Semiconductor Components Industries, LLC, 2003
April, 2003 - Rev. 4 1Publication Order Number:
MBR340/D
MBR340
Preferred Device
Axial Lead Rectifier
. . . employing the Schottky Barrier principle in a large area
metal-to-silicon power diode. State-of-the-art geometry features
epitaxial construction with oxide passivation and metal overlap
contact. Ideally suited for use as rectifiers in low-voltage,
high-frequency inverters, free wheeling diodes, and polarity
protection diodes.
Extremely Low VF
Low Power Loss/High Efficiency
Highly Stable Oxide Passivated Junction
Low Stored Charge, Majority Carrier Conduction
Mechanical Characteristics:
Case: Epoxy, Molded
Weight: 1.1 gram (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
220°C Max. for 10 Seconds, 1/16 from case
Shipped in plastic bags, 500 per bag
Available Tape and Reeled, 1500 per reel, by adding an “RL’ suffix
to the part number
Polarity: Cathode indicated by Polarity Band
Marking: B340
MAXIMUM RATINGS
Rating Symbol Max Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40 V
Average Rectified Forward Current
TA = 65°C (RJA = 28°C/W,
P.C. Board Mounting)
IO3.0 A
Non-Repetitive Peak
Surge Current (Note 1)
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz, TL = 75°C)
IFSM 80 A
Operating and Storage Junction
Temperature Range
(Reverse Voltage Applied)
TJ, Tstg -65 to +150 °C
Peak Operating Junction
Temperature
(Forward Current Applied)
TJ(pk) 150 °C
1. Lead Temperature reference is cathode lead 1/32 from case.
Device Package Shipping
ORDERING INFORMATION
AXIAL LEAD
CASE 267-05
(DO-201AD)
STYLE 1
SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERES
40 VOLTS
Preferred devices are recommended choices for future use
and best overall value.
MBR340 Axial Lead 500 Units/Bag
MBR340RL Axial Lead 1500/Tape & Reel
MARKING DIAGRAM
MBR
340
MBR340 = Device Code
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MBR340
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient (see Note 4, Mounting Method 3) RθJA 28 °C/W
ELECTRICAL CHARACTERISTICS (TL = 25°C unless otherwise noted) (Note 2)
Characteristic Symbol Max Unit
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 1.0 Amp)
(iF = 3.0 Amp)
(iF = 9.4 Amp)
vF0.500
0.600
0.850
V
Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 3)
TL = 25°C
TL = 100°C
iR0.60
20
mA
2. Lead Temperature reference is cathode lead 1/32 from case.
3. Pulse Test: Pulse Width = 300 µs, Duty Cycle = 2.0%.
TA, AMBIENT TEMPERATURE (C°)
20 1006040 80
4.0
2.0
8.0
6.0
0
10
dc
SQUARE
WAVE
120 140 160 180 200
I , AVERAGE FORWARD CURRENT (AMPS)
F (AV)
VR REVERSE VOLTAGE (VOLTS)
02010 30 40
40
0.001
100
0.002
0.004
0.01
0.04
0.02
0.1
0.4
0.2
20
10
4.0
2.0
1.0
25°C
75°C
100°C
10
10
100
1000
vF, INSTANTANEOUS VOLTAGE (VOLTS)
0.20.1 0.3 0.4 0.5
5.0
0.01
0.03
0.02
0.07
0.2
0.1
20
10
3.0
2.0
1.0
0.70.6 0.8 0.9
0.3
0.05
0.5
0.7
150°C
I , REVERSE CURRENT (mA)
R
7.0
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
25°C
100°C
TJ = 150°C
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selec-
tions can be estimated from these same curves if VR is sufficiently
below rated VR.
Figure 1. Typical Forward Voltage
Figure 2. Typical Reverse Current*
Figure 3. Current Derating
(Mounting Method #3 per Note 4)
MBR340
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3
VR REVERSE VOLTAGE (VOLTS)IF (AV), AVERAGE FORWARD CURRENT (AMPS)
0 2.01.0 3.0 4.0 5.0
0.5
1.0
1.5
2.0
2.5
TJ = 150°C
20
(CAPACITIVE LOAD)
P , AVERAGE POWER DISSIPATION (WATTS)
F (AV)
10
dc
IPK
IAV
5.0
SQUARE
WAVE
02010 30 40 50
70
60
300
400
500
TJ = 25°C
C, CAPACITANCE (pF)
200
90
80
50
100
RESISTIVE LOAD
Figure 4. Power Dissipation Figure 5. Typical Capacitance
IPK
IAV
TYPICAL VALUES FOR RθJA IN STILL AIR
Data shown for thermal resistance junction-to-ambient
(RθJA) for the mountings shown is to be used as typical
guideline values for preliminary engineering, or in case the
tie point temperature cannot be measured.
1
2
3
Mounting
Method
Lead Length, L (in)
1/8 1/4 1/2 3/4 RθJA
50 51 53 55 °C/W
°C/W
°C/W
58 59 61 63
28
NOTE 4 — MOUNTING DATA
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
Mounting Method 1
P.C. Board where available
copper surface is small.
L L L
Mounting Method 2
Vector Push-In
Terminals T-28
L
Mounting Method 3
P.C. Board with
2-1/2 X 2-1/2
copper surface.
L = 1/2’
Board Ground Plane
MBR340
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4
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267-05
(DO-201AD)
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
12
KA
K
D
B
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.287 0.374 7.30 9.50
B0.189 0.209 4.80 5.30
D0.047 0.051 1.20 1.30
K1.000 −−− 25.40 −−−
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MBR340/D
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