TLP2403(V4-TP,F) - Toshiba America Electronic Components, Inc.

TLP2403

Photocouplers GaAℓAs Infrared LED & Photo IC

TLP2403

1. Applications

Applications

• High-Speed Digital Interfacing for Instrumentation and Control Devices

• Simplex/Multiplex Data Transmission

2. General

General

The Toshiba TLP2403 consists of a high-output GaAℓAs light-emitting diode coupled with a high-speed photo-

diode-transistor chip. It is housed in the SO8 package.

The TLP2403 uses a high-speed, high-gain detector element and thus is ideal for applications which require low-

input current and high-speed data transmission.

3. Features

Features

(1) Package: SO8

(2) Operating temperature: -40 to 100

(3) Current transfer ratio: 400% (min) @IF = 0.5 mA

(4) Maximum output current: 60 mA

(5) Propagation delay time: tpHL = 2 µs (typ.), tpLH = 4 µs (typ.) @ RL = 4.7 kΩ, IF = 0.5 mA

(6) Isolation voltage: 3750 Vrms (min)

(7) Safety standards

UL-approved: UL1577 File No.E67349

cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349

VDE-approved: Option (V4) EN60747-5-2 (Note)

(Note)

Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4)

Option (V4)

Option (V4).

4. Packaging and Pin Configuration

Packaging and Pin Configuration

1: NC

2: Anode

3: Cathode

4: NC

5: GND (Emitter)

6: Output (Collector)

7: Base

8: VCC

SO8

2010-09-06

Rev.1.0

TLP2403

5. Internal Circuit

Internal Circuit

Fig.

Fig. 5.1

5.1

5.1 Internal Circuit

Internal Circuit

6. Principle of Operation

Principle of Operation

6.1.

6.1. Mechanical Parameters

Mechanical Parameters

Characteristics

Creepage distances

Clearance

Internal isolation thickness

Min

4.0



Unit

2010-09-06

Rev.1.0

TLP2403

7. Absolute Maximum Ratings (Note)

Absolute Maximum Ratings (Note)

Unless otherwise specified, Ta = 25

LED

Detector

Common

Characteristics

Forward current

Forward current derating

Pulse forward current

Pulse forward current derating

Transient pulse forward current

derating

Reverse voltage

Power dissipation

Power dissipation derating

Output current

Output current derating

Output voltage

Supply voltage

Emitter-base reverse voltage

Output power dissipation

derating

Operating temperature

Storage temperature

Lead soldering temperature

Isolation voltage

(Ta ≥ 85)

(Ta ≥ 25)

(10 s)

AC, 1 min, R.H. ≤ 60%

Symbol

∆IF/

IFP

∆IFP/

IFPT

∆IFPT/

∆PD/

∆IO/

VCC

VEB

∆PO/

Topr

Tstg

Tsol

BVS

Note

(Note 1)

(Note 2)

(Note 3)

Rating

-0.67

-1.0

-25

-1.0

-0.6

-0.5 to 18

0.5

100

-1.0

-40 to 100

-55 to 125

260

3750

Unit

mA/

mW/

mA/

mW/



Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width (PW) ≤ 1 ms, duty = 50%

Note 2: Pulse width (PW) ≤ 1 µs, 300 pps

Note 3: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7

and 8 are shorted together.

8. Recommended Operating Conditions (Note)

Recommended Operating Conditions (Note)

Characteristics

Forward current

Output current

Supply voltage

Operating temperature

Symbol

VCC

Topr

Note

(Note 1)

Min

0.5



-40

Typ.



Max

100

Unit



Note: The recommended operating conditions are given as a design guide necessary to obtain the intended

performance of the device. Each parameter is an independent value. When creating a system design using

this device, the electrical characteristics specified in this datasheet should also be considered.

Note 1: Denotes the operating range, not the recommended operating condition.

2010-09-06

Rev.1.0

TLP2403

9. Electrical Characteristics (Note)

Electrical Characteristics (Note)

Unless otherwise specified, Ta = 0 to 100

Characteristics

Input forward voltage

Input temperature coefficient

of forward voltage

Input reverse current

Input capacitance

High-level output current

High-level supply current

Low-level supply current

Current transfer ratio

Low-level output voltage

Symbol

∆VF/∆Ta

IOH

ICCH

ICCL

IO/IF

VOL

Note Test

Circuit Test Condition

IF = 1.6 mA, Ta = 25

IF = 1.6 mA

VR = 5 V, Ta = 25

V = 0 V, f = 1 MHz, Ta = 25

VF = 0.8 V, VCC = VO = 18 V

IF = 0 mA, VCC = 5 V,

VO = Open

IF = 1.6 mA, VCC = 5 V,

VO = Open

IF = 0.5 mA, VCC = 4.5 V,

VO = 0.4 V

IF = 1.6 mA, VCC = 4.5 V,

VO = 0.4 V

IF = 1.6 mA, VCC = 4.5 V,

IOL = 6.4 mA

IF = 5 mA, VCC = 4.5 V,

IOL = 15 mA

IF = 12 mA, VCC = 4.5 V,

VO = 24 mA

Min

1.30



0.1

400

500



Typ.

1.45

-1.8



0.1

0.01

1000

900

0.1

0.15

Max

1.70



100

1.5



0.4

Unit

mV/

µA

Note: All typical values are at Ta = 25.

10.

10. Isolation Characteristics

Isolation Characteristics

Unless otherwise specified, Ta = 25

Characteristics

Capacitance (input to output)

Isolation resistance

Isolation voltage

Symbol

BVS

Note

(Note 1)

Test Conditions

VS = 0 V, f = 1 MHz

VS = 500 V, R.H. ≤ 60%

AC, 1 min

AC, 1 s in oil

DC, 1 min in oil

Min



1×1012

3750



Typ.

