+N vs Output Power (6Ω)
Figure 30. THD+N vs Frequency (6Ω)
Figure 31. Crosstalk vs Output Power (6Ω)
Figure 32. Crosstalk vs Frequency (6Ω)
BW 20 to 20kHz
AES17
RL=6Ω
f=1kHz
f=100Hz
f=6kHz
f=6kHz
f=100Hz
f=1kHz
BW 20 to 20kHz
AES17
RL=6Ω
OUT1
OUT2
OUT1
OUT2
RL=6Ω
OUT1
OUT2
OUT2
OUT1
RL=6Ω
OUT1
OUT2
OUT1
OUT2
15/49
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Typical Performance Curves – continued (8/11)
(Unless otherwise specified, Ta =25°C, VCC=12V, f=1kHz, RL=4Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
0.01
0.1
1
10
10 100 1k 10k 100k
Frequency [Hz]
THD+N [%]
0.01
0.1
1
10
0.01 0.1 110 100
Output Power [W/ch]
THD+N [%]
10
15
20
25
30
10 100 1k 10k 100k
Frequency [Hz]
Voltage Gain [dB]
-140
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
Noise FFT [dBV]
Figure 33. FFT of output noise voltage (4Ω)
Figure 34. Voltage Gain vs Frequency (4Ω)
Figure 35. THD+N vs Output Power (4Ω)
Figure 36. THD+N vs Frequency (4Ω)
No Signal
RL=4Ω
VCC=12V
OUT1
OUT2
PO=1W
RL=4Ω
VCC=12V
OUT1
OUT2
BW 20 to 20kHz
AES17
RL=4Ω
VCC=12V
OUT1
OUT2
OUT1
OUT2
BW 20 to 20kHz
AES17
RL=4Ω
VCC=12V
f=1kHz
f=100Hz
f=6kHz
f=6kHz
f=1kHz
f=100Hz
16/49
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TSZ02201-0C1C0E900290-1-2
Typical Performance Curves - continued (9/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL= 4Ω/4.8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
-120
-100
-80
-60
-40
-20
0
0.01 0.1 1 10 100
Output Power [W/ch]
Crosstalk [dB]
10
15
20
25
30
10 100 1k 10k 100k
Frequency [Hz]
Voltage Gain [dB]
-140
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
Noise FFT [dBV]
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
Crosstalk [dB]
Figure 37. Crosstalk vs Output Power (4Ω)
Figure 38. Crosstalk vs Frequency (4Ω)
Figure 39. FFT of output noise voltage (4.8Ω)
Figure 40. Voltage Gain vs Frequency (4.8Ω)
No Signal
RL=4.8Ω
OUT1
OUT2
PO=1W
RL=4.8Ω
OUT1
OUT2
RL=4Ω
VCC=12V
OUT1
OUT2
OUT2
OUT1
RL=4Ω
VCC=12V
OUT1
OUT2
OUT1
OUT2
17/49
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Typical Performance Curves – continued (10/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=4.8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
-120
-100
-80
-60
-40
-20
0
0.01 0.1 110 100
Output Power [W/ch]
Crosstalk [dB]
0.01
0.1
1
10
10 100 1k 10k 100k
Frequency [Hz]
THD+N [%]
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
Crosstalk [dB]
0.01
0.1
1
10
0.01 0.1 1 10 100
Output Power [W/ch]
THD+N [%]
Figure 41. THD+N vs Output Power (4.8Ω)
Figure 42. THD+N vs Frequency (4.8Ω)
Figure 43. Crosstalk vs Output Power (4.8Ω)
Figure 44. Crosstalk vs Frequency (4.8Ω)
BW 20 to 20kHz
AES17
RL=4.8Ω
f=1kHz
f=100Hz
f=6kHz
f=6kHz
f=100Hz
f=1kHz
BW 20 to 20kHz
AES17
RL=4.8Ω
OUT1
OUT2
OUT1
OUT2
RL=4.8Ω
OUT1
OUT2
OUT2
OUT1
RL=4.8Ω
OUT1
OUT2
OUT1
OUT2
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TSZ02201-0C1C0E900290-1-2
Typical Performance Curves – continued (11/11)
(Unless otherwise specified, Ta =25°C, VCC=18V, f=1kHz, RL=8Ω/6Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz,
MCLK=256fS, ROHM 4-layer Board)
Figure 47. Audio Characteristics Measurement Environment
※ Dotted line means power dissipation is exceeded.
0
5
10
15
20
25
30
6 8 10 12 14 16 18 20 22 24 26
Supply Voltage : VCC [V]
Maximum Output Power [W/ch]
26dB
20dB
17dB
RL=6Ω
BW 20 to 20kHz
AES17
THD+N<1%
0
5
10
15
20
25
30
6 8 10 12 14 16 18 20 22 24 26
Supply Voltage : VCC [V]
Maximum Output Power [W/ch]
26dB
20dB
17dB
RL=8Ω
BW 20 to 20kHz
AES17
THD+N<1%
Figure 45. Supply Voltage vs Maximum Output Power
(8Ω)
Figure 46. Supply Voltage vs Maximum Output Power
(6Ω)
PC
Power Supply
AP AUX-0025
(passive filter)
Ammeter
Voltmeter
LC filter
Audio Precision
BD28623MUV
INPUT
OUTPUT
I2S
Dummy Resister
(RL= 4, 6 or 8Ω)
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Timing Chart
1. Power Supply Start-up Sequence
t
t
t
t
t
①Power up VCCA, VCCP1, VCCP2 simultaneously.
③Digital audio data communication.
④After RSTX=L→H wait more than
TWAIT to MUTEX=L→H
②Set RSTX to High
after power up.
