Product Brief
August 2000
TADM04622 SONET/SDH 155/622 Mbits/s Interface
Features
■Transmission convergence and SONET/SDH ter-
minal/ADM functionality for linear and ring net-
works.
■Versatile IC supports 155/622 Mbits/s SONET/
SDH interface solutions for packet over SONET
(POS), frame relay (FR), or asynchronous transfer
mode (ATM) applications.
■Low-power 2.5 V/3.3 V operation.
■–40 °C to +85 °C temperature range.
SONET/SDH Interface
■Termination of quad STS-3/STM-1 or STS-12/
STM-4.
■Supports overhead processing for transport and
path overhead bytes.
■Optional insertion and extraction of overhead bytes
via serial overhead interface.
■STS pointer processing to align the receive frame
to the system frame.
■STS-1 granularity cross connect between receive,
mate, STM, and data payloads.
■Support for 1+1 and 1:1 linear networks; UPSR
and BLSR ring networks.
■Full path termination and SPE extraction/insertion.
■SONET/SDH compliant condition and alarm
reporting.
■Handles all concatenation levels of STS-1 to
STS-12c (in multiples of 1: e.g., 2c, 3c, 4c, etc.).
■Built-in diagnostic loopback modes.
■Compliant with
Telcordia Technologies
®,
ANSI
®,
and ITU standards.
Data Processing
■Provisionable data engine supports payload inser-
tion/extraction for PPP, ATM, or HDLC streams.
■Extraction and insertion of DS3 frames containing
HDLC or ATM data streams for up to 16 channels.
■Integrated UTOPIA Level 2 and Level 3 compatible
physical layer interface for packets or ATM cells.
■Insertion and extraction of up to 16 separate data
channels.
■Maintains counts for cell/packet traffic (e.g., total
number of cells, number of discarded cells).
■Direct cell/packet over fiber interface device.
■Compliant with ATM forum, ITU standards, and
IETF standards.
Interfaces
■Enhanced UTOPIA interface for cell and packet
transfer (PLATO).
■Built-in redundant STS/STM backplane interface
using 622 MHz LVDS technology.
■Mate-to-mate backplane interface using 622 MHz
LVDS technology for 1+1, 1:1, BLSR, and UPSR
network support.
■Optional 78 MHz bus (32-bit) for STS/STM inter-
face.
Microprocessor Interface
■Up to 66 MHz synchronous.
■16-bit address and 16-bit data interface.
■Synchronous or asynchronous modes available.
22 Agere Systems Inc.
Product Brief
August 2000
TADM04622 SONET/SDH 155/622 Mbits/s Interface
Description*
The TADM04622 SONET/SDH interface device pro-
vides a versatile solution for OC-3/OC-12 linear and
ring datacom/telecom applications. Constructed using
Agere’s state-of-the-art CMOS technology, this device
incorporates integrated SONET/SDH framing, section/
line/path termination, pointer processing, cross con-
nect, and data engine blocks.
The device provides complete encapsulation and de-
encapsulation for packet and ATM streams into and out
of SONET/SDH payloads.
Communication with the TADM device is accomplished
through a generic microprocessor interface. The device
supports separate address and data buses.
With the TADM device, construction of all types of inter-
faces for OC-3/OC-12 data equipment is simplified and
cost reduced allowing extremely competitive solutions
to be constructed.
This device integrates the SONET/SDH network termi-
nation functions with a generic cell/packet delineation
circuit. It supports STS-12/STM-4 and quad STS-3/
STM-1 interface rates. Up to 16 data channels trans-
ported within an STS-N payload are processed and
handed off over an enhanced UTOPIA interface. The
concatenation levels supported by this device are STS-
1,STS-2c,STS-3c,STS-4c,...,STS12c.Thedata
formats processed by this device are ATM cells or
HDLC framed packets such as PPP or SDL (SDL is
planned for future releases of the device) framed pack-
ets. Future plans for the TADM04622 also call for a vir-
tual concatenation feature allowing all nontraditional
concatenation modes like STS-5c, STS-7c, etc.,
enabling service providers flexibility to adjust their
bandwidth on demand.
* Therelevantdocumentation forthe TADM04622 device is found in
the
TADM042G5
Advance Data Sheet and the
TADM SONET/
SDH 155/622/2488 Mbits/s Add/Drop Data Interface
Data Adden-
dum.
5-7393(F).a
Figure 1. Block Diagram
PACKET/CELL
OVERHEAD PROCESSOR:
•DELINEATION
•DESCRAMBLING
•DECAPSULATION
PROCESSOR
MONITOR
OVERHEAD
PROCESSOR
INSERT
TRANSPORT
OVERHEAD
INTERFACE BLOCK
POINTER
PROCESSOR
CONNECTION
MEMORY
PTR
INTER
AND
DS3/
MPR
PACKET/CELL
FIFOs
CONTROL
DS3/
MPR
AND
SPE
MPR
PACKET/CELL
PROCESSOR:
•ENCAPSULATION
•SCRAMBLING
PAYLOAD
TERMINATION
TSI STM INTERFACE
MATE
INTERFACE
SWITCHING
UTOPIA
INTERFACE
STM_B
STM_A
MPU INTERFACE
DIRECT CELL/PACKET OVER FIBER
DIRECT CELL/PACKET OVER FIBER
STM-4/STS-12
OR QUAD
STM-1/STS-3
STM-4/STS-12
OR QUAD
STM-1/STS-3
MISCELLANEOUS
GPIO/STMDCCTO GO INTERFACE
TERMINATION
TXCLK
PATH
SWITCH
LINE
SWITCH
Agere Systems Inc. 3
Product Brief
August 2000 TADM04622 SONET/SDH 155/622 Mbits/s Interface
Notes
Agere Systems Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
Copyright © 2001 Agere Systems Inc.
All Rights Reserved
August 2000
PB00-121SONT (Replaces PN00-008SONT)
For additional information, contact your Agere Systems Account Manager or the following:
INTERNET: http://www.agere.com
E-MAIL: docmaster@agere.com
N. AMERICA: Agere Systems Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18109-3286
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA: Agere Systems Hong Kong Ltd., Suites 3201 & 3210-12, 32/F, Tower 2, The Gateway, Harbour City, Kowloon
Tel. (852) 3129-2000, FAX (852) 3129-2020
CHINA: (86) 21-5047-1212 (Shanghai), (86) 10-6522-5566 (Beijing), (86) 755-695-7224 (Shenzhen)
JAPAN: (81) 3-5421-1600 (Tokyo), KOREA: (82) 2-767-1850 (Seoul), SINGAPORE: (65) 778-8833, TAIWAN: (886) 2-2725-5858 (Taipei)
EUROPE: Tel. (44) 7000 624624, FAX (44) 1344 488 045
Product Brief
August 2000
in PCI Bus Master (with Target) Applications
TADM04622 SONET/SDH 155/622
Telcordia Technologies
is a registered trademark of Bell Communications Research, Inc.
ANSI
is a registered trademark of American National Standards Institute, Inc.
