1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Built Into Tomorrow
Benets
• AEC-Q200automotivequalied
• ESDqualiedperHBM-AECQ200-002
• Available in package size EIA 0402, 0603, 0805, 1206
• DC Voltage ratings of 25 V, 50 V, 63 V, 100 V, 200 V and 250 V
• Capacitance range from 1 nF to 100 nF
• −55°Cto+125°Coperatingtemperaturerange
• Lead(Pb)-free,RoHSandREACHcompliant
• Available capacitance tolerances of ±1%, ±2%, ±5%, ±10%, and ±20%
• No piezoelectric noise
• Extremely low ESR and ESL
• Highthermalstability
• Highripplecurrentcapability
• Preferred capacitance solution at line frequencies and
intotheMHzrange
• NocapacitancechangeswithrespecttoappliedDCvoltage
• Negligiblecapacitancechangewithrespecttotemperaturefrom−55°Cto+125°C
• Nocapacitancedecaywithtime
• Non-polar devices, minimizing installation concerns
• 100%puremattetin-platedterminationnishallowingforexcellentsolderability
• Flexible Termination option available
Overview
TheKEMETelectrostaticdischarge(ESD)ratedcommercial
and automotive grade surface mount capacitors in C0G
dielectricaresuitedforavarietyofapplicationswhere
electrostaticdischarge(ESD)eventsduringassembly
oroperationcoulddamagethecapacitororthecircuit.
TheseESDratedcapacitorsprovidetheabilitytodesign
withinagivenESDcriteriaperthehumanbodymodel
(HBM)AECQ200–002criteria.TheKEMETautomotive
gradecapacitorsalsomeettheotherdemanding
AutomotiveElectronicsCouncil'sAEC–Q200qualication
requirements.
TheC0Gdielectricfeaturesa125°Cmaximumoperating
temperatureandisconsidered“stable.”TheElectronics
IndustriesAlliance(EIA)characterizesC0Gdielectricas
aClassImaterial.Componentsofthisclassicationare
temperature compensating and are suited for resonant
circuitapplications,aswellasthosewhereQandstabilityof
capacitancecharacteristicsarerequired.TheC0Gdielectric
exhibitsnochangeincapacitancewithrespecttotimeand
voltage,andboastsanegligiblechangeincapacitance
comparedtoitsvalueat25°C.Capacitancechangeislimited
to±30ppm/°Cfrom−55°Cto+125°C.
SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)
ESD, C0G Dielectric, 25 – 250 VDC
(Commercial & Automotive Grade)
Applications
Typicalapplicationsinclude:electrostaticdischarge(ESD),integratedcircuit(IC)protection,radiofrequency(RF)ltering
function,inputandoutputautomotiveapplicationssuchascontrollers,navigationsystems,airbagsandkeylesssystems.
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2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Ordering Information
C0603 C103 J 3 G E C AUTO
Ceramic Case Size
(L" x W") Specication/
Series Capacitance
Code (pF) Capacitance
Tolerance2Rated Voltage
(VDC) Dielectric Failure Rate/
Design Termination
Finish2
Packaging/
Grade
(C-Spec)
0402
0603
0805
1206
C = Standard
X = Flexible
Termination
Two
signicant
digits and
number of
zeros
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3 = 25
5 = 50
M = 63
1 = 100
2 = 200
A = 250
G = C0G E = ESD C = 100%
Matte Sn
See
"Packaging
C-Spec
Ordering
Options
Table"
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 Additional capacitance tolerance offerings and termination nish options may be available. Contact KEMET for details.Benets (cont'd)
Table 1A – Capacitance Range/Selection Waterfall
Capacitance Cap Code
Case Size/
Series C0402C C0603C C0805C C1206C
Rated Voltage
(VDC) 25 50 63 100 25 50 63 100 200 25 50 63 100 200 250 25 50 63 100 200 250
Voltage Code 35M 1 3 5M 1 235M 1 2A 3 5M 1 2A
Cap Tolerance ESD Level per AEC–Q200
1.0 nF 102
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
4 kV 4 kV 4 kV 4 kV 6 kV 6 kV 6 kV 6 kV 6 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV
1.5 nF 152 6 kV 6 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
2.2 nF 222 6 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
3.3 nF 332 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
4.7 nF 472 16 kV 16 kV 16 kV 16 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
6.8 nF 682 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
10 nF 103 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
15 nF 153 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
22 nF 223 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
33 nF 333 25 kV 25 kV 25 kV 25 kV 25 kV
47 nF 473 25 kV 25 kV 25 kV 25 kV 25 kV
68 nF 683 25 kV 25 kV
100 nF 104 25 kV
3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade1
Bulk Bag
Not required (blank)
7" Reel/Unmarked
TU
13" Reel/Unmarked
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7"Reel/Unmarked/2mmpitch
2
7081
13"Reel/Unmarked/2mmpitch
2
7082
Automotive Grade3
7" Reel
AUTO
13" Reel/Unmarked
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
7"Reel/Unmarked/2mmpitch
2
3190
13"Reel/Unmarked/2mmpitch
2
3191
1 Default packaging is "Bulk Bag." An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking."
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3 All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For
more information see "Capacitor Marking."
