BD34701KS2 - ROHM SEMICONDUCTOR

Datashee

t

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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www.rohm.com

TSZ22111・14・001 TSZ02201-0C2C0E100080-1-2

017.Sep.2013 Rev.002

Logic

FR

Volume FL

Volume SW

Volume C

Volume SR

Volume SL

Volume SBR

Volume SBL

Volume

Mode

selector

Rec

ADC

26

25

24

23

22

21

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10 11 12 13

20

19

18

17

16

15

14

GSMGSMGSM GSM

30 29 28 2734 33 32 3138 37 36 3539

GSMGSMGSMGSMGSMGSMGSMGSMGSMGSMGSMGSM

40

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47

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50

51

52

GSM GSM GSM GSM GSM GSM GSM GSM

Main

OUTSBR OUTSBLOUTSR OUTSL

OUTSW OUTC

CLDGND DA

47µ 0.1µ VEE

47µ 0.1µOUTFR OUTFL

SUBR

SUBL

RECR

RECL

GND

INL8

INR8

INL7

INR7

GND

INL6INR6INL5INR5

INL4

INR4INL3

INR3

INL2

INR2

INL1

INR1

GND

SBLIN

SBRIN

SLIN

SRIN

CIN

SWIN

FLIN

FRIN

GND

ADCR

ADCL

CHP

VCC

Mode

selector

Mode

selector

Mode

selector

Sub

MULTI

INPUT

STEREO

INPUT

INR9

INL12

INR12

INL11

INR11

INL10

INR10

INL9

Sound Processors for Home Theater Systems

7.1ch Sound Processor

with Built-in Micro-step Volume

BD34701KS2

General description

The BD34701KS2 is an 8ch inde pende nt volume system.

The system is designed in such a way, that it can be

used as a 7.1ch surround system. Micro-step volume

can reduce the switching shock noise when volume

changes, so it can achieve a high- quality set.

8ch dual input selector for zone 2 and multi channel

input enable the connection of a number of sources.

Features

 8ch input selectors

 Micro-step volume can reduce the switching shock

noise when volume changes.

 Zone 2 can support.

 2-wire serial bus control, corresponding to 3.3/5V.

Applications

 Most suitable for the AV receiv er, home theater

system

Key Specifications

 Total harmonic distortion: 0.0004%(Typ.)

 Maximum output voltage: 4.2Vrms(Typ.)

 Output noise voltage: 1.5uVrms(Typ.)

 Residual output noise voltage: 1.0uVrms(Typ.)

 Cross-talk between channels: -105dB(Typ.)

 Cross-talk between selectors: -105dB(Typ.)

Package W(Typ.) x D(Typ.) x H(Max.)

