PCF8576C Universal LCD driver for low multiplex rates Rev. 13 -- 16 December 2013 Product data sheet 1. General description The PCF8576C is a peripheral device which interfaces to almost any Liquid Crystal Display (LCD)1 with low multiplex rates. It generates the drive signals for any static or multiplexed LCD containing up to four backplanes and up to 40 segments and can easily be cascaded for larger LCD applications. The PCF8576C is compatible with most microcontrollers and communicates via the two-line bidirectional I2C-bus. Communication overheads are minimized by a display RAM with auto-incremented addressing and by hardware subaddressing. For a selection of NXP LCD segment drivers, see Table 24 on page 52. 2. Features and benefits Single-chip LCD controller and driver 40 segment drives: Up to twenty 7-segment alphanumeric characters Up to ten 14-segment alphanumeric characters Any graphics of up to 160 elements Versatile blinking modes No external components required (even in multiple device applications) Selectable backplane drive configuration: static, 2, 3, or 4 backplane multiplexing Selectable display bias configuration: static, 12, or 13 Internal LCD bias generation with voltage-follower buffers 40 4-bit RAM for display data storage Auto-incremented display data loading across device subaddress boundaries Display memory bank switching in static and duplex drive modes Wide logic LCD supply range: From 2 V for low-threshold LCDs Up to 6 V for high-threshold twisted nematic LCDs Low power consumption May be cascaded for large LCD applications (up to 2560 elements possible) No external components required Separate or combined LCD and logic supplies Optimized pinning for plane wiring in both single and multiple PCF8576C applications Power-saving mode for extremely low power consumption in battery-operated and telephone applications 1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20. PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 3. Ordering information Table 1. Ordering information Type number Package Name Description Version PCF8576CHL/1 LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2 PCF8576CT/1 VSO56 plastic very small outline package, 56 leads SOT190-1 PCF8576CU/2/F2 bare die bare die; 56 bumps; 3.2 2.92 0.40 mm PCF8576CU/2 PCF8576CU/F1 bare die wire bond die; 56 bonding pads; 3.2 2.92 0.38 mm PCF8576CU 3.1 Ordering options Table 2. Ordering options Product type number Sales item (12NC) Orderable part number IC Delivery form revision PCF8576CHL/1 935290305118 PCF8576CHL/1,118 1 tape and reel, 13 inch 935290305157 PCF8576CHL/1,157 1 tray pack PCF8576CT/1 935278818518 PCF8576CT/1,518 1 tape and reel, 13 inch, dry pack PCF8576CU/2/F2 935261851026 PCF8576CU/2/F2,026 1 chips in tray PCF8576CU/F1 935208600026 PCF8576CU/F1,026 chips in tray 1 4. Marking Table 3. PCF8576C Product data sheet Marking codes Product type number Marking code PCF8576CHL/1 PCF8576CHL PCF8576CT/1 PCF8576CT PCF8576CU/2/F2 PC8576C-2 PCF8576CU/F1 PC8576C-1 All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 2 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 5. Block diagram %3 %3 %3 %3 6WR6 9'' %$&.3/$1( 2873876 ',63/$<6(*0(172873876 /&' 92/7$*( 6(/(&725 ',63/$</$7&+ /&'%,$6 *(1(5$725 9/&' 6+,)75(*,67(5 3&)& &/. 6<1& 7,0,1* ,1387 %$1. 6(/(&725 %/,1.(5 ',63/$< 5$0 i%,76 287387 %$1. 6(/(&725 ',63/$< &21752//(5 26& 26&,//$725 32:(5 21 5(6(7 '$7$ 32,17(5 &200$1' '(&2'(5 966 6&/ 6'$ ,1387 ),/7(56 68% $''5(66 &2817(5 ,&%86 &21752//(5 $ 6$ $ $ DDD Fig 1. Block diagram of PCF8576C PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 3 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 6. Pinning information 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6.1 Pinning QF QF 6 6 6 6 6 6 6 6 6 6 6 6 QF QF 6 3&)&+/ 6 6'$ 6 6&/ 6 6<1& 6 &/. 6 9'' 6 26& 6 6 6 6 6 %3 %3 %3 %3 QF QF QF 9/&' 966 6$ $ QF $ $ DDD Top view. For mechanical details, see Figure 33. Fig 2. PCF8576C Product data sheet Pin configuration for LQFP64 (PCF8576CHL/1) All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 4 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 6'$ 6 6&/ 6 6<1& 6 &/. 6 9'' 6 26& 6 $ 6 $ 6 $ 6 6$ 6 966 6 9/&' 6 %3 6 %3 %3 6 3&)&7 6 %3 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 DDJ Top view. For mechanical details, see Figure 34. Fig 3. PCF8576C Product data sheet Pin configuration for VSO56 (PCF8576CT/1) All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 5 of 62 PCF8576C NXP Semiconductors 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Universal LCD driver for low multiplex rates 6 6 6 6 6 6 6 6 6 %3 6 %3 6 %3 6 6 6 6 6 6 966 6 6$ 6 $ 6 $ 3&)&8 %3 6 6 6 6 6 6 6'$ 6&/ 6<1& &/. 