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126 Revision: 05-Oct-09
NFR25/25H
Vishay BCcomponents
Fusible, Non-Flammable Metal Film Leaded Resistors
A homogenous film of metal alloy is deposited on a high
grade ceramic body. After a helical groove has been cut in
the resistive layer, tinned connecting wires of electrolytic
copper are welded to the end-caps. The resistors are coated
with a grey, flame retardant lacquer which provides
electrical, mechanical, and climatic protection. The
encapsulation is resistant to all cleaning solvents in
accordance with IEC 60068-2-45.
FEATURES
Overload protection without risk of fire
Wide range of overload currents
(refer Fusing Characteristics graphs)
Lead (Pb)-free solder contacts
Pure tin plating provides compatibility with
lead (Pb)-free and lead containing soldering processes
Compliant to RoHS directive 2002/95/EC
APPLICATIONS
Audio
Video
Notes
(1) Ohmic values (other than resistance range) are available on request
R value is measured with probe distance of 24 mm ± 1 mm using 4-terminal method
TECHNICAL SPECIFICATIONS
DESCRIPTION
VALUE
NFR25 NFR25H
Resistance Range (1) 0.22 Ωto 15 kΩ
Resistance Tolerance and Series ± 5 %; E24 series
Rated Dissipation, P70 0.33 W 0.5 W
Thermal Resistance Rth 240 K/W 150 K/W
Temperature Coefficient:
0.22 Ω≤R4.7 Ω≤ ± 200 ppm/K ± 200 ppm/K
4.7 Ω<R15 Ω≤ ± 200 ppm/K ± 100 ppm/K
15 Ω<R15 kΩ≤ ± 100 ppm/K ± 100 ppm/K
Maximum Permissible Voltage, Umax. (DC or RMS) 250 V 350 V
Basic Specifications IEC 60115-1
Climatic Category (IEC 60068-1) 55/155/56
Stability After:
Load (1000 h, P70): ΔR max.: ± (1 % R + 0.05 Ω)
Long Term Damp Heat Test (56 Days) ΔR max.: ± (1 % R +0.05Ω)
Soldering (10 s, 260 °C) ΔR max.: ± (0.25 % R +0.05Ω)
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Revision: 05-Oct-09 127
NFR25/25H
Fusible, Non-Flammable Metal Film
Leaded Resistors Vishay BCcomponents
Notes
(1) Please refer to table PACKAGING for details
The PART NUMBER is shown to facilitate the introduction of a unified part numbering system for ordering products
DIMENSIONS
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: NFR2500002207JA100
MODEL/SIZE VARIANT TCR/MATERIAL VALUE TOLERANCE PAC K AG I N G (1) SPECIAL
NFR2500
NFR25H0
0 = Neutral
Z = Value overflow
(Special)
0 = Standard 3 digit value
1 digit multiplier
MULTIPLIER
7 = *10-3
8 = *10-2
9 = *10-1
0 = *100
1 = *101
2 = *102
J = ± 5 % N4
A5
A1
R5
The 2 digits
are used for
all special
parts.
00 = Standard
PRODUCT DESCRIPTION: NFR25 5 % A1 R22
NFR25 5 % A1 R22
MODEL/SIZE TOLERANCE PACKAGING (1) RESISTANCE VALUE
NFR25
NFR25H
± 5 % N4
A5
A1
R5
1K0 = 1 kΩ
4R7 = 4.7 Ω
PACKAGING
MODEL TAPING
AMMO PACK REEL
PIECES CODE PIECES CODE
NFR25, NFR25H Axial, 52 mm
5000 A5
5000 R5
1000 A1
NFR25, NFR25H Radial 4000 N4 - -
Ø D
L
1
L
2
Ø d
Outline
DIMENSIONS - Resistor types and relevant physical dimensions
TYPE Ø Dmax. L1 max. L2 max. Ø d
NFR25
2.5 6.5 7.5 0.58 ± 0.05
NFR25H
25RFN00002207JA100
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128 Revision: 05-Oct-09
NFR25/25H
Vishay BCcomponents Fusible, Non-Flammable Metal Film
Leaded Resistors
PRODUCTS WITH RADIAL LEADS (NFR25, NFR25H)
Note
Please refer document number 28721 “Packaging” for more detail
MARKING
The nominal resistance and tolerance are marked on the
resistor using four colored bands in accordance with
IEC 60062, marking codes for resistors and capacitors.
