ATXMEGA32D4-AUR - Atmel - Datasheet.Live

Features

•High-performance, low-power Atmel® AVR® XMEGA® 8/16-bit Microcontroller

•Nonvolatile program and data memories

– 16K - 128KBytes of in-system self-programmable flash

– 4K - 8KBytes boot section

– 1K - 2KBytes EEPROM

– 2K - 8KBytes internal SRAM

•Peripheral Features

– Four-channel event system

– Four 16-bit timer/counters

Three timer/counters with four output compare or input capture channels

One timer/counter with two output compare or input capture channels

High-resolution extension on two timer/counters

Advanced waveform extension (AWeX) on one timer/counter

– Two USARTs with IrDA support for one USART

– Two Two-wire interfaces with dual address match (I2C and SMBus compatible)

– Two serial peripheral interfaces (SPIs)

– CRC-16 (CRC-CCITT) and CRC-32 (IEEE 802.3) generator

– 16-bit real time counter (RTC) with separate oscillator

– One twelve-channel, 12-bit, 200ksps Analog to Digital Converter

– Two Analog Comparators with window compare function, and current sources

– External interrupts on all general purpose I/O pins

– Programmable watchdog timer with separate on-chip ultra low power oscillator

– QTouch® library support

Capacitive touch buttons, sliders and wheels

•Special microcontroller features

– Power-on reset and programmable brown-out detection

– Internal and external clock options with PLL and prescaler

– Programmable multilevel interrupt controller

– Five sleep modes

– Programming and debug interface

PDI (program and debug interface)

•I/O and packages

– 34 programmable I/O pins

– 44 - lead TQFP

– 44 - pad VQFN/QFN

– 49 - ball VFBGA

•Operating voltage

– 1.6 – 3.6V

•Operating frequency

– 0 – 12MHz from 1.6V

–0 – 32MHz from 2.7V

Typical Applications

•Industrial control •Climate control •Low power battery applications

•Factory automation •RF and ZigBee®•Power tools

•Building control •Motor control •HVAC

•Board control •Sensor control •Utility metering

•White goods •Optical •Medical applications

8/16-bit Atmel

XMEGA D4

Microcontroller

ATxmega128D4

ATxmega64D4

ATxmega32D4

ATxmega16D4

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XMEGA D4

1. Ordering Information

Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.

2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also

Halide free and fully Green.

3. For packaging information see ”Packaging information” on page 61.

4. Tape and Reel.

Ordering Code Flash [Bytes] EEPROM [Bytes] SRAM [Bytes] Speed [MHz] Power supply Package (1)(2)(3) Temp.

ATxmega128D4-AU 128K + 8K 2K 8K

32 1.6 - 3.6V

44A

-40°C - 85°C

ATxmega128D4-AUR (4) 128K + 8K 2K 8K

ATxmega64D4-AU 64K + 4K 2K 4K

ATxmega64D4-AUR (4) 64K + 4K 2K 4K

ATxmega32D4-AU 32K + 4K 1K 4K

ATxmega32D4-AUR (4) 32K + 4K 1K 4K

ATxmega16D4-AU 16K + 4K 1K 2K

ATxmega16D4-AUR (4) 16K + 4K 1K 2K

ATxmega128D4-MH 128K + 8K 2K 8K

44M1

ATxmega128D4-MHR (4) 128K + 8K 2K 8K

ATxmega64D4-MH 64K + 4K 2K 4K

ATxmega64D4-MHR (4) 64K + 4K 2K 4K

ATxmega32D4-MH 32K + 4K 1K 4K

ATxmega32D4-MHR (4) 32K + 4K 1K 4K

ATxmega16D4-MH 16K + 4K 1K 2K

ATxmega16D4-MHR (4) 16K + 4K 1K 2K

ATxmega128D4-CU 128K + 8K 2K 8K

49C2

ATxmega128D4-CUR (4) 128K + 8K 2K 8K

ATxmega64D4-CU 64K + 4K 2K 4K

ATxmega64D4-CUR (4) 64K + 4K 2K 4K

ATxmega32D4-CU 32K + 4K 1K 4K

ATxmega32D4-CUR (4) 32K + 4K 1K 4K

ATxmega16D4-CU 16K + 4K 1K 2K

ATxmega16D4-CUR (4) 16K + 4K 1K 2K

Package type

44A 44-Lead, 10 x 10mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP)

44M1 44-Pad, 7 x 7 x 1mm body, lead pitch 0.50mm, 5.20mm exposed pad, thermally enhanced plastic very thin quad no lead package (VQFN)

49C2 49-Ball (7 x 7 Array), 0.65mm pitch, 5.0 x 5.0 x 1.0mm, very thin, fine-pitch ball grid array package (VFBGA)

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2. Pinout/Block Diagram

Figure 2-1. Block diagram and QFN/TQFP pinout.

Note: 1. For full details on pinout and pin functions refer to ”Pinout and Pin Functions” on page 51.

PA0

PA1

PA2

PA3

PA4

PB0

PB1

PB3

PB2

PA7

PA6

PA5

GND

VCC

PC0

VDD

GND

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PD0

PD1

PD2

PD3

PD4

PD5

PD6

VCC

GND

PD7

PE0

PE1

PE2

PE3

RESET/PDI

PDI

PR0

PR1

AVCC

GND

Power

Supervision

Port A

EVENT ROUTING NETWORK

BUS

matrix

SRAM

FLASH

ADC

AC0:1

OCD

Port EPort D

Prog/Debug

Interface

EEPROM

Port C

TC0:1

Event System

Controller

Watchdog

Timer

Watchdog

OSC/CLK

Control

Real Time

Counter

Interrupt

Controller

DATA BUS

Port R

USART0

TWI

SPI

TC0

USART0

SPI

TC0

TWI

Port B

AREF

Sleep

Controller

Reset

Controller

IRCOM

CRC

CPU

Internal

references

Internal

oscillators

XOSC TOSC

Digital function

Analog function / Oscillators

Programming, debug, test

External clock / Crystal pins

General Purpose I /O

Ground

Power

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XMEGA D4

Figure 2-2. VFBGA pinout.

Table 2-1. BGA pinout.

1234 5 67

APA3 AVCC GND PR1 PR0 PDI PE3

BPA4 PA1 PA0 GND RESET/PDI_CLK PE2 VCC

CPA5 PA2 PA6 PA7 GND PE1 GND

DPB1 PB2 PB3 PB0 GND PD7 PE0

EGND GND PC3 GND PD4 PD5 PD6

FVCC PC0 PC4 PC6 PD0 PD1 PD3

GPC1PC2PC5PC7 GND VCCPD2

1234567

7654321

Top view Bottom view

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XMEGA D4

3. Overview

The Atmel AVR XMEGA is a family of low power, high performance, and peripheral rich 8/16-bit

microcontrollers based on the AVR enhanced RISC architecture. By executing instructions in a

single clock cycle, the AVR XMEGA devices achieve CPU throughput approaching one million

instructions per second (MIPS) per megahertz, allowing the system designer to optimize power

consumption versus processing speed.

The AVR CPU combines a rich instruction set with 32 general purpose working registers. All 32

registers are directly connected to the arithmetic logic unit (ALU), allowing two independent reg-

isters to be accessed in a single instruction, executed in one clock cycle. The resulting

architecture is more code efficient while achieving throughputs many times faster than conven-

tional single-accumulator or CISC based microcontrollers.

The AVR XMEGA D4 devices provide the following features: in-system programmable flash with

read-while-write capabilities; internal EEPROM and SRAM; four-channel event system and pro-

grammable multilevel interrupt controller; 34 general purpose I/O lines; 16-bit real-time counter

(RTC); four flexible, 16-bit timer/counters with compare and PWM channels; two USARTs; two

two-wire serial interfaces (TWIs); two serial peripheral interfaces (SPIs); one twelve-channel, 12-

bit ADC with programmable gain; two analog comparators (ACs) with window mode; program-

mable watchdog timer with separate internal oscillator; accurate internal oscillators with PLL and

prescaler; and programmable brown-out detection.

The program and debug interface (PDI), a fast two-pin interface for programming and debug-

ging, is available.

The XMEGA D4 devices have five software selectable power saving modes. The idle mode

stops the CPU while allowing the SRAM, event system, interrupt controller, and all peripherals to

continue functioning. The power-down mode saves the SRAM and register contents, but stops

the oscillators, disabling all other functions until the next TWI, or pin-change interrupt, or reset.

In power-save mode, the asynchronous real-time counter continues to run, allowing the applica-

tion to maintain a timer base while the rest of the device is sleeping. In standby mode, the

external crystal oscillator keeps running while the rest of the device is sleeping. This allows very

fast startup from the external crystal, combined with low power consumption. In extended

standby mode, both the main oscillator and the asynchronous timer continue to run. To further

reduce power consumption, the peripheral clock to each individual peripheral can optionally be

stopped in active mode and idle sleep mode.

Atmel offers a free QTouch library for embedding capacitive touch buttons, sliders and wheels

functionality into AVR microcontrollers.

The devices are manufactured using Atmel high-density, nonvolatile memory technology. The

program flash memory can be reprogrammed in-system through the PDI. A boot loader running

in the device can use any interface to download the application program to the flash memory.

The boot loader software in the boot flash section will continue to run while the application flash

section is updated, providing true read-while-write operation. By combining an 8/16-bit RISC

CPU with in-system, self-programmable flash, the AVR XMEGA is a powerful microcontroller

family that provides a highly flexible and cost effective solution for many embedded applications.

All Atmel AVR XMEGA devices are supported with a full suite of program and system develop-

ment tools, including: C compilers, macro assemblers, program debugger/simulators,

programmers, and evaluation kits.

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3.1 Block Diagram

Figure 3-1. XMEGA D4 block diagram.

Power

Supervision

POR/BOD &

RESET

PORT A (8)

PORT B (4)

SRAMADCA

ACA

OCD

Int. Refs.

PDI

PA[0..7]

PB[0..3]

Watchdog

Timer

Watchdog

Oscillator

Interrupt

Controller

DATA BUS

Prog/Debug

Controller

VCC

GND

Oscillator

Circuits/

Clock

Generation

Oscillator

Control

Real Time

Counter

Event System

Controller

AREFA

AREFB

PDI_DATA

RESET/

PDI_CLK

Sleep

Controller

CRC

PORT C (8)

PC[0..7]

TCC0:1

USARTC0

TWIC

SPIC

PD[0..7] PE[0..3]

PORT D (8)

TCD0

USARTD0

SPID

TCE0

TWIE

PORT E (4)

Tempref

VCC/10

PORT R (2)

XTAL/

TOSC1

XTAL2/

TOSC2

PR[0..1]

DATA BUS

NVM Controller

salF

IRCOM

BUS Matrix

CPU

TOSC1

TOSC2

To Clock

Generator

EVENT ROUTING NETWORK

Digital function

Analog function

Programming, debug, test

Oscillator/Crystal/Clock

General Purpose I/O

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XMEGA D4

4. Resources

A comprehensive set of development tools, application notes and datasheets are available for

download on http://www.atmel.com/avr.

4.1 Recommended reading

• Atmel AVR XMEGA D manual

• XMEGA application notes

This device data sheet only contains part specific information with a short description of each

peripheral and module. The XMEGA D manual describes the modules and peripherals in depth.

The XMEGA application notes contain example code and show applied use of the modules and

peripherals.

All documentation are available from www.atmel.com/avr.

5. Capacitive touch sensing

The Atmel QTouch library provides a simple to use solution to realize touch sensitive interfaces

on most Atmel AVR microcontrollers. The patented charge-transfer signal acquisition offers

robust sensing and includes fully debounced reporting of touch keys and includes Adjacent Key

Suppression® (AKS®) technology for unambiguous detection of key events. The QTouch library

includes support for the QTouch and QMatrix acquisition methods.

Touch sensing can be added to any application by linking the appropriate Atmel QTouch library

for the AVR microcontroller. This is done by using a simple set of APIs to define the touch chan-

nels and sensors, and then calling the touch sensing API’s to retrieve the channel information

and determine the touch sensor states.

The QTouch library is FREE and downloadable from the Atmel website at the following location:

www.atmel.com/qtouchlibrary. For implementation details and other information, refer to the

QTouch library user guide - also available for download from the Atmel website.

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6. AVR CPU

6.1 Features

•8/16-bit, high-performance Atmel AVR RISC CPU

– 137 instructions

– Hardware multiplier

•32x8-bit registers directly connected to the ALU

•Stack in RAM

•Stack pointer accessible in I/O memory space

•Direct addressing of up to 16MB of program memory and 16MB of data memory

•True 16/24-bit access to 16/24-bit I/O registers

•Efficient support for 8-, 16-, and 32-bit arithmetic

•Configuration change protection of system-critical features

6.2 Overview

All Atmel AVR XMEGA devices use the 8/16-bit AVR CPU. The main function of the CPU is to

execute the code and perform all calculations. The CPU is able to access memories, perform

calculations, control peripherals, and execute the program in the flash memory. Interrupt han-

dling is described in a separate section, refer to ”Interrupts and Programmable Multilevel

Interrupt Controller” on page 28.

6.3 Architectural Overview

In order to maximize performance and parallelism, the AVR CPU uses a Harvard architecture

with separate memories and buses for program and data. Instructions in the program memory

are executed with single-level pipelining. While one instruction is being executed, the next

instruction is pre-fetched from the program memory. This enables instructions to be executed on

every clock cycle. For details of all AVR instructions, refer to http://www.atmel.com/avr.

Figure 6-1. Block diagram of the AVR CPU architecture.

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XMEGA D4

The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or

between a constant and a register. Single-register operations can also be executed in the ALU.

After an arithmetic operation, the status register is updated to reflect information about the result

of the operation.

The ALU is directly connected to the fast-access register file. The 32 x 8-bit general purpose

working registers all have single clock cycle access time allowing single-cycle arithmetic logic

unit (ALU) operation between registers or between a register and an immediate. Six of the 32

registers can be used as three 16-bit address pointers for program and data space addressing,

enabling efficient address calculations.

The memory spaces are linear. The data memory space and the program memory space are

two different memory spaces.

The data memory space is divided into I/O registers, SRAM, and external RAM. In addition, the

EEPROM can be memory mapped in the data memory.

All I/O status and control registers reside in the lowest 4KB addresses of the data memory. This

is referred to as the I/O memory space. The lowest 64 addresses can be accessed directly, or as

the data space locations from 0x00 to 0x3F. The rest is the extended I/O memory space, ranging

from 0x0040 to 0x0FFF. I/O registers here must be accessed as data space locations using load

(LD/LDS/LDD) and store (ST/STS/STD) instructions.

The SRAM holds data. Code execution from SRAM is not supported. It can easily be accessed

through the five different addressing modes supported in the AVR architecture. The first SRAM

address is 0x2000.

Data addresses 0x1000 to 0x1FFF are reserved for memory mapping of EEPROM.

The program memory is divided in two sections, the application program section and the boot

program section. Both sections have dedicated lock bits for write and read/write protection. The

SPM instruction that is used for self-programming of the application flash memory must reside in

the boot program section. The application section contains an application table section with sep-

arate lock bits for write and read/write protection. The application table section can be used for

safe storing of nonvolatile data in the program memory.

6.4 ALU - Arithmetic Logic Unit

The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or

between a constant and a register. Single-register operations can also be executed. The ALU

operates in direct connection with all 32 general purpose registers. In a single clock cycle, arith-

metic operations between general purpose registers or between a register and an immediate are

executed and the result is stored in the register file. After an arithmetic or logic operation, the

status register is updated to reflect information about the result of the operation.

ALU operations are divided into three main categories – arithmetic, logical, and bit functions.

Both 8- and 16-bit arithmetic is supported, and the instruction set allows for efficient implementa-

tion of 32-bit aritmetic. The hardware multiplier supports signed and unsigned multiplication and

fractional format.

6.4.1 Hardware Multiplier

The multiplier is capable of multiplying two 8-bit numbers into a 16-bit result. The hardware mul-

tiplier supports different variations of signed and unsigned integer and fractional numbers:

• Multiplication of unsigned integers

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XMEGA D4

• Multiplication of signed integers

• Multiplication of a signed integer with an unsigned integer

• Multiplication of unsigned fractional numbers

• Multiplication of signed fractional numbers

• Multiplication of a signed fractional number with an unsigned one

A multiplication takes two CPU clock cycles.

6.5 Program Flow

After reset, the CPU starts to execute instructions from the lowest address in the flash program-

memory ‘0.’ The program counter (PC) addresses the next instruction to be fetched.

Program flow is provided by conditional and unconditional jump and call instructions capable of

addressing the whole address space directly. Most AVR instructions use a 16-bit word format,

while a limited number use a 32-bit format.

During interrupts and subroutine calls, the return address PC is stored on the stack. The stack is

allocated in the general data SRAM, and consequently the stack size is only limited by the total

SRAM size and the usage of the SRAM. After reset, the stack pointer (SP) points to the highest

address in the internal SRAM. The SP is read/write accessible in the I/O memory space,

enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be

accessed through the five different addressing modes supported in the AVR CPU.

6.6 Status Register

The status register (SREG) contains information about the result of the most recently executed

arithmetic or logic instruction. This information can be used for altering program flow in order to

perform conditional operations. Note that the status register is updated after all ALU operations,

as specified in the instruction set reference. This will in many cases remove the need for using

the dedicated compare instructions, resulting in faster and more compact code.

The status register is not automatically stored when entering an interrupt routine nor restored

when returning from an interrupt. This must be handled by software.

The status register is accessible in the I/O memory space.

6.7 Stack and Stack Pointer

The stack is used for storing return addresses after interrupts and subroutine calls. It can also be

used for storing temporary data. The stack pointer (SP) register always points to the top of the

stack. It is implemented as two 8-bit registers that are accessible in the I/O memory space. Data

are pushed and popped from the stack using the PUSH and POP instructions. The stack grows

from a higher memory location to a lower memory location. This implies that pushing data onto

the stack decreases the SP, and popping data off the stack increases the SP. The SP is auto-

matically loaded after reset, and the initial value is the highest address of the internal SRAM. If

the SP is changed, it must be set to point above address 0x2000, and it must be defined before

any subroutine calls are executed or before interrupts are enabled.

During interrupts or subroutine calls, the return address is automatically pushed on the stack.

The return address can be two or three bytes, depending on program memory size of the device.

For devices with 128KB or less of program memory, the return address is two bytes, and hence

the stack pointer is decremented/incremented by two. For devices with more than 128KB of pro-

gram memory, the return address is three bytes, and hence the SP is decremented/incremented

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XMEGA D4

by three. The return address is popped off the stack when returning from interrupts using the

RETI instruction, and from subroutine calls using the RET instruction.

The SP is decremented by one when data are pushed on the stack with the PUSH instruction,

and incremented by one when data is popped off the stack using the POP instruction.

To prevent corruption when updating the stack pointer from software, a write to SPL will auto-

matically disable interrupts for up to four instructions or until the next I/O memory write.

After reset the stack pointer is initialized to the highest address of the SRAM. See Figure 7-2 on

page 15.

6.8 Register File

The register file consists of 32 x 8-bit general purpose working registers with single clock cycle

access time. The register file supports the following input/output schemes:

• One 8-bit output operand and one 8-bit result input

• Two 8-bit output operands and one 8-bit result input

• Two 8-bit output operands and one 16-bit result input

• One 16-bit output operand and one 16-bit result input

Six of the 32 registers can be used as three 16-bit address register pointers for data space

addressing, enabling efficient address calculations. One of these address pointers can also be

used as an address pointer for lookup tables in flash program memory.

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7. Memories

7.1 Features

•Flash program memory

– One linear address space

– In-system programmable

– Self-programming and boot loader support

– Application section for application code

– Application table section for application code or data storage

– Boot section for application code or boot loader code

– Separate read/write protection lock bits for all sections

– Built in fast CRC check of a selectable flash program memory section

•Data memory

– One linear address space

– Single-cycle access from CPU

– SRAM

– EEPROM

Byte and page accessible

Optional memory mapping for direct load and store

– I/O memory

Configuration and status registers for all peripherals and modules

16 bit-accessible general purpose registers for global variables or flags

•Production signature row memory for factory programmed data

– ID for each microcontroller device type

– Serial number for each device

– Calibration bytes for factory calibrated peripherals

•User signature row

– One flash page in size

– Can be read and written from software

– Content is kept after chip erase

7.2 Overview

The Atmel AVR architecture has two main memory spaces, the program memory and the data

memory. Executable code can reside only in the program memory, while data can be stored in

the program memory and the data memory. The data memory includes the internal SRAM, and

EEPROM for nonvolatile data storage. All memory spaces are linear and require no memory

bank switching. Nonvolatile memory (NVM) spaces can be locked for further write and read/write

operations. This prevents unrestricted access to the application software.

A separate memory section contains the fuse bytes. These are used for configuring important

system functions, and can only be written by an external programmer.

The available memory size configurations are shown in ”Ordering Information” on page 2 In

addition, each device has a Flash memory signature row for calibration data, device identifica-

tion, serial number etc.

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7.3 Flash Program Memory

The Atmel AVR XMEGA devices contain on-chip, in-system reprogrammable flash memory for

program storage. The flash memory can be accessed for read and write from an external pro-

grammer through the PDI or from application software running in the device.

All AVR CPU instructions are 16 or 32 bits wide, and each flash location is 16 bits wide. The

flash memory is organized in two main sections, the application section and the boot loader sec-

tion. The sizes of the different sections are fixed, but device-dependent. These two sections

have separate lock bits, and can have different levels of protection. The store program memory

(SPM) instruction, which is used to write to the flash from the application software, will only oper-

ate when executed from the boot loader section.

The application section contains an application table section with separate lock settings. This

enables safe storage of nonvolatile data in the program memory.

7.3.1 Application Section

The Application section is the section of the flash that is used for storing the executable applica-

tion code. The protection level for the application section can be selected by the boot lock bits

for this section. The application section can not store any boot loader code since the SPM

instruction cannot be executed from the application section.