Soft-start
21.5msec(fS=48kHz)
More than TWAIT
VCCA
VCCP1
VCCP2
RSTX
t
REGG
REGD
REGG
REGD
MCLK
SDATA
BCLK
LRCLK
MUTEX
Speaker
Output
Caution: To eliminate pop noise when power supply is turned ON, RSTX and MUTEX should always be set Low. And also, all
power supply terminals should start up together.
Order of ② and ③ can be interchange
BSP Capacitor Value
(C9, C12, C19, C22)
Limit of TWAIT
Unit
Min
Typ
Max
3.3μF
300
-
-
msec
4.7μF
400
-
-
msec
Figure 48. Power Supply Start-up Sequence
20/49
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2. Power Supply Shutdown Sequence
t
t
t
t
t
t
①Set MUTEX to Low
②After stopping speaker output,
Turn off the transmission of digital audio signal.
③Set RSTX to Low
④Power down VCCA, VCCP1,
VCCP2, simultaneously.
Soft-mute
21.5msec(fS=48kHz)
VCCA
VCCP1
VCCP2
RSTX
REGG
REGD
MCLK
SDATA
BCLK
LRCLK
MUTEX
Speaker
Output
REGG
REGD
Caution: To eliminate pop noise when power supply is turned OFF, RSTX and MUTEX should always be set Low first. And also,
all power supply terminals should shut down together.
Order of ② and ③ can be interchanged
Figure 49. Power Supply Shutdown Sequence
21/49
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3. About Changing Audio Signal
Output PWM frequency is sixteen times the sampling frequency “fS”.
Therefore, output PWM frequency will also become unstable if MCLK becomes unstable when switching channel or
switching input. During unstable period, LC resonance may occur and short protection function may work.
To prevent “MCLK unstable condition”, please obey the following process.
(1) Mute “AUDIODATA” from scaler IC. (A)
(2) After muting “AUDIODATA” (B), set MUTEX=L (C).
(3) After MCLK goes to stable state, set MUTEX=H (D).
(4) Release mute “AUDIODATA” (E).
MCLK
AUDIODATA
MUTEX
OUTX
MCLK unstable period
A B C D E
PWM STOP
Soft-start
21.5msec(fs=48kHz.)
Soft-Mute
21.5msec(fs=48kHz.)
F
Order of E and F can be interchanged
Figure 50. Action at MCLK Unstable 1
Figure 51. Action at MCLK Unstable 2
MCLK
AUDIODATA
MUTEX
OUTX
MCLK　unstable　period
ERROR
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Especially, if the “twice and more frequency compared with normality” is entered, for some timing, the incorrect
data is set to the IC’s internal resistor and it generates noises continuously.
In case the “twice and more frequency compared with normality” is entered, please follow the timing chart
bellow and add a reset sequence.
(Please release reset after MCLK (BCLK) becomes stable, then release mute of BD28623MUV.)
MCLK
(BCLK)
AUDIODATA
MUTEX
RESETX
OUTX
MCLK(BCLK) unstable period
(Twice and more frequency
compared with normality.)
A B C D E F G
PWM STOP
Soft-Mute
21.5msec(fs=48kHz.)
More than TWAIT*
Soft-start
21.5msec(fs=48kHz.)
Order of F and G can be interchanged
*TWAIT: Refer to P.19
Figure 52. Action at MCLK Unstable 3
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4. Recovery Sequence from the Instantaneous Power Supply Interruption
VCCP1
VCCP2
VCCA
REGG
REGD
BCLK
LRCLK
Speaker
Output
SDATA
①Instantaneous power interruotion occurs.
③Please set MUTEX “L”
and stop digital audio data.
t
t
t
t
t
MUTEX
RSTX
t
MCLK
⑧Soft Start
21.5msec(fs=48kHz)
⑥Wait over TWAIT*
②VCC under 7V
=>UVLO Function ON
(Stop speaker out)
⑤Degital audio data communication
④Power recovery
⑦Please set MUTEX “H”
*TWAIT: Refer to P.19
Figure 53. Instantaneous Power Interruption Recovery Sequence
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
LRCLK
BCLK
SDATA
Lch Rch
32 clocks 32 clocks
MSB 22 21 20 19 18 17 16 15 14 MSB 22 21 20 19 18 17 16 15 1413 12 11 10 9 813 12 11 10 9 87 676
3
5 4 12 LSB 3
5 4 12 LSB
MSB 18 17 9 8 7 6 5 MSB 18 1716 15 14 13 12 11 10 4 3 2 1 LSB 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 LSB
LRCLK
BCLK
SDATA
Lch Rch
MSB MSB
LRCLK
BCLK
SDATA
Lch Rch
9 8 7 6 514 13 12 11 10 4 3 2 1 LSB 9 8 7 6 514 13 12 11 10 4 3 2 1 LSB
1/64fs
Application Information
1. About digital audio input
(1) Input digital audio signal sampling frequency (fS)
PWM frequency, Soft-start time, Soft-mute time, and the detection time of the DC voltage protection in the speaker
depend on the sampling frequency (fS) of the digital audio input.
Sampling Frequency of the
Digital Audio Input (fS)
PWM Frequency
(fPWM)
Soft-start / Soft-mute Time
DC Voltage Protection in the
Speaker Detection Time
32kHz
512kHz
32msec
1.02sec
44.1kHz
705.6kHz
23msec
0.74sec
48kHz
768kHz
21.5msec
0.68sec
(2) Format of digital audio input
MCLK: System Clock input signal
It will input LRCLK, BCLK, SDATA that synchronizes with this clock. MCLK frequency is 256 times the sampling
frequency (256fS) or 512 times the sampling frequency (512fS).
LRCLK: L/R Clock input signal
It corresponds to 32kHz/44.1kHz/48kHz clock (fS) which are same to the sampling frequency (fS). The audio
data of left and right channel for one sample is input to this section.