4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMETautomotivegradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.
DetailsregardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualicationforPassive
Components.TheseproductsaresupportedbyaProductChangeNotication(PCN)andProductionPartApprovalProcess
warrant (PPAP).
AutomotiveproductsofferedthroughourdistributionchannelhavebeenassignedaninclusiveorderingcodeC-Spec,“AUTO.”
ThisC-Specwasdevelopedinordertobetterservesmallandmedium-sizedcompaniesthatpreferanautomotivegrade
componentwithouttherequirementtosubmitacustomerSourceControlledDrawing(SCD)orspecicationforreviewbya
KEMETengineeringspecialist.ThisC-SpecisthereforenotintendedforusebyKEMETOEMautomotivecustomersandare
notgrantedthesame“privileges”asotherautomotiveC-Specs.CustomerPCNapprovalandPPAPrequestlevelsarelimited
(see details below.)
Product Change Noti cation (PCN)
TheKEMETproductchangenoticationsystemisusedtocommunicateprimarilythefollowingtypesofchanges:
•Product/processchangesthataffectproductform,t,function,and/orreliability
•Changesinmanufacturingsite
• Product obsolescence
KEMET Automotive
C-Spec
Customer Noti cation Due To: Days Prior To
Implementation
Process/Productchange Obsolescence*
KEMET assigned1Yes(withapprovalandsignoff) Yes 180 days minimum
AUTO Yes(withoutapproval) Yes 90 days minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
ThepurposeoftheProductionPartApprovalProcessis:
•Toensurethatsuppliercanmeetthemanufacturabilityandqualityrequirementsforthepurchasedparts.
•Toprovidetheevidencethatallcustomerengineeringdesignrecordsandspecicationrequirementsareproperly
understoodandfullledbythemanufacturingorganization.
•Todemonstratethattheestablishedmanufacturingprocesshasthepotentialtoproducethepart.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET assigned1●●●●●
AUTO ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.
●PartnumberspecicPPAPavailable
○ Product family PPAP only
5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
Without Flexible Termination
0402 1005 1.00 (0.040)
±0.05 (0.002)
0.50 (0.020)
±0.05 (0.002)
See Table 2 for
Thickness
0.30 (0.012)
±0.10 (0.004) 0.30 (0.012) Solderreow
only
0603 1608 1.60 (0.063)
±0.15 (0.006)
0.80 (0.032)
±0.15 (0.006)
0.35 (0.014)
±0.15 (0.006) 0.70 (0.028)
Solder wave
or
Solderreow
0805 2012 2.00 (0.079)
±0.20 (0.008)
1.25 (0.049)
±0.20 (0.008)
0.50 (0.02)
±0.25 (0.010) 0.75 (0.030)
1206 3216 3.20 (0.126)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
0.50 (0.02)
±0.25 (0.010) N/A
With Flexible Termination
0603 1608 1.60 (0.063)
±0.17 (0.007)
0.80 (0.032)
±0.15 (0.006)
See Table 2 for
Thickness
0.45 (0.018)
±0.15 (0.006) 0.58 (0.023)
Solder wave or
Solderreow
0805 2012 2.00 (0.079)
±0.30 (0.012)
1.25 (0.049)
±0.30 (0.012)
0.50 (0.02)
±0.25 (0.010) 0.75 (0.030)
1206 3216 3.30 (0.130)
±0.40 (0.016)
1.60 (0.063)
±0.35 (0.013)
0.60 (0.024)
±0.25 (0.010) N/A
6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Qualication/Certication
Commercialgradeproductsaresubjecttointernalqualication.Detailsregardingtestmethodsandconditionsare
referenced in Table 4, Performance & Reliability.
AutomotivegradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.Details
regardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualicationforPassive
Components.ForadditionalinformationregardingtheAutomotiveElectronicsCouncilandAEC–Q200,pleasevisittheir
website at www.aecouncil.com.
Environmental Compliance
Lead(Pb)-free,RoHS,andREACHcompliantwithoutexemptions.