7.3.2 Application Table Section

The application table section is a part of the application section of the flash memory that can be

used for storing data. The size is identical to the boot loader section. The protection level for the

application table section can be selected by the boot lock bits for this section. The possibilities

for different protection levels on the application section and the application table section enable

safe parameter storage in the program memory. If this section is not used for data, application

code can reside here.

7.3.3 Boot Loader Section

While the application section is used for storing the application code, the boot loader software

must be located in the boot loader section because the SPM instruction can only initiate pro-

gramming when executing from this section. The SPM instruction can access the entire flash,

including the boot loader section itself. The protection level for the boot loader section can be

selected by the boot loader lock bits. If this section is not used for boot loader software, applica-

tion code can be stored here.

Figure 7-1. Flash program memory (Hexadecimal address).

Word address

0Application Section

(128K/64K/32K/16K)

...

EFFF / 77FF / 37FF / 17FF EFFF /

F000 / 7800 / 3800 / 1800 F000 / Application Table Section

(4K/4K/4K/4K)

FFFF / 7FFF / 3FFF / 1FFF FFFF /

10000 / 8000 / 4000 / 2000 10000 / Boot Section

(8K/4K/4K/4K)

10FFF / 87FF / 47FF / 27FF 10FFF /

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XMEGA D4

7.3.4 Production Signature Row

The production signature row is a separate memory section for factory programmed data. It con-

tains calibration data for functions such as oscillators and analog modules. Some of the

calibration values will be automatically loaded to the corresponding module or peripheral unit

during reset. Other values must be loaded from the signature row and written to the correspond-

ing peripheral registers from software. For details on calibration conditions, refer to ”Electrical

Characteristics” on page 64.

The production signature row also contains an ID that identifies each microcontroller device type

and a serial number for each manufactured device. The serial number consists of the production

lot number, wafer number, and wafer coordinates for the device. The device ID for the available

devices is shown in Table 7-1.

The production signature row cannot be written or erased, but it can be read from application

software and external programmers.

Table 7-1. Device ID bytes for Atmel AVR XMEGA D4 devices.

7.3.5 User Signature Row

The user signature row is a separate memory section that is fully accessible (read and write)

from application software and external programmers. It is one flash page in size, and is meant

for static user parameter storage, such as calibration data, custom serial number, identification

numbers, random number seeds, etc. This section is not erased by chip erase commands that

erase the flash, and requires a dedicated erase command. This ensures parameter storage dur-

ing multiple program/erase operations and on-chip debug sessions.

7.4 Fuses and Lock bits

The fuses are used to configure important system functions, and can only be written from an

external programmer. The application software can read the fuses. The fuses are used to config-

ure reset sources such as brownout detector and watchdog and startup configuration.

The lock bits are used to set protection levels for the different flash sections (that is, if read

and/or write access should be blocked). Lock bits can be written by external programmers and

application software, but only to stricter protection levels. Chip erase is the only way to erase the

lock bits. To ensure that flash contents are protected even during chip erase, the lock bits are

erased after the rest of the flash memory has been erased.

An unprogrammed fuse or lock bit will have the value one, while a programmed fuse or lock bit

will have the value zero.

Both fuses and lock bits are reprogrammable like the flash program memory.

Device Device ID bytes

Byte 2 Byte 1 Byte 0

ATxmega16D4 42 94 1E

ATxmega32D4 42 95 1E

ATxmega64D4 47 96 1E

ATxmega128D4 47 97 1E

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7.5 Data Memory

The data memory contains the I/O memory, internal SRAM, optionally memory mapped

EEPROM, and external memory if available. The data memory is organized as one continuous

memory section, see Figure 7-2. To simplify development, I/O Memory, EEPROM and SRAM

will always have the same start addresses for all Atmel AVR XMEGA devices.

7.6 EEPROM

All devices have EEPROM for nonvolatile data storage. It is either addressable in a separate

data space (default) or memory mapped and accessed in normal data space. The EEPROM

supports both byte and page access. Memory mapped EEPROM allows highly efficient

EEPROM reading and EEPROM buffer loading. When doing this, EEPROM is accessible using

load and store instructions. Memory mapped EEPROM will always start at hexadecimal address

0x1000.

7.7 I/O Memory

The status and configuration registers for peripherals and modules, including the CPU, are

addressable through I/O memory locations. All I/O locations can be accessed by the load

(LD/LDS/LDD) and store (ST/STS/STD) instructions, which are used to transfer data between

the 32 registers in the register file and the I/O memory. The IN and OUT instructions can

address I/O memory locations in the range of 0x00 to 0x3F directly. In the address range 0x00 -

0x1F, single-cycle instructions for manipulation and checking of individual bits are available.

Figure 7-2. Data memory map (Hexadecimal address).

Byte address ATxmega64D4 Byte address ATxmega32D4 Byte address ATxmega16D4

0I/O Registers

(4K)

0I/O Registers

(4K)

0I/O Registers

(4K)

FFF FFF FFF

1000 EEPROM

(2K)

1000 EEPROM

(1K)

1000 EEPROM

(1K)

17FF 13FF 13FF

RESERVED RESERVED RESERVED

2000 Internal SRAM

(4K)

2000 Internal SRAM

(4K)

2000 Internal SRAM

(2K)

2FFF 2FFF 27FF

Byte address ATxmega128D4

0I/O Registers

(4K)

FFF

1000 EEPROM

(2K)

17FF

RESERVED

2000 Internal SRAM

(8K)

3FFF

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The I/O memory address for all peripherals and modules in XMEGA D4 is shown in the ”Periph-

eral Module Address Map” on page 56.

7.7.1 General Purpose I/O Registers

The lowest 16 I/O memory addresses are reserved as general purpose I/O registers. These reg-

isters can be used for storing global variables and flags, as they are directly bit-accessible using

the SBI, CBI, SBIS, and SBIC instructions.

7.8 Data Memory and Bus Arbitration

Since the data memory is organized as four separate sets of memories, the bus masters (CPU,

etc.) can access different memory sections at the same time.

7.9 Memory Timing

Read and write access to the I/O memory takes one CPU clock cycle. A write to SRAM takes

one cycle, and a read from SRAM takes two cycles. EEPROM page load (write) takes one cycle,

and three cycles are required for read. For burst read, new data are available every second

cycle. Refer to the instruction summary for more details on instructions and instruction timing.

7.10 Device ID and Revision

Each device has a three-byte device ID. This ID identifies Atmel as the manufacturer of the

device and the device type. A separate register contains the revision number of the device.

7.11 I/O Memory Protection

Some features in the device are regarded as critical for safety in some applications. Due to this,

it is possible to lock the I/O register related to the clock system, the event system, and the

advanced waveform extensions. As long as the lock is enabled, all related I/O registers are

locked and they can not be written from the application software. The lock registers themselves

are protected by the configuration change protection mechanism.

7.12 Flash and EEPROM Page Size

The flash program memory and EEPROM data memory are organized in pages. The pages are

word accessible for the flash and byte accessible for the EEPROM.

Table 7-2 shows the Flash Program Memory organization and Program Counter (PC) size.

Flash write and erase operations are performed on one page at a time, while reading the Flash

is done one byte at a time. For Flash access the Z-pointer (Z[m:n]) is used for addressing. The

most significant bits in the address (FPAGE) give the page number and the least significant

address bits (FWORD) give the word in the page.

Table 7-2. Number of words and pages in the flash.

Devices PC size Flash size Page size FWORD FPAGE Application Boot

[bits] [bytes] [words] Size No of pages Size No of pages

ATxmega16D4 14 16K + 4K 128 Z[6:0] Z[13:7] 16K 64 4K 16

ATxmega32D4 15 32K + 4K 128 Z[6:0] Z[14:7] 32K 128 4K 16

ATxmega64D4 16 64K + 4K 128 Z[6:0] Z[15:7] 64K 256 4K 16

ATxmega128D4 17 128K + 8K 128 Z[8:0] Z[16:7] 128K 512 8K 32

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Table 7-3 shows EEPROM memory organization. EEEPROM write and erase operations can be

performed one page or one byte at a time, while reading the EEPROM is done one byte at a

time. For EEPROM access the NVM address register (ADDR[m:n]) is used for addressing. The

most significant bits in the address (E2PAGE) give the page number and the least significant

address bits (E2BYTE) give the byte in the page.

Table 7-3. Number of bytes and pages in the EEPROM.

Devices EEPROM Page size E2BYTE E2PAGE No of pages

size [bytes]

ATxmega16D4 1K 32 ADDR[4:0] ADDR[10:5] 32

ATxmega32D4 1K 32 ADDR[4:0] ADDR[10:5] 32

ATxmega64D4 2K 32 ADDR[4:0] ADDR[10:5] 64

ATxmega128D4 2K 32 ADDR[4:0] ADDR[10:5] 64

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8. Event System

8.1 Features

•System for direct peripheral-to-peripheral communication and signaling

•Peripherals can directly send, receive, and react to peripheral events

– CPU independent operation

– 100% predictable signal timing

– Short and guaranteed response time

•Four event channels for up to four different and parallel signal routing configurations

•Events can be sent and/or used by most peripherals, clock system, and software

•Additional functions include

– Quadrature decoders

– Digital filtering of I/O pin state

•Works in active mode and idle sleep mode

8.2 Overview

The event system enables direct peripheral-to-peripheral communication and signaling. It allows

a change in one peripheral’s state to automatically trigger actions in other peripherals. It is

designed to provide a predictable system for short and predictable response times between

peripherals. It allows for autonomous peripheral control and interaction without the use of inter-

rupts or CPU resources, and is thus a powerful tool for reducing the complexity, size and

execution time of application code. It also allows for synchronized timing of actions in several

peripheral modules.

A change in a peripheral’s state is referred to as an event, and usually corresponds to the

peripheral’s interrupt conditions. Events can be directly passed to other peripherals using a ded-

icated routing network called the event routing network. How events are routed and used by the

peripherals is configured in software.

Figure 8-1 on page 19 shows a basic diagram of all connected peripherals. The event system

can directly connect together analog to digital converter, analog comparators, I/O port pins, the

real-time counter, timer/counters, and IR communication module (IRCOM). Events can also be

generated from software and the peripheral clock.

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Figure 8-1. Event system overview and connected peripherals.

The event routing network consists of four software-configurable multiplexers that control how

events are routed and used. These are called event channels, and allow for up to four parallel

event routing configurations. The maximum routing latency is two peripheral clock cycles. The

event system works in both active mode and idle sleep mode.

Timer /

Counters

ADC

Real Time

Counter

Port pins

CPU /

Software

IRCOM

Event Routing Network

Event

System

Controller

clkPER

Prescaler

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9. System Clock and Clock options

9.1 Features

•Fast start-up time

•Safe run-time clock switching

•Internal oscillators:

– 32MHz run-time calibrated and tuneable oscillator

– 2MHz run-time calibrated oscillator

– 32.768kHz calibrated oscillator

– 32kHz ultra low power (ULP) oscillator with 1kHz output

•External clock options

– 0.4MHz - 16MHz crystal oscillator

– 32.768kHz crystal oscillator

– External clock

•PLL with 20MHz - 128MHz output frequency

– Internal and external clock options and 1x to 31x multiplication

– Lock detector

•Clock prescalers with 1x to 2048x division

•Fast peripheral clocks running at two and four times the CPU clock

•Automatic run-time calibration of internal oscillators

•External oscillator and PLL lock failure detection with optional non-maskable interrupt

9.2 Overview

Atmel AVR XMEGA D4 devices have a flexible clock system supporting a large number of clock

sources. It incorporates both accurate internal oscillators and external crystal oscillator and res-

onator support. A high-frequency phase locked loop (PLL) and clock prescalers can be used to

generate a wide range of clock frequencies. A calibration feature (DFLL) is available, and can be

used for automatic run-time calibration of the internal oscillators to remove frequency drift over

voltage and temperature. An oscillator failure monitor can be enabled to issue a non-maskable

interrupt and switch to the internal oscillator if the external oscillator or PLL fails.

When a reset occurs, all clock sources except the 32kHz ultra low power oscillator are disabled.

After reset, the device will always start up running from the 2MHz internal oscillator. During nor-

mal operation, the system clock source and prescalers can be changed from software at any

time.

Figure 9-1 on page 21 presents the principal clock system in the XMEGA D4 family of devices.

Not all of the clocks need to be active at a given time. The clocks for the CPU and peripherals

can be stopped using sleep modes and power reduction registers, as described in ”Power Man-

agement and Sleep Modes” on page 23.

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Figure 9-1. The clock system, clock sources and clock distribution.

9.3 Clock Sources

The clock sources are divided in two main groups: internal oscillators and external clock

sources. Most of the clock sources can be directly enabled and disabled from software, while

others are automatically enabled or disabled, depending on peripheral settings. After reset, the

device starts up running from the 2MHz internal oscillator. The other clock sources, DFLLs and

PLL, are turned off by default.

The internal oscillators do not require any external components to run. For details on character-

istics and accuracy of the internal oscillators, refer to the device datasheet.

Real Time

Counter Peripherals RAM AVR CPU Non-Volatile

Memory

Watchdog

Timer

Brown-out

Detector

System Clock Prescalers

System Clock Multiplexer

(SCLKSEL)

PLLSRC

RTCSRC

DIV32

32 kHz

Int. ULP

32.768 kHz

Int. OSC

32.768 kHz

TOSC

2 MHz

Int. Osc

32 MHz

Int. Osc

0.4 – 16 MHz

XTAL

DIV32

DIV4

XOSCSEL

PLL

TOSC1

TOSC2

XTAL1

XTAL2

clkSYS

clkRTC

clkPER2

clkPER

clkCPU

clkPER4

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9.3.1 32kHz Ultra Low Power Internal Oscillator

This oscillator provides an approximate 32kHz clock. The 32kHz ultra low power (ULP) internal

oscillator is a very low power clock source, and it is not designed for high accuracy. The oscilla-

tor employs a built-in prescaler that provides a 1kHz output. The oscillator is automatically

enabled/disabled when it is used as clock source for any part of the device. This oscillator can

be selected as the clock source for the RTC.

9.3.2 32.768kHz Calibrated Internal Oscillator

This oscillator provides an approximate 32.768kHz clock. It is calibrated during production to

provide a default frequency close to its nominal frequency. The calibration register can also be

written from software for run-time calibration of the oscillator frequency. The oscillator employs a

built-in prescaler, which provides both a 32.768kHz output and a 1.024kHz output.

9.3.3 32.768kHz Crystal Oscillator

A 32.768kHz crystal oscillator can be connected between the TOSC1 and TOSC2 pins and

enables a dedicated low frequency oscillator input circuit. A low power mode with reduced volt-

age swing on TOSC2 is available. This oscillator can be used as a clock source for the system

clock and RTC, and as the DFLL reference clock.

9.3.4 0.4 - 16MHz Crystal Oscillator

This oscillator can operate in four different modes optimized for different frequency ranges, all

within 0.4 - 16MHz.

9.3.5 2MHz Run-time Calibrated Internal Oscillator

The 2MHz run-time calibrated internal oscillator is the default system clock source after reset. It

is calibrated during production to provide a default frequency close to its nominal frequency. A

DFLL can be enabled for automatic run-time calibration of the oscillator to compensate for tem-

perature and voltage drift and optimize the oscillator accuracy.

9.3.6 32MHz Run-time Calibrated Internal Oscillator

The 32MHz run-time calibrated internal oscillator is a high-frequency oscillator. It is calibrated

during production to provide a default frequency close to its nominal frequency. A digital fre-

quency looked loop (DFLL) can be enabled for automatic run-time calibration of the oscillator to

compensate for temperature and voltage drift and optimize the oscillator accuracy. This oscilla-

tor can also be adjusted and calibrated to any frequency between 30MHz and 55MHz.

9.3.7 External Clock Sources

The XTAL1 and XTAL2 pins can be used to drive an external oscillator, either a quartz crystal or

a ceramic resonator. XTAL1 can be used as input for an external clock signal. The TOSC1 and

TOSC2 pins is dedicated to driving a 32.768kHz crystal oscillator.

9.3.8 PLL with 1x-31x Multiplication Factor

The built-in phase locked loop (PLL) can be used to generate a high-frequency system clock.

The PLL has a user-selectable multiplication factor of from 1 to 31. In combination with the pres-

calers, this gives a wide range of output frequencies from all clock sources.

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10. Power Management and Sleep Modes

10.1 Features

•Power management for adjusting power consumption and functions

•Five sleep modes

–Idle

–Power down

– Power save

–Standby

– Extended standby

•Power reduction register to disable clock and turn off unused peripherals in active and idle

modes

10.2 Overview

Various sleep modes and clock gating are provided in order to tailor power consumption to appli-

cation requirements. This enables the Atmel AVR XMEGA microcontroller to stop unused

modules to save power.

All sleep modes are available and can be entered from active mode. In active mode, the CPU is

executing application code. When the device enters sleep mode, program execution is stopped

and interrupts or a reset is used to wake the device again. The application code decides which

sleep mode to enter and when. Interrupts from enabled peripherals and all enabled reset

sources can restore the microcontroller from sleep to active mode.

In addition, power reduction registers provide a method to stop the clock to individual peripherals

from software. When this is done, the current state of the peripheral is frozen, and there is no

power consumption from that peripheral. This reduces the power consumption in active mode

and idle sleep modes and enables much more fine-tuned power management than sleep modes

alone.

10.3 Sleep Modes

Sleep modes are used to shut down modules and clock domains in the microcontroller in order

to save power. XMEGA microcontrollers have five different sleep modes tuned to match the typ-

ical functional stages during application execution. A dedicated sleep instruction (SLEEP) is

available to enter sleep mode. Interrupts are used to wake the device from sleep, and the avail-

able interrupt wake-up sources are dependent on the configured sleep mode. When an enabled

interrupt occurs, the device will wake up and execute the interrupt service routine before con-

tinuing normal program execution from the first instruction after the SLEEP instruction. If other,

higher priority interrupts are pending when the wake-up occurs, their interrupt service routines

will be executed according to their priority before the interrupt service routine for the wake-up

interrupt is executed. After wake-up, the CPU is halted for four cycles before execution starts.

The content of the register file, SRAM and registers are kept during sleep. If a reset occurs dur-

ing sleep, the device will reset, start up, and execute from the reset vector.

10.3.1 Idle Mode

In idle mode the CPU and nonvolatile memory are stopped (note that any ongoing programming

will be completed), but all peripherals, including the interrupt controller, and event system are

kept running. Any enabled interrupt will wake the device.

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10.3.2 Power-down Mode

In power-down mode, all clocks, including the real-time counter clock source, are stopped. This

allows operation only of asynchronous modules that do not require a running clock. The only

interrupts that can wake up the MCU are the two-wire interface address match interrupt, and

asynchronous port interrupts.

10.3.3 Power-save Mode

Power-save mode is identical to power down, with one exception. If the real-time counter (RTC)

is enabled, it will keep running during sleep, and the device can also wake up from either an

RTC overflow or compare match interrupt.

10.3.4 Standby Mode

Standby mode is identical to power down, with the exception that the enabled system clock

sources are kept running while the CPU, peripheral, and RTC clocks are stopped. This reduces

the wake-up time.

10.3.5 Extended Standby Mode

Extended standby mode is identical to power-save mode, with the exception that the enabled

system clock sources are kept running while the CPU and peripheral clocks are stopped. This

reduces the wake-up time.

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11. System Control and Reset

11.1 Features

•Reset the microcontroller and set it to initial state when a reset source goes active

•Multiple reset sources that cover different situations

–Power-on reset

– External reset

– Watchdog reset

– Brownout reset

– PDI reset

– Software reset

•Asynchronous operation

– No running system clock in the device is required for reset

•Reset status register for reading the reset source from the application code

11.2 Overview

The reset system issues a microcontroller reset and sets the device to its initial state. This is for

situations where operation should not start or continue, such as when the microcontroller oper-

ates below its power supply rating. If a reset source goes active, the device enters and is kept in

reset until all reset sources have released their reset. The I/O pins are immediately tri-stated.

The program counter is set to the reset vector location, and all I/O registers are set to their initial

values. The SRAM content is kept. However, if the device accesses the SRAM when a reset

occurs, the content of the accessed location can not be guaranteed.

After reset is released from all reset sources, the default oscillator is started and calibrated

before the device starts running from the reset vector address. By default, this is the lowest pro-

gram memory address, 0, but it is possible to move the reset vector to the lowest address in the

boot section.

The reset functionality is asynchronous, and so no running system clock is required to reset the

device. The software reset feature makes it possible to issue a controlled system reset from the

user software.

The reset status register has individual status flags for each reset source. It is cleared at power-

on reset, and shows which sources have issued a reset since the last power-on.

11.3 Reset Sequence

A reset request from any reset source will immediately reset the device and keep it in reset as

long as the request is active. When all reset requests are released, the device will go through

three stages before the device starts running again:

•Reset counter delay

•Oscillator startup

•Oscillator calibration

If another reset requests occurs during this process, the reset sequence will start over again.

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11.4 Reset Sources

11.4.1 Power-on Reset

A power-on reset (POR) is generated by an on-chip detection circuit. The POR is activated when

the VCC rises and reaches the POR threshold voltage (VPOT), and this will start the reset

sequence.

The POR is also activated to power down the device properly when the VCC falls and drops

below the VPOT level.

The VPOT level is higher for falling VCC than for rising VCC. Consult the datasheet for POR char-

acteristics data.

11.4.2 Brownout Detection

The on-chip brownout detection (BOD) circuit monitors the VCC level during operation by com-

paring it to a fixed, programmable level that is selected by the BODLEVEL fuses. If disabled,

BOD is forced on at the lowest level during chip erase and when the PDI is enabled.