BCLK: Bit Clock input signal
It is used to latch data per bit using 64 times the sampling frequency (64fS).
SDATA: Data input signal
It is amplitude data. The data length is different according to the resolution of the input digital audio data. It
corresponds to 16/ 20/ 24 bits.
(3) I2S Data Format
The Low section of LRCLK becomes Lch and the High section of LRCLK becomes Rch.
After changing LRCLK, second bit becomes MSB.
Figure 54. I2S Data Format 64fs, 24bit Data
Figure 55. I2S Data Format 64fs, 20bit Data
Figure 56. I2S Data Format 64fs, 16bit Data
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(4) Audio Interface Format and Timing
Recommended timing and operating condition (MCLK, BCLK, LRCLK and SDATA)
Limit
No.
Parameter
Symbol
MCLK=256fS
MCLK=512fS
Unit
Min
Max
Min
Max
1
MCLK Frequency(Note 8-1)
fMCLK
8.192
±10%
12.288
±10%
16.384
±10%
24.576
±10%
MHz
2
LRCLK Frequency(Note 8-1)
fLRCLK
32
±10%
48
±10%
32
±10%
48
±10%
kHz
3
BCLK Frequency(Note 8-1)
fBCLK
2.048
±10%
3.072
±10%
2.048
±10%
3.072
±10%
MHz
4
Setup Time, LRCLK (Note 8-2)
tSU;LR
20
－
20
－
ns
5
Hold Time, LRCLK (Note 8-2)
tHD;LR
20
－
20
－
ns
6
Setup Time, SDATA
tSU;SD
20
－
20
－
ns
7
Hold Time, SDATA
tHD;SD
20
－
20
－
ns
8
MCLK, DUTY
dMCLK
40
60
40
60
%
9
LRCLK, DUTY
dLRCLK
40
60
40
60
%
10
BCLK, DUTY
dBCLK
40
60
40
60
%
(Note 8-1) Must be synchronized with BCLK, LRCK
(Note 8-2) This regulation is to keep rising edge of LRCK and rising edge of BCLK from overlapping.
Figure 57. Clock Timing
Figure 58. Audio Interface Timing
MCLK
1/ｆ
LRCLK
1/fLRCLK
BCLK
1/fBCLK
/ MCLK
LRCLK
BCLK
SDATA
tHD;LR tSU;LR
tHD;SD
;
tSU ;SD
;
tHD;LR
tSU;LR
tSU;SD
tHD;SD
26/49
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1. Terminal Setting
1) RSTX Pin, MUTEX Pin Function
Condition
RSTX
MUTEX
Normal
Error Detection
PWM Outputs
(OUT1P, 1N, 2P, 2N)
ERROR
PWM Outputs
(OUT1P, 1N, 2P, 2N)
ERROR
“RESET”(Note 9)
L
L/H
High-Z_Low(Note 10)
(Reset mode)
H
High-Z_Low
(Reset mode)
H
“MUTE”
H
L
High-Z_Low
(MUTE_ON)
H
High-Z_Low
(MUTE_ON)
L
“ACTIVE”
H
H
Active
(MUTE_OFF)
H
High-Z_Low
(MUTE_ON)
L
(Note 9) If RSTX is set Low, internal registers (I2S / I/F part, ×8 over sampling digital filter part, latch circuit when detecting ERROR) are initialized.
(Note 10) This means that all power transistors are OFF and output terminals are pulled down by 40kΩ (Typ).
27/49
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2) GAIN Pin Function
GAIN terminal sets the gain. Gain setting limits maximum output power.
GAIN setting depends on the value of speaker load, because maximum output power depends on speaker load.
Please set GAIN after setting MUTE to L. Pop noise may be occur if GAIN is set while MUTE=H.
GAIN
Gain Setting (BTL)
Output Power
L
17dB
Min 5 W (at 8Ω)
Pull-up (3.3V)
to 47kΩ (1/16W, J (±5%))
20dB
Min 10 W (at 8Ω)
H
26dB
-
VO_SP=VO_DF×GBTL
0V
Vcc Vcc
-Vcc
VO_DF=1.1Vrms
Digital Filter Output Signal
(Changed into Analog signal) Driver Output Signal
(converted in the analog signal)
Speaker Output Signal
(BTL Output Signal)
Maximum output
Depends on a setup
of Gain
Figure 60. Schematic of Output Equivalent
Figure 59.
where:
VIN is the I2S input level [dBFS]
GBTL is the gain setting [dB]
RL is the load resistance [Ω]
rDS is the resistance of FET [Ω]
(Typ=0.23Ω)
rDC is the DC resistance of inductor [Ω]
L
LDCDS
L
G
V
THDO R
Rrr
R
P
BTL
IN
2
20
20
%)1(
2
1010
VCC
VCC
VO_DF=1.1 Vrms
VO_SP=VO_DF x GBTL
rL
Cg
RL
Cg
VCC
rDS
VCC
rDS
ON
ON
OFF
OFF
rL
LDCDS
L
G
V
SPORrr
R
V
BTL
IN
2
1010 20
20
_
[Vrms]
[W]
-VCC
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2. About the Protection Function
Protection Function
Detecting & Releasing Condition
PWM Output
OUT1P,1N,2P,2N
ERROR
Output Short
Protection
Detecting
condition
Detecting current = 8A (Typ) /5A (Min. Tj=85°C)
High-Z_Low
(Latch)
L
(Latch)
DC Voltage
Protection in the
Speaker
Detecting
condition
At speaker output, impressed DC voltage over
0.68sec (fS=48kHz)
Over 3.5V (Gain=26dB)
Over 1.75V (Gain=20dB)
Over 1.225V (Gain=17dB)
High-Z_Low
(Latch)
L
(Latch)
Overheat
Protection
Detecting
condition
Chip temperature above 150°C(Min.)