SQFP-T52 12.00mm x 12.00mm x 1.50mm

SQFP-T52

Typical Application Circuit

Figure 1. Application Circuit

2/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

17 GND

16 GND

15 SUBR

14 SUBL

VCC 1

DGND 2

DA 3

CL 4

VEE 5

OUTFR 6

OUTFL 7

OUTSW 8

OUTC 9

OUTSR 10

OUTSL 11

OUTSBR 12

OUTSBL 13

18 RECL

19 RECR

21 GND

20 GND

22 INL8

23 INR8

24 INL7

25 INR7

26 GND

27 INL6

28 INR6

29 INL5

30 INR5

31 INL4

32 INR4

33 INL3

34 INR3

35 INL2

36 INR2

37 INL1

38 INR1

39 GN D

SBLIN 40

SBRIN 41

SLIN 42

SRIN 43

CIN 44

SWIN 45

FLIN 46

FRIN 47

GND 48

ADCR 49

ADCL 50

GND 51

CHIP 52

Pin Configuration

Figure 2. Pin Configuration

3/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Description of terminal

Terminal

Number Symbol Function

Terminal

Number Symbol Function

1 VCC Positive power supply

terminal 27 INL6 Lch in put terminal 6

2 DGND Digital ground terminal 28 INR6 Rch input terminal 6

3 DA Data and latch input terminal 29 INL5 Lch in put terminal 5

4 CL Clock input terminal 30 INR5 Rch input terminal 5

5 VEE Negative power suppl y

terminal 31 INL4 Lch in put terminal 4

6 OUTFR FRch Output terminal 32 INR4 Rch input terminal 4

7 OUTFL FLch Output terminal 33 INL3 Lch in put terminal 3

8 OUTSW SWch Output terminal 34 INR3 Rch input terminal 3

9 OUTC Cch Output terminal 35 INL2 Lch in put terminal 2

10 OUTSR SRch Output terminal 36 INR2 Rch input terminal 2

11 OUTSL SLch Output terminal 37 INL1 Lch input terminal 1

12 OUTSBR SBRch Output terminal 38 INR1 Rch input terminal 1

13 OUTSBL SBLch Output terminal 39 GND Analog ground terminal

14 SUBL Lch SUB output terminal 40 SBLIN SBLch input terminal for DSP

15 SUBR Rch SUB output terminal 41 SBRIN SBRch input terminal for DSP

16 GND Analog ground terminal 42 SLIN SLch input terminal for DSP

17 GND Analog ground terminal 43 SRIN SRch input terminal for DSP

18 RECL Lch REC output terminal 44 CIN Cch input terminal for DSP

19 RECR Rch REC output terminal 45 SWIN SWch input terminal for DSP

20 GND Analog ground terminal 46 FLIN FLch input terminal for DSP

21 GND Analog ground terminal 47 FRIN FRch input terminal for DSP

22 INL8 Lch input terminal 8 48 GND Analog ground terminal

23 INR8 Rch input terminal 8 49 ADCR Rch output terminal to ADC

24 INL7 Lch input terminal 7 50 ADCL Lch outp ut terminal to ADC

25 INR7 Rch input terminal 7 51 GND Analog gro und terminal

26 GND Analog ground terminal 52 CHIP Chip select

4/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Logic

FR

Volume FL

Volume SW

Volume C

Volume SR

Volume SL

Volume SBR

Volume SBL

Volume

Mode

selector

Rec

ADC

26

25

24

23

22

21

123456789

10 11 12 13

20

19

18

17

16

15

14

GSMGSMGSM GSM

30 29 28 2734 33 32 3138 37 36 3539

GSMGSMGSMGSMGSMGSMGSMGSMGSMGSMGSMGSM

40

41

42

43

44

45

46

47

48

49

50

51

52

GSM GSM GSM GSM GSM GSM GSM GSM

Main

Mode

selector

Mode

selector

Mode

selector

Sub

Block Diagram

Figure 3. Block Diagram

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Absolute Maximum Ratings

Item Symbol Rating Unit

Positive power supply Vcc +7.75

(Note1) V

Negative power supply Vee -7.75

(Note1) V

Power dissipation Pd 1.30

(Note2) W

Input voltage Vin Vee-0.2 to Vcc +0.2 V

Operating temperature Topr -40 to +85 (Note3) °C

Storage temperature Tastg -55 to +125 °C

(Note1) The maximum voltage that can be applied based on GND.

(Note2) This value decreases 13.0mW/°C for Ta=25°C or more. A standard board, 70×70×1.6 mm, shall be mounted.

(Note3) If it within operation voltage range, circuit functions operation is guaranteed within operation temp.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between

pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as

adding a fuse, in case the IC is operated over the absolute maximum ratings.

Operating Condition

Item Symbol Rating Unit

Positive power supply Vcc +6.5 to +7.5 (Note4,5) V

Negative power supply Vee -6.5 to -7.5 (Note4,5) V

(Note4) Applying a voltage based on GND.

(Note5) Within operation temp range, basic circuit function Operation is guaranteed within operation voltage range.

But please confirm set up of constant and element, voltage set up and temp set up on use.

Please watch out except condition stipulated by electrical characteristics within the range, It cannot guarantee

standard value of electrical characteristics. But it retains original function.

6/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Electrical characteristic

Unless specified particularly, Ta=25°C, Vcc=7V, Vee=-7V, f=1kHz, Vin=1Vrms, RL=10kΩ,

Stereo input selector(MAIN, SUB)=IN1, Mode selector(FL, FRch)=MAIN, Mode selector(SW, C, SL, SRch)=MULTI,

Mode selector(SBL, SBRch)=MULTI, Input Att=0dB, Input gain=0dB, Volume=0dB.

Item Symbol Limit Unit Conditions

Min. Typ. Max.

TOTAL

Positive circuit current Iqp - 22 44 mA

No signal

Negative circuit current Iqn -44 -22 - mA

No signal

Output voltage gain Gv -1.5 0 1.5 dB 6 to 13pin output

Channel balance CB -0.5 0 0.5 dB

C Channel reference,

6 to 13pin output

Total harmonic distortion THD - 0.0004 0.02 %

BW=400 to 30kHz

6 to 13pin output

Maximum output voltage Vom 3.8 4.2 - Vrms THD=1%,

VOLUME=+10dB

6 to 13pin output

Output noise voltage Vno - 1.5 10 µVrms

Rg=0Ω, BW=IHF-A

6 to 13pin output

Residual output noise

voltage Vnor - 1 8 µVrms

Volume=Mute,

Rg=0Ω, BW=IHF-A

6 to 13pin output

Cross-talk between

channels CT - -105 -80 dB

Rg=0Ω, BW=IHF-A

6, 7pin output

Cross-talk between

selectors CS - -105 -80 dB

Rg=0Ω, BW=IHF-A

6, 7pin output

Input impedance Rin 32 47 62 kΩ 22 to 25, 27 to 38

40 to 47pin input

VOLUME Maximum attenuation ATTmax - -115 -100 dB Volume=Mute, BW=IHF-A

REC

OUT Total harmonic distortion THDR - 0.0005 0.02 %

BW=400 to 30kHz,

RL=6.8kΩ

14,15,18,19pin output

7/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Typical Performance Cu rve(s)

-30

-25

-20

-15

-10

-5

0

5

10

15

20

25

30

012345678

VCC(+)/VEE(-)[V]

Current[mA]

Figure 4. Circuit Currents vs. Circuit Voltage Figure 5. Volu me Gain vs. Input F r equency

(32dB to 0 dB setting)

Operational

range

Figure 6. Volu me Gain vs. Input F r equency

(0dB to -32 dB setting) Figure 7. Volu me Gain vs. Input F r equency

(-32dB to -64 dB setting)

-2

0

2

4

6

8

10

12

14

16

18

20

22

24

26

28

30

32

34

10 100 1000 10000 100000

Frequency[Hz]

Vol ume Gain[d B]

-34

-32

-30

-28

-26

-24

-22

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

2

10 100 1000 10000 100000

Frequency[Hz]

Volum e Gain[dB]

-66

-64

-62

-60

-58

-56

-54

-52

-50

-48

-46

-44

-42

-40

-38

-36

-34

-32

-30

10 100 1000 10000 100000

Frequency[Hz]

Volume Gain[dB]

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

-98

-96

-94

-92

-90

-88

-86

-84

-82

-80

-78

-76

-74

-72

-70

-68

-66

-64

-62

-60

10 100 1000 10000 100000

Frequency[Hz]

Volume Gain[dB]

0.0001

0.0010

0.0100

0.1000

1.0000

0.001 0.010 0.100 1.000 10.000

Input Voltage [Vrms]

THD+N[%]

Figure 8. Volu me Gain vs. Input F r equency

(-64dB to -95 dB setting) Figure 9. THD + N vs. Input Voltage

10kHz

1 kHz

100Hz

9/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Specifica tions for Control Signal

(1) Timing of control signal

Data is read at a rising edge of clock.