11.4.3 External Reset

The external reset circuit is connected to the external RESET pin. The external reset will trigger

when the RESET pin is driven below the RESET pin threshold voltage, VRST, for longer than the

minimum pulse period, tEXT. The reset will be held as long as the pin is kept low. The RESET pin

includes an internal pull-up resistor.

11.4.4 Watchdog Reset

The watchdog timer (WDT) is a system function for monitoring correct program operation. If the

WDT is not reset from the software within a programmable timeout period, a watchdog reset will

be given. The watchdog reset is active for one to two clock cycles of the 2MHz internal oscillator.

For more details see ”WDT – Watchdog Timer” on page 27.

11.4.5 Software Reset

The software reset makes it possible to issue a system reset from software by writing to the soft-

ware reset bit in the reset control register.The reset will be issued within two CPU clock cycles

after writing the bit. It is not possible to execute any instruction from when a software reset is

requested until it is issued.

11.4.6 Program and Debug Interface Reset

The program and debug interface reset contains a separate reset source that is used to reset

the device during external programming and debugging. This reset source is accessible only

from external debuggers and programmers.

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12. WDT – Watchdog Timer

12.1 Features

•Issues a device reset if the timer is not reset before its timeout period

•Asynchronous operation from dedicated oscillator

•1kHz output of the 32kHz ultra low power oscillator

•11 selectable timeout periods, from 8ms to 8s

•Two operation modes:

– Normal mode

– Window mode

•Configuration lock to prevent unwanted changes

12.2 Overview

The watchdog timer (WDT) is a system function for monitoring correct program operation. It

makes it possible to recover from error situations such as runaway or deadlocked code. The

WDT is a timer, configured to a predefined timeout period, and is constantly running when

enabled. If the WDT is not reset within the timeout period, it will issue a microcontroller reset.

The WDT is reset by executing the WDR (watchdog timer reset) instruction from the application

code.

The window mode makes it possible to define a time slot or window inside the total timeout

period during which WDT must be reset. If the WDT is reset outside this window, either too early

or too late, a system reset will be issued. Compared to the normal mode, this can also catch sit-

uations where a code error causes constant WDR execution.

The WDT will run in active mode and all sleep modes, if enabled. It is asynchronous, runs from a

CPU-independent clock source, and will continue to operate to issue a system reset even if the

main clocks fail.

The configuration change protection mechanism ensures that the WDT settings cannot be

changed by accident. For increased safety, a fuse for locking the WDT settings is also available.

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13. Interrupts and Programmable Multilevel Interrupt Controller

13.1 Features

•Short and predictable interrupt response time

•Separate interrupt configuration and vector address for each interrupt

•Programmable multilevel interrupt controller

– Interrupt prioritizing according to level and vector address

– Three selectable interrupt levels for all interrupts: low, medium and high

– Selectable, round-robin priority scheme within low-level interrupts

– Non-maskable interrupts for critical functions

•Interrupt vectors optionally placed in the application section or the boot loader section

13.2 Overview

Interrupts signal a change of state in peripherals, and this can be used to alter program execu-

tion. Peripherals can have one or more interrupts, and all are individually enabled and

configured. When an interrupt is enabled and configured, it will generate an interrupt request

when the interrupt condition is present. The programmable multilevel interrupt controller (PMIC)

controls the handling and prioritizing of interrupt requests. When an interrupt request is acknowl-

edged by the PMIC, the program counter is set to point to the interrupt vector, and the interrupt

handler can be executed.

All peripherals can select between three different priority levels for their interrupts: low, medium,

and high. Interrupts are prioritized according to their level and their interrupt vector address.

Medium-level interrupts will interrupt low-level interrupt handlers. High-level interrupts will inter-

rupt both medium- and low-level interrupt handlers. Within each level, the interrupt priority is

decided from the interrupt vector address, where the lowest interrupt vector address has the

highest interrupt priority. Low-level interrupts have an optional round-robin scheduling scheme to

ensure that all interrupts are serviced within a certain amount of time.

Non-maskable interrupts (NMI) are also supported, and can be used for system critical

functions.

13.3 Interrupt vectors

The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address

for specific interrupts in each peripheral. The base addresses for the Atmel AVR XMEGA D4

devices are shown in Table 13-1. Offset addresses for each interrupt available in the peripheral

are described for each peripheral in the XMEGA D manual. For peripherals or modules that have

only one interrupt, the interrupt vector is shown in Table 13-1. The program address is the word

address.

Table 13-1. Reset and interrupt vectors.

Program address

(base address) Source Interrupt description

0x000 RESET

0x002 OSCF_INT_vect Crystal oscillator failure interrupt vector (NMI)

0x004 PORTC_INT_base Port C interrupt base

0x008 PORTR_INT_base Port R interrupt base

0x014 RTC_INT_base Real time counter interrupt base

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0x018 TWIC_INT_base Two-Wire Interface on Port C interrupt base

0x01C TCC0_INT_base Timer/Counter 0 on port C interrupt base

0x028 TCC1_INT_base Timer/Counter 1 on port C interrupt base

0x030 SPIC_INT_vect SPI on port C interrupt vector

0x032 USARTC0_INT_base USART 0 on port C interrupt base

0x040 NVM_INT_base Non-Volatile Memory interrupt base

0x044 PORTB_INT_base Port B interrupt base

0x056 PORTE_INT_base Port E interrupt base

0x05A TWIE_INT_base Two-Wire Interface on Port E interrupt base

0x05E TCE0_INT_base Timer/Counter 0 on port E interrupt base

0x080 PORTD_INT_base Port D interrupt base

0x084 PORTA_INT_base Port A interrupt base

0x088 ACA_INT_base Analog Comparator on Port A interrupt base

0x08E ADCA_INT_base Analog to Digital Converter on Port A interrupt base

0x09A TCD0_INT_base Timer/Counter 0 on port D interrupt base

0x0AE SPID_INT_vector SPI on port D interrupt vector

0x0B0 USARTD0_INT_base USART 0 on port D interrupt base

Table 13-1. Reset and interrupt vectors. (Continued)

Program address

(base address) Source Interrupt description

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14. I/O Ports

14.1 Features

•34 general purpose input and output pins with individual configuration

•Output driver with configurable driver and pull settings:

– Totem-pole

– Wired-AND

–Wired-OR

– Bus-keeper

– Inverted I/O

•Input with synchronous and/or asynchronous sensing with interrupts and events

– Sense both edges

– Sense rising edges

– Sense falling edges

– Sense low level

•Optional pull-up and pull-down resistor on input and Wired-OR/AND configurations

•Optional slew rate control

•Asynchronous pin change sensing that can wake the device from all sleep modes

•Two port interrupts with pin masking per I/O port

•Efficient and safe access to port pins

– Hardware read-modify-write through dedicated toggle/clear/set registers

– Configuration of multiple pins in a single operation

– Mapping of port registers into bit-accessible I/O memory space

•Peripheral clocks output on port pin

•Real-time counter clock output to port pin

•Event channels can be output on port pin

•Remapping of digital peripheral pin functions

– Selectable USART, SPI, and timer/counter input/output pin locations

14.2 Overview

One port consists of up to eight port pins: pin 0 to 7. Each port pin can be configured as input or

output with configurable driver and pull settings. They also implement synchronous and asyn-

chronous input sensing with interrupts and events for selectable pin change conditions.

Asynchronous pin-change sensing means that a pin change can wake the device from all sleep

modes, included the modes where no clocks are running.

All functions are individual and configurable per pin, but several pins can be configured in a sin-

gle operation. The pins have hardware read-modify-write (RMW) functionality for safe and

correct change of drive value and/or pull resistor configuration. The direction of one port pin can

be changed without unintentionally changing the direction of any other pin.

The port pin configuration also controls input and output selection of other device functions. It is

possible to have both the peripheral clock and the real-time clock output to a port pin, and avail-

able for external use. The same applies to events from the event system that can be used to

synchronize and control external functions. Other digital peripherals, such as USART, SPI, and

timer/counters, can be remapped to selectable pin locations in order to optimize pin-out versus

application needs.

The notation of the ports are PORTA, PORTB, PORTC, PORTD, PORTE, and PORTR.

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14.3 Output Driver

All port pins (Pn) have programmable output configuration. The port pins also have configurable

slew rate limitation to reduce electromagnetic emission.

14.3.1 Push-pull

Figure 14-1. I/O configuration - Totem-pole.

14.3.2 Pull-down

Figure 14-2. I/O configuration - Totem-pole with pull-down (on input).

14.3.3 Pull-up

Figure 14-3. I/O configuration - Totem-pole with pull-up (on input).

INn

OUTn

DIRn

INn

OUTn

DIRn

INn

OUTn

DIRn

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14.3.4 Bus-keeper

The bus-keeper’s weak output produces the same logical level as the last output level. It acts as

a pull-up if the last level was ‘1’, and pull-down if the last level was ‘0’.

Figure 14-4. I/O configuration - Totem-pole with bus-keeper.

14.3.5 Others

Figure 14-5. Output configuration - Wired-OR with optional pull-down.

Figure 14-6. I/O configuration - Wired-AND with optional pull-up.

INn

OUTn

DIRn

INn

OUTn

INn

OUTn

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14.4 Input sensing

Input sensing is synchronous or asynchronous depending on the enabled clock for the ports,

and the configuration is shown in Figure 14-7.

Figure 14-7. Input sensing system overview.

When a pin is configured with inverted I/O, the pin value is inverted before the input sensing.

14.5 Alternate Port Functions

Most port pins have alternate pin functions in addition to being a general purpose I/O pin. When

an alternate function is enabled, it might override the normal port pin function or pin value. This

happens when other peripherals that require pins are enabled or configured to use pins. If and

how a peripheral will override and use pins is described in the section for that peripheral. ”Pinout

and Pin Functions” on page 51 shows which modules on peripherals that enable alternate func-

tions on a pin, and which alternate functions that are available on a pin.

INVERTED I/O

Interrupt

Control IREQ

Event

Synchronizer

INn

EDGE

DETECT

Asynchronous sensing

Synchronous sensing

EDGE

DETECT

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15. TC0/1 – 16-bit Timer/Counter Type 0 and 1

15.1 Features

•Four 16-bit timer/counters

– Three timer/counters of type 0

– One timer/counter of type 1

– Split-mode enabling two 8-bit timer/counter from each timer/counter type 0

•32-bit timer/counter support by cascading two timer/counters

•Up to four compare or capture (CC) channels

– Four CC channels for timer/counters of type 0

– Two CC channels for timer/counters of type 1

•Double buffered timer period setting

•Double buffered capture or compare channels

•Waveform generation:

– Frequency generation

– Single-slope pulse width modulation

– Dual-slope pulse width modulation

•Input capture:

– Input capture with noise cancelling

– Frequency capture

– Pulse width capture

– 32-bit input capture

•Timer overflow and error interrupts/events

•One compare match or input capture interrupt/event per CC channel

•Can be used with event system for:

– Quadrature decoding

– Count and direction control

–Capture

•High-resolution extension

– Increases frequency and waveform resolution by 4x (2-bit) or 8x (3-bit)

•Advanced waveform extension:

– Low- and high-side output with programmable dead-time insertion (DTI)

•Event controlled fault protection for safe disabling of drivers

15.2 Overview

Atmel AVR XMEGA devices have a set of four flexible 16-bit Timer/Counters (TC). Their capabil-

ities include accurate program execution timing, frequency and waveform generation, and input

capture with time and frequency measurement of digital signals. Two timer/counters can be cas-

caded to create a 32-bit timer/counter with optional 32-bit capture.

A timer/counter consists of a base counter and a set of compare or capture (CC) channels. The

base counter can be used to count clock cycles or events. It has direction control and period set-

ting that can be used for timing. The CC channels can be used together with the base counter to

do compare match control, frequency generation, and pulse width waveform modulation, as well

as various input capture operations. A timer/counter can be configured for either capture or com-

pare functions, but cannot perform both at the same time.

A timer/counter can be clocked and timed from the peripheral clock with optional prescaling or

from the event system. The event system can also be used for direction control and capture trig-

ger or to synchronize operations.

There are two differences between timer/counter type 0 and type 1. Timer/counter 0 has four CC

channels, and timer/counter 1 has two CC channels. All information related to CC channels 3

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and 4 is valid only for timer/counter 0. Only Timer/Counter 0 has the split mode feature that split

it into two 8-bit Timer/Counters with four compare channels each.

Some timer/counters have extensions to enable more specialized waveform and frequency gen-

eration. The advanced waveform extension (AWeX) is intended for motor control and other

power control applications. It enables low- and high-side output with dead-time insertion, as well

as fault protection for disabling and shutting down external drivers. It can also generate a syn-

chronized bit pattern across the port pins.

The advanced waveform extension can be enabled to provide extra and more advanced fea-

tures for the Timer/Counter. This are only available for Timer/Counter 0. See ”AWeX –

Advanced Waveform Extension” on page 37 for more details.

The high-resolution (hi-res) extension can be used to increase the waveform output resolution

by four or eight times by using an internal clock source running up to four times faster than the

peripheral clock. See ”Hi-Res – High Resolution Extension” on page 38 for more details.

Figure 15-1. Overview of a Timer/Counter and closely related peripherals.

PORTC has one Timer/Counter 0 and one Timer/Counter1. PORTD and PORTE each has one

Timer/Conter0. Notation of these are TCC0 (Time/Counter C0), TCC1, TCD0 and TCE0,

respectively.

AWeX

Compare/Capture Channel D

Compare/Capture Channel C

Compare/Capture Channel B

Compare/Capture Channel A

Waveform

Generation

Buffer

Comparator

Hi-Res

Fault

Protection

Capture

Control

Base Counter

Counter

Control Logic

Timer Period

Prescaler

Dead-Time

Insertion

Pattern

Generation

clkPER4

PORT

Event

System

clkPER

Timer/Counter

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16. TC2 - Timer/Counter Type 2

16.1 Features

•Six eight-bit timer/counters

– Three Low-byte timer/counter

– Three High-byte timer/counter

•Up to eight compare channels in each Timer/Counter 2

– Four compare channels for the low-byte timer/counter

– Four compare channels for the high-byte timer/counter

•Waveform generation

– Single slope pulse width modulation

•Timer underflow interrupts/events

•One compare match interrupt/event per compare channel for the low-byte timer/counter

•Can be used with the event system for count control

16.2 Overview

There are three Timer/Counter 2. These are realized when a Timer/Counter 0 is set in split

mode. It is then a system of two eight-bit timer/counters, each with four compare channels. This

results in eight configurable pulse width modulation (PWM) channels with individually controlled

duty cycles, and is intended for applications that require a high number of PWM channels.

The two eight-bit timer/counters in this system are referred to as the low-byte timer/counter and

high-byte timer/counter, respectively. The difference between them is that only the low-byte

timer/counter can be used to generate compare match interrupts and events. The two eight-bit

timer/counters have a shared clock source and separate period and compare settings. They can

be clocked and timed from the peripheral clock, with optional prescaling, or from the event sys-

tem. The counters are always counting down.

PORTC, PORTD and PORTE each has one Timer/Counter 2. Notation of these are TCC2

(Time/Counter C2), TCD2 and TCE2, respectively.

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17. AWeX – Advanced Waveform Extension

17.1 Features

•Waveform output with complementary output from each compare channel

•Four dead-time insertion (DTI) units

– 8-bit resolution

– Separate high and low side dead-time setting

– Double buffered dead time

– Optionally halts timer during dead-time insertion

•Pattern generation unit creating synchronised bit pattern across the port pins

– Double buffered pattern generation

– Optional distribution of one compare channel output across the port pins

•Event controlled fault protection for instant and predictable fault triggering

17.2 Overview

The advanced waveform extension (AWeX) provides extra functions to the timer/counter in

waveform generation (WG) modes. It is primarily intended for use with different types of motor

control and other power control applications. It enables low- and high side output with dead-time

insertion and fault protection for disabling and shutting down external drivers. It can also gener-

ate a synchronized bit pattern across the port pins.

Each of the waveform generator outputs from the timer/counter 0 are split into a complimentary

pair of outputs when any AWeX features are enabled. These output pairs go through a dead-

time insertion (DTI) unit that generates the non-inverted low side (LS) and inverted high side

(HS) of the WG output with dead-time insertion between LS and HS switching. The DTI output

will override the normal port value according to the port override setting.

The pattern generation unit can be used to generate a synchronized bit pattern on the port it is

connected to. In addition, the WG output from compare channel A can be distributed to and

override all the port pins. When the pattern generator unit is enabled, the DTI unit is bypassed.

The fault protection unit is connected to the event system, enabling any event to trigger a fault

condition that will disable the AWeX output. The event system ensures predictable and instant

fault reaction, and gives flexibility in the selection of fault triggers.

The AWeX is available for TCC0. The notation of this is AWEXC.

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18. Hi-Res – High Resolution Extension

18.1 Features

•Increases waveform generator resolution up to 8x (three bits)

•Supports frequency, single-slope PWM, and dual-slope PWM generation

•Supports the AWeX when this is used for the same timer/counter

18.2 Overview

The high-resolution (hi-res) extension can be used to increase the resolution of the waveform

generation output from a timer/counter by four or eight. It can be used for a timer/counter doing

frequency, single-slope PWM, or dual-slope PWM generation. It can also be used with the

AWeX if this is used for the same timer/counter.

The hi-res extension uses the peripheral 4x clock (ClkPER4). The system clock prescalers must

be configured so the peripheral 4x clock frequency is four times higher than the peripheral and

CPU clock frequency when the hi-res extension is enabled.

There is one hi-res extension that can be enabled for the timer/counter pair on PORTC. The

notation of this is HIRESC.

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19. RTC – 16-bit Real-Time Counter

19.1 Features

•16-bit resolution

•Selectable clock source

– 32.768kHz external crystal

– External clock

– 32.768kHz internal oscillator

– 32kHz internal ULP oscillator

•Programmable 10-bit clock prescaling

•One compare register

•One period register

•Clear counter on period overflow

•Optional interrupt/event on overflow and compare match

19.2 Overview

The 16-bit real-time counter (RTC) is a counter that typically runs continuously, including in low-

power sleep modes, to keep track of time. It can wake up the device from sleep modes and/or

interrupt the device at regular intervals.

The reference clock is typically the 1.024kHz output from a high-accuracy crystal of 32.768kHz,

and this is the configuration most optimized for low power consumption. The faster 32.768kHz

output can be selected if the RTC needs a resolution higher than 1ms. The RTC can also be

clocked from an external clock signal, the 32.768kHz internal oscillator or the 32kHz internal

ULP oscillator.

The RTC includes a 10-bit programmable prescaler that can scale down the reference clock

before it reaches the counter. A wide range of resolutions and time-out periods can be config-

ured. With a 32.768kHz clock source, the maximum resolution is 30.5µs, and time-out periods

can range up to 2000 seconds. With a resolution of 1s, the maximum timeout period is more

than18 hours (65536 seconds). The RTC can give a compare interrupt and/or event when the

counter equals the compare register value, and an overflow interrupt and/or event when it

equals the period register value.

Figure 19-1. Real-time counter overview.

32.768kHz Crystal Osc

32.768kHz Int. Osc

TOSC1

TOSC2

External Clock

DIV32

32kHz int ULP (DIV32)

RTCSRC

10-bit

prescaler

clkRTC

CNT

PER

COMP

”match”/

Compare

TOP/

Overflow

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20. TWI – Two-Wire Interface

20.1 Features

•Two Identical two-wire interface peripherals

•Bidirectional, two-wire communication interface

– Phillips I2C compatible

– System Management Bus (SMBus) compatible

•Bus master and slave operation supported

– Slave operation

– Single bus master operation

– Bus master in multi-master bus environment

– Multi-master arbitration

•Flexible slave address match functions

– 7-bit and general call address recognition in hardware

– 10-bit addressing supported

– Address mask register for dual address match or address range masking

– Optional software address recognition for unlimited number of addresses

•Slave can operate in all sleep modes, including power-down

•Slave address match can wake device from all sleep modes

•100kHz and 400kHz bus frequency support

•Slew-rate limited output drivers

•Input filter for bus noise and spike suppression

•Support arbitration between start/repeated start and data bit (SMBus)

•Slave arbitration allows support for address resolve protocol (ARP) (SMBus)

20.2 Overview

The two-wire interface (TWI) is a bidirectional, two-wire communication interface. It is I2C and

System Management Bus (SMBus) compatible. The only external hardware needed to imple-

ment the bus is one pull-up resistor on each bus line.

A device connected to the bus must act as a master or a slave. The master initiates a data trans-

action by addressing a slave on the bus and telling whether it wants to transmit or receive data.

One bus can have many slaves and one or several masters that can take control of the bus. An

arbitration process handles priority if more than one master tries to transmit data at the same

time. Mechanisms for resolving bus contention are inherent in the protocol.

The TWI module supports master and slave functionality. The master and slave functionality are

separated from each other, and can be enabled and configured separately. The master module

supports multi-master bus operation and arbitration. It contains the baud rate generator. Both

100kHz and 400kHz bus frequency is supported. Quick command and smart mode can be

enabled to auto-trigger operations and reduce software complexity.

The slave module implements 7-bit address match and general address call recognition in hard-

ware. 10-bit addressing is also supported. A dedicated address mask register can act as a

second address match register or as a register for address range masking. The slave continues

to operate in all sleep modes, including power-down mode. This enables the slave to wake up

the device from all sleep modes on TWI address match. It is possible to disable the address

matching to let this be handled in software instead.

The TWI module will detect START and STOP conditions, bus collisions, and bus errors. Arbitra-

tion lost, errors, collision, and clock hold on the bus are also detected and indicated in separate

status flags available in both master and slave modes.

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It is possible to disable the TWI drivers in the device, and enable a four-wire digital interface for

connecting to an external TWI bus driver. This can be used for applications where the device

operates from a different VCC voltage than used by the TWI bus.

PORTC and PORTE each has one TWI. Notation of these peripherals are TWIC and TWIE.