High-Z_Low
L
Releasing
condition
Chip temperature below 120°C(Min.)
Normal
operation
Under Voltage
Protection
Detecting
condition
Power supply voltage below 7V (Typ)
High-Z_Low
H
Releasing
condition
Power supply voltage above 7.5V (Typ)
Normal
operation
Clock Stop
Protection
Detecting
condition
No change in MCLK for more than 1µsec (Typ) or
H
No change in BCLK for more than 1µsec (Typ) or
High-Z_Low
No change in LRCLK for more than 21µsec (at
fS=48kHz.).
Releasing
condition
Normal input to MCLK, BCLK and LRCLK.
Normal
operation
(Note) The ERROR pin is Nch open-drain output. ERROR pin is pulled up by 100kΩ resistor.
(Note) Once an IC is latched, the circuit is not released automatically even after the detecting status is removed.
Procedure ① or ② is needed for recovery.
①MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to High again.
②Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the internal power ON reset circuit activates.
(Note) Please remove the DC component in SCALER IC of the preceding paragraph of this IC so that DC voltage protection feature not to aim at does not
operate.
The High pass filter function for the DC component removal is not to BD28623MUV.
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(1) Output Short Protection (Short to Power Supply)
This IC has PWM output short protection circuit that stops the PWM output when the Speaker output (after LC-filter) is
short-circuited to the power supply due to wrong condition.
Detecting condition - It will detect when MUTEX pin is set High and the current that flows in the PWM output pin
becomes 8A(Typ) or more. The PWM output instantaneously enters the state of High-Z_Low if
detected, and the IC is latched.
Releasing method - ①After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to
High again.
② Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the
internal power ON reset circuit activates.
t
t
8A(Typ)
t
About 0.3µsec
t
Short to VCC Release from short to VCC
PWM out : IC latches with High-Z_Low. Released from latch state.
Over-current
Latch release
10msec(Min)
ERROR
OUT1P
OUT1N
OUT2P
OUT2N
MUTEX
Figure 61. Output Short Protection (Short to Power Supply) Sequence
30/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
(2) Output Short Protection6 (Short to GND)
This IC has PWM output short protection circuit that stops the PWM output when the Speaker output (after LC-filter) is
short-circuited to GND due to wrong condition.
Detecting condition - It will detect when MUTEX pin is set High and the current that flows in the PWM output terminal
becomes 8A(Typ) or more. The PWM output instantaneously enters the state of High-Z_Low if
detected, and the IC is latched.
Releasing method - ① After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to
High again.
② Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the
internal power ON reset circuit activates.
About 0.4µsec
t
t
t
8A(Typ)
t
Short to GND Release from short to GND
PWM out : IC latches with High-Z_Low. Released from latch state.
Latch release
10msec(Min)
Over-current
ERROR
OUT1P
OUT1N
OUT2P
OUT2N
MUTEX
Figure 62. Output Short Protection (Short to GND) Sequence
31/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
(3) DC Voltage Protection
When DC voltage is applied to the speaker due to wrong condition, this IC has protection circuit where the speaker is
protected from destruction.
Detecting condition - It will detect when MUTEX pin is set High and speaker output is more than 3.5V (TYP,
Gain=26dB setting), 1.75V (TYP, Gain=20dB setting), 1.225V (TYP, Gain=17dB setting),
0.68sec (fS=48kHz) or above. Once detected, the PWM output instantaneously enters the state
of High-Z_Low, and the IC is latched.
Releasing method - ①After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back
to High again.
② Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which
the internal power ON reset circuit activates.
t
t
t
t
Latch release
PWM out ：IC latches with High-Z_Low
Protection start about
0.68sec(fS=48kHz) impress DC
voltage to speaker output
Latch release
Abnormal condition
Impress DC voltage to speaker output ever 3.5V
Release abnormal condition
Soft-start
21.5msec(fS=48kHz)
10msec(Min)
3.5V
-3.5V
Speaker
Output
ERROR
OUT1P
OUT1N
OUT2P
OUT2N
MUTEX
(GAIN=26dB settings)
(Note) Please remove the DC component in SCALER IC of the preceding paragraph of this IC so that DC voltage protection feature not to aim at does not
operate.
The High pass filter function for the DC component removal is not to BD28623MUV.
Figure 63. DC Voltage Protection Sequence
32/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
(4) Overheat Protection
This IC has the overheat protection circuit that prevents thermal runaway when the temperature of the chip exceeds
Tjmax=150°C.
Detecting condition - It will detect when MUTEX pin is set High and the temperature of the chip becomes 150°C
(Min) or more. Speaker output turns MUTE immediately when high temperature protection is
detected.
Releasing condition - It will release when MUTEX pin is set High and the temperature of the chip becomes 120°C
(Min) or less. The speaker output is outputted through a soft-start when released. (Auto
recovery)
Tj
Speaker
Output
High-Z_Low
150℃
120℃
3.3V
ERROR
t
t
t
t
Soft-Start(Auto recovery)
21.5msec(fS=48kHz)
OUT1P
OUT1N
OUT2P
OUT2N
Figure 64. Overheat Protection Sequence
33/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
(5) Under Voltage Protection
This IC has under voltage protection circuit that mutes the speaker output mute once it detects extreme drop of the
power supply voltage.
Detecting condition - It will detect when MUTEX pin is set High and the power supply voltage becomes lower than 7V (Typ).
Speaker output turns MUTE immediately when under voltage protection is detected.