9'' 26& $ 9/&' DDD Viewed from pin side. For mechanical details, see Figure 36 and Figure 35. Fig 4. PCF8576C Product data sheet Pin locations of PCF8576CU/F1 and PCF8576CU/2/F2 All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 6 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 6.2 Pin description Table 4. Pin description Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified. Symbol Pin Description LQFP64 (PCF8576CHL) VSO56 (PCF8576CT) PCF8576CU Type SDA 10 1 1 input/output I2C-bus serial data input and output SCL 11 2 2 input I2C-bus serial clock input SYNC 12 3 3 input/output cascade synchronization input and output CLK 13 4 4 input/output external clock input/output 5 5[1] supply supply voltage 14 VDD OSC 15 6 6 input internal oscillator enable input A0 to A2 16 to 18 7 to 9 7 to 9 input subaddress inputs SA0 19 10 10 input I2C-bus address input; bit 0 VSS 20 11 11 supply ground supply voltage VLCD 21 12 12 supply LCD supply voltage BP0, BP2, BP1, BP3 25 to 28 13 to 16 13 to 16 output LCD backplane outputs S0 to S39 2 to 7, 29 to 32, 34 to 47, 49 to 64 17 to 56 17 to 56 output LCD segment outputs n.c. 1, 8, 9, 22 to 24, 33, 48 - - - not connected; do not connect and do not use as feed through [1] The substrate (rear side of the die) is connected to VDD and should be electrically isolated. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 7 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7. Functional description The PCF8576C is a versatile peripheral device designed to interface between any microcontroller to a wide variety of LCD segment or dot matrix displays (see Figure 5). It can directly drive any static or multiplexed LCD containing up to four backplanes and up to 40 segments. GRWPDWUL[ VHJPHQWZLWKGRW VHJPHQWZLWKGRWDQGDFFHQW DDD Fig 5. Example of displays suitable for PCF8576C The possible display configurations of the PCF8576C depend on the number of active backplane outputs required. A selection of display configurations is shown in Table 5. All of these configurations can be implemented in the typical system shown in Figure 6. Table 5. Selection of possible display configurations Number of Backplanes PCF8576C Product data sheet Icons Digits/Characters 7-segment 14-segment Dot matrix/ Elements 4 160 20 10 160 dots (4 40) 3 120 15 7 120 dots (3 40) 2 80 10 5 80 dots (2 40) 1 40 5 2 40 dots (1 40) All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 8 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 9'' 5 WU &% 9 '' 9 /&' 6'$ +267 0,&52 352&(6625 0,&52 &21752//(5 VHJPHQWGULYHV 6&/ 3&)& 26& EDFNSODQHV $ $ $ 6$ 9 66 /&'3$1(/ XSWR HOHPHQWV DDD 966 Fig 6. Typical system configuration The host microprocessor or microcontroller maintains the 2-line I2C-bus communication channel with the PCF8576C. Biasing voltages for the multiplexed LCD waveforms are generated internally, removing the need for an external bias generator. The internal oscillator is selected by connecting pin OSC to VSS. The only other connections required to complete the system are the power supplies (pins VDD, VSS, and VLCD) and the LCD panel selected for the application. 7.1 Power-On-Reset (POR) At power-on the PCF8576C resets to the following starting conditions: * * * * * * All backplane and segment outputs are set to VDD The selected drive mode is 1:4 multiplex with 13 bias Blinking is switched off Input and output bank selectors are reset The I2C-bus interface is initialized The data pointer and the subaddress counter are cleared Remark: Do not transfer data on the I2C-bus for at least 1 ms after a power-on to allow the reset action to complete. 7.2 LCD bias generator The full-scale LCD voltage (Voper) is obtained from VDD VLCD. The LCD voltage may be temperature compensated externally through the VLCD supply to pin VLCD. Fractional LCD biasing voltages are obtained from an internal voltage divider comprising three series resistors connected between VDD and VLCD. The center resistor can be switched out of the circuit to provide a 12 bias voltage level for the 1:2 multiplex configuration. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 9 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.3 LCD voltage selector The LCD voltage selector coordinates the multiplexing of the LCD in accordance with the selected LCD drive configuration. The operation of the voltage selector is controlled by the mode-set command from the command decoder. The biasing configurations that apply to the preferred modes of operation, together with the biasing characteristics as functions of VLCD and the resulting discrimination ratios (D) are given in Table 6. Discrimination is a term which is defined as the ratio of the on and off RMS voltage across a segment. It can be thought of as a measurement of contrast. Table 6. Biasing characteristics LCD drive mode Number of: LCD bias Backplanes Levels configuration V off RMS ------------------------V LCD V on RMS -----------------------V LCD V on RMS D = -----------------------V off RMS static 1 2 static 0 1 3 1 2 0.354 0.791 2.236 1:2 multiplex 2 4 1 3 0.333 0.745 2.236 1:3 multiplex 3 4 1 3 0.333 0.638 1.915 1:4 multiplex 4 4 1 3 0.333 0.577 1.732 1:2 multiplex 2 A practical value for VLCD is determined by equating Voff(RMS) with a defined LCD threshold voltage (Vth), typically when the LCD exhibits approximately 10 % contrast. In the static drive mode, a suitable choice is VLCD > 3Vth. Multiplex drive modes of 1:3 and 1:4 with 12 bias are possible but the discrimination and hence the contrast ratios are smaller. 