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21. SPI – Serial Peripheral Interface

21.1 Features

•Two Identical SPI peripherals

•Full-duplex, three-wire synchronous data transfer

•Master or slave operation

•Lsb first or msb first data transfer

•Eight programmable bit rates

•Interrupt flag at the end of transmission

•Write collision flag to indicate data collision

•Wake up from idle sleep mode

•Double speed master mode

21.2 Overview

The Serial Peripheral Interface (SPI) is a high-speed synchronous data transfer interface using

three or four pins. It allows fast communication between an Atmel AVR XMEGA device and

peripheral devices or between several microcontrollers. The SPI supports full-duplex

communication.

A device connected to the bus must act as a master or slave. The master initiates and controls

all data transactions.

PORTC and PORTD each has one SPI. Notation of these peripherals are SPIC and SPID.

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22. USART

22.1 Features

•Two identical USART peripherals

•Full-duplex operation

•Asynchronous or synchronous operation

– Synchronous clock rates up to 1/2 of the device clock frequency

– Asynchronous clock rates up to 1/8 of the device clock frequency

•Supports serial frames with 5, 6, 7, 8, or 9 data bits and 1 or 2 stop bits

•Fractional baud rate generator

– Can generate desired baud rate from any system clock frequency

– No need for external oscillator with certain frequencies

•Built-in error detection and correction schemes

– Odd or even parity generation and parity check

– Data overrun and framing error detection

– Noise filtering includes false start bit detection and digital low-pass filter

•Separate interrupts for

– Transmit complete

– Transmit data register empty

– Receive complete

•Multiprocessor communication mode

– Addressing scheme to address a specific devices on a multidevice bus

– Enable unaddressed devices to automatically ignore all frames

•Master SPI mode

– Double buffered operation

– Operation up to 1/2 of the peripheral clock frequency

•IRCOM module for IrDA compliant pulse modulation/demodulation

22.2 Overview

The universal synchronous and asynchronous serial receiver and transmitter (USART) is a fast

and flexible serial communication module. The USART supports full-duplex communication and

asynchronous and synchronous operation. The USART can be configured to operate in SPI

master mode and used for SPI communication.

Communication is frame based, and the frame format can be customized to support a wide

range of standards. The USART is buffered in both directions, enabling continued data transmis-

sion without any delay between frames. Separate interrupts for receive and transmit complete

enable fully interrupt driven communication. Frame error and buffer overflow are detected in

hardware and indicated with separate status flags. Even or odd parity generation and parity

check can also be enabled.

The clock generator includes a fractional baud rate generator that is able to generate a wide

range of USART baud rates from any system clock frequencies. This removes the need to use

an external crystal oscillator with a specific frequency to achieve a required baud rate. It also

supports external clock input in synchronous slave operation.

When the USART is set in master SPI mode, all USART-specific logic is disabled, leaving the

transmit and receive buffers, shift registers, and baud rate generator enabled. Pin control and

interrupt generation are identical in both modes. The registers are used in both modes, but their

functionality differs for some control settings.

An IRCOM module can be enabled for one USART to support IrDA 1.4 physical compliant pulse

modulation and demodulation for baud rates up to 115.2Kbps.

PORTC and PORTD each has one USART. Notation of these peripherals are USARTC0 and

USARTD0 respectively.

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23. IRCOM – IR Communication Module

23.1 Features

•Pulse modulation/demodulation for infrared communication

•IrDA compatible for baud rates up to 115.2Kbps

•Selectable pulse modulation scheme

– 3/16 of the baud rate period

– Fixed pulse period, 8-bit programmable

– Pulse modulation disabled

•Built-in filtering

•Can be connected to and used by any USART

23.2 Overview

Atmel AVR XMEGA devices contain an infrared communication module (IRCOM) that is IrDA

compatible for baud rates up to 115.2Kbps. It can be connected to any USART to enable infra-

red pulse encoding/decoding for that USART.

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24. CRC – Cyclic Redundancy Check Generator

24.1 Features

•Cyclic redundancy check (CRC) generation and checking for

– Communication data

– Program or data in flash memory

– Data in SRAM and I/O memory space

•Integrated with flash memory and CPU

– Automatic CRC of the complete or a selectable range of the flash memory

– CPU can load data to the CRC generator through the I/O interface

•CRC polynomial software selectable to

– CRC-16 (CRC-CCITT)

– CRC-32 (IEEE 802.3)

•Zero remainder detection

24.2 Overview

A cyclic redundancy check (CRC) is an error detection technique test algorithm used to find

accidental errors in data, and it is commonly used to determine the correctness of a data trans-

mission, and data present in the data and program memories. A CRC takes a data stream or a

block of data as input and generates a 16- or 32-bit output that can be appended to the data and

used as a checksum. When the same data are later received or read, the device or application

repeats the calculation. If the new CRC result does not match the one calculated earlier, the

block contains a data error. The application will then detect this and may take a corrective

action, such as requesting the data to be sent again or simply not using the incorrect data.

Typically, an n-bit CRC applied to a data block of arbitrary length will detect any single error

burst not longer than n bits (any single alteration that spans no more than n bits of the data), and

will detect the fraction 1-2-n of all longer error bursts. The CRC module in Atmel AVR XMEGA

devices supports two commonly used CRC polynomials; CRC-16 (CRC-CCITT) and CRC-32

(IEEE 802.3).

•CRC-16:

•CRC-32:

Polynomial: x16+x12+x5+1

Hex value: 0x1021

Polynomial: x32+x26+x23+x22+x16+x12+x11+x10+x8+x7+x5+x4+x2+x+1

Hex value: 0x04C11DB7

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25. ADC – 12-bit Analog to Digital Converter

25.1 Features

•One Analog to Digital Converter (ADC)

•12-bit resolution

•Up to 200 thousand samples per second

– Down to 3.6µs conversion time with 8-bit resolution

– Down to 5.0µs conversion time with 12-bit resolution

•Differential and single-ended input

– Up to 12 single-ended inputs

– 12x4 differential inputs without gain

– 8x4 differential inputs with gain

•Built-in differential gain stage

–1/2x, 1x, 2x, 4x, 8x, 16x, 32x, and 64x gain options

•Single, continuous and scan conversion options

•Three internal inputs

– Internal temperature sensor

–V

CC voltage divided by 10

– 1.1V bandgap voltage

•Internal and external reference options

•Compare function for accurate monitoring of user defined thresholds

•Optional event triggered conversion for accurate timing

•Optional interrupt/event on compare result

25.2 Overview

The ADC converts analog signals to digital values. The ADC has 12-bit resolution and is capable

of converting up to 200 thosuand samples per second (ksps). The input selection is flexible, and

both single-ended and differential measurements can be done. For differential measurements,

an optional gain stage is available to increase the dynamic range. In addition, several internal

signal inputs are available. The ADC can provide both signed and unsigned results.

The ADC measurements can either be started by application software or an incoming event from

another peripheral in the device. The ADC measurements can be started with predictable timing,

and without software intervention.

Both internal and external reference voltages can be used. An integrated temperature sensor is

available for use with the ADC. The VCC/10 and the bandgap voltage can also be measured by

the ADC.

The ADC has a compare function for accurate monitoring of user defined thresholds with mini-

mum software intervention required.

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Figure 25-1. ADC overview.

The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (prop-

agation delay) from 5.0µs for 12-bit to 3.6µs for 8-bit result.

ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This

eases calculation when the result is represented as a signed integer (signed 16-bit number).

PORTA has one ADC. Notation of this peripheral is ADCA.

CH0 Result

Compare

>Threshold

(Int Req)

Internal 1.00V

Internal VCC/1.6V

AREFA

AREFB

INP

INN

Internal

signals

Internal VCC/2

ADC0

ADC11

•

ADC0

ADC7

•

Reference

Voltage

ADC

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26. AC – Analog Comparator

26.1 Features

•Two Analog Comparators

•Selectable hysteresis

–No

–Small

–Large

•Analog comparator output available on pin

•Flexible input selection

– All pins on the port

– Bandgap reference voltage

– A 64-level programmable voltage scaler of the internal VCC voltage

•Interrupt and event generation on:

– Rising edge

– Falling edge

–Toggle

•Window function interrupt and event generation on:

– Signal above window

– Signal inside window

– Signal below window

•Constant current source with configurable output pin selection

26.2 Overview

The analog comparator (AC) compares the voltage levels on two inputs and gives a digital out-

put based on this comparison. The analog comparator may be configured to generate interrupt

requests and/or events upon several different combinations of input change.

The analog comparator hysteresis can be adjusted in order to achieve the optimal operation for

each application.

The input selection includes analog port pins, several internal signals, and a 64-level program-

mable voltage scaler. The analog comparator output state can also be output on a pin for use by

external devices.

A constant current source can be enabled and output on a selectable pin. This can be used to

replace, for example, external resistors used to charge capacitors in capacitive touch sensing

applications.

The analog comparators are always grouped in pairs on each port. These are called analog

comparator 0 (AC0) and analog comparator 1 (AC1). They have identical behavior, but separate

control registers. Used as pair, they can be set in window mode to compare a signal to a voltage

range instead of a voltage level.

PORTA has one AC pair. Notation is ACA.

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Figure 26-1. Analog comparator overview.

The window function is realized by connecting the external inputs of the two analog comparators

in a pair as shown in Figure 26-2.

Figure 26-2. Analog comparator window function.

ACnMUXCTRL ACnCTRL

Interrupt

Mode

Enable

Hysteresis

AC1OUT

WINCTRL

Interrupt

Sensititivity

Control

Window

Function

Events

Interrupts

AC0OUT

Pin Input

Voltage

Scaler

Bandgap

AC0

AC1

AC0

AC1

Input signal

Upper limit of window

Lower limit of window

Interrupt

sensitivity

control

Interrupts

Events

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27. Programming and Debugging

27.1 Features

•Programming

– External programming through PDI

Minimal protocol overhead for fast operation

Built-in error detection and handling for reliable operation

– Boot loader support for programming through any communication interface

•Debugging

– Nonintrusive, real-time, on-chip debug system

– No software or hardware resources required from device except pin connection

– Program flow control

Go, Stop, Reset, Step Into, Step Over, Step Out, Run-to-Cursor

– Unlimited number of user program breakpoints

– Unlimited number of user data breakpoints, break on:

Data location read, write, or both read and write

Data location content equal or not equal to a value

Data location content is greater or smaller than a value

Data location content is within or outside a range

– No limitation on device clock frequency

•Program and Debug Interface (PDI)

– Two-pin interface for external programming and debugging

– Uses the Reset pin and a dedicated pin

– No I/O pins required during programming or debugging

27.2 Overview

The Program and Debug Interface (PDI) is an Atmel proprietary interface for external program-

ming and on-chip debugging of a device.

The PDI supports fast programming of nonvolatile memory (NVM) spaces; flash, EEPOM, fuses,

lock bits, and the user signature row.

Debug is supported through an on-chip debug system that offers nonintrusive, real-time debug.

It does not require any software or hardware resources except for the device pin connection.

Using the Atmel tool chain, it offers complete program flow control and support for an unlimited

number of program and complex data breakpoints. Application debug can be done from a C or

other high-level language source code level, as well as from an assembler and disassembler

level.

Programming and debugging can be done through the PDI physical layer. This is a two-pin inter-

face that uses the Reset pin for the clock input (PDI_CLK) and one other dedicated pin for data

input and output (PDI_DATA). Any external programmer or on-chip debugger/emulator can be

directly connected to this interface.

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28. Pinout and Pin Functions

The device pinout is shown in ”Pinout/Block Diagram” on page 3. In addition to general purpose

I/O functionality, each pin can have several alternate functions. This will depend on which

peripheral is enabled and connected to the actual pin. Only one of the pin functions can be used

at time.

28.1 Alternate Pin Function Description

The tables below show the notation for all pin functions available and describe its function.

28.1.1 Operation/Power Supply

28.1.2 Port Interrupt functions

28.1.3 Analog functions

28.1.4 Timer/Counter and AWEX functions

VCC Digital supply voltage

AVCC Analog supply voltage

GND Ground

SYNC Port pin with full synchronous and limited asynchronous interrupt function

ASYNC Port pin with full synchronous and full asynchronous interrupt function

ACn Analog Comparator input pin n

ACnOUT Analog Comparator n Output

ADCn Analog to Digital Converter input pin n

AREF Analog Reference input pin

OCnxLS Output Compare Channel x Low Side for Timer/Counter n

OCnxHS Output Compare Channel x High Side for Timer/Counter n

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28.1.5 Communication functions

28.1.6 Oscillators, Clock and Event

28.1.7 Debug/System functions

SCL Serial Clock for TWI

SDA Serial Data for TWI

SCLIN Serial Clock In for TWI when external driver interface is enabled

SCLOUT Serial Clock Out for TWI when external driver interface is enabled

SDAIN Serial Data In for TWI when external driver interface is enabled

SDAOUT Serial Data Out for TWI when external driver interface is enabled

XCKn Transfer Clock for USART n

RXDn Receiver Data for USART n

TXDn Transmitter Data for USART n

SS Slave Select for SPI

MOSI Master Out Slave In for SPI

MISO Master In Slave Out for SPI

SCK Serial Clock for SPI

TOSCn Timer Oscillator pin n

XTALn Input/Output for Oscillator pin n

CLKOUT Peripheral Clock Output

EVOUT Event Channel Output

RTCOUT RTC Clock Source Output

RESET Reset pin

PDI_CLK Program and Debug Interface Clock pin

PDI_DATA Program and Debug Interface Data pin

8135L–AVR–06/12

XMEGA D4

28.2 Alternate Pin Functions

The tables below show the primary/default function for each pin on a port in the first column, the

pin number in the second column, and then all alternate pin functions in the remaining columns.

The head row shows what peripheral that enable and use the alternate pin functions.

For better flexibility, some alternate functions also have selectable pin locations for their func-

tions, this is noted under the first table where this apply.

Table 28-1. Port A - Alternate functions.

PORT A PIN # INTERRUPT ADCA

POS/GAINPOS

ADCA

NEG

ADCA

GAINNEG

ACA

POS

ACA

NEG

ACA

OUT

REFA

GND 38

AVCC 39

PA0 40 SYNC ADC0 ADC0 AC0 AC0 AREF

PA1 41 SYNC ADC1 ADC1 AC1 AC1

PA2 42 SYNC/ASYNC ADC2 ADC2 AC2

PA3 43 SYNC ADC3 ADC3 AC3 AC3

PA4 44 SYNC ADC4 ADC4 AC4

PA5 1 SYNC ADC5 ADC5 AC5 AC5

PA6 2 SYNC ADC6 ADC6 AC6 AC1OUT

PA7 3 SYNC ADC7 ADC7 AC7 AC0OUT

Table 28-2. Port B - Alternate functions.

PORT B PIN # INTERRUPT ADCA

POS

REFB

PB0 4 SYNC ADC8 AREF

PB1 5 SYNC ADC9

PB2 6 SYNC/ASYNC ADC10

PB3 7 SYNC ADC11

8135L–AVR–06/12

XMEGA D4

Notes: 1. Pin mapping of all TC0 can optionally be moved to high nibble of port.

2. If TC0 is configured as TC2 all eight pins can be used for PWM output.

3. Pin mapping of all USART0 can optionally be moved to high nibble of port.

4. Pins MOSI and SCK for all SPI can optionally be swapped.

5. CLKOUT can optionally be moved between port C, D and E and between pin 4 and 7.

6. EVOUT can optionally be moved between port C, D and E and between pin 4 and 7.

Table 28-3. Port C - Alternate functions.

PORT C PIN # INTERRUPT TCC0 (1)(2) AWEXC TCC1 USARTC0 (3) SPIC (4) TWIC CLOCKOUT (5) EVENTOUT (6)

GND 8

VCC 9

PC0 10 SYNC OC0A OC0ALS SDA

PC1 11 SYNC OC0B OC0AHS XCK0 SCL

PC2 12 SYNC/ASYNC OC0C OC0BLS RXD0

PC3 13 SYNC OC0D OC0BHS TXD0

PC4 14 SYNC OC0CLS OC1A SS

PC5 15 SYNC OC0CHS OC1B MOSI

PC6 16 SYNC OC0DLS MISO clkRTC

PC7 17 SYNC OC0DHS SCK clkPER EVOUT

Table 28-4. Port D - Alternate functions.

PORT D PIN # INTERRUPT TCD0 USARTD0 SPID CLOCKOUT EVENTOUT

GND 18

VCC 19

PD0 20 SYNC OC0A

PD1 21 SYNC OC0B XCK0

PD2 22 SYNC/ASYNC OC0C RXD0

PD3 23 SYNC OC0D TXD0

PD4 24 SYNC SS

PD5 25 SYNC MOSI

PD6 26 SYNC MISO

PD7 27 SYNC SCK clkPER EVOUT

Table 28-5. Port E - Alternate functions.

PORT E PIN # INTERRUPT TCE0 TWIE

PE0 28 SYNC OC0A SDA

PE1 29 SYNC OC0B SCL

GND 30

VCC 31

PE2 32 SYNC/ASYNC OC0C

PE3 33 SYNC OC0D

8135L–AVR–06/12

XMEGA D4

Note: 1. TOSC pins can optionally be moved to PE2/PE3.

Table 28-6. Port R- Alternate functions.

PORT R PIN # INTERRUPT PDI XTAL TOSC(1)

PDI 34 PDI_DATA

RESET 35 PDI_CLOCK

PRO 36 SYNC XTAL2 TOSC2

PR1 37 SYNC XTAL1 TOSC1

8135L–AVR–06/12

XMEGA D4

29. Peripheral Module Address Map

The address maps show the base address for each peripheral and module in Atmel AVR

XMEGA D4. For complete register description and summary for each peripheral module, refer to

the XMEGA D manual.

Base address Name Description

0x0000 GPIO General Purpose IO Registers

0x0010 VPORT0 Virtual Port 0

0x0014 VPORT1 Virtual Port 1

0x0018 VPORT2 Virtual Port 2

0x001C VPORT3 Virtual Port 3

0x0030 CPU CPU

0x0040 CLK Clock Control

0x0048 SLEEP Sleep Controller

0x0050 OSC Oscillator Control

0x0060 DFLLRC32M DFLL for the 32MHz Internal Oscillator

0x0068 DFLLRC2M DFLL for the 2MHz Internal Oscillator

0x0070 PR Power Reduction

0x0078 RST Reset Controller

0x0080 WDT Watch-Dog Timer

0x0090 MCU MCU Control

0x00A0 PMIC Programmable Multilevel Interrupt Controller

0x00B0 PORTCFG Port Configuration

0x00D0 CRC CRC Module

0x0180 EVSYS Event System

0x01C0 NVM Non Volatile Memory (NVM) Controller

0x0200 ADCA Analog to Digital Converter on port A

0x0380 ACA Analog Comparator pair on port A

0x0400 RTC Real Time Counter

0x0480 TWIC Two Wire Interface on port C

0x04A0 TWIE Two Wire Interface on port E

0x0600 PORTA Port A

0x0620 PORTB Port B

0x0640 PORTC Port C

0x0660 PORTD Port D

0x0680 PORTE Port E

0x07E0 PORTR Port R

0x0800 TCC0 Timer/Counter 0 on port C

0x0840 TCC1 Timer/Counter 1 on port C

0x0880 AWEXC Advanced Waveform Extension on port C

0x0890 HIRESC High Resolution Extension on port C

0x08A0 USARTC0 USART 0 on port C

0x08C0 SPIC Serial Peripheral Interface on port C

0x08F8 IRCOM Infrared Communication Module

0x0900 TCD0 Timer/Counter 0 on port D

0x09A0 USARTD0 USART 0 on port D

0x09C0 SPID Serial Peripheral Interface on port D

0x0A00 TCE0 Timer/Counter 0 on port E

8135L–AVR–06/12

XMEGA D4

30. Instruction Set Summary

Mnemonics Operands Description Operation Flags #Clocks

Arithmetic and logic instructions

ADD Rd, Rr Add without Carry Rd ←Rd + Rr Z,C,N,V,S,H 1

ADC Rd, Rr Add with Carry Rd ←Rd + Rr + C Z,C,N,V,S,H 1

ADIW Rd, K Add Immediate to Word Rd ←Rd + 1:Rd + K Z,C,N,V,S 2

SUB Rd, Rr Subtract without Carry Rd ←Rd - Rr Z,C,N,V,S,H 1

SUBI Rd, K Subtract Immediate Rd ←Rd - K Z,C,N,V,S,H 1

SBC Rd, Rr Subtract with Carry Rd ←Rd - Rr - C Z,C,N,V,S,H 1

SBCI Rd, K Subtract Immediate with Carry Rd ←Rd - K - C Z,C,N,V,S,H 1

SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd ←Rd + 1:Rd - K Z,C,N,V,S 2

AND Rd, Rr Logical AND Rd ←Rd • Rr Z,N,V,S 1

ANDI Rd, K Logical AND with Immediate Rd ←Rd • K Z,N,V,S 1

OR Rd, Rr Logical OR Rd ←Rd v Rr Z,N,V,S 1

ORI Rd, K Logical OR with Immediate Rd ←Rd v K Z,N,V,S 1

EOR Rd, Rr Exclusive OR Rd ←Rd ⊕ Rr Z,N,V,S 1

COM Rd One’s Complement Rd ←$FF - Rd Z,C,N,V,S 1

NEG Rd Two’s Complement Rd ←$00 - Rd Z,C,N,V,S,H 1

SBR Rd,K Set Bit(s) in Register Rd ←Rd v K Z,N,V,S 1

CBR Rd,K Clear Bit(s) in Register Rd ←Rd • ($FFh - K) Z,N,V,S 1

INC Rd Increment Rd ←Rd + 1 Z,N,V,S 1

DEC Rd Decrement Rd ←Rd - 1 Z,N,V,S 1

TST Rd Test for Zero or Minus Rd ←Rd • Rd Z,N,V,S 1

CLR Rd Clear Register Rd ←Rd ⊕ Rd Z,N,V,S 1

SER Rd Set Register Rd ←$FF None 1

MUL Rd,Rr Multiply Unsigned R1:R0 ←Rd x Rr (UU) Z,C 2

MULS Rd,Rr Multiply Signed R1:R0 ←Rd x Rr (SS) Z,C 2

MULSU Rd,Rr Multiply Signed with Unsigned R1:R0 ←Rd x Rr (SU) Z,C 2

FMUL Rd,Rr Fractional Multiply Unsigned R1:R0 ←Rd x Rr<<1 (UU) Z,C 2

FMULS Rd,Rr Fractional Multiply Signed R1:R0 ←Rd x Rr<<1 (SS) Z,C 2

FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0 ←Rd x Rr<<1 (SU) Z,C 2

Branch instructions

RJMP k Relative Jump PC ←PC + k + 1 None 2

IJMP Indirect Jump to (Z) PC(15:0)

