5962R8551401VGA - ANALOG DEVICES

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

Change to military drawing format. Changes to output adjustment range. Add

conditions for load regulation test at -55°C and +125°C. Change group A

subgroups for load regulation and line regulation tests, and output voltage

temperature coefficient. Add vendor CAGE 64155. Editorial changes

throughout.

88-03-17

M. A. FRYE

Add vendor CAGE 07933. Add vendor CAGE 54186. Add case outline 2.

Change output voltage temperature coefficient test limits.

89-04-12

M. A. FRYE

Add device type 02. Editorial changes throughout. Delete vendors CAGEs

54186 and 07933. Add vendor CAGE 1ES66.

92-11-25

M. A. FRYE

Add class V devices. Replace CAGE 06665 with 24355. Add case outline H

and TABLE IIB. Make changes to 1.2.2 and TABLE II.

97-06-10

R. MONNIN

Add radiation hardness assurance requirements. - ro

98-08-07

R. MONNIN

Make changes to 1.5, table IIA, 4.4.1b, and output voltage temperature

coefficient test as specified in table I. - ro

00-01-21

R. MONNIN

Add device types 03 and 04. Make changes 1.2.2 and to the output voltage

noise test as specified under TABLE I. - ro

01-02-07

R. MONNIN

Drawing updated to reflect current requirements. -rrp

05-12-07

R. MONNIN

THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.

CURRENT CAGE CODE 67268

REV

SHEET

REV

SHEET

REV STATUS REV H H H H H H H H H H

OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10

PMIC N/A PREPARED BY

DONALD OSBORNE

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

DANIEL A. DiCENZO

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

APPROVED BY

N. A. HAUCK

MICROCIRCUIT, LINEAR, RADIATION

HARDENED, +5 VOLT ADJUSTABLE PRECISION

VOLTAGE REFERENCE, MONOLITHIC SILICON

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

86-03-08

AMSC N/A

REVISION LEVEL

H SIZE

A CAGE CODE

14933

85514

SHEET

1 OF

DSCC FORM 2233

APR 97 5962-E061-06

STANDARD

MICROCIRCUIT DRAWING

SIZE

85514

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APR 97

1. SCOPE

1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)

and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or

Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

1.2 PIN. The PIN is as shown in the following examples.

For device classes M and Q:

85514 01 G X

Drawing number Device type

(see 1.2.1) Case outline

(see 1.2.2) Lead finish

(see 1.2.3)

For device class V:

5962 R 85514 01 V G X

Federal

stock class

designator

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Device

class

designator

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

\ / (see 1.2.3)

Drawing number

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are

marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

1.2.2 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function Output voltage noise

01 REF02A Precision reference +5-volt 18 µVP-P

adjustable output

02 REF02 Precision reference +5-volt 18 µVP-P

adjustable output

03 REF02A Precision reference +5-volt 100 µVP-P

adjustable output

04 REF02 Precision reference +5-volt 100 µVP-P

adjustable output

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed

below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q

designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation

M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-

JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A

Q or V Certification and qualification to MIL-PRF-38535

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1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

G MACY1-X8 8 Can

H GDFP1-F10 or CDFP2-F10 10 Flat pack

P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

2 CQCC1-N20 20 Square leadless chip carrier

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

1.3 Absolute maximum ratings. 1/

Input voltage (VIN)........................................................................................ 40 V dc

Power dissipation (PD) ................................................................................. 500 mW 2/

Output short circuit duration.......................................................................... Indefinite

Storage temperature..................................................................................... -65°C to +150°C

Lead temperature (soldering, 10 seconds)................................................... +300°C

Junction temperature (TJ)............................................................................. +150°C

Thermal resistance, junction-to-case (θJC)................................................... See MIL-STD-1835

1.4 Recommended operating conditions.

Ambient operating temperature range (TA) .................................................. -55°C to +125°C

1.5 Radiation features.

Maximum total dose available (dose rate = 50 – 300 rads(Si)/s)......................... 100 Krads(Si) 3/

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICAT ION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE ST ANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ Derate 7.1 mW/°C above +80°C for the "G" and "H" packages, 6.6 mW/°C above +75°C for the "P" package, and

7.8 mW/°C above +72°C for the "2" package.