1 Bias is calculated by ------------- , where the values for a are 1+a a = 1 for 12 bias a = 2 for 13 bias The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 1: V on RMS = V LCD a 2 + 2a + n -----------------------------2 n 1 + a (1) where the values for n are n = 1 for static drive mode n = 2 for 1:2 multiplex drive mode n = 3 for 1:3 multiplex drive mode n = 4 for 1:4 multiplex drive mode The RMS off-state voltage (Voff(RMS)) for the LCD is calculated with Equation 2: V off RMS = V LCD a 2 - 2a + n -----------------------------2 n 1 + a (2) Discrimination is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 3: PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 10 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates V on RMS D = ----------------------- = V off RMS 2 a + 1 + n - 1 -------------------------------------------2 a - 1 + n - 1 (3) Using Equation 3, the discrimination for an LCD drive mode of 1:3 multiplex with 1 2 bias is 1 2 21 bias is ---------- = 1.528 . 3 3 = 1.732 and the discrimination for an LCD drive mode of 1:4 multiplex with The advantage of these LCD drive modes is a reduction of the LCD full scale voltage VLCD as follows: * 1:3 multiplex (12 bias): V LCD = 6 V off RMS = 2.449V off RMS 4 3 - = 2.309V off RMS * 1:4 multiplex (12 bias): V LCD = --------------------3 These compare with V LCD = 3V off RMS when 13 bias is used. VLCD is sometimes referred as the LCD operating voltage. 7.3.1 Electro-optical performance Suitable values for Von(RMS) and Voff(RMS) are dependent on the LCD liquid used. The RMS voltage, at which a pixel will be switched on or off, determine the transmissibility of the pixel. For any given liquid, there are two threshold values defined. One point is at 10 % relative transmission (at Vth(off)) and the other at 90 % relative transmission (at Vth(on)), see Figure 7. For a good contrast performance, the following rules should be followed: V on RMS V th on (4) V off RMS V th off (5) Von(RMS) and Voff(RMS) are properties of the display driver and are affected by the selection of a (see Equation 1), n (see Equation 3), and the VLCD voltage. Vth(off) and Vth(on) are properties of the LCD liquid and can be provided by the module manufacturer. Vth(off) is sometimes named Vth. Vth(on) is sometimes named saturation voltage Vsat. It is important to match the module properties to those of the driver in order to achieve optimum performance. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 11 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 5HODWLYH7UDQVPLVVLRQ 9WK RII 2)) 6(*0(17 9WK RQ *5(< 6(*0(17 9506>9@ 21 6(*0(17 DDD Fig 7. PCF8576C Product data sheet Electro-optical characteristic: relative transmission curve of the liquid All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 12 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.4 LCD drive mode waveforms 7.4.1 Static drive mode The static LCD drive mode is used when a single backplane is provided in the LCD. Backplane and segment drive waveforms for this mode are shown in Figure 8. 7IU /&'VHJPHQWV 9/&' %3 966 VWDWH RQ 9/&' VWDWH RII 6Q 966 9/&' 6Q 966 D :DYHIRUPVDWGULYHU 9/&' VWDWH 9 9/&' 9/&' VWDWH 9 9/&' E 5HVXOWDQWZDYHIRUPV DW/&'VHJPHQW PJO Vstate1(t) = VSn(t) VBP0(t). Von(RMS) = VLCD. Vstate2(t) = VSn+1(t) VBP0(t). Voff(RMS) = 0 V. Fig 8. PCF8576C Product data sheet Static drive mode waveforms All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 13 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.4.2 1:2 Multiplex drive mode When two backplanes are provided in the LCD, the 1:2 multiplex mode applies. The PCF8576C allows the use of 12 bias or 13 bias (see Figure 9 and Figure 10). 7IU 9/&' %3 /&'VHJPHQWV 9/&' 966 VWDWH 9/&' %3 VWDWH 9/&' 966 9/&' 6Q 966 9/&' 6Q 966 D :DYHIRUPVDWGULYHU 9/&' 9/&' VWDWH 9 9/&' 9/&' 9/&' 9/&' VWDWH 9 9/&' 9/&' E 5HVXOWDQWZDYHIRUPV DW/&'VHJPHQW PJO Vstate1(t) = VSn(t) VBP0(t). Von(RMS) = 0.791VLCD. Vstate2(t) = VSn(t) VBP1(t). Voff(RMS) = 0.354VLCD Fig 9. PCF8576C Product data sheet Waveforms for the 1:2 multiplex drive mode with 12 bias All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 14 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7IU 9/&' %3 %3 /&'VHJPHQWV 9/&' 9/&' 966 VWDWH 9/&' 9/&' VWDWH 9/&' 966 9/&' 6Q 9/&' 9/&' 966 9/&' 6Q 9/&' 9/&' 966 D :DYHIRUPVDWGULYHU 9/&' 9/&' VWDWH 9/&' 9 9/&' 9/&' 9/&' 9/&' 9/&' 9/&' VWDWH 9 9/&' 9/&' 9/&' E 5HVXOWDQWZDYHIRUPV DW/&'VHJPHQW PJO Vstate1(t) = VSn(t) VBP0(t). Von(RMS) = 0.745VLCD Vstate2(t) = VSn(t) VBP1(t) Voff(RMS) = 0.333VLCD. Fig 10. Waveforms for the 1:2 multiplex drive mode with 13 bias PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 15 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.4.3 1:3 Multiplex drive mode When three backplanes are provided in the LCD, the 1:3 multiplex drive mode applies as shown in Figure 11. 7IU %3 9/&' 9/&' /&'VHJPHQWV 9/&' 966 VWDWH 9/&' %3 %3 6Q 6Q 6Q VWDWH 9/&' 9/&' 966 9/&' 9/&' 9/&' 966 9/&' 9/&' 9/&' 966 9/&' 9/&' 9/&' 966 9/&' 9/&' 9/&' 966 D :DYHIRUPVDWGULYHU 9/&' 9/&' 9/&' VWDWH 9 9/&' 9/&' 9/&' 9/&' 9/&' 9/&' VWDWH 9 9/&' 9/&' 9/&' E 5HVXOWDQWZDYHIRUPV DW/&'VHJPHQW PJO Vstate1(t) = VSn(t) VBP0(t). Von(RMS) = 0.638VLCD. Vstate2(t) = VSn(t) VBP1(t). Voff(RMS) = 0.333VLCD. Fig 11. Waveforms for the 1:3 multiplex drive mode with 13 bias PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 16 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.4.4 1:4 multiplex drive mode When four backplanes are provided in the LCD, the 1:4 multiplex drive mode applies, as shown in Figure 12. 