PC(21:16)

←

None 2

EIJMP Extended Indirect Jump to (Z) PC(15:0)

PC(21:16)

←

EIND

None 2

JMP k Jump PC ←k None 3

RCALL k Relative Call Subroutine PC ←PC + k + 1 None 2 / 3 (1)

ICALL Indirect Call to (Z) PC(15:0)

PC(21:16)

←

None 2 / 3 (1)

EICALL Extended Indirect Call to (Z) PC(15:0)

PC(21:16)

←

EIND

None 3 (1)

CALL k call Subroutine PC ←k None 3 / 4 (1)

8135L–AVR–06/12

XMEGA D4

RET Subroutine Return PC ←STACK None 4 / 5 (1)

RETI Interrupt Return PC ←STACK I 4 / 5 (1)

CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ←PC + 2 or 3 None 1 / 2 / 3

CP Rd,Rr Compare Rd - Rr Z,C,N,V,S,H 1

CPC Rd,Rr Compare with Carry Rd - Rr - C Z,C,N,V,S,H 1

CPI Rd,K Compare with Immediate Rd - K Z,C,N,V,S,H 1

SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC ←PC + 2 or 3 None 1 / 2 / 3

SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC ←PC + 2 or 3 None 1 / 2 / 3

SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC ←PC + 2 or 3 None 2 / 3 / 4

SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC ←PC + 2 or 3 None 2 / 3 / 4

BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC ←PC + k + 1 None 1 / 2

BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC ←PC + k + 1 None 1 / 2

BREQ k Branch if Equal if (Z = 1) then PC ←PC + k + 1 None 1 / 2

BRNE k Branch if Not Equal if (Z = 0) then PC ←PC + k + 1 None 1 / 2

BRCS k Branch if Carry Set if (C = 1) then PC ←PC + k + 1 None 1 / 2

BRCC k Branch if Carry Cleared if (C = 0) then PC ←PC + k + 1 None 1 / 2

BRSH k Branch if Same or Higher if (C = 0) then PC ←PC + k + 1 None 1 / 2

BRLO k Branch if Lower if (C = 1) then PC ←PC + k + 1 None 1 / 2

BRMI k Branch if Minus if (N = 1) then PC ←PC + k + 1 None 1 / 2

BRPL k Branch if Plus if (N = 0) then PC ←PC + k + 1 None 1 / 2

BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ←PC + k + 1 None 1 / 2

BRLT k Branch if Less Than, Signed if (N ⊕ V= 1) then PC ←PC + k + 1 None 1 / 2

BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ←PC + k + 1 None 1 / 2

BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ←PC + k + 1 None 1 / 2

BRTS k Branch if T Flag Set if (T = 1) then PC ←PC + k + 1 None 1 / 2

BRTC k Branch if T Flag Cleared if (T = 0) then PC ←PC + k + 1 None 1 / 2

BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ←PC + k + 1 None 1 / 2

BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ←PC + k + 1 None 1 / 2

BRIE k Branch if Interrupt Enabled if (I = 1) then PC ←PC + k + 1 None 1 / 2

BRID k Branch if Interrupt Disabled if (I = 0) then PC ←PC + k + 1 None 1 / 2

Data transfer instructions

MOV Rd, Rr Copy Register Rd ←Rr None 1

MOVW Rd, Rr Copy Register Pair Rd+1:Rd ←Rr+1:Rr None 1

LDI Rd, K Load Immediate Rd ←K None 1

LDS Rd, k Load Direct from data space Rd ←(k) None 2 (1)(2)

LD Rd, X Load Indirect Rd ←(X) None 1 (1)(2)

LD Rd, X+ Load Indirect and Post-Increment Rd

←

(X)

X + 1

None 1 (1)(2)

LD Rd, -X Load Indirect and Pre-Decrement X ← X - 1,

Rd ← (X)

←

X - 1

(X)

None 2 (1)(2)

LD Rd, Y Load Indirect Rd ← (Y) ←(Y) None 1 (1)(2)

LD Rd, Y+ Load Indirect and Post-Increment Rd

←

(Y)

Y + 1

None 1 (1)(2)

Mnemonics Operands Description Operation Flags #Clocks

8135L–AVR–06/12

XMEGA D4

LD Rd, -Y Load Indirect and Pre-Decrement Y

←

Y - 1

(Y)

None 2 (1)(2)

LDD Rd, Y+q Load Indirect with Displacement Rd ←(Y + q) None 2 (1)(2)

LD Rd, Z Load Indirect Rd ←(Z) None 1 (1)(2)

LD Rd, Z+ Load Indirect and Post-Increment Rd

←

(Z),

Z+1

None 1 (1)(2)

LD Rd, -Z Load Indirect and Pre-Decrement Z

←

Z - 1,

(Z)

None 2 (1)(2)

LDD Rd, Z+q Load Indirect with Displacement Rd ←(Z + q) None 2 (1)(2)

STS k, Rr Store Direct to Data Space (k) ←Rd None 2 (1)

ST X, Rr Store Indirect (X) ←Rr None 1 (1)

ST X+, Rr Store Indirect and Post-Increment (X)

←

Rr,

X + 1

None 1 (1)

ST -X, Rr Store Indirect and Pre-Decrement X

(X)

←

X - 1,

None 2 (1)

ST Y, Rr Store Indirect (Y) ←Rr None 1 (1)

ST Y+, Rr Store Indirect and Post-Increment (Y)

←

Rr,

Y + 1

None 1 (1)

ST -Y, Rr Store Indirect and Pre-Decrement Y

(Y)

←

Y - 1,

None 2 (1)

STD Y+q, Rr Store Indirect with Displacement (Y + q) ←Rr None 2 (1)

ST Z, Rr Store Indirect (Z) ←Rr None 1 (1)

ST Z+, Rr Store Indirect and Post-Increment (Z)

←

Z + 1

None 1 (1)

ST -Z, Rr Store Indirect and Pre-Decrement Z ←Z - 1 None 2 (1)

STD Z+q,Rr Store Indirect with Displacement (Z + q) ←Rr None 2 (1)

LPM Load Program Memory R0 ←(Z) None 3

LPM Rd, Z Load Program Memory Rd ←(Z) None 3

LPM Rd, Z+ Load Program Memory and Post-Increment Rd

←

(Z),

Z + 1

None 3

ELPM Extended Load Program Memory R0 ←(RAMPZ:Z) None 3

ELPM Rd, Z Extended Load Program Memory Rd ←(RAMPZ:Z) None 3

ELPM Rd, Z+ Extended Load Program Memory and Post-

Increment

←

(RAMPZ:Z),

Z + 1

None 3

SPM Store Program Memory (RAMPZ:Z) ←R1:R0 None -

SPM Z+ Store Program Memory and Post-Increment

by 2

(RAMPZ:Z)

←

R1:R0,

Z + 2

None -

IN Rd, A In From I/O Location Rd ←I/O(A) None 1

OUT A, Rr Out To I/O Location I/O(A) ←Rr None 1

PUSH Rr Push Register on Stack STACK ←Rr None 1 (1)

POP Rd Pop Register from Stack Rd ←STACK None 2 (1)

Bit and bit-test instructions

LSL Rd Logical Shift Left Rd(n+1)

Rd(0)

←

Rd(n),

Rd(7)

Z,C,N,V,H 1

LSR Rd Logical Shift Right Rd(n)

Rd(7)

←

Rd(n+1),

Rd(0)

Z,C,N,V 1

Mnemonics Operands Description Operation Flags #Clocks

8135L–AVR–06/12

XMEGA D4

Notes: 1. Cycle times for data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface.

2. One extra cycle must be added when accessing Internal SRAM.

ROL Rd Rotate Left Through Carry Rd(0)

Rd(n+1)

←

Rd(n),

Rd(7)

Z,C,N,V,H 1

ROR Rd Rotate Right Through Carry Rd(7)

Rd(n)

←

Rd(n+1),

Rd(0)

Z,C,N,V 1

ASR Rd Arithmetic Shift Right Rd(n) ←Rd(n+1), n=0..6 Z,C,N,V 1

SWAP Rd Swap Nibbles Rd(3..0) ↔Rd(7..4) None 1

BSET s Flag Set SREG(s) ←1SREG(s)1

BCLR s Flag Clear SREG(s) ←0SREG(s)1

SBI A, b Set Bit in I/O Register I/O(A, b) ←1 None 1

CBI A, b Clear Bit in I/O Register I/O(A, b) ←0 None 1

BST Rr, b Bit Store from Register to T T ←Rr(b) T 1

BLD Rd, b Bit load from T to Register Rd(b) ←T None 1

SEC Set Carry C ←1C1

CLC Clear Carry C ←0C1

SEN Set Negative Flag N ←1N1

CLN Clear Negative Flag N ←0N1

SEZ Set Zero Flag Z ←1Z1

CLZ Clear Zero Flag Z ←0Z1

SEI Global Interrupt Enable I ←1I1

CLI Global Interrupt Disable I ←0I1

SES Set Signed Test Flag S ←1S1

CLS Clear Signed Test Flag S ←0S1

SEV Set Two’s Complement Overflow V ←1V1

CLV Clear Two’s Complement Overflow V ←0V1

SET Set T in SREG T ←1T1

CLT Clear T in SREG T ←0T1

SEH Set Half Carry Flag in SREG H ←1H1

CLH Clear Half Carry Flag in SREG H ←0H1

MCU control instructions

BREAK Break (See specific descr. for BREAK) None 1

NOP No Operation None 1

SLEEP Sleep (see specific descr. for Sleep) None 1

WDR Watchdog Reset (see specific descr. for WDR) None 1

Mnemonics Operands Description Operation Flags #Clocks

8135L–AVR–06/12

XMEGA D4

31. Packaging information

31.1 44A

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

44A, 44-lead, 10 x 10mm body size, 1.0mm body thickness,

0.8 mm lead pitch, thin profile plastic quad flat package (TQFP) C

44A

2010-10-20

PIN 1 IDENTIFIER

0°~7°

PIN 1

A1 A2 A

E1 E

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

Notes:

1. This package conforms to JEDEC reference MS-026, Variation ACB.

2. Dimensions D1 and E1 do not include mold protrusion. Allowable

protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum

plastic body size dimensions including mold mismatch.

3. Lead coplanarity is 0.10mm maximum.

A – – 1.20

A1 0.05 – 0.15

A2 0.95 1.00 1.05

D 11.75 12.00 12.25

D1 9.90 10.00 10.10 Note 2

E 11.75 12.00 12.25

E1 9.90 10.00 10.10 Note 2

B 0.30 – 0.45

C 0.09 – 0.20

L 0.45 – 0.75

e 0.80 TYP

8135L–AVR–06/12

XMEGA D4

31.2 44M1

TITLE DRAWING NO.GPC REV.

Package Drawing Contact:

packagedrawings@atmel.com 44M1ZWS H

44M1, 44-pad, 7 x 7 x 1.0mm body, lead

pitch 0.50mm, 5.20mm exposed pad, thermally

enhanced plastic very thin quad flat no

lead package (VQFN)

9/26/08

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A 0.80 0.90 1.00

A1 – 0.02 0.05

A3 0.20 REF

b 0.18 0.23 0.30

D2 5.00 5.20 5.40

6.90 7.00 7.10

E2 5.00 5.20 5.40

e 0.50 BSC

L 0.59 0.64 0.69

K 0.20 0.26 0.41

Note: JEDEC Standard MO-220, Fig. 1 (SAW Singulation) VKKD-3.

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Marked Pin# 1 ID

Pin #1 Corner

SEATING PLANE

Pin #1

Triangle

Pin #1

Chamfer

(C 0.30)

Option A

Option B

Pin #1

Notch

(0.20 R)

Option C

8135L–AVR–06/12

XMEGA D4

31.3 49C2

TITLE DRAWING NO. GPC REV.

Package Drawing Contact:

packagedrawings@atmel.com 49C2 CBD A

49C2, 49-ball (7 x 7 array), 0.65mm pitch,

5.0 x 5.0 x 1.0mm, very thin, fine-pitch

ball grid array package (VFBGA)

3/14/08

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A – – 1.00

A1 0.20 – –

A2 0.65 – –

D 4.90 5.00 5.10

D1 3.90 BSC

E 4.90 5.00 5.10

E1 3.90 BSC

b 0.30 0.35 0.40

e 0.65 BSC

TOP VIEW

SIDE VIEW

A1 BALL ID

1 2 3 4 5 6 7

0.10

49 - Ø0.35 ±0.05

A1 BALL CORNER

BOTTOM VIEW

b e

8135L–AVR–06/12

XMEGA D4

32. Electrical Characteristics

All typical values are measured at T = 25°C unless other temperature condition is given. All min-

imum and maximum values are valid across operating temperature and voltage unless other

conditions are given.

32.1 Absolute Maximum Ratings

Stresses beyond those listed in Table 32-1 under may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at these or other conditions

beyond those indicated in the operational sections of this specification is not implied. Exposure

to absolute maximum rating conditions for extended periods may affect device reliability.

32.2 General Operating Ratings

The device must operate within the ratings listed in Table 32-2 in order for all other electrical

characteristics and typical characteristics of the device to be valid.

Table 32-1. Absolute maximum ratings.

Symbol Parameter Condition Min. Typ. Max. Units

VCC Power Supply Voltage -0.3 4 V

IVCC Current into a VCC pin 200 mA

IGND Current out of a Gnd pin 200

VPIN

Pin voltage with respect to

Gnd and VCC

-0.5 VCC+0.5 V

IPIN I/O pin sink/source current -25 25 mA

TAStorage temperature -65 150 °C

TjJunction temperature 150

Table 32-2. General operating conditions.

Symbol Parameter Condition Min. Typ. Max. Units

VCC Power Supply Voltage 1.60 3.6 V

AVCC Analog Supply Voltage 1.60 3.6

TATemperature range -40 85 °C

TjJunction temperature -40 105

8135L–AVR–06/12

XMEGA D4

The maximum CPU clock frequency depends on VCC. As shown in Figure 32-1 the Frequency

vs. VCC curve is linear between 1.8V < VCC <2.7V.

Figure 32-1. Maximum frequency vs. VCC.

Table 32-3. Operating voltage and frequency.

Symbol Parameter Condition Min. Typ. Max. Units

ClkCPU CPU clock frequency

VCC = 1.6V 0 12

MHz

VCC = 1.8V 0 12

VCC = 2.7V 0 32

VCC = 3.6V 0 32

1.8

MHz

2.7 3.6

1.6

Safe Operating Area

8135L–AVR–06/12

XMEGA D4

32.3 Current consumption

Notes: 1. All Power Reduction Registers set.

2. Maximum limits are based on characterization, and not tested in production.

Table 32-4. Current consumption for active mode and sleep modes.

Symbol Parameter Condition Min. Typ. Max. Units

ICC

Active power

consumption (1)

32kHz, ext. clk. VCC = 1.8V 68

µA

VCC = 3.0V 145

1MHz, ext. clk. VCC = 1.8V 260

VCC = 3.0V 540

2MHz, ext. clk. VCC = 1.8V 460 600

VCC = 3.0V 0.96 1.4 mA

32MHz, ext. clk. 9.8 12

Idle power

consumption (1)

32kHz, ext. clk. VCC = 1.8V 2.4

µA

VCC = 3.0V 3.9

1MHz, ext. clk. VCC = 1.8V 62

VCC = 3.0V 118

2MHz, ext. clk. VCC = 1.8V 125 225

VCC = 3.0V 240 350

32MHz, ext. clk. 3.8 5.5 mA

Power-down power

consumption

T=25°C VCC = 3.0V 0.1 1.0

µA

T = 85°C 1.2 4.5

WDT and Sampled BOD enabled,

T=25°C VCC = 3.0V

1.3 3.0

WDT and Sampled BOD enabled,

T = 85°C 2.4 6.0

Power-save power

consumption (2)

RTC from ULP clock, WDT and

sampled BOD enabled, T = 25°C

VCC = 1.8V 1.2

VCC = 3.0V 1.3

RTC from 1.024kHz low power

32.768kHz TOSC, T = 25°C

VCC = 1.8V 0.6 2

VCC = 3.0V 0.7 2

RTC from low power 32.768kHz

TOSC, T = 25°C

VCC = 1.8V 0.8 3

VCC = 3.0V 1.0 3

Reset power consumption Current through RESET pin

substracted VCC = 3.0V 320

8135L–AVR–06/12

XMEGA D4

Note: 1. All parameters measured as the difference in current consumption between module enabled and disabled. All data at

VCC =3.0V, Clk

SYS = 1MHz external clock without prescaling, T = 25°C unless other conditions are given.

Table 32-5. Current consumption for modules and peripherals.

Symbol Parameter Condition (1) Min. Typ. Max. Units

ICC

ULP oscillator 1.0

µA

32.768kHz int. oscillator 27

2MHz int. oscillator 85

DFLL enabled with 32.768kHz int. osc. as reference 115

32MHz int. oscillator 270

DFLL enabled with 32.768kHz int. osc. as reference 460

PLL 20x multiplication factor,

32MHz int. osc. DIV4 as reference 220

Watchdog Timer 1

BOD Continuous mode 138

Sampled mode, includes ULP oscillator 1.2

Internal 1.0V reference 100

Temperature sensor 95

ADC 50ksps

VREF = Ext ref

3.0

CURRLIMIT = LOW 2.6

CURRLIMIT = MEDIUM 2.1

CURRLIMIT = HIGH 1.6

AC 330

µATimer/Counter 16

USART Rx and Tx enabled, 9600 BAUD 2.5

Flash memory and EEPROM programming 4 8 mA

8135L–AVR–06/12

XMEGA D4

32.4 Wake-up time from sleep modes

Note: 1. The wake-up time is the time from the wake-up request is given until the peripheral clock is available on pin, see Figure 32-

2. All peripherals and modules start execution from the first clock cycle, expect the CPU that is halted for four clock cycles

before program execution starts.

Figure 32-2. Wake-up time definition.

Table 32-6. Device wake-up time from sleep modes with various system clock sources.

Symbol Parameter Condition Min. Typ. (1) Max. Units

twakeup

Wake-up time from Idle,

Standby, and Extended Standby

mode

External 2MHz clock 2

µs

32.768kHz internal oscillator 120

2MHz internal oscillator 2

32MHz internal oscillator 0.2

Wake-up time from Power-save

and Power-down mode

External 2MHz clock 4.5

32.768kHz internal oscillator 320

2MHz internal oscillator 9

32MHz internal oscillator 5

Wakeup request

Clock output

Wakeup time

8135L–AVR–06/12

XMEGA D4

32.5 I/O Pin Characteristics

The I/O pins complies with the JEDEC LVTTL and LVCMOS specification and the high- and low

level input and output voltage limits reflect or exceed this specification.

Notes: 1. The sum of all IOH for PORTA and PORTB must not exceed 100mA.

The sum of all IOH for PORTC must not exceed 200mA.

The sum of all IOH for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.

The sum of all IOH for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.

2. The sum of all IOL for PORTA and PORTB must not exceed 100mA.

The sum of all IOL for PORTC must not not exceed 200mA.

The sum of all IOL for PORTD and pins PE[0-1] on PORTE must not exceed 200mA.

The sum of all IOL for PE[2-3] on PORTE, PORTR and PDI must not exceed 100mA.

Table 32-7. I/O pin characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

IOH (1)/

IOL (2) I/O pin source/sink current -15 15 mA

VIH High Level Input Voltage

VCC = 2.7 - 3.6V 2 VCC+0.3

VCC = 2.0 - 2.7V 0.7×VCC VCC+0.3

VCC = 1.6 - 2.0V 0.7×VCC VCC+0.3

VIL Low Level Input Voltage

VCC = 2.7- 3.6V -0.3 0.3×VCC

VCC = 2.0 - 2.7V -0.3 0.3×VCC

VCC = 1.6 - 2.0V -0.3 0.3×VCC

VOH High Level Output Voltage

VCC = 3.3V IOH = -4mA 2.6 2.9

VCC = 3.0V IOH = -3mA 2.1 2.6

VCC = 1.8V IOH = -1mA 1.4 1.6

VOL Low Level Output Voltage

VCC = 3.3V IOL = 8mA 0.4 0.76

VCC = 3.0V IOL = 5mA 0.3 0.64

VCC = 1.8V IOL = 3mA 0.2 0.46

IIN Input Leakage Current T = 25°C <0.001 0.1 µA

RPPull/Buss keeper Resistor 24 kΩ

trRise time No load 4ns

slew rate limitation 7

8135L–AVR–06/12

XMEGA D4

32.6 ADC characteristics

Table 32-8. Power supply, reference and input range.

Symbol Parameter Condition Min. Typ. Max. Units

AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3 V

VREF Reference voltage 1 AVCC- 0.6

Rin Input resistance Switched 4.0 kΩ

Csample Input capacitance Switched 4.4 pF

RAREF Reference input resistance (leakage only) >10 MΩ

CAREF Reference input capacitance Static load 7 pF

VIN Input range -0.1 AVCC+0.1

VConversion range Differential mode, Vinp - Vinn -VREF VREF

VIN Conversion range Single ended unsigned mode, Vinp -ΔVVREF-ΔV

ΔVFixed offset voltage 190 LSB

Table 32-9. Clock and timing.