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°Cto+125°C
CapacitanceChangewithReferenceto
+25°Cand0VDCApplied(TCC) ±30ppm/°C
AgingRate(Maximum%CapacitanceLoss/DecadeHour) 0%
1DielectricWithstandingVoltage(DWV)
250% of rated voltage
(5±1secondsandcharge/dischargenotexceeding50mA)
2DissipationFactor(DF)MaximumLimitat25°C 0.1%
3InsulationResistance(IR)MinimumLimitat25°C
1,000MΩµFor100GΩ
(Ratedvoltageappliedfor120±5secondsat25°C)
1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2 Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance, it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as automatic level control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
Post Environmental Limits
Dielectric Rated DC
Voltage Capacitance Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
C0G All All 0.5 0.3% or
±0.25 pf
10% of
Initial limit
7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 1B – Product Availability and Chip Thickness Waterfall – Standard Termination
Capacitance Cap Code
Case Size/
Series C0402C C0603C C0805C C1206C
Rated Voltage
(VDC) 25 50 63 100 25 50 63 100 200 25 50 63 100 200 250 25 50 63 100 200 250
Voltage Code 35M 1 3 5M 1 235M 1 2A 3 5M 1 2A
Cap Tolerance Product Availability and Chip Thickness Codes – See Packaging Specs for Chip Thickness Dimensions
1.0 nF 102
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
BB BB BB BB CF CF CF CF CF DD DD DD DD DD DD EQ EQ EQ EQ EQ EQ
1.5 nF 152 BB BB CF CF CF CF CF DR DR DR DR DR DR ER ER ER ER ER ER
2.2 nF 222 BB CF CF CF CF CF DR DR DR DR DR DR ET ET ET ET ET ET
3.3 nF 332 CF CF CF CF DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ
4.7 nF 472 CF CF CF CF DD DD DD DD DD DD EQ EQ EQ EQ EQ EQ
6.8 nF 682 CF CF DG DG DG DG DG DG EQ EQ EQ EQ EQ EQ
10 nF 103 CF DD DD DD DD ER ER ER ER ER ER
15 nF 153 CF DG DG DG DG EF EF EF EF EF EF
22 nF 223 DF DF EH EH EH EH EH EH
33 nF 333 DG EF EF EF EF
47 nF 473 DG EH EH EH EH
68 nF 683 EH EH
100 nF 104 EH
Table 1C – Product Availability and Chip Thickness Waterfall – Flexible Termination
Capacitance Cap Code
Case Size/
Series C0603C C0805C C1206C
Rated Voltage
(VDC) 25 50 63 100 200 25 50 63 100 200 250 25 50 63 100 200 250
Voltage Code 35M 1 235M 1 2A 3 5M 1 2A
Cap Tolerance Product Availability and Chip Thickness Codes – See Packaging Specs for Chip Thickness Dimensions
1.0 nF 102
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
CJ CJ CJ CJ CJ DD DD DD DD DD DD EQ EQ EQ EQ EQ EQ
1.5 nF 152 CJ CJ CJ CJ CJ DR DR DR DR DR DR ER ER ER ER ER ER
2.2 nF 222 CJ CJ CJ CJ CJ DR DR DR DR DR DR ET ET ET ET ET ET
3.3 nF 332 CJ CJ CJ CJ DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ
4.7 nF 472 CJ CJ CJ CJ DD DD DD DD DD DD EQ EQ EQ EQ EQ EQ
6.8 nF 682 CJ CJ DG DG DG DG DG DG EQ EQ EQ EQ EQ EQ
10 nF 103 CJ DD DD DD DD ER ER ER ER ER ER
15 nF 153 CJ DG DG DG DG EF EF EF EF EF EF
22 nF 223 DF DF EH EH EH EH EH EH
33 nF 333 DG EF EF EF EF
47 nF 473 DG EH EH EH EH
68 nF 683 EH EH
100 nF 104 EH
8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
BB
0.50 ±0.05
10,000
50,000
0
0
CF
0.80 ±0.07*
4,000
15,000
0
0
CJ
0.80 ± 0.15*
4,000
15,000
0
0
DD
0.90 ± 0.10
0
0
4,000
10,000
DF
1.10 ± 0.10
0
0
2,500
10,000
DG
1.25 ± 0.15
0
0
2,500
10,000
DR
0.78 ± 0.20
0
0
4,000
10,000
EB
0.78 ±0.10
0
0
4,000
10,000
EC
0.90 ±0.10
0
0
4,000
10,000
EE
1.10 ±0.10
0
0
2,500
10,000
EF
1.20 ±0.15
0
0
2,500
10,000
EH
1.60 ±0.20
0
0
2,000
8,000
EQ
0.78 ± 0.20
0
0
4,000
10,000
ER
0.90 ± 0.20
0
0
4,000
10,000
ET
1.10 ± 0.20
0
0
2,500
10,000
Table 3 – Bulk Packaging Quantities
Packaging Type Loose Packaging
Bulk Bag (default)
Packaging C-Spec1N/A2
Case Size Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum
0402
1005
1
50,000
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
20,000
1812
4532
1825
4564
2220
5650
2225
5664
1 The "Packaging C-Spec" is a 4 to 8 digit code which identies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for automotive grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and automotive grade products.) The
15th through 22nd character positions of the ordering code should be left blank. All products ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 4 – Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
Without Flexible Termination
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
With Flexible Termination
0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20
0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81
1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualication testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique
•SolderwaveorsolderreowforEIAcasesizes0603,0805and1206
•AllotherEIAcasesizesarelimitedtosolderreowonly
Recommended Reow Soldering Prole
TheKEMETfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),
convection,IRorvaporphasereowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedproleconditionsforconvectionandIRreowreecttheproleconditionsofthe
IPC/J-STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereow
passesattheseconditions.