For ease of recognition a fifth ring is added, which is violet for
type NFR25 and white for type NFR25H.
OUTLINES
The length of the body (L1) is measured by inserting the
leads into holes of two identical gauge plates and moving
these plates parallel to each other until the resistor body is
clamped without deformation (IEC 60294).
FUNCTIONAL PERFORMANCE
PRODUCT CHARACTERIZATION
Standard values of nominal resistance are taken from the
E24 series for resistors with a tolerance of ± 5 %.
The values of the E24 series are in accordance with
IEC 60063.
Note
(1) The maximum voltage that may be continuously applied to the resistor element, see IEC 60115-1.
The maximum permissible hot-spot temperature is 155 °C.
DIMENSIONS - RADIAL TAPING
SYMBOL PARAMETER VALUE TOLERANCE UNIT
P Pitch of components 12.7 ± 1.0 mm
P0Feed-hole pitch 12.7 ± 0.2 mm
P1Feed-hole centre to lead at topside at the tape 3.85 ± 0.5 mm
P2Feed-hole center to body center 6.35 ± 1.0 mm
F Lead-to-lead distance 4.8 + 0.7/- 0 mm
W Tape width 18.0 ± 0.5 mm
W0Minimum hold down tape width 5.5 - mm
H1Component height 29 Max. mm
H0Lead wire clinch height 16.5 ± 0.5 mm
H Height of component from tape center 19.5 ± 1 mm
D0Feed-hole diameter 4.0 ± 0.2 mm
L Maximum length of snipped lead 11.0 - mm
L1Minimum lead wire (tape portion) shortest lead 2.5 - mm
P
P2
W
W0
D0
P1
P0
L1
L
F
H0
H1
H
MASS PER UNIT
TYPE MASS
(mg)
NFR25 201
NFR25H 201
LIMITING VALUES
TYPE LIMITING VOLTAGE U (1)
(V)
LIMITING POWER P70
(W)
NFR25 250 0.33
NFR25H 350 0.5
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Revision: 05-Oct-09 129
NFR25/25H
Fusible, Non-Flammable Metal Film
Leaded Resistors Vishay BCcomponents
The power that the resistor can dissipate depends on the operating
temperature.
The resistors will fuse without the risk of fire and within an indicated
range of overload. Fusing means that the resistive value of the
resistor increases at least 100 times.
The fusing characteristic is measured under constant voltage.
Maximum dissipation (Pmax.) in percentage of rated power as a
function of the ambient temperature (Tamb)
Derating
Fusing Characteristics
70 100 50
0
0
50
100
155
- 55
T
a
m
b
( °C)
P
max.
(%
P
rated
)
10
3
10
2
10
1
10
-1
12
4 0 8
P
overload
(W)
t
(s)
16 20 24
NFR25 This graph is based on measured data which may deviate
according to the application. Fusing Characteristics: 1 Ω
10
3
10
2
10
1
124 0 8
P
overload (W)
t
(s)
10
-1
NFR25 This graph is based on measured data
which may deviate according to the application.
Fusing Characteristics: 1 Ω R 15 Ω
10
3
10
2
10
1
10
-1
12
4 0 8
P
overload
(W)
t
(s)
16 20 24
NFR25H This graph is based on measured data
which may deviate according to the application.
Fusing Characteristics: 1 Ω
10
3
10
2
10
1
12 4 0 8
P
overload (W)
t
(s)
10
-1
NFR25 This graph is based on measured data
which may deviate according to the application.
Fusing Characteristics: 15 Ω R 15 kΩ
10
3
10
2
10
1
12
40 8
P
overload
(W)
t
(s)
16 20 24
10-1
NFR25H This graph is based on measured data
which may deviate according to the application.
Fusing Characteristic: 1 Ω R 15 kΩ
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130 Revision: 05-Oct-09
NFR25/25H
Vishay BCcomponents Fusible, Non-Flammable Metal Film
Leaded Resistors
Pulse Loading Capabilities
10
3
10
3
10
1
10
-1
50
20
10
5
2
P
max.
(W)
i
(s)
t
pi
/ = 1000
t
t
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
500
200
100
NFR25 Pulse on a regular basis; maximum permissible peak pulse power (Pmax.) as a function
of pulse duration (ti), 0.22 Ω≤R<15Ω
10
3
10
2
10
1
10
-1
i
(s)
t
P
max.