Latch is read at a falling edge of clock. And Data on the latest 16bit are taken in the inside of this IC.

Be sure to set DA and C L to LOW after latching.

1byte=16bit

Item Symbol

Limit Unit

Min. Typ. Max.

Clock width twc 1.0 - - µsec

Data width twd 1.0 - - µsec

Latch widt h twl 1.0 - - µsec

Low hold width twh 1.0 - - µsec

Data setup time (DATA→CLK) tsd 0.5 - - µsec

Data hold time (CLK→DATA) thd 0.5 - - µsec

Latch setup time (CLK→LATCH) tsl 0.5 - - µsec

Latch hold time thl 0.5 - - µsec

Latch Low setup time ts 0.5 - - µsec

Latch Low hold time th 0.5 - - µsec

(2) Voltage of control signal (CL, DA, CHIP)

Item Conditions Limit Unit

Min. Typ. Max.

(<Vcc)

High input voltage Vcc=+6.5 to +7.5V

Vee=-6.5 to -7.5V

2.3 - 5.5 V

Low input voltage 0 - 1.0 V

(3) Basic Structure of Control Data

←Input Direction

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Data Select Address

Figure 10. The timing definition of the control signal.

CL

（

CLOCK）

DA

DAT

A

LATCH

thd thd

th

ts tsl thl

tsd

twc

twh

twd twl

tsu

DATA DATA LATCH

90％

90％ 90％ 90％

10％ 10％ 10％

90％

90％ 90％ 90％ 90％

10％ 10％

10％

twc

10/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

(4) Table of Control Data

←Input Direction

Select

Address

No. D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

0 Input Selector (MAIN) REC

ON/OFF 0 0

SUB

ON/OFF 1 0 0

Chip

Select

0 0

1 Input Selector (SUB) 0 0 0 0 0 0 0 0 1

2 Mode Select

FL, FRch Mode Select

C, SWch Mode Select

SL, SRch Mode Select

SBL, SBRch 0 ADC ATT 0 1 0

3 Volume ch annel

Select Volume 0 1 1

7 A→B

switch-time B→A

switch-time Base

clock 0 0

System

reset 0 0 1 1 1

BD3843FS (6ch Selector IC) * 1 0 0

BD3841FS (9ch Selector IC) * 1 0 1

BD3812F (2ch volume IC) * 1 1 *

・Serial control lines can be share d with BD3843FS(6ch selector IC), BD3841FS(9ch selector IC) and

BD3812F(2ch volume IC).

・Initialize all data at every turning on the po wer supply.

(Example)

←Input direction

Address

No.0 L Address

No.1 L Address

No.2 LAddress

No.3

FRch LAddress

No.3

FLch L

Address

No.3

SBRch LAddress

No.3

SBLch L Address

No.7 L

・At the second time after turning on the power supply, eight any data to be changed.

(5) Chip Select Setting Table

CHP terminal condition D2

0 (LOW) 0

1 (HIGH) 1

BD34701KS2 can be operated in combination with another by setting the CHP terminal.

11/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.0 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Input Selector (MAIN)

MUTE 0 0 0 0 0 0

REC

ON/OFF

0 0

SUB

ON/OFF

1 0 0

Chip

Select 0 0

IN1 0 0 0 0 0 1

IN2 0 0 0 0 1 0

IN3 0 0 0 0 1 1

IN4 0 0 0 1 0 0

IN5 0 0 0 1 0 1

IN6 0 0 0 1 1 0

IN7 0 0 0 1 1 1

IN8 0 0 1 0 0 0

IN9 0 0 1 0 0 1

IN10 0 0 1 0 1 0

IN11 0 0 1 0 1 1

IN12 0 0 1 1 0 0

Prohibition

0 0 1 1 0 1

・

1 1 1 1 1 1

REC

ON/OFF

OFF

Input Selector (MAIN)

0

ON 1

SUB

ON/OFF

OFF REC

ON/OFF

0

ON 1

: Initial condition

Select Address No.1 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Input Selector (SUB)

MUTE 0 0 0 0 0 0

0 0 0 0 0 0 0

Chip

Select 0 1

IN1 0 0 0 0 0 1

IN2 0 0 0 0 1 0

IN3 0 0 0 0 1 1

IN4 0 0 0 1 0 0

IN5 0 0 0 1 0 1

IN6 0 0 0 1 1 0

IN7 0 0 0 1 1 1

IN8 0 0 1 0 0 0

IN9 0 0 1 0 0 1

IN10 0 0 1 0 1 0

IN11 0 0 1 0 1 1

IN12 0 0 1 1 0 0

Prohibition

0 0 1 1 0 1

・

1 1 1 1 1 1

: Initial condition

12/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.2 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Mode