Releasing condition - It will release when MUTEX pin is set High and the power supply voltage becomes more than 7.5V
(Typ). The speaker output is outputted through a soft-start when released. (Auto recovery)
High-Z_Low
7.5V
7V
3.3V
t
t
t
t
Soft-start(Auto recovery)
21.5msec(fS=48kHz)
VCCA
VCCP1
VCCP2
Speaker
Output
ERROR
OUT1P
OUT1N
OUT2P
OUT2N
Figure 65. Under Voltage Protection Sequence
34/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
(6) Clock Stop Protection (MCLK)
This IC has clock stop protection circuit that mutes the speaker output when the MCLK signal of the digital audio input
stops.
Detecting condition - It will detect when MUTEX pin is set High and the MCLK signal stops for about 1µsec or more.
Speaker output turns MUTE immediately when clock stop protection is detected.
Releasing condition - It will release when MUTEX pin is set High and the MCLK signal returns to the normal clock
operation. The speaker output is outputted through a soft-start when released. (Auto recovery)
3.3V
t
t
t
t
High-Z_Low
Clock stop Clock recover
Protection start with
About 1µsec clock stop
Soft-start(Auto recovery)
21.5msec(fS=48kHz)
Speaker
Output
ERROR
OUT1P
OUT1N
OUT2P
OUT2N
MCLK
Figure 66. Clock Stop Protection (MCLK) Sequence
35/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
(7) Clock Stop Protection (BCLK)
This IC has clock stop protection circuit that mutes the speaker output when the BCLK signal of the digital audio input
stops.
Detecting condition - It will detect when MUTEX pin is set High and the BCLK signal stops for about 1µsec or more. Speaker
output turns MUTE immediately when clock stop protection is detected.
Releasing condition - It will release when MUTEX pin is set High and the BCLK signal returns to the normal clock operation.
The speaker output is outputted through a soft-start when released. (Auto recovery)
t
3.3V
t
t
t
Clock stop Clock recover
High-Z_Low
Protection start with
about 1µsec clock stop
Soft-start(Auto recovery)
21.5msec(fS=48kHz)
Speaker
Output
ERROR
OUT1P
OUT1N
OUT2P
OUT2N
BCLK
Figure 67. Clock Stop Protection (BCLK) Sequence
36/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
(8) Clock Stop Protection (LRCLK)
This IC has clock stop protection circuit that mutes the speaker output when the LRCLK signal of the digital audio input
stops.
Detecting condition - It will detect when MUTEX pin is set High and the LRCLK signal stops for about 21µsec (at fS=48kHz)
or more. Speaker output turns MUTE immediately when clock stop protection is detected.
Releasing condition - It will release when MUTEX pin is set High and the LRCLK signal returns to the normal clock operation.
The speaker output is outputted through a soft-start when released. (Auto recovery)
Clock stop Clock recover
High-Z_Low
Protection start about
21µsec(fs=48kHz) clock stop
3.3V
t
t
t
t
Soft-start(Auto recovery)
21.5msec(fS=48kHz)
Speaker
Output
ERROR
OUT1P
OUT1N
OUT2P
OUT2N
LRCLK
Figure 68. Clock Stop Protection (LRCLK) Sequence
37/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Parts Qty Parts No. Description Company Product No.
10μH / 3.8A / (±20%) / 7.6mm×7.6mm TOKO B1047DS-100M
10μH / 3.1A / (±20%) / 6.0mm×6.0mm Taiyo Yuden NRS6045T-100MMGK
1
R5 47kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm MCR01MZPJ473
4
R1, R2, R3, R4 0Ω / 1/10W / J(±5%) / 1.6mm×0.8mm MCR03EZPJ000
1 R24 100kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm MCR01MZPJ104
4
C8, C13,
C18, C23, 0.68μF / 50V / B(±10%） / 2.0mm×1.25mm GRM21BB31H684KAC4
4
C9, C12,
C19, C22 3.3μF / 16V / B(±10%） / 1.6mm×0.8mm GRM21BB31E335KA75
1
C16 0.1μF / 16V / B(±10%） / 1.6mm×0.8mm GRM188B11C104KA01
1
C17 10μF / 16V / B(±10%) / 2.0mm×1.25mm GRM21BB31C106KE15
3
C10, C14, C20 10μF / 35V / B(±10%) / 3.2mm×2.5mm MURATA GRM32EB3YA106KA12
L8, L13, L18, L23
ROHM
Inductor
4
Capacitor
MURATA
Resistor
3. Application Circuit Example
Stereo BTL Output, RL=8Ω/6Ω, Vcc≤22V
SDATA
GNDA
MUTEX
RSTX
LRCLKBCLKMCLK
ERROR
22 23 24
123456
8 9 10 11 12
131415161718
Digital Audio Source
3.3V
BSP1N
OUT1N
OUT1P
VCCP1
GNDP1
BSP1P
SP 1ch
(Lch)
GAIN
C9
3.3uF
C8
0.68uF
C10
10uF
C13
0.68uF
C12
3.3uF
R24
100kΩ
C17
10uF
C16
0.1uF
R5
47kΩ
VCCA
VCCP1
REGG REGD
Control
I/FI2S I/F
Under Voltage Protection
Clock Stop Protection
Output Short Protection
Output DC Voltage Protection
High Temperature Protection
feedback
7
19 20 21
VCCA
×4 Over
Sampling Digital Filter
PWM
Modulator
Driver
FET
2P
Driver
FET
2N
Driver
FET
1N
Driver
FET
1P
feedback
3.3V
3.3V
3.3V
3.3V
C14
10uF
BSP2P
OUT2P
OUT2N
VCCP2
GNDP2
BSP2N
SP 2ch
(Rch)
C22
3.3uF
C23
0.68uF
C20
10uF
C18
0.68uF
C19
3.3uF
L18
10uH
L23
10uH
L13
10uH
L8
10uH
GNDP2
GNDP2
GNDA
GNDA GNDA
GNDP1
GNDP2
R1
0Ω
R2
0Ω
R3
0Ω
R4
0Ω
VCCP2
To SCALER IC
Caution1: If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance
frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker.