7IU %3 9/&' 9/&' /&'VHJPHQWV 9/&' 966 VWDWH 9/&' %3 VWDWH 9/&' 9/&' 966 9/&' %3 %3 6Q 9/&' 9/&' 966 9/&' 9/&' 9/&' 966 9/&' 9/&' 9/&' 966 9/&' 6Q 6Q 9/&' 9/&' 966 9/&' 9/&' 9/&' 966 9/&' 6Q 9/&' 9/&' 966 D :DYHIRUPVDWGULYHU 9/&' 9/&' 9/&' VWDWH 9 9/&' 9/&' 9/&' 9/&' 9/&' 9/&' VWDWH 9 9/&' 9/&' 9/&' E 5HVXOWDQWZDYHIRUPV DW/&'VHJPHQW PJO Vstate1(t) = VSn(t) VBP0(t). Von(RMS) = 0.577VLCD. Vstate2(t) = VSn(t) VBP1(t). Voff(RMS) = 0.333VLCD. Fig 12. Waveforms for the 1:4 multiplex mode with 13 bias PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 17 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.5 Oscillator The internal logic and the LCD drive signals of the PCF8576C are timed by the frequency fclk, which equals either the built-in oscillator frequency fosc or the external clock frequency fclk(ext). The clock frequency (fclk) determines the LCD frame frequency (ffr) and the maximum rate for data reception from the I2C-bus. To allow I2C-bus transmissions at their maximum data rate of 100 kHz, fclk should be chosen to be above 125 kHz. 7.5.1 Internal clock The internal oscillator is enabled by connecting pin OSC to pin VSS. In this case, the output from pin CLK is the clock signal for any cascaded PCF8576C in the system. 7.5.2 External clock Connecting pin OSC to VDD enables an external clock source. Pin CLK then becomes the external clock input. Remark: A clock signal must always be supplied to the device. Removing the clock, freezes the LCD in a DC state, which is not suitable for the liquid crystal. 7.6 Timing The timing of the PCF8576C sequences the internal data flow of the device. This includes the transfer of display data from the display RAM to the display segment outputs. In cascaded applications, the synchronization signal (SYNC) maintains the correct timing relationship between the PCF8576Cs in the system. The timing also generates the LCD frame frequency which is derived as an integer division of the clock frequency (see Table 7). The frame frequency is set by the mode-set command (see Table 10) when an internal clock is used or by the frequency applied to the pin CLK when an external clock is used. Table 7. LCD frame frequencies [1] Power mode Frame frequency Nominal frame frequency (Hz) Normal-power mode f clk f fr = ------------2880 69 [2] Power-saving mode f clk f fr = ---------480 65 [3] [1] The possible values for fclk see Table 17. [2] For fclk = 200 kHz. [3] For fclk = 31 kHz. The ratio between the clock frequency and the LCD frame frequency depends on the power mode in which the device is operating. In the power-saving mode, the reduction ratio is six times smaller; this allows the clock frequency to be reduced by a factor of six. The reduced clock frequency results in a significant reduction in power consumption. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 18 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates The lower clock frequency has the disadvantage of increasing the response time when large amounts of display data are transmitted on the I2C-bus. When a device is unable to process a display data byte before the next one arrives, it holds the SCL line LOW until the first display data byte is stored. This slows down the transmission rate of the I2C-bus but no data loss occurs. 7.7 Display register The display register holds the display data while the corresponding multiplex signals are generated. 7.8 Shift register The shift register transfers display information from the display RAM to the display register while previous data is displayed. 7.9 Segment outputs The LCD drive section includes 40 segment outputs, S0 to S39, which must be connected directly to the LCD. The segment output signals are generated based on the multiplexed backplane signals and with data residing in the display register. When less than 40 segment outputs are required, the unused segment outputs should be left open-circuit. 7.10 Backplane outputs The LCD drive section includes four backplane outputs: BP0 to BP3. The backplane output signals are generated based on the selected LCD drive mode. * In 1:4 multiplex drive mode: BP0 to BP3 must be connected directly to the LCD. If less than four backplane outputs are required, the unused outputs can be left as an open-circuit. * In 1:3 multiplex drive mode: BP3 carries the same signal as BP1, therefore these two adjacent outputs can be tied together to give enhanced drive capabilities. * In 1:2 multiplex drive mode: BP0 and BP2, BP1 and BP3 respectively carry the same signals and can also be paired to increase the drive capabilities. * In static drive mode: the same signal is carried by all four backplane outputs and they can be connected in parallel for very high drive requirements. 