Selector

FL, FRch

MUTE 0 0 Mode

Selector

C, SWch Mode

Selector

SL, SRch Mode

Selector

SBL,

SBRch

0

ADC A TT

0 Chip

Select 1 0

MAIN 0 1

MULTI 1 0

SUB 1 1

Mode

elector

C, SWch

MUTE

Mode

Selector

FL, FRch

0 0

MAIN 0 1

MULTI 1 0

SUB 1 1

Mode

elector

SL, SRch

MUTE

Mode

Selector

C, SWch

0 0

MAIN 0 1

MULTI 1 0

SUB 1 1

Mode

Selector

SBL, SBRch

MUTE

Mode

Selector

SL, SRch

0 0

MULTI 0 1

SUB 1 0

MAIN 1 1

ADC A TT

MUTE

Mode

Selector

SBL,

SBRch

0 0 0

0dB 0 0 1

-6dB 0 1 0

-6.5dB 0 1 1

-7.5dB 1 0 0

-9dB 1 0 1

-12dB 1 1 0

Prohibition 1 1 1

: Initial condition

13/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.3 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Volume channel Select

FR 0 0 0

Volume

0 Chip

Select 1 1

FL 0 0 1

SW 0 1 0

C 0 1 1

SR 1 0 0

SL 1 0 1

SBR 1 1 0

SBL 1 1 1

Volume

MUTE

Volume

Channel

Select 1

1 1 1 1 1 1 1 1

Prohibition

1 1 1 1 1 1 1 0

.

. .

.

0 1 0 0 0 0 0 1

+32.0dB 0 1 0 0 0 0 0 0

+31.5dB 0 0 1 1 1 1 1 1

+31.0dB 0 0 1 1 1 1 1 0

+30.5dB 0 0 1 1 1 1 0 1

+30.0dB 0 0 1 1 1 1 0 0

+29.5dB 0 0 1 1 1 0 1 1

+29.0dB 0 0 1 1 1 0 1 0

+28.5dB 0 0 1 1 1 0 0 1

+28.0dB 0 0 1 1 1 0 0 0

+27.5dB 0 0 1 1 0 1 1 1

+27.0dB 0 0 1 1 0 1 1 0

+26.5dB 0 0 1 1 0 1 0 1

+26.0dB 0 0 1 1 0 1 0 0

+25.5dB 0 0 1 1 0 0 1 1

+25.0dB 0 0 1 1 0 0 1 0

+24.5dB 0 0 1 1 0 0 0 1

+24.0dB 0 0 1 1 0 0 0 0

+23.5dB 0 0 1 0 1 1 1 1

+23.0dB 0 0 1 0 1 1 1 0

+22.5dB 0 0 1 0 1 1 0 1

+22.0dB 0 0 1 0 1 1 0 0

+21.5dB 0 0 1 0 1 0 1 1

+21.0dB 0 0 1 0 1 0 1 0

+20.5dB 0 0 1 0 1 0 0 1

+20.0dB 0 0 1 0 1 0 0 0

+19.5dB 0 0 1 0 0 1 1 1

+19.0dB 0 0 1 0 0 1 1 0

+18.5dB 0 0 1 0 0 1 0 1

+18.0dB 0 0 1 0 0 1 0 0

+17.5dB 0 0 1 0 0 0 1 1

+17.0dB 0 0 1 0 0 0 1 0

+16.5dB 0 0 1 0 0 0 0 1

+16.0dB 0 0 1 0 0 0 0 0

+15.5dB 0 0 0 1 1 1 1 1

: Initial condition

14/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.3 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Volume

+15.0dB

Volume

Channel

Select

1

0 0 0 1 1 1 1 0

0 Chip

Select 1 1

+14.5dB 0 0 0 1 1 1 0 1

+14.0dB 0 0 0 1 1 1 0 0

+13.5dB 0 0 0 1 1 0 1 1

+13.0dB 0 0 0 1 1 0 1 0

+12.5dB 0 0 0 1 1 0 0 1

+12.0dB 0 0 0 1 1 0 0 0

+11.5dB 0 0 0 1 0 1 1 1

+11.0dB 0 0 0 1 0 1 1 0

+10.5dB 0 0 0 1 0 1 0 1

+10.0dB 0 0 0 1 0 1 0 0

+9.5dB 0 0 0 1 0 0 1 1

+9.0dB 0 0 0 1 0 0 1 0

+8.5dB 0 0 0 1 0 0 0 1

+8.0dB 0 0 0 1 0 0 0 0

+7.5dB 0 0 0 0 1 1 1 1

+7.0dB 0 0 0 0 1 1 1 0

+6.5dB 0 0 0 0 1 1 0 1

+6.0dB 0 0 0 0 1 1 0 0

+5.5dB 0 0 0 0 1 0 1 1

+5.0dB 0 0 0 0 1 0 1 0

+4.5dB 0 0 0 0 1 0 0 1

+4.0dB 0 0 0 0 1 0 0 0

+3.5dB 0 0 0 0 0 1 1 1

+3.0dB 0 0 0 0 0 1 1 0

+2.5dB 0 0 0 0 0 1 0 1

+2.0dB 0 0 0 0 0 1 0 0

+1.5dB 0 0 0 0 0 0 1 1

+1.0dB 0 0 0 0 0 0 1 0

+0.5dB 0 0 0 0 0 0 0 1

Prohibition 0 0 0 0 0 0 0 0

-0dB

0

0 0 0 0 0 0 0 0

-0.5dB 0 0 0 0 0 0 0 1

-1.0dB 0 0 0 0 0 0 1 0

-1.5dB 0 0 0 0 0 0 1 1

-2.0dB 0 0 0 0 0 1 0 0

-2.5dB 0 0 0 0 0 1 0 1

-3.0dB 0 0 0 0 0 1 1 0

-3.5dB 0 0 0 0 0 1 1 1

-4.0dB 0 0 0 0 1 0 0 0

-4.5dB 0 0 0 0 1 0 0 1

-5.0dB 0 0 0 0 1 0 1 0

-5.5dB 0 0 0 0 1 0 1 1

-6.0dB 0 0 0 0 1 1 0 0

-6.5dB 0 0 0 0 1 1 0 1

-7.0dB 0 0 0 0 1 1 1 0

-7.5dB 0 0 0 0 1 1 1 1

15/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.3 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Volume