Symbol Parameter Condition Min. Typ. Max. Units

ClkADC ADC Clock frequency

Maximum is 1/4 of Peripheral clock

frequency 100 1400 kHz

Measuring internal signals 100 125

fADC Sample rate

Current limitation (CURRLIMIT) off 14 200

ksps

CURRLIMIT = LOW 14 150

CURRLIMIT = MEDIUM 14 100

CURRLIMIT = HIGH 14 50

Sampling Time 1/2 ClkADC cycle 0.25 5 µs

Conversion time (latency) (RES+2)/2+GAIN

RES = 8 or 12, GAIN = 0, 1, 2, or 3 5710

ClkADC

cycles

Start-up time ADC clock cycles 12 24

ClkADC

cycles

ADC settling time After changing reference or input mode 7 7

After ADC flush 1 1

Table 32-10. Accuracy characteristics.

Symbol Parameter Condition (2) Min. Typ. Max. Units

RES Resolution Programmable to 8 or 12 bit 8 12 12 Bits

INL (1) Integral non-linearity

50ksps VCC-1.0V < VREF < VCC-0.6V ±1.2 ±3

lsb

All VREF ±1.5 ±4

200ksps VCC-1.0V < VREF < VCC-0.6V ±1.0 ±3

All VREF ±1.5 ±4

DNL (1) Differential non-linearity guaranteed monotonic <±0.8 <±1

8135L–AVR–06/12

XMEGA D4

Notes: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.

2. Unless otherwise noted all linearity, offset and gain error numbers are valid under the condition that external VREF is used.

Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% input voltage range.

Offset error

-1 mV

Temperature drift <0.01 mV/K

Operating voltage drift <0.6 mV/V

Gain error

Differential

mode

External reference -1

AVCC/1.6 10

AVCC/2.0 8

Bandgap ±5

Temperature drift <0.02 mV/K

Operating voltage drift <0.5 mV/V

Noise Differential mode, shorted input

200ksps, VCC = 3.6V, ClkPER = 16MHz 0.4 mV

rms

Table 32-10. Accuracy characteristics. (Continued)

Symbol Parameter Condition (2) Min. Typ. Max. Units

Table 32-11. Gain stage characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

Rin Input resistance Switched in normal mode 4.0 kΩ

Csample Input capacitance Switched in normal mode 4.4 pF

Signal range Gain stage output 0 VCC - 0.6 V

Propagation delay ADC conversion rate 1 ClkADC

cycles

Sample rate Same as ADC 14 200 kHz

INL (1) Integral non-linearity 50ksps All gain

settings ±1.5 ±4 lsb

Gain error

1x gain, normal mode -0.8

%8x gain, normal mode -2.5

64x gain, normal mode -3.5

Offset error,

input referred

1x gain, normal mode -2

mV8x gain, normal mode -5

64x gain, normal mode -4

Noise

1x gain, normal mode

VCC = 3.6V

Ext. VREF

0.5

rms

8x gain, normal mode 1.5

64x gain, normal mode 11

8135L–AVR–06/12

XMEGA D4

32.7 Analog Comparator Characteristics

32.8 Bandgap and Internal 1.0V Reference Characteristics

Table 32-12. Analog comparator characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

Voff Input offset voltage <±10 mV

Ilk Input leakage current <1 nA

Input voltage range -0.1 AVCC V

AC startup time 100 µs

Vhys1 Hysteresis, none 0mV

Vhys2 Hysteresis, small 13

Vhys3 Hysteresis, large 30

tdelay Propagation delay VCC = 3.0V, T= 85°C 30 90 ns

64-level voltage scaler Integral non-linearity (INL) 0.3 0.5 lsb

Table 32-13. Bandgap and Internal 1.0V reference characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

Startup time As reference for ADC 1 ClkPER + 2.5µs µs

As input voltage to ADC and AC 1.5

Bandgap voltage 1.1 V

INT1V Internal 1.00V reference T= 85°C, after calibration 0.99 1 1.01

Variation over voltage and temperature Relative to T= 85°C, VCC = 3.0V ±1.5 %

8135L–AVR–06/12

XMEGA D4

32.9 Brownout Detection Characteristics

32.10 External Reset Characteristics

32.11 Power-on Reset Characteristics

Note: 1. VPOT- values are only valid when BOD is disabled. When BOD is enabled VPOT- = VPOT+.

Table 32-14. Brownout detection characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

VBOT

BOD level 0 falling VCC 1.60 1.62 1.72

BOD level 1 falling VCC 1.8

BOD level 2 falling VCC 2.0

BOD level 3 falling VCC 2.2

BOD level 4 falling VCC 2.4

BOD level 5 falling VCC 2.6

BOD level 6 falling VCC 2.8

BOD level 7 falling VCC 3.0

tBOD Detection time Continuous mode 0.4 µs

Sampled mode 1000

VHYST Hysteresis 1.2 %

Table 32-15. External reset characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

tEXT Minimum reset pulse width 95 1000 ns

VRST

Reset threshold voltage (VIH)VCC = 2.7 - 3.6V 0.60×VCC

VCC = 1.6 - 2.7V 0.60×VCC

Reset threshold voltage (VIL)VCC = 2.7 - 3.6V 0.50×VCC

VCC = 1.6 - 2.7V 0.40×VCC

RRST Reset pin pull-up resistor 25 kΩ

Table 32-16. Power-on reset characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

VPOT- (1) POR threshold voltage falling VCC

VCC falls faster than 1V/ms 0.4 1.0

VVCC falls at 1V/ms or slower 0.8 1.0

VPOT+ POR threshold voltage rising VCC 1.3 1.59

8135L–AVR–06/12

XMEGA D4

32.12 Flash and EEPROM Memory Characteristics

Notes: 1. Programming is timed from the 2MHz internal oscillator.

2. EEPROM is not erased if the EESAVE fuse is programmed.

Table 32-17. Endurance and data retention.

Symbol Parameter Condition Min. Typ. Max. Units

Flash

Write/erase cycles 25°C 10K Cycle

85°C 10K

Data retention 25°C 100 Ye a r

55°C 25

EEPROM

Write/erase cycles 25°C 80K Cycle

85°C 30K

Data retention 25°C 100 Ye a r

55°C 25

Table 32-18. Programming time.

Symbol Parameter Condition Min. Typ. (1) Max. Units

Chip Erase

128KB flash, EEPROM (2) and SRAM erase 75

64KB flash, EEPROM (2) and SRAM erase 55

32KB flash, EEPROM (2) and SRAM erase 50

16KB flash, EEPROM (2) and SRAM erase 45

Flash

Page erase 4

Page write 4

Atomic page erase and write 8

EEPROM

Page erase 4

Page write 4

Atomic page erase and write 8

8135L–AVR–06/12

XMEGA D4

32.13 Clock and Oscillator Characteristics

32.13.1 Calibrated 32.768kHz Internal Oscillator characteristics

32.13.2 Calibrated 2MHz RC Internal Oscillator characteristics

32.13.3 Calibrated and tunable 32MHz internal oscillator characteristics

32.13.4 32kHz Internal ULP Oscillator characteristics

Table 32-19. 32.768kHz internal oscillator characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

Frequency 32.768 kHz

Factory calibration accuracy T = 85°C, VCC = 3.0V -0.5 0.5 %

User calibration accuracy -0.5 0.5

Table 32-20. 2MHz internal oscillator characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

Frequency range DFLL can tune to this frequency over

voltage and temperature 1.8 2.2 MHz

Factory calibrated frequency 2.0

Factory calibration accuracy T = 85°C, VCC= 3.0V -1.5 1.5

%User calibration accuracy -0.2 0.2

DFLL calibration stepsize 0.21

Table 32-21. 32MHz internal oscillator characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

Frequency range DFLL can tune to this frequency over

voltage and temperature 30 55 MHz

Factory calibrated frequency 32

Factory calibration accuracy T = 85°C, VCC= 3.0V -1.5 1.5

%User calibration accuracy -0.2 0.2

DFLL calibration step size 0.22

Table 32-22. 32kHz internal ULP oscillator characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

Output frequency 32 kHz

Accuracy -30 30 %

8135L–AVR–06/12

XMEGA D4

32.13.5 Internal Phase Locked Loop (PLL) characteristics

Note: 1. The maximum output frequency vs. supply voltage is linear between 1.8V and 2.7V, and can never be higher than four times

the maximum CPU frequency.

32.13.6 External clock characteristics

Figure 32-3. External clock drive waveform.

Note: 1. The maximum frequency vs. supply voltage is linear between 1.8V and 2.7V, and the same applies for all other parameters

with supply voltage conditions.

Table 32-23. Internal PLL characteristics.

Symbo

l Parameter Condition Min. Typ. Max. Units

fIN Input frequency Output frequency must be within fOUT 0.4 64

MHz

fOUT Output frequency (1) VCC= 1.6 - 1.8V 20 48

VCC= 2.7 - 3.6V 20 128

Start-up time 25 µs

Re-lock time 25

tCH

tCL

tCK

tCH

VIL1

VIH1

tCR tCF

Table 32-24. External clock used as system clock without prescaling.

Symbo

l Parameter Condition Min. Typ. Max. Units

1/tCK Clock frequency(1) VCC = 1.6 - 1.8V 0 12 MHz

VCC = 2.7 - 3.6V 0 32

tCK Clock period VCC = 1.6 - 1.8V 83.3

VCC = 2.7 - 3.6V 31.5

tCH Clock high time VCC = 1.6 - 1.8V 30.0

VCC = 2.7 - 3.6V 12.5

tCL Clock low time VCC = 1.6 - 1.8V 30.0

VCC = 2.7 - 3.6V 12.5

tCR Rise time (for maximum frequency) VCC = 1.6 - 1.8V 10

VCC = 2.7 - 3.6V 3

tCF Fall time (for maximum frequency) VCC = 1.6 - 1.8V 10

VCC = 2.7 - 3.6V 3

ΔtCK Change in period from one clock cycle to the next 10 %

8135L–AVR–06/12

XMEGA D4

Notes: 1. System Clock Prescalers must be set so that maximum CPU clock frequency for device is not exceeded.

2. The maximum frequency vs. supply voltage is linear between 1.8V and 2.7V, and the same applies for all other parameters

with supply voltage conditions.

Table 32-25. External clock with prescaler (1) for system clock.

Symbol Parameter Condition Min. Typ. Max. Units

1/tCK Clock frequency (2) VCC = 1.6 - 1.8V 0 90 MHz

VCC = 2.7 - 3.6V 0 142

tCK Clock period VCC = 1.6 - 1.8V 11

VCC = 2.7 - 3.6V 7

tCH Clock High Time VCC = 1.6 - 1.8V 4.5

VCC = 2.7 - 3.6V 2.4

tCL Clock Low Time VCC = 1.6 - 1.8V 4.5

VCC = 2.7 - 3.6V 2.4

tCR Rise time (for maximum frequency) 1.5

tCF Fall time (for maximum frequency) 1.5

ΔtCK Change in period from one clock cycle to the next 10 %

8135L–AVR–06/12

XMEGA D4

32.13.7 External 16MHz crystal oscillator and XOSC characteristics

Table 32-26. External 16MHz crystal oscillator and XOSC characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

Cycle to cycle jitter XOSCPWR=0 FRQRANGE=0 <10

FRQRANGE=1, 2, or 3 <1

XOSCPWR=1 <1

Long term jitter XOSCPWR=0 FRQRANGE=0 <6

FRQRANGE=1, 2, or 3 <0.5

XOSCPWR=1 <0.5

Frequency error XOSCPWR=0

FRQRANGE=0 <0.1

FRQRANGE=1 <0.05

FRQRANGE=2 or 3 <0.005

XOSCPWR=1 <0.005

Duty cycle XOSCPWR=0

FRQRANGE=0 40

FRQRANGE=1 42

FRQRANGE=2 or 3 45

XOSCPWR=1 48

8135L–AVR–06/12

XMEGA D4

Note: 1. Numbers for negative impedance are not tested in production but guaranteed from design and characterization.

RQNegative impedance (1)

XOSCPWR=0,

FRQRANGE=0

0.4MHz resonator,

CL = 100pF 2.4k

1MHz crystal, CL = 20pF 8.7k

2MHz crystal, CL = 20pF 2.1k

XOSCPWR=0,

FRQRANGE=1,

CL=20pF

2MHz crystal 4.2k

8MHz crystal 250

9MHz crystal 195

XOSCPWR=0,

FRQRANGE=2,

CL=20pF

8MHz crystal 360

9MHz crystal 285

12MHz crystal 155

XOSCPWR=0,

FRQRANGE=3,

CL=20pF

9MHz crystal 365

12MHz crystal 200

16MHz crystal 105

XOSCPWR=1,

FRQRANGE=0,

CL=20pF

9MHz crystal 435

12MHz crystal 235

16MHz crystal 125

XOSCPWR=1,

FRQRANGE=1,

CL=20pF

9MHz crystal 495

12MHz crystal 270

16MHz crystal 145

XOSCPWR=1,

FRQRANGE=2,

CL=20pF

12MHz crystal 305

16MHz crystal 160

XOSCPWR=1,

FRQRANGE=3,

CL=20pF

12MHz crystal 380

16MHz crystal 205

CXTAL1

Parasitic capacitance

XTAL1 pin 5.4

CXTAL2

Parasitic capacitance

XTAL2 pin 7.1

CLOAD Parasitic capacitance load 3.07

Table 32-26. External 16MHz crystal oscillator and XOSC characteristics. (Continued)

Symbol Parameter Condition Min. Typ. Max. Units

8135L–AVR–06/12

XMEGA D4

32.13.8 External 32.768kHz crystal oscillator and TOSC characteristics

Note: 1. See Figure 32-4 for definition.

Figure 32-4. TOSC input capacitance.

The parasitic capacitance between the TOSC pins is CL1 + CL2 in series as seen from the crystal

when oscillating without external capacitors.

Table 32-27. External 32.768kHz crystal oscillator and TOSC characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

ESR/R1 Recommended crystal equivalent

series resistance (ESR)

Crystal load capacitance 6.5pF 60 kΩ

Crystal load capacitance 9.0pF 35

CTOSC1 Parasitic capacitance TOSC1 pin 5.4 pF

Alternate TOSC 4.0

CTOSC2 Parasitic capacitance TOSC2 pin 7.1 pF

Alternate TOSC 4.0

Recommended safety factor capacitance load matched to

crystal specification 3

2CS

TDevice internal

External

32.768KHz crystal

8135L–AVR–06/12

XMEGA D4

32.14 SPI Characteristics

Figure 32-5. SPI timing requirements in master mode.

Figure 32-6. SPI timing requirements in slave mode.

MSB LSB

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKF

tSCKR

tSCKW

MOSI

(Data output)

MISO

(Data input)

SCK

(CPOL = 1)

SCK

(CPOL = 0)

MSB LSB

tSIS tSIH

tSSCKW

tSSCK

tSSH

tSOSSH

tSCKR tSCKF

tSOS

tSSS

tSOSSS

MISO

(Data output)

MOSI

(Data input)

SCK

(CPOL = 1)

SCK

(CPOL = 0)

8135L–AVR–06/12

XMEGA D4

Table 32-28. SPI timing characteristics and requirements.

Symbol Parameter Condition Min. Typ. Max. Units

tSCK SCK period Master (See Table 17-4 in

XMEGA D Manual)

tSCKW SCK high/low width Master 0.5×SCK

tSCKR SCK rise time Master 2.7

tSCKF SCK fall time Master 2.7

tMIS MISO setup to SCK Master 10

tMIH MISO hold after SCK Master 10

tMOS MOSI setup SCK Master 0.5×SCK

tMOH MOSI hold after SCK Master 1

tSSCK Slave SCK period Slave 4×t ClkPER

tSSCKW SCK high/low width Slave 2×t ClkPER

tSSCKR SCK rise time Slave 1600

tSSCKF SCK fall time Slave 1600

tSIS MOSI setup to SCK Slave 3

tSIH MOSI hold after SCK Slave t ClkPER

tSSS SS setup to SCK Slave 21

tSSH SS hold after SCK Slave 20

tSOS MISO setup SCK Slave 8

tSOH MISO hold after SCK Slave 13

tSOSS MISO setup after SS low Slave 11

tSOSH MISO hold after SS high Slave 8

8135L–AVR–06/12

XMEGA D4

32.15 Two-Wire Interface Characteristics

Table 32-29 describes the requirements for devices connected to the Two-Wire Interface Bus.

The Atmel AVR XMEGA Two-wire interface meets or exceeds these requirements under the

noted conditions. Timing symbols refer to Figure 32-7.

Figure 32-7. Two-Wire Interface bus timing.

tHD;STA

tof

SDA

SCL

tLOW

tHIGH

tSU;STA

tBUF

tHD;DAT tSU;DAT tSU;STO

Table 32-29. Two-wire interface characteristics.

Symbol Parameter Condition Min. Typ. Max. Units

VIH Input high voltage 0.7VCC VCC+0.5

VIL Input low voltage 0.5 0.3×VCC

Vhys Hysteresis of schmitt trigger inputs 0.05VCC (1)

VOL Output low voltage 3mA, sink current 0 0.4

trRise time for both SDA and SCL 20+0.1Cb (1)(2) 300

nstof Output fall time from VIHmin to VILmax 10pF < Cb < 400pF (2) 20+0.1Cb (1)(2) 250

tSP Spikes suppressed by input filter 0 50

IIInput current for each I/O pin 0.1VCC < VI < 0.9VCC -10 10 µA

CICapacitance for each I/O pin 10 pF

fSCL SCL clock frequency fPER (3)>max(10fSCL, 250kHz) 0 400 kHz

RPValue of pull-up resistor

fSCL ≤ 100kHz

fSCL > 100kHz

VCC 0.4V–

3mA

----------------------------

100ns

----------------

300ns

----------------

8135L–AVR–06/12

XMEGA D4

Notes: 1. Required only for fSCL > 100kHz.

2. Cb = Capacitance of one bus line in pF.

3. fPER = Peripheral clock frequency.

tHD;STA Hold time (repeated) START condition fSCL ≤ 100kHz 4.0

µs

fSCL > 100kHz 0.6

tLOW Low period of SCL clock fSCL ≤ 100kHz 4.7

fSCL > 100kHz 1.3

tHIGH High period of SCL Clock fSCL ≤ 100kHz 4.0

fSCL > 100kHz 0.6

tSU;STA

Set-up time for a repeated START

condition

fSCL ≤ 100kHz 4.7

fSCL > 100kHz 0.6

tHD;DAT Data hold time fSCL ≤ 100kHz 0 3.45

µs

fSCL > 100kHz 0 0.9

tSU;DAT Data setup time fSCL ≤ 100kHz 250

fSCL > 100kHz 100

tSU;STO Setup time for STOP condition fSCL ≤ 100kHz 4.0

fSCL > 100kHz 0.6

tBUF

Bus free time between a STOP and

START condition

fSCL ≤ 100kHz 4.7

fSCL > 100kHz 1.3

Table 32-29. Two-wire interface characteristics. (Continued)

Symbol Parameter Condition Min. Typ. Max. Units

8135L–AVR–06/12

XMEGA D4

33. Typical Characteristics

33.1 Current consumption

33.1.1 Active mode supply current

Figure 33-1. Active supply current vs. frequency.

fSYS = 0 - 1MHz external clock, T = 25°C.

Figure 33-2. Active supply current vs. frequency.

fSYS = 1 - 32MHz external clock, T = 25°C.

3.3V

3.0V

2.7V

2.2V

1.8V

100

200

300

400

500

600

700

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

Frequency [MHz]

ICC

[µA]

3.3V

3.0V

2.7V

048121620242832

Frequency [MHz]

[mA]

2.2V

1.8V

8135L–AVR–06/12

XMEGA D4

Figure 33-3. Active mode supply current vs. VCC.

fSYS = 32.768kHz internal oscillator.

Figure 33-4. Active mode supply current vs. VCC.

fSYS = 1MHz external clock.

85°C

25°C

-40°C

120

150

180

210

240

270

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

ICC

[µA]

85°C

25°C

-40°C

200

300

400

500

600

700

800

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VCC [V]

ICC

[µA]

8135L–AVR–06/12

XMEGA D4

Figure 33-5. Active mode supply current vs. VCC.

fSYS = 2MHz internal oscillator.

Figure 33-6. Active mode supply current vs. VCC.

fSYS = 32MHz internal oscillator prescaled to 8MHz.

85°C

25°C

-40°C

400

600

800

1000

1200

1400

1600

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VCC [V]

[µA]

85°C

25°C

-40°C

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

[mA]

8135L–AVR–06/12

XMEGA D4

Figure 33-7. Active mode supply current vs. VCC.

fSYS = 32MHz internal oscillator.

33.1.2 Idle mode supply current

Figure 33-8. Idle mode supply current vs. frequency.

fSYS = 0 - 1MHz external clock, T = 25°C.

85°C

25°C

-40°C

2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6

[V]

ICC

[mA]

3.3V

3.0V

2.7V

2.2V

1.8V

100

120

140

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

Frequency [MHz]

[µA]

8135L–AVR–06/12

XMEGA D4

Figure 33-9. Idle mode supply current vs. frequency.

fSYS = 1 - 32MHz external clock, T = 25°C.

Figure 33-10. Idle mode supply current vs. VCC.

fSYS = 32.768kHz internal oscillator.

3.3V

3.0V

2.7V

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

048121620242832

Frequency [MHz]

[mA]

2.2V

1.8V

85°C

25°C

-40°C

27.0

27.5

28.0

28.5

29.0

29.5

30.0

30.5

31.0

31.5

32.0

32.5

33.0

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

[µA]

8135L–AVR–06/12

XMEGA D4

Figure 33-11. Idle mode supply current vs. VCC.

fSYS = 1MHz external clock.