Caution2: Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function
operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur
which sometimes leads to IC destruction.
The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the
LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the
magnetic saturation behavior, it instantaneously pass the heavy-current to IC.
Caution3: Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute
maximum ratings.
If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page.
Caution4: When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P.42 page, and must change LC filter value
to suppress the influence of the LRC resonance..
Caution5: This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry
out enough evaluations.
Figure 69. Application Circuit
38/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Parts Qty Parts No. Description Company Product No.
15μH / 2.9A / (±20%) / 7.6mm×7.6mm TOKO B1047DS-150M
15μH / 2.5A / (±20%) / 6.0mm×6.0mm Taiyo Yuden NRS6045T-150MMGK
1
R5 47kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm MCR01MZPJ473
4
R1, R2, R3, R4 0Ω / 1/10W / J(±5%) / 1.6mm×0.8mm MCR03EZPJ000
4
R8, R13, R18, R23 5.6Ω / 1/4W / J(±5%) / 1.6mm×0.8mm ESR03EZPJ5R6
1 R24 100kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm MCR01MZPJ104
4
C8A, C13A,
C18A, C23A
680pF / 50V / CH(±5%） / 1.0mm×0.5mm GRM1552C1H681JA01
4
C8, C13,
C18, C23, 0.47μF / 50V / B(±10%） / 2.0mm×1.25mm GRM21BB31H474KA87
4
C9, C12,
C19, C22 3.3μF / 16V / B(±10%） / 1.6mm×0.8mm GRM21BB31E335KA75
1
C16 0.1μF / 16V / B(±10%） / 1.6mm×0.8mm GRM188B11C104KA01
1
C17 10μF / 16V / B(±10%) / 2.0mm×1.25mm GRM21BB31C106KE15
3
C10, C14, C20 10μF / 35V / B(±10%) / 3.2mm×2.5mm MURATA GRM32EB3YA106KA12
L8, L13, L18, L23
ROHM
Inductor
4
Capacitor
MURATA
Resistor
Application Circuit Example
Stereo BTL Output, RL=8Ω/6Ω, Vcc=22V to 24V
SDATA
GNDA
MUTEX
RSTX
LRCLKBCLKMCLK
ERROR
22 23 24
123456
8 9 10 11 12
131415161718
Digital Audio Source
3.3V
BSP1N
OUT1N
OUT1P
VCCP1
GNDP1
BSP1P
SP 1ch
(Lch)
GAIN
C9
3.3uF
C8
0.47uF
C10
10uF
C13
0.47uF
C12
3.3uF
R24
100kΩ
C17
10uF
C16
0.1uF
R5
47kΩ
VCCA
VCCP1
REGG REGD
Control
I/FI2S I/F
Under Voltage Protection
Clock Stop Protection
Output Short Protection
Output DC Voltage Protection
High Temperature Protection
feedback
7
19 20 21
VCCA
×4 Over
Sampling Digital Filter
PWM
Modulator
Driver
FET
2P
Driver
FET
2N
Driver
FET
1N
Driver
FET
1P
feedback
3.3V
3.3V
3.3V
3.3V
C14
10uF
C13A
680pF
C8A
680pF
R13
5.6Ω
R8
5.6Ω
BSP2P
OUT2P
OUT2N
VCCP2
GNDP2
BSP2N
SP 2ch
(Rch)
C22
3.3uF
C23
0.47uF
C20
10uF
C18
0.47uF
C19
3.3uF
C18A
680pF
C23A
680pF
R18
5.6Ω
R23
5.6Ω
L18
15uH
L23
15uH
L13
15uH
L8
15uH
GNDP2
GNDP2
GNDA
GNDA GNDA
GNDP1
GNDP2
R1
0Ω
R2
0Ω
R3
0Ω
R4
0Ω
VCCP1
To SCALER IC
Caution1: If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance
frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker.
Caution2: Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function
operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur
which sometimes leads to IC destruction.
The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the
LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the
magnetic saturation behavior, it instantaneously pass the heavy-current to IC.
Caution3: Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute
maximum ratings.
If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page.
Caution4: When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P42 page, and must change LC filter value
to suppress the influence of the LRC resonance..
Caution5: This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry
out enough evaluations.
Figure 70. Application Circuit
39/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Parts Qty Parts No. Description Company Product No.