-8.0dB

Volume

Channel

Select 0

0 0 0 1 0 0 0 0

0 Chip

Select 1 1

-8.5dB 0 0 0 1 0 0 0 1

-9.0dB 0 0 0 1 0 0 1 0

-9.5dB 0 0 0 1 0 0 1 1

-10.0dB 0 0 0 1 0 1 0 0

-10.5dB 0 0 0 1 0 1 0 1

-11.0dB 0 0 0 1 0 1 1 0

-11.5dB 0 0 0 1 0 1 1 1

-12.0dB 0 0 0 1 1 0 0 0

-12.5dB 0 0 0 1 1 0 0 1

-13.0dB 0 0 0 1 1 0 1 0

-13.5dB 0 0 0 1 1 0 1 1

-14.0dB 0 0 0 1 1 1 0 0

-14.5dB 0 0 0 1 1 1 0 1

-15.0dB 0 0 0 1 1 1 1 0

-15.5dB 0 0 0 1 1 1 1 1

-16.0dB 0 0 1 0 0 0 0 0

-16.5dB 0 0 1 0 0 0 0 1

-17.0dB 0 0 1 0 0 0 1 0

-17.5dB 0 0 1 0 0 0 1 1

-18.0dB 0 0 1 0 0 1 0 0

-18.5dB 0 0 1 0 0 1 0 1

-19.0dB 0 0 1 0 0 1 1 0

-19.5dB 0 0 1 0 0 1 1 1

-20.0dB 0 0 1 0 1 0 0 0

-20.5dB 0 0 1 0 1 0 0 1

-21.0dB 0 0 1 0 1 0 1 0

-21.5dB 0 0 1 0 1 0 1 1

-22.0dB 0 0 1 0 1 1 0 0

-22.5dB 0 0 1 0 1 1 0 1

-23.0dB 0 0 1 0 1 1 1 0

-23.5dB 0 0 1 0 1 1 1 1

-24.0dB 0 0 1 1 0 0 0 0

-24.5dB 0 0 1 1 0 0 0 1

-25.0dB 0 0 1 1 0 0 1 0

-25.5dB 0 0 1 1 0 0 1 1

-26.0dB 0 0 1 1 0 1 0 0

-26.5dB 0 0 1 1 0 1 0 1

-27.0dB 0 0 1 1 0 1 1 0

-27.5dB 0 0 1 1 0 1 1 1

-28.0dB 0 0 1 1 1 0 0 0

-28.5dB 0 0 1 1 1 0 0 1

-29.0dB 0 0 1 1 1 0 1 0

-29.5dB 0 0 1 1 1 0 1 1

-30.0dB 0 0 1 1 1 1 0 0

-30.5dB 0 0 1 1 1 1 0 1

-31.0dB 0 0 1 1 1 1 1 0

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.3 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Volume

-31.5dB

Volume

Channel

Select 0

0 0 1 1 1 1 1 1

0 Chip

Select 1 1

-32.0dB 0 1 0 0 0 0 0 0

-32.5dB 0 1 0 0 0 0 0 1

-33.0dB 0 1 0 0 0 0 1 0

-33.5dB 0 1 0 0 0 0 1 1

-34.0dB 0 1 0 0 0 1 0 0

-34.5dB 0 1 0 0 0 1 0 1

-35.0dB 0 1 0 0 0 1 1 0

-35.5dB 0 1 0 0 0 1 1 1

-36.0dB 0 1 0 0 1 0 0 0

-36.5dB 0 1 0 0 1 0 0 1

-37.0dB 0 1 0 0 1 0 1 0

-37.5dB 0 1 0 0 1 0 1 1

-38.0dB 0 1 0 0 1 1 0 0

-38.5dB 0 1 0 0 1 1 0 1

-39.0dB 0 1 0 0 1 1 1 0

-39.5dB 0 1 0 0 1 1 1 1

-40.0dB 0 1 0 1 0 0 0 0

-40.5dB 0 1 0 1 0 0 0 1

-41.0dB 0 1 0 1 0 0 1 0

-41.5dB 0 1 0 1 0 0 1 1

-42.0dB 0 1 0 1 0 1 0 0

-42.5dB 0 1 0 1 0 1 0 1

-43.0dB 0 1 0 1 0 1 1 0

-43.5dB 0 1 0 1 0 1 1 1

-44.0dB 0 1 0 1 1 0 0 0

-44.5dB 0 1 0 1 1 0 0 1

-45.0dB 0 1 0 1 1 0 1 0

-45.5dB 0 1 0 1 1 0 1 1

-46.0dB 0 1 0 1 1 1 0 0

-46.5dB 0 1 0 1 1 1 0 1

-47.0dB 0 1 0 1 1 1 1 0

-47.5dB 0 1 0 1 1 1 1 1

-48.0dB 0 1 1 0 0 0 0 0

-48.5dB 0 1 1 0 0 0 0 1

-49.0dB 0 1 1 0 0 0 1 0

-49.5dB 0 1 1 0 0 0 1 1

-50.0dB 0 1 1 0 0 1 0 0

-50.5dB 0 1 1 0 0 1 0 1

-51.0dB 0 1 1 0 0 1 1 0

-51.5dB 0 1 1 0 0 1 1 1

-52.0dB 0 1 1 0 1 0 0 0

-52.5dB 0 1 1 0 1 0 0 1

-53.0dB 0 1 1 0 1 0 1 0

-53.5dB 0 1 1 0 1 0 1 1

-54.0dB 0 1 1 0 1 1 0 0

-54.5dB 0 1 1 0 1 1 0 1

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.3 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Volume