Figure 33-12. Idle mode supply current vs. VCC.

fSYS = 2MHz internal oscillator.

85°C

25°C

-40°C

100

110

120

130

140

150

160

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

[µA]

85°C

25°C

-40°C

160

180

200

220

240

260

280

300

320

340

360

380

400

420

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

[µA]

8135L–AVR–06/12

XMEGA D4

Figure 33-13. Idle mode supply current vs. VCC.

fSYS = 32MHz internal oscillator prescaled to 8MHz.

Figure 33-14. Idle mode current vs. VCC.

fSYS = 32MHz internal oscillator.

85°C

25°C

-40°C

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

ICC

[mA]

85°C

25°C

-40°C

3.4

3.6

3.8

4.0

4.2

4.4

4.6

4.8

5.0

5.2

5.4

5.6

2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6

[V]

[mA]

8135L–AVR–06/12

XMEGA D4

33.1.3 Power-down mode supply current

Figure 33-15. Power-down mode supply current vs. temperature.

All functions disabled.

Figure 33-16. Power-down mode supply current vs. VCC.

All functions disabled.

3.3V

3.0V

2.7V

2.2V

1.8V

0.15

0.30

0.45

0.60

0.75

0.90

1.05

1.20

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Temperature [°C]

[µA]

85°C

25°C

-40°C

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VCC [V]

[µA]

8135L–AVR–06/12

XMEGA D4

Figure 33-17. Power-down mode supply current vs. VCC.

Watchdog and sampled BOD enabled.

33.1.4 Power-save mode supply current

Figure 33-18. Power-save mode supply current vs. VCC.

Real Time Counter enabled and running from 1.024kHz output of 32.768kHz TOSC.

85°C

25°C

-40°C

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

2.7

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

[µA]

Normal mode

Low-power mode

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

[V]

[µA]

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

8135L–AVR–06/12

XMEGA D4

33.1.5 Standby mode supply current

Figure 33-19. Standby supply current vs. VCC.

Standby, fSYS =1MHz.

Figure 33-20. Standby supply current vs. VCC.

25°C, running from different crystal oscillators.

85°C

25°C

-40°C

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

6.5

7.0

7.5

8.0

8.5

9.0

9.5

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VCC [V]

[µA]

16MHz

12MHz

8MHz

2MHz

0.454MHz

160

200

240

280

320

360

400

440

480

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VCC [V]

ICC[µA]

8135L–AVR–06/12

XMEGA D4

33.2 I/O Pin Characteristics

33.2.1 Pull-up

Figure 33-21. I/O pin pull-up resistor current vs. input voltage.

VCC = 1.8V.

Figure 33-22. I/O pin pull-up resistor current vs. input voltage.

VCC = 3.0V.

85°C

25°C

-40°C

0.10.30.50.70.91.11.31.51.7

PIN [V]

I [µA]

85°C

25°C

-40°C

105

120

0.1 0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8 3.1

[V]

I [µA]

8135L–AVR–06/12

XMEGA D4

Figure 33-23. I/O pin pull-up resistor current vs. input voltage.

VCC = 3.3V.

33.2.2 Output Voltage vs. Sink/Source Current

Figure 33-24. I/O pin output voltage vs. source current.

VCC = 1.8V.

85°C

25°C

-40°C

105

120

135

0.1 0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8 3.1 3.4

[V]

I [µA]

85°C25°C-40°C

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

IPIN [mA]

VPIN [V]

-5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0

8135L–AVR–06/12

XMEGA D4

Figure 33-25. I/O pin output voltage vs. source current.

VCC = 3.0V.

Figure 33-26. I/O pin output voltage vs. source current.

VCC = 3.3V.

85°C25°C-40°C

0.5

1.0

1.5

2.0

2.5

3.0

[mA]

[V]

-15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0

85°C

25°C

-40°C

0.5

1.0

1.5

2.0

2.5

3.0

3.5

[mA]

[V]

-15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0

8135L–AVR–06/12

XMEGA D4

Figure 33-27. I/O pin output voltage vs. source current.

Figure 33-28. I/O pin output voltage vs. sink current.

VCC = 1.8V.

3.6V

3.3V

3.0V

2.7V

2.3V

1.8V

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

IPIN [mA]

[V]

-12.0 -10.5 -9.0 -6.0 -4.5 -1.5 0-3.0-7.5

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

IPIN [mA]

VPIN [V]

85°C 25°C -40°C

234679108501

8135L–AVR–06/12

XMEGA D4

Figure 33-29. I/O pin output voltage vs. sink current.

VCC = 3.0V.

Figure 33-30. I/O pin output voltage vs. sink current.

VCC = 3.3V.

85°C

25°C

-40°C

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

[mA]

[V]

3.0 4.5 6.0 9.0 10.5 13.5 15.012.07.50 1.5

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

[mA]

[V]

-40°C

25°C

85°C

3.0 4.5 6.0 9.0 10.5 13.5 15.012.07.50 1.5

100

8135L–AVR–06/12

XMEGA D4

Figure 33-31. I/O pin output voltage vs. sink current.

33.2.3 Thresholds and Hysteresis

Figure 33-32. I/O pin input threshold voltage vs. VCC.

T = 25°C.

0.3

0.6

0.9

1.2

1.5

IPIN [mA]

VPIN [V]

1.8V

3.6V

3.3V

3.0V

2.7V

2.3V

5.0 7.5 12.5 15.010.002.5

VIL

VIH

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VCC [V]

threshold

[V]

101

8135L–AVR–06/12

XMEGA D4

Figure 33-33. I/O pin input threshold voltage vs. VCC.

VIH I/O pin read as “1”.

Figure 33-34. I/O pin input threshold voltage vs. VCC.

VIL I/O pin read as “0”.

85°C

25°C

-40°C

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

threshold

[V]

85°C

25°C

-40°C

0.57

0.72

0.87

1.02

1.17

1.32

1.47

1.62

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

threshold

[V]

102

8135L–AVR–06/12

XMEGA D4

Figure 33-35. I/O pin input hysteresis vs. VCC.

33.3 Analog Comparator Characteristics

Figure 33-36. Analog comparator hysteresis vs. VCC.

Small hysteresis.

85°C

25°C

-40°C

0.09

0.12

0.15

0.18

0.21

0.24

0.27

0.3

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

threshold

[V]

85°C

25°C

-40°C

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

HYST

[mV]

103

8135L–AVR–06/12

XMEGA D4

Figure 33-37. Analog comparator hysteresis vs. VCC.

Large hysteresis.

Figure 33-38. Analog comparator current source vs. calibration value.

Temperature = 25°C.

85°C

25°C

-40°C

1.61.82.0 2.22.42.62.83.03.23.43.6

CC [V]

HYST

[mV]

3.3V

3.0V

2.7V

2.2V

1.8V

0123456789 101112131415

CALIB[3..0]

I [µA]

104

8135L–AVR–06/12

XMEGA D4

Figure 33-39. Analog comparator current source vs. calibration value.

VCC = 3.0V.

Figure 33-40. Voltage scaler INL vs. SCALEFAC.

T = 25

C, VCC = 3.0V.

85°C

25°C

-40°C

3.5

4.5

5.5

6.5

0123456789101112131415

CALIB[3..0]

I [µA]

25°C

-0.150

-0.125

-0.100

-0.075

-0.050

-0.025

0.025

0.050

0 10203040506070

SCALEFAC

INL [LSB]

105

8135L–AVR–06/12

XMEGA D4

33.4 Internal 1.0V reference Characteristics

Figure 33-41. ADC internal 1.0V reference vs. temperature.

33.5 BOD Characteristics

Figure 33-42. BOD thresholds vs. temperature.

BOD level = 1.6V.

3.3V

3.0V

2.7V

1.8V

0.987

0.989

0.991

0.993

0.995

0.997

0.999

1.001

1.003

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Bandgap Voltage [V]

Temperature [°C]

Rising Vcc

Falling Vcc

1.603

1.606

1.609

1.612

1.615

1.618

1.621

1.624

1.627

1.630

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Temperature [°C]

BOT

[V]

106

8135L–AVR–06/12

XMEGA D4

Figure 33-43. BOD thresholds vs. temperature.

BOD level = 3.0V.

33.6 External Reset Characteristics

Figure 33-44. Minimum reset pin pulse width vs. VCC.

Rising Vcc

Falling Vcc

2.97

2.98

2.99

3.00

3.01

3.02

3.03

3.04

3.05

3.06

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Temperature [°C]

BOT

[V]

85°C

25°C

-40°C

100

105

110

115

120

125

130

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

[V]

RST

[ns]

107

8135L–AVR–06/12

XMEGA D4

Figure 33-45. Reset pin pull-up resistor current vs. reset pin voltage.

VCC = 1.8V.

Figure 33-46. Reset pin pull-up resistor current vs. reset pin voltage.

VCC = 3.0V.

85°C

25°C

-40°C

0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8

VRESET [V]

IRESET

[µA]

85°C

25°C

-40°C

105

120

0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0

RESET

[V]

RESET

[µA]

108

8135L–AVR–06/12

XMEGA D4

Figure 33-47. Reset pin pull-up resistor current vs. reset pin voltage.

VCC = 3.3V.

Figure 33-48. Reset pin input threshold voltage vs. VCC.

VIH - Reset pin read as “1”.

85°C

25°C

-40°C

105

120

135

0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3

RESET

[V]

RESET

[µA]

85°C

25°C

-40°C

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VCC [V]

Vthreshold

[V]

109

8135L–AVR–06/12

XMEGA D4

Figure 33-49. Reset pin input threshold voltage vs. VCC.

VIL - Reset pin read as “0”.

33.7 Power-on Reset Characteristics

Figure 33-50. Power-on reset current consumption vs. VCC.

BOD level = 3.0V, enabled in continuous mode.

85°C

25°C

-40°C

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VCC [V]

threshold

[V]

85°C

25°C

-40°C

100

200

300

400

500

600

700

0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 2.8

[V]

[µA]

110

8135L–AVR–06/12

XMEGA D4

Figure 33-51. Power-on reset current consumption vs. VCC.

BOD level = 3.0V, enabled in sampled mode.

33.8 Oscillator Characteristics

33.8.1 Ultra Low-Power internal oscillator

Figure 33-52. Ultra Low-Power internal oscillator frequency vs. temperature.

85°C

25°C

-40°C

130

195

260

325

390

455

520

585

650

0.40.71.01.31.61.92.2 2.52.8

VCC [V]

ICC

[µA]

3.3V

3.0V

2.7V

2.2V

1.8V

30.5

30.7

30.9

31.1

31.3

31.5

31.7

31.9

32.1

32.3

32.5

32.7

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Frequency [kHz]

Temperature [°C]

111

8135L–AVR–06/12

XMEGA D4

33.8.2 32.768kHz Internal Oscillator

Figure 33-53. 32.768kHz internal oscillator frequency vs. temperature.

Figure 33-54. 32.768kHz internal oscillator frequency vs. calibration value.

VCC = 3.0V, T = 25°C.

3.3V

3.0V

2.7V

2.2V

1.8V

32.59

32.61

32.63

32.65

32.67

32.69

32.71

32.73

32.75

32.77

32.79

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Frequency [kHz]

Temperature [°C]

0 24 48 72 96 120 144 168 192 216 240 264

RC32KCAL[7..0]

Frequency [kHz]

112

8135L–AVR–06/12

XMEGA D4

33.8.3 2MHz Internal Oscillator

Figure 33-55. 2MHz internal oscillator frequency vs. temperature.

DFLL disabled.

Figure 33-56. 2MHz internal oscillator frequency vs. temperature.

DFLL enabled, from the 32.768kHz internal oscillator.

1.98

2.00

2.02

2.04

2.06

2.08

2.10

2.12

2.14

2.16

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Temperature [°C]

Frequency [MHz]

3.3V

3.0V

2.7V

2.2V

1.8V

3.3V

3.0V

2.7V

2.2V

1.8V

1.991

1.993

1.995

1.997

1.999

2.001

2.003

-45-35-25-15-5 5 1525354555657585

Temperature [°C]

Frequency [MHz]

113

8135L–AVR–06/12

XMEGA D4

Figure 33-57. 2MHz internal oscillator CALA calibration step size.

VCC = 3V.

33.8.4 32MHz Internal Oscillator

Figure 33-58. 32MHz internal oscillator frequency vs. temperature.

DFLL disabled.

85°C

25°C

-40°C

0.15

0.17

0.19

0.21

0.23

0.25

0.27

0.29

0.31

0 102030405060708090100110120130

CALA

Step size [%]

31.5

32.0

32.5

33.0

33.5

34.0

34.5

35.0

35.5

36.0

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Temperature [°C]

Frequency [MHz]

3.3V

3.0V

2.7V

2.2V

1.8V

114

8135L–AVR–06/12

XMEGA D4

Figure 33-59. 32MHz internal oscillator frequency vs. temperature.

DFLL enabled, from the 32.768kHz internal oscillator.

Figure 33-60. 32MHz internal oscillator CALA calibration step size.

VCC = 3.0V.

3.3V

3.0V

2.7V

2.2V

1.8V

31.76

31.78

31.80

31.82

31.84

31.86

31.88

31.90

31.92

31.94

31.96

31.98

32.00

-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85

Temperature [°C]

Frequency [MHz]

85°C

25°C

-40°C

0.10

0.12

0.14

0.16

0.18

0.20

0.22

0.24

0.26

0.28

0.30

0.32

0.34

0.36

0 8 16 24 32 40 48 56 64 72 80 88 96 104 112 120 128

CALA

Step size [%]

115

8135L–AVR–06/12

XMEGA D4

Figure 33-61. 32MHz internal oscillator frequency vs. CALB calibration value.

VCC = 3.0V.

33.8.5 32MHz internal oscillator calibrated to 48MHz

Figure 33-62. 48MHz internal oscillator frequency vs. temperature.

DFLL disabled.

85°C

25°C

-40°C

0 7 14 21 28 35 42 49 56 63

CALB

Frequency [MHz]

-45-35-25-15-5 5 1525354555657585

Temperature [°C]

Frequency [MHz]

3.3V

3.0V

2.7V

2.2V

1.8V

116

8135L–AVR–06/12

XMEGA D4

Figure 33-63. 48MHz internal oscillator frequency vs. temperature.

DFLL enabled, from the 32.768kHz internal oscillator.

Figure 33-64. 48MHz internal oscillator CALA calibration step size.

VCC = 3.0V.

47.70

47.75

47.80

47.85

47.90

47.95

48.00

48.05

-45-35-25-15-5 5 1525354555657585

Temperature [°C]

Frequency [MHz]

3.3V

3.0V

2.7V

2.2V

1.8V

85°C

25°C

-40°C

0.11

0.14

0.17

0.20

0.23

0.26

0.29

0.32

0.35

0 8 16 24 32 40 48 56 64 72 80 88 96 104 112 120 128

CALA

Step size [%]

117

8135L–AVR–06/12

XMEGA D4

33.9 Two-Wire Interface characteristics

Figure 33-65. SDA hold time vs. temperature.

Figure 33-66. SDA hold time vs. supply voltage.

100

150

200

250

300

350

400

450

500

-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Temperature [°C]

Hold time [ns]

100

150

200

250

300

350

400

450

500

[V]

Hold time [ns]

2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6

118

8135L–AVR–06/12

XMEGA D4

33.10 PDI characteristics

Figure 33-67. Maximum PDI frequency vs. VCC.

85°C

25°C

-40°C

1.61.82.0 2.22.42.62.83.03.23.43.6

[V]

MAX

[MHz]

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XMEGA D4

34. Errata

34.1 ATxmega16D4, ATxmega32D4

34.1.1 rev. E

•ADC propagation delay is not correct when gain is used

•CRC fails for Range CRC when end address is the last word address of a flash section

•AWeX fault protection restore is not done correct in Pattern Generation Mode

1. ADC propagation delay is not correct when gain is used

The propagation delay will increase by only one ADC clock cycle for all gain setting.

Problem fix/Workaround

None.

2. CRC fails for Range CRC when end address is the last word address of a flash section

If boot read lock is enabled, the range CRC cannot end on the last address of the application

section. If application table read lock is enabled, the range CRC cannot end on the last

address before the application table.

Problem fix/Workaround

Ensure that the end address used in Range CRC does not end at the last address before a

section with read lock enabled. Instead, use the dedicated CRC commands for complete

applications sections.

3. AWeX fault protection restore is not done correctly in Pattern Generation Mode

When a fault is detected the OUTOVEN register is cleared, and when fault condition is

cleared, OUTOVEN is restored according to the corresponding enabled DTI channels. For

Common Waveform Channel Mode (CWCM), this has no effect as the OUTOVEN is correct

after restoring from fault. For Pattern Generation Mode (PGM), OUTOVEN should instead

have been restored according to the DTILSBUF register.

Problem fix/Workaround

For CWCM no workaround is required.

For PGM in latched mode, disable the DTI channels before returning from the fault condi-

tion. Then, set correct OUTOVEN value and enable the DTI channels, before the direction

(DIR) register is written to enable the correct outputs again.

For PGM in cycle-by-cycle mode there is no workaround.

4. Erroneous interrupt when using Timer/Counter with QDEC

When the Timer/Counter is set in Dual Slope mode with QDEC enabled, an additional

underflow interrupt (and event) will be given when the counter counts from BOTTOM to one.

Problem fix/Workaround

When receiving underflow interrupt check direction and value of counter. If direction is UP

and counter value is zero, change the counter value to one. This will also remove the addi-

tional event. If the counter value is above zero, clear the interrupt flag.

34.1.2 rev. C/D

Not sampled.

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34.1.3 rev. A/B

•Bandgap voltage input for the ACs can not be changed when used for both ACs simultaneously

•VCC voltage scaler for AC is non-linear

•ADC gain stage cannot be used for single conversion

•ADC has increased INL error for some operating conditions

•ADC gain stage output range is limited to 2.4 V

•ADC Event on compare match non-functional

•ADC propagation delay is not correct when 8x -64x gain is used

•Bandgap measurement with the ADC is non-functional when VCC is below 2.7V

•Accuracy lost on first three samples after switching input to ADC gain stage

•Configuration of PGM and CWCM not as described in XMEGA D Manual

•PWM is not restarted properly after a fault in cycle-by-cycle mode

•BOD: BOD will be enabled at any reset

•Sampled BOD in Active mode will cause noise when bandgap is used as reference

•EEPROM page buffer always written when NVM DATA0 is written

•Pending full asynchronous pin change interrupts will not wake the device

•Pin configuration does not affect Analog Comparator Output

•NMI Flag for Crystal Oscillator Failure automatically cleared

•Flash Power Reduction Mode can not be enabled when entering sleep

•Crystal start-up time required after power-save even if crystal is source for RTC

•RTC Counter value not correctly read after sleep

•Pending asynchronous RTC-interrupts will not wake up device

•TWI Transmit collision flag not cleared on repeated start

•Clearing TWI Stop Interrupt Flag may lock the bus

•TWI START condition at bus timeout will cause transaction to be dropped

•TWI Data Interrupt Flag (DIF) erroneously read as set

•WDR instruction inside closed window will not issue reset

•Inverted I/O enable does not affect Analog Comparator Output

•TWIE is not available

•CRC generator module is not available

•ADC 1/x gain setting and VCC/2 reference setting is not available

•TOSC alternate pin locations is not available

•TWI SDAHOLD time configuration is not available

•Timer/Counter 2 is not available

•HIRES+ option is not available

•Alternate pin locations for digital peripherals are not available

•XOSCPWR high drive option for external crystal is not available

•PLL divide by two option is not available

•Real Time Counter non-prescaled 32 kHZ clock options are not available

•PLL lock detection failure function is not available

•Non available functions and options

1. Bandgap voltage input for the ACs cannot be changed when used for both ACs

simultaneously

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If the Bandgap voltage is selected as input for one Analog Comparator (AC) and then

selected/deselected as input for another AC, the first comparator will be affected for up to

1 µs and could potentially give a wrong comparison result.

Problem fix/Workaround

If the Bandgap is required for both ACs simultaneously, configure the input selection for both

ACs before enabling any of them.

2. VCC voltage scaler for AC is non-linear

The 6-bit VCC voltage scaler in the Analog Comparators is non-linear.

Figure 34-1. Analog Comparator Voltage Scaler vs. Scalefac.

T = 25°C.

Problem fix/Workaround

Use external voltage input for the analog comparator if accurate voltage levels are needed

3. ADC gain stage cannot be used for single conversion

The ADC gain stage will not output correct result for single conversion that is triggered and

started from software or event system.

Problem fix/Workaround

When the gain stage is used, the ADC must be set in free running mode for correct results.

4. ADC has increased INL error for some operating conditions

Some ADC configurations or operating condition will result in increased INL error.

In signed mode INL is increased to:

– 6LSB for sample rates above 130ksps, and up to 8LSB for 200ksps sample rate.

– 6LSB for reference voltage below 1.1V when VCC is above 3.0V.

– 20LSB for ambient temperature below 0 degree C and reference voltage below 1.3V.

In unsigned mode, the INL error cannot be guaranteed, and this mode should not be used.

Problem fix/Workaround

3.3V

2.7V

1.8V

0.5

1.5

2.5

3.5

0 5 10 15 20 25 30 35 40 45 50 55 60 65

SCALEFAC

VSCALE [V]

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XMEGA D4

None, avoid using the ADC in the above configurations in order to prevent increased INL

error. Use the ADC in signed mode also for single ended measurements.

5. ADC gain stage output range is limited to 2.4V

The amplified output of the ADC gain stage will never go above 2.4V, hence the differential

input will only give correct output when below 2.4V/gain. For the available gain settings, this

gives a differential input range of:

Problem fix/Workaround

Keep the amplified voltage output from the ADC gain stage below 2.4V in order to get a cor-

rect result, or keep ADC voltage reference below 2.4V.