3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.

Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,

method 1019, condition A.

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DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or

from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and

herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change that affects this drawing.

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TABLE I. Electrical performance characteristics.

Test

Symbol

Conditions 1/

-55°C ≤ TA ≤ +125°C

unless otherwise specified

Group A

subgroups

Device

type

Limits Unit

Min Max

Quiescent supply current ISY No load 1 All 1.4 mA

2,3 2.0

M,D,P,L,R 2/ 3/ 1 01 1.4

Output adjustment 4/

range ∆VTRIM R

P = 10 kΩ, TA = +25°C 1 All

±3.0 %

Output voltage VO I

L = 0 mA 1 01,03 4.985 5.015 V

02,04 4.975 5.025

2,3 01,03 4.978 5.022

02,04 4.953 5.047

M,D,P,L,R 2/ 3/ 1 01 4.975 5.025

Short circuit current 4/ IOS V

O = 0 V, TA = +25°C 1 All +15 +60 mA

Sink current 4/ IS T

A = +25°C 1 All -0.3 mA

Load regulation LD reg IL = 0 mA to 10 mA 5/ 1 All 0.01 %/mA

M,D,P,L,R 2/ 3/ 1 01 0.015

IL = 0 mA to 8 mA 5/ 2,3 01,03 0.012

02,04 0.015

Line regulation LN reg VIN = 8 V to 33 V 5/ 1 01,03 0.010 %/V

02,04 0.012

2,3 All 0.015

M,D,P,L,R 2/ 3/ 1 01 0.030

Load current

IL T

A = +25°C 4/ 6/ 1 All 10 mA

Output voltage noise enp-p 0.1 Hz to 10 Hz 4/ 4 01,02 18

µVP-P

03,04 100

Output voltage TCVO 4/ 7/ 8 01,03

±8.5 ppm/°C

temperature coefficient 02,04 ±25

1/ VIN = 15 V.

2/ Devices supplied to this drawing have been characterized through all levels M, D, P, L, and R of irradiation. However,

this device is only tested at the "R" level. Pre and Post irradiation values are identical unless otherwise specified

in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C.

3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.

Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,

method 1019, condition A.

4/ This parameter is not tested to post irradiation.

5/ Line and load regulation specifications include the effect of self heating.

6/ Minimum of 10 mA load current guaranteed by load regulation test.

7/ TCVO = (VMAX - VMIN) / 5 V x ((-55°C to +125°C) x (1 x 106)) / 180°C.

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Device types 01,02,03,04 01 01,02,03,04

Case outlines G and P H 2

Terminal number Terminal symbol

1 NC NC NC

2 VIN V

IN NC

3 TEMP TEMP NC

4 GND GND NC

5 TRIM TRIM

VIN

6 VOUT V

OUT NC

7 NC NC TEMP

8 NC NC NC

9 --- NC NC

10 --- NC GND

11 --- --- NC

12 --- --- TRIM

13 --- --- NC

14 --- --- NC

15 --- ---

VOUT

16 --- --- NC

17 --- --- NC

18 --- --- NC

19 --- --- NC

20 --- --- NC

NC = No connection

FIGURE 1. Terminal connections.

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FIGURE 2. Radiation exposure circuit.

STANDARD

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3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the

option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 59 (see MIL-PRF-38535, appendix A).

4. VERIFICATION

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in

accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted

on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in

accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1015.

(2) TA = +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table IIA herein.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the

device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under

document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table IIA herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in

accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups

A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with

MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device

class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for

device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections

(see 4.4.1 through 4.4.4).

4.4.1 Group A inspection.

a. Tests shall be as specified in table IIA herein.

b. Subgroups 5, 6, 7, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.

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TABLE IIA. Electrical test requirements.