-55.0dB

Volume

Channel

Select 0

0 1 1 0 1 1 1 0

0 Chip

Select 1 1

-55.5dB 0 1 1 0 1 1 1 1

-56.0dB 0 1 1 1 0 0 0 0

-56.5dB 0 1 1 1 0 0 0 1

-57.0dB 0 1 1 1 0 0 1 0

-57.5dB 0 1 1 1 0 0 1 1

-58.0dB 0 1 1 1 0 1 0 0

-58.5dB 0 1 1 1 0 1 0 1

-59.0dB 0 1 1 1 0 1 1 0

-59.5dB 0 1 1 1 0 1 1 1

-60.0dB 0 1 1 1 1 0 0 0

-60.5dB 0 1 1 1 1 0 0 1

-61.0dB 0 1 1 1 1 0 1 0

-61.5dB 0 1 1 1 1 0 1 1

-62.0dB 0 1 1 1 1 1 0 0

-62.5dB 0 1 1 1 1 1 0 1

-63.0dB 0 1 1 1 1 1 1 0

-63.5dB 0 1 1 1 1 1 1 1

-64.0dB 1 0 0 0 0 0 0 0

-64.5dB 1 0 0 0 0 0 0 1

-65.0dB 1 0 0 0 0 0 1 0

-65.5dB 1 0 0 0 0 0 1 1

-66.0dB 1 0 0 0 0 1 0 0

-66.5dB 1 0 0 0 0 1 0 1

-67.0dB 1 0 0 0 0 1 1 0

-67.5dB 1 0 0 0 0 1 1 1

-68.0dB 1 0 0 0 1 0 0 0

-68.5dB 1 0 0 0 1 0 0 1

-69.0dB 1 0 0 0 1 0 1 0

-69.5dB 1 0 0 0 1 0 1 1

-70.0dB 1 0 0 0 1 1 0 0

-70.5dB 1 0 0 0 1 1 0 1

-71.0dB 1 0 0 0 1 1 1 0

-71.5dB 1 0 0 0 1 1 1 1

-72.0dB 1 0 0 1 0 0 0 0

-72.5dB 1 0 0 1 0 0 0 1

-73.0dB 1 0 0 1 0 0 1 0

-73.5dB 1 0 0 1 0 0 1 1

-74.0dB 1 0 0 1 0 1 0 0

-74.5dB 1 0 0 1 0 1 0 1

-75.0dB 1 0 0 1 0 1 1 0

-75.5dB 1 0 0 1 0 1 1 1

-76.0dB 1 0 0 1 1 0 0 0

-76.5dB 1 0 0 1 1 0 0 1

-77.0dB 1 0 0 1 1 0 1 0

-77.5dB 1 0 0 1 1 0 1 1

-78.0dB 1 0 0 1 1 1 0 0

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.3 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Volume

-78.5dB

Volume

Channel

Select 0

1 0 0 1 1 1 0 1

0 Chip

Select 1 1

-79.0dB 1 0 0 1 1 1 1 0

-79.5dB 1 0 0 1 1 1 1 1

-80.0dB 1 0 1 0 0 0 0 0

-80.5dB 1 0 1 0 0 0 0 1

-81.0dB 1 0 1 0 0 0 1 0

-81.5dB 1 0 1 0 0 0 1 1

-82.0dB 1 0 1 0 0 1 0 0

-82.5dB 1 0 1 0 0 1 0 1

-83.0dB 1 0 1 0 0 1 1 0

-83.5dB 1 0 1 0 0 1 1 1

-84.0dB 1 0 1 0 1 0 0 0

-84.5dB 1 0 1 0 1 0 0 1

-85.0dB 1 0 1 0 1 0 1 0

-85.5dB 1 0 1 0 1 0 1 1

-86.0dB 1 0 1 0 1 1 0 0

-86.5dB 1 0 1 0 1 1 0 1

-87.0dB 1 0 1 0 1 1 1 0

-87.5dB 1 0 1 0 1 1 1 1

-88.0dB 1 0 1 1 0 0 0 0

-88.5dB 1 0 1 1 0 0 0 1

-89.0dB 1 0 1 1 0 0 1 0

-89.5dB 1 0 1 1 0 0 1 1

-90.0dB 1 0 1 1 0 1 0 0

-90.5dB 1 0 1 1 0 1 0 1

-91.0dB 1 0 1 1 0 1 1 0

-91.5dB 1 0 1 1 0 1 1 1

-92.0dB 1 0 1 1 1 0 0 0

-92.5dB 1 0 1 1 1 0 0 1

-93.0dB 1 0 1 1 1 0 1 0

-93.5dB 1 0 1 1 1 0 1 1

-94.0dB 1 0 1 1 1 1 0 0

-94.5dB 1 0 1 1 1 1 0 1

-95.0dB 1 0 1 1 1 1 1 0

Prohibition

1 0 1 1 1 1 1 1

.