0.8

1014



10000

Max



Unit

Ω

Vrms

Vdc

Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7

and 8 are shorted together.

2010-09-06

Rev.1.0

TLP2403

11.

11. Switching Characteristics

Switching Characteristics

Unless otherwise specified, Ta = 0 to 100, VCC = 5 V

Characteristics

Propagation delay time

(H/L)

Propagation delay time

(L/H)

Common-mode transient

immunity at output high

Common-mode transient

immunity at output low

Symbol

tpHL

tpLH

CMH

CML

Note

(Note 1)

(Note 2)

Test

Circuit

Fig.

12.1.1

Fig.

12.1.1

Fig.

12.1.2

Test Condition

IF = 0.5 mA, RL = 4.7 kΩ,

Ta = 25

IF = 0.5 mA, RL = 4.7 kΩ

IF = 12 mA, RL = 270 Ω,

Ta = 25

IF = 12 mA, RL = 270 Ω

IF = 1.6 mA, RL = 2.2 kΩ,

Ta = 25

IF = 1.6 mA, RL = 2.2 kΩ

IF = 0.5 mA, RL = 4.7 kΩ,

Ta = 25

IF = 0.5 mA, RL = 4.7 kΩ

IF = 12 mA, RL = 270 Ω,

Ta = 25

IF = 12 mA, RL = 270 Ω

IF = 1.6 mA, RL = 2.2 kΩ,

Ta = 25

IF = 1.6 mA, RL = 2.2 kΩ

IF = 0 mA, RL = 2.2 kΩ,

VCM = 10 V, VO(min) = 2 V

IF = 1.6 mA, RL = 2.2 kΩ,

VCM = 10 V, VO(max) = 0.8 V

Min



Typ.

0.3

0.5

4.5

500

-500

Max



Unit

µs

V/µs

Note 1: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage

in the logic high state (VO > 2.0 V).

Note 2: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in

the logic low state (VO < 0.8 V).

2010-09-06

Rev.1.0

TLP2403

12.

12. Test Circuits and Characteristics Curves

Test Circuits and Characteristics Curves

12.1.

12.1. Test Circuits

Test Circuits

Fig.

Fig. 12.1.1

12.1.1

12.1.1 Switching Time Test Circuit

Switching Time Test Circuit

Fig.

Fig. 12.1.2

12.1.2

12.1.2 Common-Mode Transient Immunity

Common-Mode Transient Immunity

2010-09-06

Rev.1.0

TLP2403

13.

13. Soldering and Storage

Soldering and Storage

13.1.

13.1. Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

• When using soldering reflow (See Fig. 13.1.1 and 13.1.2)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig.

Fig. 13.1.1

13.1.1

13.1.1 An example of a temperature profile

An example of a temperature profile

when Sn-Pb eutectic solder is used

Fig.

Fig. 13.1.2

13.1.2

13.1.2 An example of a temperature profile

An example of a temperature profile

when lead(Pb)-free solder is used

• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Apply preheating of 150 for 60 to 120 seconds.

Mounting condition of 260 within 10 seconds is recommended.

Flow soldering must be performed once.

• When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not

exceeding 350

Heating by soldering iron must be done only once per lead.

13.2.

13.2. Precautions for General Storage

Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.

• Follow the precautions printed on the packing label of the device for transportation and storage.

• Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,

respectively.

• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

• When restoring devices after removal from their packing, use anti-static containers.

• Do not allow loads to be applied directly to devices while they are in storage.

• If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

2010-09-06

Rev.1.0

TLP2403

14.

14. Land Pattern Dimensions for Reference Only

Land Pattern Dimensions for Reference Only

Fig.

Fig. 14.1

14.1

14.1 Land Pattern Dimensions for Reference Only (unit: mm)

Land Pattern Dimensions for Reference Only (unit: mm)

15.

15. Marking

Marking

Fig.

Fig. 15.1

15.1

15.1 Marking

Marking

2010-09-06

Rev.1.0

TLP2403

16.

16. EN60747-5-2 Option (V4) Specification

EN60747-5-2 Option (V4) Specification

• Part number: TLP2403 (Note)

(Note)

• The following part naming conventions are used for the devices that have been qualified according to

option (V4) of EN60747.

Example: TLP2403(V4-TP, F)

V4: EN60747 option specification

TP: Standard taping name

Note: Use TOSHIBA standard type number for safety standard application.

e.g., TLP2403(V4-TP, F) → TLP2403

Fig.

Fig. 16.1

16.1

16.1 EN60747 Insulation Characteristics

EN60747 Insulation Characteristics

2010-09-06

Rev.1.0

TLP2403

Fig.

Fig. 16.2

16.2

16.2 Insulation Related Specifications (Note)

Insulation Related Specifications (Note)

Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.

g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall

take suitable measures.

Note: This photocoupler is suitable for safe electrical isolation

safe electrical isolation

safe electrical isolation only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

Fig.

Fig. 16.3

16.3

16.3 Marking Example (Note)

Marking Example (Note)

Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747.

2010-09-06

Rev.1.0

TLP2403

Package Dimensions

Package Dimensions Unit: mm

Weight: 0.11 g (typ.)

Package Name(s)

TOSHIBA: 11-5K1S

Nickname: SO8

2010-09-06

Rev.1.0

TLP2403

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product

is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/

or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact

("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace

industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,

equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and

equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange

and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology

are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2010-09-06

Rev.1.0