(W)
pi
/ = 1000
tt
20
2
100
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
NFR25 Pulse on a regular basis; maximum permissible peak pulse power (Pmax.) as a function
of pulse duration (ti), 15 Ω<R15 kΩ
600
01
500
400
300
200
100
U
max.
(V)
i (s)
t
10-6 10-5 10-4 10-3 10-2 10-1
NFR25 Pulse on a regular basis; maximum permissible peak pulse voltage Umax. as a function
of pulse duration (ti)
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Revision: 05-Oct-09 131
NFR25/25H
Fusible, Non-Flammable Metal Film
Leaded Resistors Vishay BCcomponents
Pulse Loading Capabilities
Application Information
10
3
10
2
10
12
5
10
20
50
100
200
500
pi
/ = 1000
tt
i
(s)
t
P
max.
(W)
10
-1
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
NFR25H Pulse on a regular basis; maximum permissible peak pulse power (Pmax.) as a function
of pulse duration (ti)
1200
0
400
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
800
U
max.
(V)
t
i
(s)
NFR25H Pulse on a regular basis; maximum permissible peak pulse voltage (Umax.) as a function
of pulse duration (ti)
100
0 0.2 0.6
0
0.4
20
40
60
80
P
(W)
T
(K)
NFR25 Hot-spot temperature rise (ΔT)
as a function of dissipated power
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132 Revision: 05-Oct-09
NFR25/25H
Vishay BCcomponents Fusible, Non-Flammable Metal Film
Leaded Resistors
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days).
The tests are carried out in accordance with IEC 60068-2-xx
test method, “Recommended basic climatic and mechanical
robustness testing procedure for electronic components” and
under standard atmospheric conditions according to
IEC 60068-1, 5.3.
In the Test Procedures and Requirements table the tests and
requirements are listed with reference to the relevant clauses
of IEC 60115-1 and IEC 60068-2-xx test methods. A short
description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying. For inflammability
requirements reference is made to IEC 60115-1.
All soldering tests are performed with mildly activated flux.
Minimum distance from resistor body to PCB = 1 mm
NFR25 Temperature rise (ΔT) at the lead end (soldering point)
as a function of dissipated power at various lead lengths after
mounting
NFR25H Hot-spot temperature rise (ΔT) as a
function of dissipated power.
Minimum distance from resistor body to PCB = 1 mm
NFR25H Temperature rise (ΔT) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting
Application Information
50
0 0.2 0.6
00.4
10
20
30
40
P
(W)
T
(K)
15 mm
5 mm
10 mm
100
0 0.2 0.6
00.4
20
40
60
80
P
(W)
T
(K)
50
0 0.2 0.6
0
0.4
10
20
30
40
P
(W)
T
(K)
15 mm
5 mm
10 mm
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Revision: 05-Oct-09 133
NFR25/25H
Fusible, Non-Flammable Metal Film
Leaded Resistors Vishay BCcomponents
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
NFR25 NFR25H
4.4.1 Visual examination No holes; clean surface; no damage
4.4.2 Dimensions (outline) Gauge (mm) See Dimensions Table
4.5
Resistance
(refer note on first page
for measuring distance)
Applied voltage (+ 0/- 10 %):
R< 10 Ω: 0.1 V
10 Ω≤R< 100 Ω:0.3V
100 Ω≤R<1kΩ:1V
1kΩ≤R<10kΩ:3V
10 kΩ≤R15 kΩ:10V
R-Rnom: max. ± 5 %
4.18 20 (Tb) Resistance to
soldering heat
Thermal shock: 10 s; 260 °C;
3 mm from body ΔR max.: ± (0.25 % R + 0.05 Ω)
4.29 45 (Xa) Component solvent
resistance
Isopropyl alcohol or H2O
followed by brushing No visual damage
4.17 20 (Ta) Solderability
2 s; 235 °C:
Solder bath method; SnPb40
3 s; 245 °C:
Solder bath method; SnAg3Cu0.5