Prole Feature Termination Finish
100% Matte Sn
Preheat/Soak
Temperature minimum (TSmin)
150°C
Temperature maximum (T
Smax
)200°C
Time (tS) from TSmin to TSmax
60–120seconds
Ramp-up rate (TL to TP)3°C/secondmaximum
Liquidous temperature (TL)217°C
Time above liquidous (tL)60–150seconds
Peak temperature (TP)260°C
Timewithin5°Cofmaximumpeak
temperature (t
P
)30 seconds maximum
Ramp-down rate (TP to TL)6°C/secondmaximum
Time25°Ctopeaktemperature 8 minutes maximum
Note : All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tP
tL
ts
25°C to Peak
11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 5 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
TerminalStrength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmfor
C0G.Flexibleterminationsystem–3.0mm(minimum).
Solderability J–STD–002
Magnication50X.Conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°C,category3
c)MethodDat260°C,category3
Temperature Cycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours±4hoursaftertestconclusion.
BiasedHumidity MIL–STD–202
Method103
Loadhumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Lowvolthumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Moisture Resistance
MIL–STD–202
Method106
t=24hours/cycle.Steps7aand7bnotrequired.
Measurementat24hours±4hoursaftertestconclusion.
ThermalShock MIL–STD–202
Method107
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds.
Dwelltime–15minutes.Air–Air.
HighTemperatureLife MIL–STD–202
Method108/EIA–198 1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
Storage Life
MIL–STD–202
Method108
150°C,0VDCfor1,000hours.
Vibration MIL–STD–202
Method204
5g'sfor20minutes,12cycleseachof3orientations.Note:use8"X5"PCB0.031"thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz
MechanicalShock
MIL–STD–202
Method213
Figure1ofMethod213,ConditionF.
Resistance to Solvents
MIL–STD–202
Method215
Addaqueouswashchemical,OKEMCleanorequivalent.
Storage and Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum
storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock
shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.
12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Barrier Layer
(Ni)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Dielectric
Material (CaZrO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn)
Construction – Flexible Termination
Dielectric
Material (CaZrO3)
Detailed Cross Section
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Dielectric Material
(CaZrO3)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination
Finish
(100% Matte Sn)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional)
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA0603casesizedeviceswithexibleterminationoption.
• KPS commercial and automotive grade stacked devices.
Thesecapacitorsaresuppliedunmarkedonly.
14© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMEToffersmultilayerceramicchipcapacitorspackagedin8,12and16mmtapeon7"and13"reelsinaccordancewith
EIAStandard481.Thispackagingsystemiscompatiblewithalltape-fedautomaticpickandplacesystems.SeeTable2for
detailsonreelingquantitiesforcommercialchips.
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 6 – Carrier Tape Con guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7" Reel 13" Reel 7" Reel 13" Reel
Pitch(P
1
)* Pitch(P
1
)*
01005–0402 8 2 2
0603 82/4 2/4
0805 84444
1206–1210 84444
1805–1808 12 4 4
≥1812 12 8 8
KPS 1210 12 8 8
KPS 1812
and 2220
16 12 12
Array 0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance speci cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotive grade 7" reel unmarked
C-3191
Automotive grade 13" reel unmarked
C-7081
Commercial grade 7" reel unmarked
C-7082
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Bene ts of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Doublethepartsoneachreelresultsinfewerreel
changesandincreasedefficiency.
• Fewerreelsresultinlowerpackaging,shippingand
storage costs, reducing waste.
15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm)
and Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes, and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape, and to 1.0 mm maximum for 16 mm tape (see
Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 8 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
R Reference
Note 2
8 mm 1.5+0.10-0.0
(0.059+0.004-0.0) 1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half(2mm) 6.25
(0.246) 3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:
Tape Width Peel Strength
8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe
165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof
300 ±10 mm/minute.
3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
18© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 9 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/−0.0
(0.331+0.059/−0.0)
14.4
(0.567)
Shallaccommodatetape
widthwithoutinterference
12 mm
12.4+2.0/−0.0
(0.488+0.078/−0.0)
18.4
(0.724)
16 mm
16.4+2.0/−0.0
(0.646+0.078/−0.0)
22.4
(0.882)
19© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
20© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1091_C0G_ESD • 9/15/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
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