High Current Molded Power Inductor - PA4340.XXXNLT Series
power.pulseelectronics.com P767.G (11/17) http://www.power.pulseelectronics.com/contact
SMT Power Inductor
Height: 3.0mm Max
Footprint: 6.0mm x 5.4mm Max
Current Rating: up to 23A
Inductance Range: 0.10uH to 33uH
Shielded construction and compact design
High current, low DCR, and high efciency
Minimized acoustic noise and minimized leakage ux
200Vdc Isolation between terminal and core
Electrical Specifications @ 25°C - Operating Temperature -55°C to +125°C
Part
Number
Inductance
100KHz, 1V
Rated
Current
DC
Resistance Saturation
Current
Max.MAX. TYP.
uH A mΩmΩA
PA4340.101NLT 0.10±30% 23.0 3.0 2.5 27.0
PA4340.201NLT 0.20±30% 16.0 3.2 2.6 25.0
PA4340.221NLT 0.22±30% 15.5 4.4 3.7 21.0
PA4340.331NLT 0.33±20% 14.0 5.0 4.3 18.0
PA4340.471NLT 0.47±20% 12.0 7.4 6.4 16.0
PA4340.681NLT 0.68±20% 8.5 12.0 10.0 14.0
PA4340.102NLT 1.00±20% 7.0 14.0 13.0 11.0
PA4340.122NLT 1.20±20% 6.5 16.0 14.0 11.0
PA4340.152NLT 1.50±20% 6.0 25.0 16.0 10.0
PA4340.222NLT 2.20±20% 5.5 35.0 25.0 9.0
PA4340.332NLT 3.30±20% 5.0 38.0 32.0 8.0
PA4340.472NLT 4.70±20% 4.6 53.0 50.0 6.0
PA4340.562NLT 5.60±20% 4.25 63.0 55.0 4.5
PA4340.682NLT 6.80±20% 4.0 76.2 68.0 4.3
PA4340.103NLT 10.00±20% 2.75 128.0 110.0 3.5
PA4340.153NLT 15.0±20% 2.1 190.0 165.0 2.6
PA4340.183NLT 18.0±20% 2.0 230.0 195.0 2.3
PA4340.223NLT 22.0±20% 1.9 250.0 220.0 1.7
PA4340.333NLT 33.0±20% 1.6 440.0 380.0 1.6
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P767.H(12/17)
High Current Molded Power Inductor - PA4340.XXXNLT Series
power.pulseelectronics.com P767.G (11/17) http://www.power.pulseelectronics.com/contact
SMT Power Inductor
1. Actual temperature of the component during system operation (ambient plus tempera-
ture rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops approximately
30% at the stated ambient temperature. This current is determined by placing the com-
ponent in the specified ambient environment and applying a short duration pulse cur-
rent (to eliminate self-heating eect) to the component.
3. The rated current is the DC current required to raise the component temperature by
approximately 40°C. Take note that the components’ performanc varies depending on the
system condition. It is suggested that the component be tested at the system level, to
verify the temperature rise of the component during system operation.
4. The part temperature (ambient+temp rise) should not exceed 125°C under worst case
operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool-
ing provisions all aect the part temperature. Part temperature should be verified in the
end application.
Notes:
PA4340.XXXNLT
Mechanical
Series A B C D E F G H
PA4340.XXXNLT 6.0 MAX 5.4 MAX 3.0 MAX (1.5) 3.5 MAX (1.8) (2.0) (2.5)
TAPE & REEL INFO
E
F
ØD
P
P P
W
T
K0
02
1
0
AN
B
G
QTY
A B G N E F D P P P W T K PCS/REEL
PA4340.XXXNLT Ø330 N/A 12 100 1.75 3.5 1.5 8 4 2 8 0.35 3.3 2000
0 0 0
2
1
REEL SIZE (mm) TAPE SIZE (mm)
SURFACE MOUNTING TYPE, REEL/TAPE LIST
Final Layout
All Dimensions in mm.
SUGGESTED PAD LAYOUT
2
12
P767.H(12/17)
5.5
High Current Molded Power Inductor - PA4340.XXXNLT Series
power.pulseelectronics.com P767.G (11/17) http://www.power.pulseelectronics.com/contact
SMT Power Inductor
Typical Performance Curves
3
P767.H(12/17)
High Current Molded Power Inductor - PA4340.XXXNLT Series
power.pulseelectronics.com P767.G (11/17) http://www.power.pulseelectronics.com/contact
SMT Power Inductor
4
P767.H(12/17)
High Current Molded Power Inductor - PA4340.XXXNLT Series
power.pulseelectronics.com P767.G (11/17) http://www.power.pulseelectronics.com/contact
SMT Power Inductor
5
P767.H(12/17)
High Current Molded Power Inductor - PA4340.XXXNLT Series
SMT Power Inductor
power.pulseelectronics.com http://www.power.pulseelectronics.com/contact
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