7.11 Display RAM The display RAM is a static 40 4-bit RAM which stores LCD data. There is a one-to-one correspondence between * the bits in the RAM bitmap and the LCD elements * the RAM columns and the segment outputs * the RAM rows and the backplane outputs. A logic 1 in the RAM bitmap indicates the on-state of the corresponding LCD element; similarly, a logic 0 indicates the off-state. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 19 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates The display RAM bit map Figure 13 shows the rows 0 to 3 which correspond with the backplane outputs BP0 to BP3, and the columns 0 to 39 which correspond with the segment outputs S0 to S39. In multiplexed LCD applications the segment data of the first, second, third and fourth row of the display RAM are time-multiplexed with BP0, BP1, BP2, and BP3 respectively. GLVSOD\5$0DGGUHVVHV FROXPQV VHJPHQWRXWSXWV 6 GLVSOD\5$0ELWV URZV EDFNSODQHRXWSXWV %3 PEH The display RAM bitmap shows the direct relationship between the display RAM column and the segment outputs; and between the bits in a RAM row and the backplane outputs. Fig 13. Display RAM bit map When display data is transmitted to the PCF8576C, the display bytes received are stored in the display RAM in accordance with the selected LCD drive mode. The data is stored as it arrives and does not wait for an acknowledge cycle as with the commands. Depending on the current multiplex drive mode, data is stored singularly, in pairs, triples or quadruples. To illustrate the filling order, an example of a 7-segment numeric display showing all drive modes is given in Figure 14; the RAM filling organization depicted applies equally to other LCD types. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 20 of 62 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx /&'VHJPHQWV 6Q 6Q VWDWLF E F URZV GLVSOD\5$0 URZVEDFNSODQH RXWSXWV %3 '3 D 6Q %3 F 6Q '3 G 6Q D E 6Q %3 F E I %3 J H %3 F 21 of 62 (c) NXP B.V. 2013. All rights reserved. G Q Q F [ [ [ E [ [ [ D [ [ [ I [ [ [ J [ [ [ H [ [ [ G [ [ [ '3 [ [ [ 06% /6% F E D I J H G '3 URZV GLVSOD\5$0 URZVEDFNSODQH RXWSXWV %3 Q Q Q Q D E [ [ I J [ [ H F [ [ G '3 [ [ 06% D E /6% I J H F G '3 Q URZV GLVSOD\5$0 E URZVEDFNSODQH '3 RXWSXWV %3 F [ Q Q D G J [ I H [ [ 06% /6% E '3 F D G J I H '3 %3 Q URZV GLVSOD\5$0 D URZVEDFNSODQH F %3 RXWSXWV %3 E '3 Q I H J G 06% D F E '3 I /6% H J G DDM x = data bit unchanged. Fig 14. Relationship between LCD layout, drive mode, display RAM filling order, and display data transmitted over the I2C-bus PCF8576C PXOWLSOH[ Q FROXPQV GLVSOD\5$0DGGUHVVVHJPHQWRXWSXWV V E\WH E\WH E\WH E\WH E\WH D 6Q 6Q %3 '3 G Q FROXPQV GLVSOD\5$0DGGUHVVVHJPHQWRXWSXWV V E\WH E\WH E\WH J H Q %3 I PXOWLSOH[ Q Universal LCD driver for low multiplex rates Rev. 13 -- 16 December 2013 All information provided in this document is subject to legal disclaimers. E H Q FROXPQV GLVSOD\5$0DGGUHVVVHJPHQWRXWSXWV V E\WH E\WH J 6Q Q %3 I PXOWLSOH[ %3 6Q 6Q G 6Q 6Q 6Q J H WUDQVPLWWHGGLVSOD\E\WH FROXPQV GLVSOD\5$0DGGUHVVVHJPHQWRXWSXWV V E\WH I 6Q GLVSOD\5$0ILOOLQJRUGHU D 6Q 6Q /&'EDFNSODQHV NXP Semiconductors PCF8576C Product data sheet GULYHPRGH PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates The following applies to Figure 14: * In the static drive mode, the eight transmitted data bits are placed in row 0 of eight successive 4-bit RAM words. * In the 1:2 multiplex mode, the eight transmitted data bits are placed in pairs into row 0 and 1 of four successive 4-bit RAM words. * In the 1:3 multiplex mode, the eight bits are placed in triples into row 0, 1, and 2 to three successive 3-bit RAM words, with bit 3 of the third address left unchanged. It is not recommended to use this bit in a display because of the difficult addressing. This last bit may, if necessary, be controlled by an additional transfer to this address but care should be taken to avoid overwriting adjacent data because always full bytes are transmitted. * In the 1:4 multiplex mode, the eight transmitted data bits are placed in quadruples into row 0, 1, 2, and 3 of two successive 4-bit RAM words. 7.12 Data pointer The addressing mechanism for the display RAM is realized using the data pointer. This allows the loading of an individual display data byte or a series of display data bytes, into any location of the display RAM. The sequence commences with the initialization of the data pointer by the load-data-pointer command (see Table 11). After this, the data byte is stored starting at the display RAM address indicated by the data pointer (see Figure 14). Once each byte is stored, the data pointer is automatically incremented based on the selected LCD configuration. The contents of the data pointer are incremented as follows: * * * * In static drive mode by eight. In 1:2 multiplex drive mode by four. In 1:3 multiplex drive mode by three. In 1:4 multiplex drive mode by two. If an I2C-bus data access terminates early, the state of the data pointer is unknown. Consequently, the data pointer must be rewritten prior to further RAM accesses. 