Test requirements Subgroups

(in accordance with

MIL-STD-883,

method 5005, table I)

Subgroups

(in accordance with

MIL-PRF-38535, table III)

Device

class M Device

class Q Device

class V

Interim electrical

parameters (see 4.2) --- --- ---

Final electrical

parameters (see 4.2) 1,2,3,4 1/ 1,2,3,4 1/ 1,2,3,4 1/ 2/

Group A test

requirements (see 4.4) 1,2,3,8 1,2,3,8 1,2,3,8

Group C end-point electrical

parameters (see 4.4) 1,2,3 1,2,3 1,2,3 2/

Group D end-point electrical

parameters (see 4.4) 1,2,3 1,2,3 1,2,3

Group E end-point electrical

parameters (see 4.4) --- --- 1

1/ PDA applies to subgroup 1.

2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits

shall be computed with reference to the previous interim electrical parameters.

TABLE IIB. 240 hour and 1000 hour life test deltas.

Test Symbol End point Delta Units

Min Max

Output voltage

VO 4.985 5.015 ±3 mV

4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.

4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:

a. Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level control

and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,

outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-

STD-883.

b. TA = +125°C, minimum.

c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

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4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,

or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The

test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-

883.

4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.

4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured

(see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-PRF-38535. End-point electrical

parameters shall be as specified in table IIA herein.

4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883

method 1019, condition A and as specified herein.

4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater than

5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-

irradiation end-point electrical parameter limit at 25°C ±5°C. Testing shall be performed at initial qualification and after any

design or process changes which may affect the RHA response of the device.

4.4.4.2 Dose rate burnout. When required by the customer test shall be performed on devices, SEC, or approved test

structures at technology qualifications and after any design or process changes which may effect the RHA capability of the

process. Dose rate burnout shall be performed in accordance with test method 1023 of MIL-ST D-883 and as specified herein.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes

Q and V or MIL-PRF-38535, appendix A for device class M.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users

and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic

devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0525.

6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone

(614) 692-0547.

6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535 and MIL-HDBK-1331.

6.6 Sources of supply.

6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.

The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to

this drawing.

6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.

The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been

submitted to and accepted by DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 05-12-07

Approved sources of supply for SMD 85514 are listed below for immediate acquisition information only and shall be

added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to

include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of

compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next

dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of

supply at http://www.dscc.dla.mil/Programs/Smcr/ .

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

8551401GA 24355 REF02AJ/883

3/ REF-02AH/883

8551401GC 3/ REF02AJ/883B

8551401PA 24355 REF02AZ/883

3/ REF-02AJ8/883

3/ REF02AZ/883B

85514012A 24355 REF-02ARC/883

8551402GC 3/ REF02J/883B

8551402PA 3/ REF02Z/883B

85514022C 3/ REF02RC/883B

5962-8551401VGA 24355 REF02AJ/QMLV

5962-8551401VHA 24355 REF02AL/QMLV

5962-8551401VPA 24355 REF02AZ/QMLV

5962-8551401V2A 24355 REF02ARC/QMLV

5962R8551401VGA 24355 REF02AJ/QMLR

5962R8551401VHA 24355 REF02AL/QMLR

5962R8551401VPA 24355 REF02AZ/QMLR

5962R8551401V2A 24355 REF02ARC/QMLR

8551403GC 1ES66 REF02AJ/883B

8551403PA 1ES66 REF02AZ/883B

1 of 2

STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

8551404GC 1ES66 REF02J/883B

8551404PA 1ES66 REF02Z/883B

85514042C 1ES66 REF02RC/883B

1/ The lead finish shown for each PIN representing a hermetic

package is the most readily available from the manufacturer

listed for that part. If the desired lead finish is not listed

contact the vendor to determine its availability.

2/ Caution. Do not use this number for item acquisition. Items

acquired to this number may not satisfy the performance

requirements of this drawing.

3/ Not available from an approved source of supply.

Vendor CAGE Vendor name

number and address

24355 Analog Devices

RT 1 Industrial Park

P.O. Box 9106

Norwood, MA 02062

Point of contact: 1500 Space Park Drive

P.O. Box 58020

Santa Clara, CA 95050-8020

1ES66 Maxim Integrated Products

120 San Gabriel Drive

Sunnyvale, CA 94086-5125

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.

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