WEDPS512K32-XBX 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20, ns TTL Compatible Inputs and Outputs Packaging 5V Power Supply Low Power CMOS * 16mm x 18mm, 143 PBGA Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8 This product is subject to change without notice. Commercial, Industrial and Military Temperature Ranges PIN CONFIGURATION FOR WEDPS512K32-XBX TOP VIEW 1 2 3 4 5 6 7 8 9 10 11 12 A - A2 A1 A0 GND GND VCC VCC A18 A17 A16 GND B CS#2 A3 A4 D14 D15 NC CS#4 D24 D25 OE# A15 NC C D9 D8 NC D12 D13 GND VCC D26 D27 WE#4 D31 D30 D D10 D11 GND GND GND GND VCC VCC VCC VCC D28 D29 E WE#2 GND GND GND GND GND VCC VCC VCC VCC VCC NC F GND GND GND GND GND GND VCC VCC VCC VCC VCC VCC G VCC VCC VCC VCC VCC VCC GND GND GND GND GND GND H CS#1 VCC VCC VCC VCC VCC GND GND GND GND GND NC J D1 D0 VCC VCC VCC VCC GND GND GND GND D23 D22 K D2 D3 NC D7 D5 VCC GND D17 D16 CS#3 D20 D21 L WE#1 A6 A5 D6 D4 NC WE#3 D19 D18 A14 A13 NC M GND A7 A8 A9 VCC VCC GND GND A10 A11 A12 VCC BLOCK DIAGRAM W E # 1 CS#1 W E # 2 CS#2 W E # 3 CS#3 PIN DESCRIPTION I/O0-31 A0-18 WE#1-4 CS#1-4 OE# VCC GND NC W E # 4 CS#4 OE# A0-18 512K x 8 8 I/O0-7 512K x 8 8 I/O8-15 512K x 8 8 I/O16-23 512K x 8 8 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected I/O24-31 Microsemi Corporation reserves the right to change products or specifications without notice. May 2011 Rev. 7 (c) 2011 Microsemi Corporation. All rights reserved. 1 Microsemi Corporation * (602) 437-1520 * www.whiteedc.com www.microsemi.com WEDPS512K32-XBX ABSOLUTE MAXIMUM RATINGS Parameter TRUTH TABLE Symbol Min Max Unit CS OE WE Mode Data I/O Power TA -55 +125 C H X X Standby High Z Standby Operating Temperature Storage Temperature Signal Voltage Relative to GND TSTG -65 +150 C L L H Read Data Out Active VG -0.5 VCC+0.5 V L H H Out Disable High Z Active 150 C L X L Write Data In Active 7.0 V Junction Temperature TJ Supply Voltage VCC -0.5 RECOMMENDED OPERATING CONDITIONS Parameter BGA THERMAL RESISTANCE Symbol Min Max Unit Description Symbol Max Unit Notes Supply Voltage VCC 4.5 5.5 V Junction to Ambient (No Airflow) Theta JA 16.5 C/W 1 Input High Voltage VIH 2.2 VCC + 0.3 V Junction to Ball Theta JB 11.3 C/W 1 Input Low Voltage VIL -0.5 +0.8 V Junction to Case (Top) Theta JC 9.8 C/W 1 Operating Temp (Mil) TA -55 +125 C CAPACITANCE (TA = +25C) Parameter Symbol Conditions Max Unit OE# capacitance COE VIN = 0 V, f = 1.0 MHz 30 pF WE#1-4 capacitance CWE VIN = 0 V, f = 1.0 MHz 10 pF CS#1-4 capacitance CCS VIN = 0 V, f = 1.0 MHz 10 pF Data I/O capacitance CI/O VI/O = 0 V, f = 1.0 MHz 10 pF Address input capacitance CAD VIN = 0 V, f = 1.0 MHz 30 pF This parameter is guaranteed by design but not tested. DC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55C to +125C) Parameter Symbol Conditions Max Units Input Leakage Current ILI VCC = 5.5, VIN = GND to VCC 10 A Output Leakage Current ILO CS# = VIH, OE# = VIH, VOUT = GND to VCC 10 A ICC x 32 CS# = VIL, OE# = VIH, f = 5MHz, Vcc = 5.5 660 mA Standby Current ISB CS# = VIH, OE# = VIH, f = 5MHz, Vcc = 5.5 80 mA Output Low Voltage VOL IOL = 8mA 0.4 Output High Voltage VOH IOH = -4.0mA Operating Supply Current x 32 Mode Min 2.4 V V NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V Microsemi Corporation reserves the right to change products or specifications without notice. May 2011 Rev. 7 (c) 2011 Microsemi Corporation. All rights reserved. 2 Microsemi Corporation * (602) 437-1520 * www.whiteedc.com www.microsemi.com WEDPS512K32-XBX AC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55C to +125C) Parameter Symbol Read Cycle Read Cycle Time tRC Address Access Time tAA Output Hold from Address Change tOH Chip Select Access Time tACS -12 Min -15 Max Min 12 -17 Max 15 Min Min 17 12 0 20 ns 20 ns 10 ns 0 15 Units ns 17 0 12 Max 20 15 0 -20 Max ns 17 Output Enable to Output Valid tOE Chip Select to Output in Low Z tCLZ1 1 2 2 2 Output Enable to Output in Low Z tOLZ1 0 0 0 0 Chip Disable to Output in High Z tCHZ1 7 12 12 12 ns Output Disable to Output in High Z tOHZ1 7 12 12 12 ns 7 8 9 ns ns 1. This parameter is guaranteed by design but not tested. AC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55C