7.13 Sub-address counter The storage of display data is conditioned by the contents of the subaddress counter. Storage is allowed to take place only when the contents of the subaddress counter match with the hardware subaddress applied to A0, A1, and A2. The subaddress counter value is defined by the device-select command (see Table 12). If the contents of the subaddress counter and the hardware subaddress do not match, then data storage is blocked but the data pointer will be incremented as if data storage had taken place. The subaddress counter is also incremented when the data pointer overflows. The storage arrangements described lead to extremely efficient data loading in cascaded applications. When a series of display bytes are sent to the display RAM, automatic wrap-over to the next PCF8576C occurs when the last RAM address is exceeded. Subaddressing across device boundaries is successful even if the change to the next device in the cascade occurs within a transmitted character. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 22 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.14 Bank selector 7.14.1 Output bank selector The output bank selector (see Table 13), selects one of the four rows per display RAM address for transfer to the display register. The actual row selected depends on the LCD drive mode in operation and on the instant in the multiplex sequence. * In 1:4 multiplex mode: all RAM addresses of row 0 are selected, followed sequentially by the contents of row 1, row 2, and then row 3. * In 1:3 multiplex mode: rows 0, 1, and 2 are selected sequentially. * In 1:2 multiplex mode: rows 0 and 1 are selected. * In the static mode: row 0 is selected. The PCF8576C includes a RAM bank switching feature in the static and 1:2 multiplex drive modes. In the static drive mode, the bank-select command may request the contents of row 2 to be selected for display instead of the contents of row 0. In 1:2 multiplex drive mode, the contents of rows 2 and 3 may be selected instead of rows 0 and 1. This enables preparation of display information in an alternative bank and the ability to switch to it once it has been assembled. 7.14.2 Input bank selector The input bank selector (see Table 13) loads display data into the display RAM based on the selected LCD drive configuration. Using the bank-select command, display data can be loaded in row 2 into static drive mode or in rows 2 and 3 into 1:2 multiplex drive mode. The input bank selector functions independently of the output bank selector. 7.15 Blinking The display blinking capabilities of the PCF8576C are very versatile. The whole display can be blinked at frequencies selected by the blink-select command. The blinking frequencies are integer fractions of the clock frequency; the ratios between the clock and blinking frequencies depend on the mode in which the device is operating (see Table 8). Table 8. Blink frequencies Blinking mode Normal-power mode ratio Power-saving mode ratio Blink frequency off - - blinking off 1 f clk f blink = ---------------92160 f clk f blink = ---------------15360 2 Hz 2 f clk f blink = -------------------184320 f clk f blink = ---------------30720 1 Hz 3 f clk f blink = -------------------368640 f clk f blink = ---------------61440 0.5 Hz An additional feature is for an arbitrary selection of LCD segments to be blinked. This applies to the static and 1:2 multiplex drive modes and can be implemented without any communication overheads. Using the output bank selector, the displayed RAM banks are exchanged with alternate RAM banks at the blinking frequency. This mode can also be specified by the blink-select command (see Table 14). PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 23 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates In the 1:3 and 1:4 multiplex modes, where no alternate RAM bank is available, groups of LCD segments can be blinked by selectively changing the display RAM data at fixed time intervals. If the entire display must be blinked at a frequency other than the nominal blink frequency, this can be done using the mode-set command to set and reset the display enable bit E at the required rate (see Table 10). 7.16 Characteristics of the I2C-bus The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a Serial DAta line (SDA) and a Serial CLock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 7.16.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse. Changes in the data line at this time will be interpreted as a control signal. Bit transfer is illustrated in Figure 15. 6'$ 6&/ GDWDOLQH VWDEOH GDWDYDOLG FKDQJH RIGDWD DOORZHG PED Fig 15. Bit transfer 7.16.2 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW change of the data line, while the clock is HIGH, is defined as the START condition (S). A LOW-to-HIGH change of the data line, while the clock is HIGH, is defined as the STOP condition (P). The START and STOP conditions are illustrated in Figure 16. 6'$ 6'$ 6&/ 6&/ 6 3 67$57FRQGLWLRQ 6723FRQGLWLRQ PEF Fig 16. Definition of START and STOP conditions PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 24 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.16.3 System configuration A device generating a message is a transmitter and a device receiving a message is the receiver. The device that controls the message is the master and the devices which are controlled by the master are the slaves. The system configuration is illustrated in Figure 17. 