10μH / 3.8A / (±20%) / 7.6mm×7.6mm TOKO B1047DS-100M
10μH / 3.1A / (±20%) / 6.0mm×6.0mm Taiyo Yuden NRS6045T-100MMGK
1
R5 47kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm MCR01MZPJ473
4
R1, R2, R3, R4 0Ω / 1/10W / J(±5%) / 1.6mm×0.8mm MCR03EZPJ000
1 R24 100kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm MCR01MZPJ104
4
C8, C13,
C18, C23 1μF / 50V / B(±10%） / 2.0mm×1.25mm GRM21BB31H105KA12
4
C9, C12,
C19, C22 3.3μF / 16V / B(±10%） / 1.6mm×0.8mm GRM21BB31E335KA75
1
C16 0.1μF / 16V / B(±10%） / 1.6mm×0.8mm GRM188B11C104KA01
1
C17 10μF / 16V / B(±10%) / 2.0mm×1.25mm GRM21BB31C106KE15
3
C10, C14, C20 10μF / 35V / B(±10%) / 3.2mm×2.5mm MURATA GRM32EB3YA106KA12
L8, L13, L18, L23
ROHM
Inductor
4
Capacitor
MURATA
Resistor
Application Circuit Example
Monaural BTL Output, RL=4Ω
SDATA
GNDA
MUTEX
RSTX
LRCLKBCLKMCLK
ERROR
22 23 24
1 2 3 4 5 6
8 9 10 11 12
131415161718
Digital Audio Source
3.3V
BSP1N
OUT1N
OUT1P
VCCP1
GNDP1
BSP1P
SP 1ch
(Lch)
GAIN
C9
3.3uF
C8
1uF
C10
10uF
C13
1uF
C12
3.3uF
R24
100kΩ
C17
10uF
C16
0.1uF
R5
47kΩ
VCCA
VCCP1
REGG REGD
Control
I/FI2S I/F
Under Voltage Protection
Clock Stop Protection
Output Short Protection
Output DC Voltage Protection
High Temperature Protection
feedback
7
19 20 21
VCCA
×4 Over
Sampling Digital Filter
PWM
Modulator
Driver
FET
2P
Driver
FET
2N
Driver
FET
1N
Driver
FET
1P
feedback
3.3V
3.3V
3.3V
3.3V
C14
10uF
BSP2P
OUT2P
OUT2N
VCCP2
GNDP2
BSP2N
L13
10uH
L8
10uH
GNDP2
GNDA
GNDA GNDA
GNDP1
GNDP2
R1
0Ω
R2
0Ω
R3
0Ω
R4
0Ω
To SCALER IC
Caution1: If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance
frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker.
Caution2: Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function
operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur
which sometimes leads to IC destruction.
The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the
LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the
magnetic saturation behavior, it instantaneously pass the heavy-current to IC.
Caution3: Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute
maximum ratings.
If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page.
Caution4: When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P42 page, and must change LC filter value
to suppress the influence of the LRC resonance..
Caution5: This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry
out enough evaluations.
Figure 71. Application Circuit
40/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
1. About Using BD28623MUV ICs for 2.1ch or 2.2ch audio
Be careful when using two BD28623MUVs at the same time for 2.1ch or 2.2ch audio.
BD28623MUV doesn’t have the function that synchronizes both PWM frequencies of the two BD28623MUVs.
Beat noise may occur due to the difference between PWM frequencies.
Switching current flows to the GND of LC-Filter and only a small part to the speaker which lowers emission noise. When
you have two BD28623MUVs used at the same time with synchronized PWM output, there is common impedance in the
GND of the filter. The GND electric potential becomes higher which also causes noise to become higher. The GND of the
filter is shorted at one point when you use two BD28623MUVs at the same time. (Figure 73.)
Figure 72. Output LC Filter
Figure 73. Circuit Using Two ICs to 2.1ch audio
MAIN
SPEAKER
SUB
WOOFER
One point GND
DRIVER
DRIVER
OUT1P
OUT2P
BSP1P
BSP2P
BSP1N
BSP2N
OUT1N
OUT2N
41/49
© 2015 ROHM Co., Ltd. All rights reserved.
20.May.2016 Rev.002
www.rohm.com
TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
2. Selecting External Components
(1) Output LC Filter Circuit
An output filter is required to eliminate radio-frequency components exceeding the audio-frequency region supplied to
a load (speaker). Because this IC uses sampling clock frequencies from 512kHz (fS=32kHz) to 768kHz (fS=48kHz) in
the output PWM signals, the high-frequency components must be appropriately removed.
This section takes an example of an LC type LPF shown below, in which coil L and capacitor C compose a differential
filter with an attenuation property of -12dB/oct. A large part of switching currents of PWM signal flow to capacitor C,
and only a small part of the currents flow to speaker RL. This filter reduces unwanted emission this way. In addition,
coil L and capacitor C compose a filter against in-phase components, reducing unwanted emission further.
.
The following shows output LC filter constants with typical load impedances.
RL
L
C
4Ω
10μH
1μF
6Ω, 8Ω
(Vcc≤22V)
10μH
0.68μF
6Ω, 8Ω
(Vcc＞22V)
15μH
0.47μF
The inductors must be use with low ESR and with sufficient margin of rated DC current (saturation current).
Power loss will increase if inductors with high ESR are used.
When the short-circuit of the speaker output (After the LC filter) to VCC or GND occurs when the coil with small rated
DC current is used, IC destruction might be caused. Because the coil cause the magnetic saturation behavior, it
instantaneously pass the heavy-current to IC. (The coil of the rated DC current: 7.2A or more will be recommended
when using it by 22V or more.)
Select a closed magnetic circuit type product in normal cases to prevent emission noise.
Use capacitors with low equivalent series resistance, and good impedance characteristics at high frequency ranges
(100kHz or higher). Also, select an item with sufficient voltage rating because massive amount of high-frequency
current flow is expected.
Figure 74. Output LC Filter
RL
C
L
C
L
OUT_P
OUT_N
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(2) Snubber circuit constant
When overshoot of PWM Output exceeds absolute maximum rating, or when overshoot of PWM output negatively
affects EMC, or when ringing deteriorates the audio characteristic of the PWM output, snubber circuit is used as
shown below.
(a) Measure the spike resonance frequency “f1” of PWM output waveform (when rising) by using Low capacitance
Probe (e.g. FET probe) at the OUT terminal. (Figure 75)
Shorten GND lead of FET probe and monitor as near as possible to output pin.
(b) Measure the resonance frequency “f2” of the spike as the snubber-circuit R value equals 0Ω
(capacitor “C” is connected to GND)
Adjust the value of the capacitor “C” until it becomes (2 x f2 = f1)
The value of “C” that becomes (2xf2=f1) is 3 times of the parasitic capacity “Cp” that a spike is formed. (C=3Cp)
(c) Parasitic inductance “Lp” is calculated using the next formula.
(d) The character impedance Z of resonance is calculated from the parasitic capacity “Cp” and the parasitic inductance
Lp using the next formula.
