BPW 34
1Version 1.4 | 2018-05-30
Produktdatenblatt | Version 1.1
www.osram-os.com
BPW 34
DIL
Silicon PIN Photodiode
Applications
Electronic Equipment Industrial Automation (Machine controls, Light
barriers, Vision controls)
Features:
Package: Epoxy, di󰘯use
Corrosion Robustness Class: 3B
ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
Especially suitable for applications from 400 nm to 1100 nm
Short switching time (typ. 20 ns)
DIL plastic package with high packing density
Ordering Information
Type Photocurrent Photocurrent Ordering Code
typ.
Ev = 1000 lx; Std. Light A; VR = 5 V Ev = 1000 lx; Std. Light A; VR = 5 V
IPIP
BPW 34 ≥ 50 µA 80 µA Q62702P0073
BPW 34
2Version 1.4 | 2018-05-30
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating Temperature Top min.
max.
-40 °C
100 °C
Storage temperature Tstg min.
max.
-40 °C
100 °C
Reverse voltage VRmax. 32 V
Total power dissipation Ptot max. 150 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD 2 kV
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Characteristics
TA = 25 °C
Parameter Symbol Values
Spectral sensitivity
VR = 5 V; Std. Light A; T = 2856 K
S typ. 80 nA/lx
Wavelength of max sensitivity
λ
S max typ. 850 nm
Spectral range of sensitivity
λ
10% typ. 400 ... 1100
nm
Radiant sensitive area A typ. 7.02 mm²
Dimensions of active chip area L x W typ. 2.65 x 2.65
mm x mm
Half angle
φ
typ. 60 °
Dark current
VR = 10 V
IRtyp.
max.
2 nA
30 nA
Spectral sensitivity of the chip
λ
= 850 nm
S
λ
typ. 0.62 A / W
Quantum yield of the chip
λ
= 850 nm
η
typ. 0.90 Electrons
/ Photon
Open-circuit voltage
Ev = 1000 lx; Std. Light A
VOmin.
typ.
300 mV
365 mV
Short-circuit current
Ev = 1000 lx; Std. Light A
ISC typ. 80 µA
Rise time
VR = 5 V; RL = 50 Ω;
λ
= 850 nm; IP = 800 µA
trtyp. 0.02 µs
Fall time
VR = 5 V; RL = 50 Ω;
λ
= 850 nm; IP = 800 µA
tftyp. 0.02 µs
Forward voltage
IF = 100 mA; E = 0
VFtyp. 1.3 V
Capacitance
VR = 0 V; f = 1 MHz; E = 0
C0typ. 72 pF
Temperature coe󰘲cient of voltage TCVtyp. -2.6 mV / K
Temperature coe󰘲cient of short-circuit current
Std. Light A
TCItyp. 0.18 % / K
Noise equivalent power
VR = 10 V;
λ
= 850 nm
NEP typ. 0.041 pW /
Hz1/2
Detection limit
VR = 10 V;
λ
= 850 nm
D* typ. 6.5e12 cm x
Hz1/2 / W
BPW 34
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λ
OHF00078
0
rel
S
400
20
40
60
80
%
100
500 600 700 800 900 nm 1100
Relative Spectral Sensitivity 1), 2)
Srel = f (
λ
)
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100 0
0
0
Directional Characteristics 1), 2)
Srel = f (
φ
)
BPW 34
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0
OHF00080
Ι
R
R
V
0 5 10 15 V 20
1000
2000
3000
4000
pA
Dark Current 1), 2)
IR = f (VR) ; E = 0
E
OHF01066
V
0
10
P
Ι
-1
10
10 110 210 4
10 0
10 1
10 2
10
34
10
3
10
2
10
1
10
10 0
VO
µ
Am
V
Ι
P
VO
10 3lx
Photocurrent/Open-Circuit Voltage 1), 2)
IP (VR = 5 V) / VO = f (Ee)
V
OHF00081
R
-2
10
C
0
-1
10
0
10
1
10
2
10V
10
20
30
40
50
60
70
80
pF
100
Capacitance 1), 2)
C = f (VR); f = 1 MHz; E = 0;
BPW 34
6Version 1.4 | 2018-05-30
OHF05717
A
T
10-1
˚C020406080 100
R
I
nA
100
101
102
103
104
Dark Current 2)
IR = f (TA); E = 0; VR = 10 V
T
OHF00394
A
0
tot
P
020 40 60 80 ˚C 100
mW
20
40
60
80
100
120
140
160
Power Consumption
Ptot = f (TA);
BPW 34
7Version 1.4 | 2018-05-30
Dimensional Drawing 3)
GEOY6643
4.0 (0.157)
3.7 (0.146) 4.3 (0.169)
4.5 (0.177)
5.4 (0.213)
4.9 (0.193)
0.6 (0.024)
0.4 (0.016)
0.6 (0.024)
0.4 (0.016)
1.2 (0.047)
0.7 (0.028)
0.3 (0.012)
0.5 (0.020)
0.8 (0.031)
0.6 (0.024)
Cathode marking
0.6 (0.024)
0.8 (0.031)
1.9 (0.075)
2.2 (0.087)
3.0 (0.118)
3.5 (0.138)
0.6 (0.024)
0.4 (0.016)
Chip position
0.4 (0.016)
0.6 (0.024)
0.35 (0.014)
0.2 (0.008)
0 ... 5˚
5.08 (0.200)
spacing
1.4 (0.055)
Photosensitive area
2.65 (0.104) x 2.65 (0.104)
1.8 (0.071)
Approximate Weight: 78.0 mg
Package marking: Cathode
Corrosion test: Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC
60068-2-43)
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TTW Soldering
IEC-61760-1 TTW
0
0s
OHA04645
50
100
150
200
250
300
t
T
˚C
235 ˚C - 260 ˚C
First wave
20 40 60 80 100 120 140 160 180 200 220 240
Second wave
10 s max., max. contact time 5 s per wave
Preheating
T
100 ˚C
120 ˚C
130 ˚C
Typical
Cooling
ca. 3.5 K/s typical
ca. 2 K/s
ca. 5 K/s
Continuous line: typical process
Dotted line: process limits
< 150 K
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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED speci󰘰ed in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding e󰘯ect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal 󰘰lled materials including silver.
Metal 󰘰lled materials can be a󰘯ected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-
duction, and use. LEDs that showed visible discoloration when tested using the described tests above did
show no performance deviations within failure limits during the stated test duration. Respective failure limits
are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
BPW 34
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Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version in the OSRAM OS Webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.
BPW 34
11 Version 1.4 | 2018-05-30
Glossary
1) Testing temperature: TA = 25°C
2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures. These do not nec-
essarily correspond to the actual parameters of each single product, which could di󰘯er from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
BPW 34
12 Version 1.4 | 2018-05-30
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.