0$67(5 75$160,77(5 5(&(,9(5 6/$9( 75$160,77(5 5(&(,9(5 6/$9( 5(&(,9(5 0$67(5 75$160,77(5 5(&(,9(5 0$67(5 75$160,77(5 6'$ 6&/ PJD Fig 17. System configuration 7.16.4 Acknowledge The number of data bytes transferred between the START and STOP conditions from transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge cycle. * A slave receiver, which is addressed, must generate an acknowledge after the reception of each byte. * A master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. * The device that acknowledges must pull-down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be considered). * A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. Acknowledgement on the I2C-bus is illustrated in Figure 18. GDWDRXWSXW E\WUDQVPLWWHU QRWDFNQRZOHGJH GDWDRXWSXW E\UHFHLYHU DFNQRZOHGJH 6&/IURP PDVWHU 6 67$57 FRQGLWLRQ FORFNSXOVHIRU DFNQRZOHGJHPHQW PEF Fig 18. Acknowledgement of the I2C-bus PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 25 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.16.5 PCF8576C I2C-bus controller The PCF8576C acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or transmit data to an I2C-bus master receiver. The only data output from the PCF8576C are the acknowledge signals of the selected devices. Device selection depends on the I2C-bus slave address, the transferred command data and the hardware subaddress. In single device application, the hardware subaddress inputs A0, A1, and A2 are normally tied to VSS which defines the hardware subaddress 0. In multiple device applications A0, A1, and A2 are tied to VSS or VDD using a binary coding scheme so that no two devices with a common I2C-bus slave address have the same hardware subaddress. In the power-saving mode, it is possible that the PCF8576C is not able to keep up with the highest transmission rates when large amounts of display data are transmitted. If this situation occurs, the PCF8576C forces the SCL line LOW until its internal operations are completed. This is known as the clock synchronization feature of the I2C-bus and serves to slow down fast transmitters. Data loss does not occur. 7.16.6 Input filter To enhance noise immunity in electrically adverse environments, RC low-pass filters are provided on the SDA and SCL lines. 7.17 I2C-bus protocol Two I2C-bus slave addresses (0111000 and 0111001) are reserved for the PCF8576C. The least significant bit of the slave address that a PCF8576C responds to is defined by the level tied at its input SA0. Therefore, two types of PCF8576C can be distinguished on the same I2C-bus which allows: * Up to 16 PCF8576Cs on the same I2C-bus for very large LCD applications. * The use of two types of LCD multiplexes on the same I2C-bus. The I2C-bus protocol is shown in Figure 19. The sequence is initiated with a START condition (S) from the I2C-bus master which is followed by one of the two PCF8576C slave addresses available. All PCF8576Cs with the corresponding SA0 level acknowledge in parallel with the slave address but all PCF8576Cs with the alternative SA0 level ignore the whole I2C-bus transfer. After acknowledgement, one or more command bytes follow which define the status of the addressed PCF8576Cs. The last command byte is tagged with a cleared most significant bit, the continuation bit C. The command bytes are also acknowledged by all addressed PCF8576Cs on the bus. After the last command byte, a series of display data bytes may follow. These display bytes are stored in the display RAM at the address specified by the data pointer and the subaddress counter. Both data pointer and subaddress counter are automatically updated and the data is directed to the intended PCF8576C device. The acknowledgement after each byte is made only by the (A0, A1, and A2) addressed PCF8576C. After the last display byte, the I2C-bus master issues a STOP condition (P). PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 26 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates DFNQRZOHGJH E\$$DQG$ VHOHFWHG 3&)&RQO\ DFNQRZOHGJHE\ DOODGGUHVVHG 3&)&V 5: VODYHDGGUHVV 6 6 $ $ & &200$1' $ ',63/$<'$7$ QE\WH V E\WH $ 3 QE\WH V XSGDWHGDWDSRLQWHUV DQGLIQHFHVVDU\ VXEDGGUHVVFRXQWHU PEH Fig 19. I2C-bus protocol 7.18 Command decoder The command decoder identifies command bytes that arrive on the I2C-bus. All available commands carry a continuation bit C in the most significant bit position as shown in Figure 20. When this bit is set logic 1, it indicates that the next byte of the transfer to arrive will also represent a command. If this bit is set logic 0, it indicates that the command byte is the last in the transfer. Further bytes will be regarded as display data. 06% /6% & 5(672)23&2'( PVD (1) C = 0; last command. (2) C = 1; commands continue. Fig 20. General format of the command byte The five commands available to the PCF8576C are defined in Table 9. Table 9. PCF8576C Product data sheet Definition of PCF8576C commands Command Operation Code Reference Bit 7 6 5 4 3 2 1 LP E B M[1:0] 0 mode-set C 1 0 load-data-pointer C 0 P[5:0] Section 7.18.1 device-select C 1 1 0 0 A[2:0] bank-select C 1 1 1 1 0 I blink-select C 1 1 1 0 AB BF[1:0] Section 7.18.2 All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 Section 7.18.3 O Section 7.18.4 Section 7.18.5 (c) NXP B.V. 2013. All rights reserved. 