Approval sheet
Page 8 of 10 ASC_WR_V23 APR.- 2015
TEST AND REQUIREMENTS
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
REQUIREMENT
TEST PROCEDURE / TEST METHOD Resistor 0Ω
ΩΩ
Ω
Electrical
Characteristics
JISC5201-1: 1998
Clause 4.8
-
DC resistance values measurement
-
Temperature Coefficient of Resistance (T.C.R)
Natural resistance change per change in degree centigrade.
( )
6
121
12 10×
−
ttR RR
(ppm/°C) t
1
: 20°C+5°C-1°C; t
2
: -55°C or +155°C
R
1
: Resistance at reference temperature (20°C+5°C/-1 °C)
R
2
: Resistance at test temperature (-55°C or +155°C)
Within the specified tolerance
Refer to “QUICK REFERENCE
DATA”
<50mΩ
Resistance to
soldering heat(R.S.H)
JISC5201-1:1998
Clause 4.18
Un-mounted chips completely immersed for 10±1second in a SAC
solder bath at 260℃±5ºC
±5%:∆R/Rmax.±(1%+0.05Ω)
±1%:∆R/Rmax.±(0.5%+0.05Ω)
no visible damage <50mΩ
Solderability
JISC5201-1: 1998
Clause 4.17
Un-mounted chips completely immersed for 2±0.5 second in a SAC
solder bath at 235℃±5℃ 95% coverage min., good tinning and no
visible damage
Temperature cycling
JISC5201-1: 1998
Clause 4.19
30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes at
+155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous cycles
±5%: ∆R/R max. ±(1%+0.05Ω)
±1%:∆R/Rmax.±(0.5%+0.05Ω)
No visible damage
<50mΩ
High Temperature
Exposure
MIL-STD-202
method 108
1000+48/-0 hours; without load in a temperature chamber
controlled 155±3°C
±5%:∆R/Rmax.±(2%+0.1Ω)
±1%:∆R/Rmax.±(1%+0.1Ω)
No visible damage <50mΩ
Bending strength
JISC5201-1: 1998
Clause 4.33
Resistors mounted on a 90mm glass epoxy resin PCB(FR4), bending
once 3mm for 10sec, 5mm for WR04
±5%:∆R/Rmax.±(1%+0.05Ω)
±1%:∆R/Rmax.±(1%+0.05Ω)
No visual damaged <50mΩ
Adhesion
JISC5201-1: 1998
Clause 4.32
Pressurizing force: 5N, Test time: 10±1sec.
No remarkable damage or removal of the
terminations
Short Time Overload
(STOL)
JISC5201-1: 1998
Clause 4.13
2.5 times RCWV or max. overload voltage, for 5seconds
±5%: ∆R/R max. ±(2%+0.05Ω)
±1%: ∆R/R max. ±(1%+0.05Ω)
No visible damage <50mΩ