Good tinning ( 95 % covered);
no damage
Solderability
(after aging)
8 h steam or 16 h 155 °C;
leads immersed 6 mm;
for 2 s at 235 °C: Solder bath (SnPb40)
for 3 s at 245 °C: Solder bath
(SnAg3Cu0.5) method
Good tinning ( 95 % covered);
no damage
4.7 Voltage proof on
insulation
URMS = 500 V during
1 min; metal block method No breakdown or flashover
4.16 Robustness of
terminations:
4.16.2 21 (Ua1) Tensile all samples Load 10 N; 10 s Number of failures < 10 x 10-6
4.16.3 21 (Ub) Bending half number
of samples Load 5 N; 4 x 90° Number of failures < 10 x 10-6
4.16.4 21 (Uc) Torsion other half
of samples 3x360° in opposite directions No damage
ΔR max.: ± (0.25 % R + 0.05 Ω)
4.20 29 (Eb) Bump 3 x 1500 bumps in 3 directions; 40 g No damage
ΔR max.: ± (0.25 % R + 0.05 Ω)
4.22 6 (Fc) Vibration
Frequency 10 Hz to 500 Hz;
displacement 1.5 mm or acceleration
10 g; 3 directions; total 6 h
(3 x 2 h)
No damage
ΔR max.: ± (0.25 % R+ 0.05 Ω)
4.19 14 (Na) Rapid change
of temperature
30 min at LCT and
30 min at UCT; 5 cycles
No visual damage
ΔR max.: ± (0.25 % + 0.05 Ω)
4.23 Climatic sequence:
4.23.2 2 (Ba) Dry heat 16 h; 155 °C
4.23.3 30 (Db) Damp heat (accelerated)
1st cycle 24 h; 55 °C; 90 % to 100 % RH
4.23.4 1 (Aa) Cold 2 h; - 55 °C
4.23.5 13 (M) Low air pressure 2 h; 8.5 kPa; 15 °C to 35 °C
4.23.6 30 (Db) Damp heat (accelerated)
remaining cycles 5days;55°C; 95 % to 100 % RH Rins min.: 103MΩ
ΔR max.: ± (1.5 % R + 0.1 Ω)
4.24 78 (Cab) Damp heat
(steady state)
56 days; 40 °C; 90 % to 95 % RH;
loaded with 0.01 P70
(IEC steps: 0 V to 100 V)
Rins max.: 1000 MΩ
ΔR max.: ± (1 % R + 0.05 Ω)
4.25.1 Endurance (at 70 °C)
1000 h;
loaded with P70 or Umax.;
1.5 h ON and 0.5 h OFF
ΔR max.: ± (1 % R + 0.05 Ω)
4.25.3 Endurance at upper
category temperature
1000 h;
no load ΔR max.: ± (1 % R + 0.05 Ω)
4.8 Temperature coefficient
Between - 55 °C and + 155 °C
0.22 Ω≤R4.7 Ω≤ ± 200 ppm/K ± 200 ppm/K
4.7 Ω<R15 Ω≤ ± 200 ppm/K ± 100 ppm/K
15 Ω<R15 kΩ≤ ± 100 ppm/K ± 100 ppm/K
4.12 Noise IEC 60195 < 0.1 µV/V
4.26 Accidental overload Cheese-cloth Non flammable
4.6.1.1 Insulation resistance Maximum voltage Umax. DC = 500 V
after 1 min; metal block method Rins min.: 104MΩ
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134 Revision: 05-Oct-09
NFR25/25H
Vishay BCcomponents Fusible, Non-Flammable Metal Film
Leaded Resistors
12NC INFORMATION FOR HISTORICAL CODING REFERENCES
The resistors have a 12-digit numeric code starting with 23
The subsequent 7 digits indicate the resistor type and
packaging
The remaining 3 digits indicate the resistance values:
- The first 2 digits indicate the resistance value
- The last digit indicates the resistance decade
Last Digit of 12NC Indicating Resistance Decade
12NC Example
The 12NC for a NFR25 resistor with value 750 Ω, supplied
on a bandolier of 1000 units in ammopack is:
2322 205 13751.
RESISTANCE DECADE LAST DIGIT
0.22 Ωto 0.91 Ω7
1Ωto 9.1 Ω8
10 Ωto 91 Ω9
100 Ωto 910 Ω1
1kΩto 9.1 kΩ2
10 kΩto 15 kΩ3
12NC - Resistor type and packaging
TYPE
23.. ... .....
BANDOLIER IN AMMOPACK BANDOLIER
ON REEL
RADIAL TAPED STRAIGHT LEADS STRAIGHT LEADS
4000
UNITS
1000
UNITS
5000
UNITS
5000
UNITS
NFR25 06 204 03... 22 205 13... 22 205 33... 22 205 23...
NFR25H 06 207 03... 22 207 13... 22 207 33... 22 207 23...
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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Legal Disclaimer Notice
Vishay
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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