6. ADC Event on compare match non-functional

ADC signalling event will be given at every conversion complete even if Interrupt mode (INT-

MODE) is set to BELOW or ABOVE.

Problem fix/Workaround

Enable and use interrupt on compare match when using the compare function.

7. ADC propagation delay is not correct when 8x -64x gain is used

The propagation delay will increase by only one ADC clock cycle for 8x and 16x gain setting,

and 32x and 64x gain settings.

Problem fix/Workaround

None

8. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V

The ADC can not be used to do bandgap measurements when VCC is below 2.7V.

Problem fix/Workaround

None.

9. Accuracy lost on first three samples after switching input to ADC gain stage

Due to memory effect in the ADC gain stage, the first three samples after changing input

channel must be disregarded to achieve 12-bit accuracy.

Problem fix/Workaround

Run three ADC conversions and discard these results after changing input channels to ADC

gain stage.

– 1x gain: 2.4 V

– 2x gain: 1.2 V

– 4x gain: 0.6 V

– 8x gain: 300 mV

– 16x gain: 150 mV

– 32x gain: 75 mV

– 64x gain: 38 mV

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10. Configuration of PGM and CWCM not as described in XMEGA D Manual

Enabling Common Waveform Channel Mode will enable Pattern generation mode (PGM),

but not Common Waveform Channel Mode.

Enabling Pattern Generation Mode (PGM) and not Common Waveform Channel Mode

(CWCM) will enable both Pattern Generation Mode and Common Waveform Channel Mode.

Problem fix/Workaround

11. PWM is not restarted properly after a fault in cycle-by-cycle mode

When the AWeX fault restore mode is set to cycle-by-cycle, the waveform output will not

return to normal operation at first update after fault condition is no longer present.

Problem fix/Workaround

Do a write to any AWeX I/O register to re-enable the output.

12. BOD will be enabled after any reset

If any reset source goes active, the BOD will be enabled and keep the device in reset if the

VCC voltage is below the programmed BOD level. During Power-On Reset, reset will not be

released until VCC is above the programmed BOD level even if the BOD is disabled.

Problem fix/Workaround

Do not set the BOD level higher than VCC even if the BOD is not used.

13. Sampled BOD in Active mode will cause noise when bandgap is used as reference

Using the BOD in sampled mode when the device is running in Active or Idle mode will add

noise on the bandgap reference for ADC and Analog Comparator.

Problem fix/Workaround

If the bandgap is used as reference for either the ADC or the Analog Comparator, the BOD

must not be set in sampled mode.

14. EEPROM page buffer always written when NVM DATA0 is written

If the EEPROM is memory mapped, writing to NVM DATA0 will corrupt data in the EEPROM

page buffer.

Problem fix/Workaround

Before writing to NVM DATA0, for example when doing software CRC or flash page buffer

write, check if EEPROM page buffer active loading flag (EELOAD) is set. Do not write NVM

DATA0 when EELOAD is set.

15. Pending full asynchronous pin change interrupts will not wake the device

Any full asynchronous pin-change Interrupt from pin 2, on any port, that is pending when the

sleep instruction is executed, will be ignored until the device is woken from another source

or the source triggers again. This applies when entering all sleep modes where the System

Clock is stopped.

Table 34-1. Configure PWM and CWCM according to this table:

PGM CWCM Description

0 0 PGM and CWCM disabled

0 1 PGM enabled

1 0 PGM and CWCM enabled

1 1 PGM enabled

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Problem fix/Workaround

None.

16. Pin configuration does not affect Analog Comparator output

The Output/Pull and inverted pin configuration does not affect the Analog Comparator

output.

Problem fix/Workaround

None for Output/Pull configuration.

For inverted I/O, configure the Analog Comparator to give an inverted result (i.e. connect

positive input to the negative AC input and vice versa), or use and external inverter to

change polarity of Analog Comparator output.

17. NMI Flag for Crystal Oscillator Failure automatically cleared

NMI flag for Crystal Oscillator Failure (XOSCFDIF) will be automatically cleared when exe-

cuting the NMI interrupt handler.

Problem fix/Workaround

This device revision has only one NMI interrupt source, so checking the interrupt source in

software is not required.

18. Flash Power Reduction Mode can not be enabled when entering sleep

If Flash Power Reduction Mode is enabled when entering Power-save or Extended Standby

sleep mode, the device will only wake up on every fourth wake-up request. If Flash Power

Reduction Mode is enabled when entering Idle sleep mode, the wake-up time will vary with

up to 16 CPU clock cycles.

Problem fix/Workaround

Disable Flash Power Reduction mode before entering sleep mode.

19. Crystal start-up time required after power-save even if crystal is source for RTC

Even if 32.768kHz crystal is used for RTC during sleep, the clock from the crystal will not be

ready for the system before the specified start-up time. See "XOSCSEL[3:0]: Crystal Oscilla-

tor Selection" in XMEGA D Manual. If BOD is used in active mode, the BOD will be on

during this period (0.5s).

Problem fix/Workaround

If faster start-up is required, go to sleep with internal oscillator as system clock.

20. RTC Counter value not correctly read after sleep

If the RTC is set to wake up the device on RTC Overflow and bit 0 of RTC CNT is identical to

bit 0 of RTC PER as the device is entering sleep, the value in the RTC count register can not

be read correctly within the first prescaled RTC clock cycle after wakeup. The value read will

be the same as the value in the register when entering sleep.

The same applies if RTC Compare Match is used as wake-up source.

Problem fix/Workaround

Wait at least one prescaled RTC clock cycle before reading the RTC CNT value.

21. Pending asynchronous RTC-interrupts will not wake up device

Asynchronous Interrupts from the Real-Time-Counter that is pending when the sleep

instruction is executed, will be ignored until the device is woken from another source or the

source triggers again.

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XMEGA D4

Problem fix/Workaround

None.

22. TWI Transmit collision flag not cleared on repeated start

The TWI transmit collision flag should be automatically cleared on start and repeated start,

but is only cleared on start.

Problem fix/Workaround

Clear the flag in software after address interrupt.

23. Clearing TWI Stop Interrupt Flag may lock the bus

If software clears the STOP Interrupt Flag (APIF) on the same Peripheral Clock cycle as the

hardware sets this flag due to a new address received, CLKHOLD is not cleared and the

SCL line is not released. This will lock the bus.

Problem fix/Workaround

Check if the bus state is IDLE. If this is the case, it is safe to clear APIF. If the bus state is

not IDLE, wait for the SCL pin to be low before clearing APIF.

Code:

/* Only clear the interrupt flag if within a "safe zone". */

while ( /* Bus not IDLE: */

((COMMS_TWI.MASTER.STATUS & TWI_MASTER_BUSSTATE_gm) !=

TWI_MASTER_BUSSTATE_IDLE_gc)) &&

/* SCL not held by slave: */

!(COMMS_TWI.SLAVE.STATUS & TWI_SLAVE_CLKHOLD_bm)

)

{

/* Ensure that the SCL line is low */

if ( !(COMMS_PORT.IN & PIN1_bm) )

break;

}

/* Check for an pending address match interrupt */

if ( !(COMMS_TWI.SLAVE.STATUS & TWI_SLAVE_CLKHOLD_bm) )

{

/* Safely clear interrupt flag */

COMMS_TWI.SLAVE.STATUS |= (uint8_t)TWI_SLAVE_APIF_bm;

}

24. TWI START condition at bus timeout will cause transaction to be dropped

If Bus Timeout is enabled and a timeout occurs on the same Peripheral Clock cycle as a

START is detected, the transaction will be dropped.

Problem fix/Workaround

None.

25. TWI Data Interrupt Flag erroneously read as set

When issuing the TWI slave response command CMD=0b11, it takes one Peripheral Clock

cycle to clear the data interrupt flag (DIF). A read of DIF directly after issuing the command

will show the DIF still set.

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Problem fix/Workaround

Add one NOP instruction before checking DIF.

26. WDR instruction inside closed window will not issue reset

When a WDR instruction is execute within one ULP clock cycle after updating the window

control register, the counter can be cleared without giving a system reset.

Problem fix/Workaround

Wait at least one ULP clock cycle before executing a WDR instruction.

28. Inverted I/O enable does not affect Analog Comparator Output

The inverted I/O pin function does not affect the Analog Comparator output function

Problem fix/Workaround

Configure the analog comparator setup to give an inverted result, or use an external inverter

to change polarity of Analog Comparator Output.

29. Non available functions and options

The below function and options are not available. Writing to any registers or fuse to try and

enable or configure these functions or options will have no effect, and will be as writing to a

reserved address location.

•TWIE, the TWI module on PORTE

•TWI SDAHOLD option in the TWI CTRL register is one bit

•CRC generator module

•ADC 1/2x gain option, and this configuration option in the GAIN bits in the ADC Channel

CTRL register

•ADC VCC/2 reference option and this configuration option in the REFSEL bits on the ADC

REFCTRL register

•ADC option to use internal Gnd as negative input in differential measurements and this

configuration option in the MUXNEG bits in the ADC Channel MUXCTRL register

•ADC channel scan and the ADC SCAN register

•ADC current limitation option, and the CURRLIMIT bits in the ADC CTRLB register

•ADC impedance mode selection for the gain stage, and the IMPMODE bit in the ADC

CTRLB register

•Timer/Counter 2 and the SPLITMODE configuration option in the BYTEM bits in the

Timer/Counter 0 CTRLE register

•Analog Comparator (AC) current output option, and the AC CURRCTRL and CURRCALIB

registers

•PORT remap functions with alternate pin locations for Timer/Counter output compare

channels, USART0 and SPI, and the PORT REMAP register

•PORT RTC clock output option and the RTCOUT bit in the PORT CLKEVOUT register

•PORT remap functions with alternate pin locations for the clock and event output, and the

CLKEVPIN bit in the PORT CLKEVOUT register

•TOSC alternate pin locations, and TOSCSEL bit in FUSEBYTE2

•Real Time Counter clock source options of external clock from TOSC1, and 32.768kHz from

TOSC, and 32.768kHz from the 32.768kHz internal oscillator, and these configuration

options in the RTCSRC bits in the Clock RTCTRL register

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XMEGA D4

•PLL divide by two option, and the PLLDIV bit in the Clock PLLCTRL register

•PLL lock detection failure function and the PLLDIF and PLLFDEN bits in the Clock

XOSCFAIL register

•The high drive option for external crystal and the XOSCPWR bit on the Oscillator

XOSCCTRL register

•The option to enable sequential startup of the analog modules and the ANAINIT register in

MCU Control memory

Problem fix/Workaround

None.

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35. Datasheet Revision History

Please note that the referring page numbers in this section are referred to this document. The

referring revision in this section are referring to the document revision.

35.1 8135L – 06/12

35.2 8135K – 06/12

35.3 8135J – 12/10

35.4 8135I – 10/10

35.5 8135H – 09/10

1. Editing updates.

2. Updated all tables in the Chapter ”Electrical Characteristics” on page 64.

3. Added new ”Typical Characteristics” on page 85.

4. Added new Errata ”rev. E” on page 119.

5. Added new ERRATA on ”rev. A/B” on page 120: Non available functions and options

1. ATxmega64D4-CU is added in ”Ordering Information” on page 2

1. Datasheet status changed to complete: Preliminary removed from the front page.

2. Updated all tables in the “Electrical Characteristics” .

3. Replaced Table 31-11 on page 64

4. Replaced Table 31-17 on page 65 and added the figure ”TOSC input capacitance” on page 66

5. Updated ERRATA ADC (ADC has increased INL for some operating conditions).

6. Updated ERRATA ”rev. A/B” on page 133 with TWIE (TWIE is not available).

7. Updated the last page with Atmel new Brand Style Guide.

1. Updated Table 31-1 on page 58.

1. Updated ”Errata” on page 90.

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XMEGA D4

35.6 8135G – 08/10

35.7 8135F – 02/10

35.8 8135E – 02/10

35.9 8135D – 12/09

1. Updated the Footnote 3 of ”Ordering Information” on page 2.

2. All references to CRC removed. Updated Figure 3-1 on page 7.

3. Updated ”Features” on page 26. Event Channel 0 output on port pin 7.

4. Updated ”DC Characteristics” on page 58 by adding Icc for Flash/EEPROM Programming.

5. Added AVCC in ”ADC Characteristics” on page 62.

6. Updated Start up time in ”ADC Characteristics” on page 62.

7. Updated and fixed typo in “Errata” section.

1. Added ”PDI Speed” on page 89.

1. Updated the device pin-out Figure 2-1 on page 3. PDI_CLK and PDI_DATA renamed only PDI.

2. Updated Table 7-3 on page 18. No of Pages for ATxmega32D4: 32

3. Updated ”Alternate Port Functions” on page 29.

4. Updated ”ADC - 12-bit Analog to Digital Converter” on page 39.

5. Updated Figure 25-1 on page 50.

6. Updated ”Alternate Pin Functions” on page 48.

7. Updated ”Timer/Counter and AWEX functions” on page 46.

8. Added Table 31-17 on page 65.

9. Added Table 31-18 on page 66.

10. Changed Internal Oscillator Speed to ”Oscillators and Wake-up Time” on page 85.

11. Updated ”Errata” on page 90.

1. Added ATxmega128D4 device and updated the datasheet accordingly.

2. Updated ”Electrical Characteristics” on page 58 with Max/Min numbers.

3. Added ”Flash and EEPROM Memory Characteristics” on page 61.

4. Updated Table 31-10 on page 64, Input hysteresis is in V and not in mV.

5. Added ”Errata” on page 90.

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XMEGA D4

35.10 8135C – 10/09

35.11 8135B – 09/09

35.12 8135A – 03/09

1. Updated ”Features” on page 1 with Two Two-Wire Interfaces.

2. Updated ”Block Diagram and QFN/TQFP pinout” on page 3.

3. Updated ”Overview” on page 5.

4. Updated ”XMEGA D4 Block Diagram” on page 7.

5. Updated Table 13-1 on page 24.

6. Updated ”Overview” on page 35.

7. Updated Table 27-5 on page 49.

8. Updated ”Peripheral Module Address Map” on page 50.

1. Added ”Electrical Characteristics” on page 58.

2. Added ”Typical Characteristics” on page 67.

1. Initial revision.

8135L–AVR–06/12

XMEGA D4

Table of Contents

Features ..................................................................................................... 1

1 Ordering Information ............................................................................... 2

2 Pinout/Block Diagram .............................................................................. 3

3 Overview ................................................................................................... 5

3.1 Block Diagram ...................................................................................................6

4 Resources ................................................................................................. 7

4.1 Recommended reading .....................................................................................7

5 Capacitive touch sensing ........................................................................ 7

6 AVR CPU ................................................................................................... 8

6.1 Features ............................................................................................................8

6.2 Overview ............................................................................................................8

6.3 Architectural Overview .......................................................................................8

6.4 ALU - Arithmetic Logic Unit ...............................................................................9

6.5 Program Flow ..................................................................................................10

6.6 Status Register ................................................................................................10

6.7 Stack and Stack Pointer ..................................................................................10

6.8 Register File ....................................................................................................11

7 Memories ................................................................................................ 12

7.1 Features ..........................................................................................................12

7.2 Overview ..........................................................................................................12

7.3 Flash Program Memory ...................................................................................13

7.4 Fuses and Lock bits .........................................................................................14

7.5 Data Memory ...................................................................................................15

7.6 EEPROM .........................................................................................................15

7.7 I/O Memory ......................................................................................................15

7.8 Data Memory and Bus Arbitration ...................................................................16

7.9 Memory Timing ................................................................................................16

7.10 Device ID and Revision ...................................................................................16

7.11 I/O Memory Protection .....................................................................................16

7.12 Flash and EEPROM Page Size .......................................................................16

8 Event System ......................................................................................... 18

8.1 Features ..........................................................................................................18

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XMEGA D4

8.2 Overview ..........................................................................................................18

9 System Clock and Clock options ......................................................... 20

9.1 Features ..........................................................................................................20

9.2 Overview ..........................................................................................................20

9.3 Clock Sources .................................................................................................21

10 Power Management and Sleep Modes ................................................. 23

10.1 Features ..........................................................................................................23

10.2 Overview ..........................................................................................................23

10.3 Sleep Modes ....................................................................................................23

11 System Control and Reset .................................................................... 25

11.1 Features ..........................................................................................................25

11.2 Overview ..........................................................................................................25

11.3 Reset Sequence ..............................................................................................25

11.4 Reset Sources .................................................................................................26

12 WDT – Watchdog Timer ......................................................................... 27

12.1 Features ..........................................................................................................27

12.2 Overview ..........................................................................................................27

13 Interrupts and Programmable Multilevel Interrupt Controller ........... 28

13.1 Features ..........................................................................................................28

13.2 Overview ..........................................................................................................28

13.3 Interrupt vectors ...............................................................................................28

14 I/O Ports .................................................................................................. 30

14.1 Features ..........................................................................................................30

14.2 Overview ..........................................................................................................30

14.3 Output Driver ...................................................................................................31

14.4 Input sensing ...................................................................................................33

14.5 Alternate Port Functions ..................................................................................33

15 TC0/1 – 16-bit Timer/Counter Type 0 and 1 ......................................... 34

15.1 Features ..........................................................................................................34

15.2 Overview ..........................................................................................................34

16 TC2 - Timer/Counter Type 2 .................................................................. 36

16.1 Features ..........................................................................................................36

16.2 Overview ..........................................................................................................36

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17 AWeX – Advanced Waveform Extension ............................................. 37

17.1 Features ..........................................................................................................37

17.2 Overview ..........................................................................................................37

18 Hi-Res – High Resolution Extension .................................................... 38

18.1 Features ..........................................................................................................38

18.2 Overview ..........................................................................................................38

19 RTC – 16-bit Real-Time Counter ........................................................... 39

19.1 Features ..........................................................................................................39

19.2 Overview ..........................................................................................................39

20 TWI – Two-Wire Interface ...................................................................... 40

20.1 Features ..........................................................................................................40

20.2 Overview ..........................................................................................................40

21 SPI – Serial Peripheral Interface ........................................................... 42

21.1 Features ..........................................................................................................42

21.2 Overview ..........................................................................................................42

22 USART ..................................................................................................... 43

22.1 Features ..........................................................................................................43

22.2 Overview ..........................................................................................................43

23 IRCOM – IR Communication Module .................................................... 44

23.1 Features ..........................................................................................................44

23.2 Overview ..........................................................................................................44

24 CRC – Cyclic Redundancy Check Generator ...................................... 45

24.1 Features ..........................................................................................................45

24.2 Overview ..........................................................................................................45

25 ADC – 12-bit Analog to Digital Converter ............................................ 46

25.1 Features ..........................................................................................................46

25.2 Overview ..........................................................................................................46

26 AC – Analog Comparator ...................................................................... 48

26.1 Features ..........................................................................................................48

26.2 Overview ..........................................................................................................48

27 Programming and Debugging .............................................................. 50

27.1 Features ..........................................................................................................50

27.2 Overview ..........................................................................................................50

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XMEGA D4

28 Pinout and Pin Functions ...................................................................... 51

28.1 Alternate Pin Function Description ..................................................................51

28.2 Alternate Pin Functions ...................................................................................53

29 Peripheral Module Address Map .......................................................... 56

30 Instruction Set Summary ...................................................................... 57

31 Packaging information .......................................................................... 61

31.1 44A ..................................................................................................................61

31.2 44M1 ................................................................................................................62

31.3 49C2 ................................................................................................................63

32 Electrical Characteristics ...................................................................... 64

32.1 Absolute Maximum Ratings .............................................................................64

32.2 General Operating Ratings ..............................................................................64

32.3 Current consumption .......................................................................................66

32.4 Wake-up time from sleep modes .....................................................................68

32.5 I/O Pin Characteristics .....................................................................................69

32.6 ADC characteristics ........................................................................................70

32.7 Analog Comparator Characteristics .................................................................72

32.8 Bandgap and Internal 1.0V Reference Characteristics ...................................72

32.9 Brownout Detection Characteristics ................................................................73

32.10 External Reset Characteristics ........................................................................73

32.11 Power-on Reset Characteristics ......................................................................73

32.12 Flash and EEPROM Memory Characteristics .................................................74

32.13 Clock and Oscillator Characteristics ................................................................75

32.14 SPI Characteristics ..........................................................................................81

32.15 Two-Wire Interface Characteristics .................................................................83

33 Typical Characteristics .......................................................................... 85

33.1 Current consumption .......................................................................................85

33.2 I/O Pin Characteristics .....................................................................................95

33.3 Analog Comparator Characteristics ...............................................................102

33.4 Internal 1.0V reference Characteristics .........................................................105

33.5 BOD Characteristics ......................................................................................105

33.6 External Reset Characteristics ......................................................................106

33.7 Power-on Reset Characteristics ....................................................................109

33.8 Oscillator Characteristics ...............................................................................110

33.9 Two-Wire Interface characteristics ................................................................117

33.10 PDI characteristics .........................................................................................118

34 Errata ..................................................................................................... 119

34.1 ATxmega16D4, ATxmega32D4 .....................................................................119

35 Datasheet Revision History ................................................................ 128

35.1 8135L – 06/12 ................................................................................................128

35.2 8135K – 06/12 ...............................................................................................128

35.3 8135J – 12/10 ................................................................................................128

35.4 8135I – 10/10 .................................................................................................128

35.5 8135H – 09/10 ...............................................................................................128

35.6 8135G – 08/10 ...............................................................................................129

35.7 8135F – 02/10 ...............................................................................................129

35.8 8135E – 02/10 ...............................................................................................129

35.9 8135D – 12/09 ...............................................................................................129

35.10 8135C – 10/09 ...............................................................................................130

35.11 8135B – 09/09 ...............................................................................................130

35.12 8135A – 03/09 ...............................................................................................130

Table of Contents....................................................................................... i

8135L–AVR–06/12

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