to +125C) Parameter Symbol Read Cycle -12 Min -15 Max Min -17 Max Min -20 Max Min Max Units Write Cycle Time tWC 12 15 17 20 ns Chip Select to End of Write tCW 10 13 15 15 ns Address Valid to End of Write tAW 10 13 15 15 ns Data Valid to End of Write tDW 8 10 11 12 ns Write Pulse Width tWP 10 13 15 15 ns Address Setup Time tAS 0 2 2 2 ns Address Hold Time tAH 0 0 0 0 ns Output Active from End of Write tOW1 2 2 2 3 Write Enable to Output in High Z tWHZ1 Data Hold Time tDH 7 8 0 0 9 ns 11 0 ns 0 1. This parameter is guaranteed by design but not tested. AC TEST CIRCUIT AC TEST CONDITIONS IOL Current Source Typ Input Pulse Levels VIL = 0, VIH = 3.0 Unit V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V NOTES: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 . VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. VZ 1.5V (Bipolar Supply) D.U.T. Ceff = 50 pf Parameter IOH Current Source Microsemi Corporation reserves the right to change products or specifications without notice. May 2011 Rev. 7 (c) 2011 Microsemi Corporation. All rights reserved. 3 Microsemi Corporation * (602) 437-1520 * www.whiteedc.com www.microsemi.com WEDPS512K32-XBX TIMING WAVEFORM - READ CYCLE tRC ADDRESS tAA tRC CS# ADDRESS tAA tACS tCHZ tCLZ tOH OE# DATA I/O PREVIOUS DATA VALID tOE DATA VALID READ CYCLE 1 (CS# = OE# = VIL, WE# = VIH) DATA I/O tOHZ tOLZ HIGH IMPEDANCE DATA VALID READ CYCLE 2 (WE# = VIH) WRITE CYCLE - WE# CONTROLLED tWC ADDRESS tAW tAH tCW CS# tAS tWP WE# tOW tDW tWHZ tDH DATA VALID DATA I/O WRITE CYCLE 1, WE# CONTROLLED WRITE CYCLE - CS# CONTROLLED tWC ADDRESS tAS tAW tAH tCW CS# tWP WE# tDW DATA I/O tDH DATA VALID WRITE CYCLE 2, CS# CONTROLLED Microsemi Corporation reserves the right to change products or specifications without notice. May 2011 Rev. 7 (c) 2011 Microsemi Corporation. All rights reserved. 4 Microsemi Corporation * (602) 437-1520 * www.whiteedc.com www.microsemi.com WEDPS512K32-XBX PACKAGE 7043 - 143 BALL GRID ARRAY BOTTOM VIEW 12 11 10 9 8 7 6 5 4 3 2 1 A 16.25 (0.640) MAX B C D 13.97 (0.550) NOM 1.27 (0.050) NOM E F G H J K L M 1.27 (0.050) NOM 0.61 (0.024) NOM 13.97 (0.550) NOM 1.93 (0.076) MAX 18.25 (0.719) MAX ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Microsemi Corporation reserves the right to change products or specifications without notice. May 2011 Rev. 7 (c) 2011 Microsemi Corporation. All rights reserved. 5 Microsemi Corporation * (602) 437-1520 * www.whiteedc.com www.microsemi.com WEDPS512K32-XBX ORDERING INFORMATION WED P S 512K 32 - XX X X MICROSEMI CORPORATION PLASTIC SRAM ORGANIZATION, 512Kx32 User configurable as 1Mx16 or 2Mx8 ACCESS TIME (ns) PACKAGE TYPE: B = 143 PBGA, 16mm x 18mm, 288mm2 DEVICE GRADE: M = Military Screened I = Industrial C = Commercial -55C to +125C -40C to 85C 0C to +70C Microsemi Corporation reserves the right to change products or specifications without notice. May 2011 Rev. 7 (c) 2011 Microsemi Corporation. All rights reserved. 6 Microsemi Corporation * (602) 437-1520 * www.whiteedc.com www.microsemi.com WEDPS512K32-XBX Document Title 512K x 32 SRAM Multi-Chip Package Revision History Rev # History Release Date Status Rev 0 Initial Release March 2002 Advanced Rev 1 1.1 Switch Rows and Columns header position (Pg. 1) March 2002 Advanced Rev 2 2.1 Switch Rows and Columns header position (Pg. 1) May 2002 Advanced Rev 3 3.1 Change mechanical outline to more accurate design (Pg. 1, 5) May 2002 Advanced Rev 4 4.1 Remove references to 25-55ns speed grades (Pg. 1, 2, 3) August 2002 Advanced Rev 5 Changes (Pg. 1, 2) January 2003 Final November 2003 Final May 2011 Final 5.1 Add Thermal Resistance Table 5.2 Change product status to Final Rev 6 Changes (Pg. 1, 5, 7) 6.1 Change package body height to 1.93mm Max 6.2 Add ball pitch (1.27mm) to package dimension Rev 7 Changes (Pg. 1-7) 7.1 Change document layout from White Electronic Designs to Microsemi Microsemi Corporation reserves the right to change products or specifications without notice. May 2011 Rev. 7 (c) 2011 Microsemi Corporation. All rights reserved. 7 Microsemi Corporation * (602) 437-1520 * www.whiteedc.com www.microsemi.com