. .

.

1 1 1 1 1 1 1 1

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Select Address No.7 Setting Table

Function & Setting D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

A→B

switching-time

11msec 0 0 0

B→A

switching-time

Base

clock

0 0

System

Reset

0 0 1

Chip

Select 1 1

5msec 0 0 1

7msec 0 1 0

14msec 0 1 1

3msec 1 0 0

2msec 1 0 1

Prohibition 1 1 0

1 1 1

B→A

switching-time

11msec

A→B

switching-time

0 0 0

5msec 0 0 1

7msec 0 1 0

14msec 0 1 1

3msec 1 0 0

2msec 1 0 1

Prohibition 1 1 0

1 1 1

Base

clock

x1

B→A

switching-time

0

×1/2 1

System

Reset

Normal Base

clock

0

Reset 1

: Initial condition

20/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Volume changing needs the time that is following Figure. (Ex. It selected 11msec, 22msec need.)

Figure 11. About [A→B switching-time] [B→A switching-time]

Base clock is able to change Internal Oscillator Frequency. For example, when Base clock select ×1/2,

A->B and B->A switching time is to be two times. (ex. 11msec->22msec)

○Caution on send data

When send the same channel data among the switc hin g process, internal operation is as below.

Figure 12. The switching process with send data

②data is sent during A -> B switchin g time, it is valid.

③data and ④data are sent during B -> A switching time, it is valid at the next processing time.

But ③data is replaced b y ④data.

○About pop noise in gain changing

The level of the pop noise so metimes varies in the difference in output DC offset of the inside condition A and B.

Prossing Time

[A->B switching ti me] [B->A switching time]

Current XdB

Send YdB Changed YdB

CLK

DATA

IC processing

Ou tput Initi al → ① → ② ② → ④

④ ③ ② ①

Invalid data

Initial

Processing time per 1 Processing time per 1

A->B switching time B->A swit ching time A- >B switch ing t ime B->A switch ing tim e

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Logic

FR

Volume FL

Volume SW

Volume C

Volume SR

Volume SL

Volume SBR

Volume SBL

Volume

Mode

selector

Rec

ADC

26

25

24

23

22

21

123456789

10 11 12 13

20

19

18

17

16

15

14

GSMGSMGSM GSM

30 29 28 2734 33 32 3138 37 36 3539

GSMGSMGSMGSMGSMGSMGSMGSMGSMGSMGSMGSM

40

41

42

43

44

45

46

47

48

49

50

51

52

GSM GSM GSM GSM GSM GSM GSM GSM

Main

OUTSBR OUTSBL

OUTSR OUTSL

OUTSW OUTC

CLDGND DA

47µ 0.1µ VEE

47µ 0.1µOUTFR OUTFL

SUBR

SUBL

RECR

RECL

GND

INL8

INR8

INL7

INR7

GND

INL6INR6INL5INR5

INL4

INR4INL3

INR3

INL2

INR2

INL1

INR1

GND

SBLIN

SBRIN

SLIN

SRIN

CIN

SWIN

FLIN

FRIN

GND

ADCR

ADCL

CHP

VCC

Mode

selector

Mode

selector

Mode

selector

Sub

MULTI

INPUT

STEREO

INPUT

INR9

INL12

INR12

INL11

INR11

INL10

INR10

INL9

Application Circuit Diagram

Figure 13. Application Circuit Diagr am

Notes on wiring

① GND shall be wired from reference point and thicken.

② Wiring pattern of CL and DA shall be away from that of analog unit and cross-talk shall not be acceptable.

③ Lines of CL and DA of shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other.

④ Please pay attention the wiring pattern of the input terminal of the input selector to the cross talk. Recommend that

wiring period is shielded.

⑤ Please connect the decoupling capacitor of a power supply in the shortest distance as much as possible to VCC and

GND, VEE.

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Power Dissipation

About the thermal design by the IC

Characteristics of an IC have a great de al to do with the temperature at which it is used, and exceeding absolute maximum

ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two

standpoints of immediate damage and long-term reliability of operation.

Figure 14. Temperature Derating Curve

Note) Value are actual measur ements and are not guaranteed.

Power dissipation values vary according to the board on which the IC is mounted.

Reference data

SQFP-T52

2.0

1.0

0.0

0 25 50 75 100 125

150

Ambient Temperature Ta(°C)

Power Dissipation Pd(W)

1.30W

θja = 76.9°C/W

85

Measurement condition: ROHM Standard board

board Size：70×70×1.6(㎣)

material：A FR4 grass epoxy board

(3% or less of copper foil area)

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

I/O equivalence circuit(s)

Terminal

Number Terminal

Name Terminal

Voltage (V) Equivalent Circuit Description of terminal

16

17

20

21

39

48

51

AGND 0

Analog ground terminals.

1

5 VCC

VEE +7

-7

Positive power supply terminal and

2 DGND 0

Digital ground terminal.

3

4

52

DA

CL

CHP -

Input terminals for a clock and data.

6

7

8

9

10

11

12

13

49

50

OUTFR

OUTFL

OUTSW

OUTC

OUTSR

OUTSL

OUTSBR

OUTSBL

ADCR

ADCL

0

Output terminal s for analog sound signal.

14

15

18

19

SUBL

SUBR

RECL

RECR

0

Output terminal s for analog sound signal.