(e) Set snubber circuit “R” same as the character impedance “Z”.
Set snubber circuit “C” 4 to 10 times of the parasitic capacity “Cp”.
If “C” is set larger than 10Cp, switching current will possibly increase.
The following table shows ROHM recommended value of “Snubber filter constants” when using ROHM 4 layer board.
(Vcc=22V to 24V, RL=8Ω, Po=10W+10W)
C
R
470pF to 820pF, 50V CH(±5%)
Murata GRM1552C1H Series
5.6Ω, 1/4W J(±5%)
ROHM ESR03EZPJ5R6
Figure76. Snubber Schematic
Figure 75. PWM Output Waveform
（Measure of Spike Resonance Frequency)
Spike resonance frequency
5nsec/div
Driver
GND
P
VCC
P
R
C
Snubb
er
LCfilte
r
OU
T
p
Cf 2
1
p2
1
L
p
p
C
L
Z
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3) Operating condition with the application component
Parameter
Parts No.
Limit
Unit
Conditions
Min
Typ
Max
Tolerance of Coupling capacitor
for Power supply
C10, C14,
C20
1(Note 11)
10
-
µF
B characteristics
Ceramic type capacitor
recommended
Tolerance of Capacitor for
REGG
C17
1(Note 11)
10
-
µF
B characteristics, 16V
Ceramic type capacitor
recommended
Tolerance of Capacitor for REGD
C16
0.05(Note 11)
0.1
-
µF
B characteristics, 16V
Ceramic type capacitor
recommended
Tolerance of Capacitor for BSP
C9, C12,
C19, C22
2.0(Note 11)
3.3
4.5(Note 12)
µF
B characteristics, 16V
Ceramic type capacitor
recommended
2.0(Note 11)
4.7
6.3(Note 12)
µF
Tolerance of GAIN Terminal Pull
up resistor
R5
43
47
51
kΩ
1/16W J(±5%) recommended
(Note 11) Should use the capacity of the capacitor not to be less than a minimum in consideration of temperature characteristics and dc-bias characteristics.
(Note 12) It is value in consideration of +/-10% of capacity unevenness, capacity rate of change 22%. Please use the capacitor within this limit.
44/49
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Power Dissipation
Measuring instrument : TH-156 (Shibukawa Kuwano Electrical Instruments Co., Ltd.)
Measuring conditions : Installation on ROHM’s board
Board size : 74.2mm x 74.2mm x 1.6mm (with thermal via on board)
Material：FR4
・The board and exposed heat sink on the back of package are connected by soldering.
PCB①：4- layer board (Top and bottom layer back copper foil size: 10.29mm2, 2nd and 3rd layer
back copper foil size: 5505mm2), θja = 56.6°C/W
PCB②：4-layer board（back copper foil size: 5505mm2), θja = 35.1°C/W
Use a thermal design that has sufficient margin so as not to exceed allowable power dissipation (Pd) in actual operating
conditions. This IC exposes its frame of the backside of package. Note that this part is used to provide heat dissipation
treatment to improve heat dissipation efficiency. Try to occupy as wide as possible heat dissipation pattern not only on the
board surface but also the backside.
Class D speaker amplifier has high efficiency and low heat generation in comparison with conventional analog power
amplifier. However, in case it is operated continuously by maximum output power, power dissipation (Pdiss) may exceed
package dissipation. Please consider heat design that power dissipation (Pdiss) does not exceed package dissipation (Pd) in
average power (Poav).
Package dissipation :
ja/TamaxTjWPd
Power dissipation :
1/1PoavWPdiss
where:
Tjmax is the maximum junction temperature=150°C
Ta is the peripheral temperature[°C],
θja is the thermal resistance of package[°C/W],
Poav is the average power [W],
η is the efficiency
PCB② 3.56W
PCB① 2.21W
VQFN024V4040
0
0.5
1
1.5
2
2.5
3
3.5
4
025 50 75 100 125 150
Ta [℃]
Pd [W]
Temperature : Ta [°C]
Power Dissipation : Pd [W]
Figure 77. Power Dissipation Curve
VCC
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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TSZ22111・15・001
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 78. Example of Monolithic IC Structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature
(Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold,
the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over-Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in
applications characterized by continuous operation or transitioning of the protection circuit.
N N
P+P
N N
P+
P Substrate
GND
NP+
N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
E
Parasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
47/49
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
TSZ02201-0C1C0E900290-1-2
Ordering Information
B
D
2
8
6
2
3
M
U
V
-
E 2
Part Number
Package
MUV: VQFN024V4040
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN024V4040 (TOP VIEW)
2 8 6 2 3
Part Number Marking
LOT Number
1PIN MARK
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© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
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Physical Dimension, Tape and Reel Information
Package Name
VQFN024V4040
49/49
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TSZ02201-0C1C0E900290-1-2
Revision History
Date
Revision
Changes
20.Aug.2015
001
First revision
20.May.2016
002
P.3 Pin Descriptions, I/O Equivalent Circuits Pin No. 5
P.4 Pin Descriptions, I/O Equivalent Circuits Pin No. 17
P.7 Electrical Characteristics
High level Input Voltage 1, Low level Input Voltage 1 Conditions
P.19 Timing Chart/ Power Supply Start-up Sequence
P.22 Timing Chart/ Action at MCLK Unstable 3
P.23 Timing Chart/ Instantaneous Power Interruption Recovery Sequence
P.38 Application Circuit Example/Product No.
P.39 Application Circuit Example /Description.
P.40 Output LC Filter
P.43 Operating condition with the application component
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Datasheet
Part Number BD28623MUV
Package VQFN024V4040
Unit Quantity 2500
Minimum Package Quantity 2500
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
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