(SUB/REC)

Vee

Vcc

Vee

Vcc

Vee

47k

Vcc

Vee

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Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Terminal

Number Terminal

Name Terminal

Voltage (V) Equivalent Circuit Description of terminal

22

23

24

25

27

28

29

30

31

32

33

34

35

36

37

38

INL8

INR8

INL7

INR7

INL6

INR6

INL5

INR5

INL4

INR4

INL3

INR3

INL2

INR2

INL1

INR1

0

Input terminals for stereo sound signal.

Input impedance is 47kΩ(Typ.).

40

41

42

43

44

45

46

47

SBLIN

SBRIN

SLIN

SRIN

CIN

SWIN

FLIN

FRIN

0

Input terminals for an analog multi sound

signal.

Input impedance is 47kΩ(Typ.).

Vcc

Vee

47k

Vcc

Vee

47k

25/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground an d supply lines of the digital bloc k from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Vee Voltage

Ensure that no pins are at a voltage below that of the VEE pin at any time, even during transient condition.

4. Ground Wiring Pattern

GND pins which are digital ground(2pin) and analog ground(16,17,20,21,26,39,48,51pin) are not connected inside

LSI. These ground pins traces should be ro uted separately but conn ected to a single ground at the reference p oint of

the application board. Also ensure that the ground traces of external components do not cause variations on the

ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute ma ximum rating of the Pd stated in this specific ation is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the cond itions of each parameter.

7. Rush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, widt h of ground wiring, and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to IC pin may subject the IC to stress.

Always discharge capacitors completely after each process or step. The IC’s po wer supply should al ways be turned

off completely before connecting or removing it from the test setup during the inspection process. To prevent damage

from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mountin g may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder br idge deposited in between pins during assembl y to nam e a few.

11. Unused Input Terminals

Because the input impedance of the terminal becomes 47kΩ when the signal input terminal makes a terminal open,

the plunge noise from outside sometimes becomes a problem. Please connect the no using input pin to GND. And

please open the no using output pin.

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Datasheet

BD34701KS2

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TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Operational Notes – continued 1

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When Vee > Pin A and Vee > Pin B, the P-N junction operates as a parasitic diod e.

When Vee > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operation al faults, or physical damage. Therefore, con ditions that cause these diodes to

operate, such as appl ying a v oltage lower than the Vee voltage to an input pin (an d thus to the P substrate) should be

avoided.

Figure 15. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nomi nal capacitance due to DC bias and others.

14. About power ON/OFF

1. At po wer ON/OFF, a shock sound will be generated and, therefore, use MUT E on the set.

2. When turning on po wer suppli es, Vee and Vcc sho ul d be po wered on simultaneousl y or Vee first; then followed

by Vcc. If the Vcc side is started up first, an excessive current may pass Vcc through Vee.

15. About function switching

When switching Input Selector, Mode selector or Input Gain, use MUTE on Volume.

16. Volume gain switching

In case of the boost of the volume when changing to the high gain which exceeds +20dB especially, the switching

shock noise sometimes beco mes big. In this case, we recommend ch anging ev ery 1 dB step without changing a gain

at once. Also, the shock n oise sometimes can reduce by making micro-step volume switching time long, too.

NN

P+PN N

P

+

P Substrate

Vee

NP+N N

P+

NP

P Substrate

Vee Vee

Parasitic

Elements

Pin A

Pin B Pin B

BC

EParasitic

Elements

Vee

Parasitic

Elements

CB

E

Transisto

r

( NPN) Resisto

r

N Region

close - by

Parasitic

Elements

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Datasheet

BD34701KS2

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TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Operational Notes – continued 2

17. Output load characteristic

The usages of load for output are below (reference). Please use the load more than 10 kΩ(TYP).

Output terminal

Terminal

No. Terminal

Name Terminal

No. Terminal

Name Terminal

No. Terminal

Name Terminal

No. Terminal

Name

6 OUTFR 10 OUTSR 14 SUBL 49 ADCR

7 OUTFL 11 OUTSL 15 SUBR 50 ADCL

8 OUTSW 12 OUTSBR 18 RECL - -

9 OUTC 13 OUTSBL 19 RECR - -

Figure 16. Output load characteristic at Vcc=+7V, Vee=-7V(Reference)

Ordering Information

B D 3 4 7 0 1 K S 2 -

Part Number Package

KS2: SQFP-T52 Packaging and forming specific ation

none: Tray

E2: Embossed tape and reel

Marking Diagram(T OP VIEW)

SQFP-T52 (TOP VIEW) Part Number M arking

LOT Number

1PIN MARK

BD34701KS2

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

100 1000 10000 100000

Load Resistance Ω

VO,max

Vrms

Vcc=+7V

Vee=-7V

THD+n=1%

BW=400～30kHz

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Datasheet

BD34701KS2

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TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Physical Dimension, Tape and Reel Information

Package Name SQFP-T52

∗ Order quantity needs to be multiple of the minimum quantity.

Tray (with dry pack)Container

Quantity

Direction of feed 1000pcs

Direction of product is fixed in a tray

1pin

29/29

Datasheet

BD34701KS2

www.rohm.com

TSZ22111・15・001 TSZ02201-0C2C0E100080-1-2

17.Sep.2013 Rev.002

Revision History

Date Revision Changes

02.Sep.2013 001 New Release

17.Sep.2003 002 P27. Delete “M” of “SQFP-T 52M” in Marking Diagram.

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Datasheet

Part Number bd34701ks2

Package SQFP-T52

Unit Quantity 1000

Minimum Package Quantity 1000

Packing Type Tray

Constitution Materials List inquiry

RoHS Yes

bd34701ks2 - Web Page

Distribution Inventory

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