27 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.18.1 Mode-set command Table 10. Mode-set command bit description Bit Symbol Value Description 7 C 0, 1 see Figure 20 6 to 5 - 10 fixed value 4 LP 3 power dissipation (see Table 7) 0 normal-power mode 1 power-saving mode E 2 display status 0 disabled[1] 1 enabled LCD bias configuration[2] B 1 to 0 0 1 3 bias 1 1 2 bias M[1:0] LCD drive mode selection 01 static; BP0 10 1:2 multiplex; BP0, BP1 11 1:3 multiplex; BP0, BP1, BP2 00 1:4 multiplex; BP0, BP1, BP2, BP3 [1] The possibility to disable the display allows implementation of blinking under external control. [2] Bit B is not applicable for the static LCD drive mode. 7.18.2 Load-data-pointer command Table 11. Load-data-pointer command bit description Bit Symbol Value Description 7 C 0, 1 see Figure 20 6 - 0 fixed value 5 to 0 P[5:0] 000000 to 100111 6-bit binary value, 0 to 39; transferred to the data pointer to define one of forty display RAM addresses 7.18.3 Device-select command PCF8576C Product data sheet Table 12. Device-select command bit description Bit Symbol Value Description 7 C 0, 1 see Figure 20 6 to 4 - 1100 fixed value 3 to 0 A[2:0] 000 to 111 3-bit binary value, 0 to 7; transferred to the subaddress counter to define one of eight hardware subaddresses All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 28 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7.18.4 Bank-select command Table 13. Bank-select command bit description Bit Symbol Value Description Static 7 C 0, 1 see Figure 20 6 to 2 - 11110 fixed value 1 I input bank selection; storage of arriving display data 0 1 0 [1] 1:2 multiplex[1] O RAM bit 0 RAM bits 0 and 1 RAM bit 2 RAM bits 2 and 3 output bank selection; retrieval of LCD display data 0 RAM bit 0 RAM bits 0 and 1 1 RAM bit 2 RAM bits 2 and 3 The bank-select command has no effect in 1:3 and 1:4 multiplex drive modes. 7.18.5 Blink-select command Table 14. Blink-select command bit description Bit Symbol Value Description 7 C 0, 1 see Figure 20 6 to 3 - 1110 2 AB 1 to 0 fixed value blink mode selection 0 normal blinking[1] 1 alternate RAM bank blinking[2] BF[1:0] blink frequency selection 00 off 01 1 10 2 11 3 [1] Normal blinking is assumed when the LCD multiplex drive modes 1:3 or 1:4 are selected. [2] Alternate RAM bank blinking does not apply in 1:3 and 1:4 multiplex drive modes. 7.19 Display controller The display controller executes the commands identified by the command decoder. It contains the status registers of the PCF8576C and coordinates their effects. The controller is also responsible for loading display data into the display RAM as required by the filling order. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 29 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 8. Internal circuitry 9/&' 966 6'$6&/ %3WR%3 6WR6 &/.26&$WR$ 6$ 6<1& 9'' DDD Fig 21. Device protection diagram 9. Safety notes CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. CAUTION Static voltages across the liquid crystal display can build up when the LCD supply voltage (VLCD) is on while the IC supply voltage (VDD) is off, or vice versa. This may cause unwanted display artifacts. To avoid such artifacts, VLCD and VDD must be applied or removed together. CAUTION Semiconductors are light sensitive. Exposure to light sources can cause the IC to malfunction. The IC must be protected against light. The protection must be applied to all sides of the IC. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 30 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 10. Limiting values Table 15. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions supply voltage VDD [1] Min Max Unit 0.5 +8.0 V VDD 8.0 VDD V 0.5 +8.0 V 0.5 +8.0 V VLCD LCD supply voltage VI input voltage on each of the pins SCL, SDA, CLK, SYNC, SA0, OSC and A0 to A2 VO output voltage on each of the pins S0 to S39 and BP0 to BP3 II input current 20 +20 mA IO output current 25 +25 mA IDD supply current 50 +50 mA ISS ground supply current 50 +50 mA IDD(LCD) LCD supply current 50 +50 mA Ptot total power dissipation - 400 mW Po output power - 100 mW VESD electrostatic discharge voltage - 4000 V all pins - 500 V corner pins - 1000 V - 500 V [1] HBM [2] CDM [4] PCF8576CHL PCF8576CT all pins corner pins PCF8576C Product data sheet - 750 V Ilu latch-up current [5] - 150 mA Tstg storage temperature [6] 65 +150 C Tamb ambient temperature 40 +85 C operating device [1] Values with respect to VDD. [2] Pass level; Human Body Model (HBM), according to Ref. 8 "JESD22-A114". [3] Pass level; Machine Model (MM), according to Ref. 9 "JESD22-A115". [4] Pass level; Charged-Device Model (CDM), according to Ref. 10 "JESD22-C101". [5] Pass level; latch-up testing according to Ref. 11 "JESD78" at maximum ambient temperature (Tamb(max)). [6] According to the store and transport requirements (see Ref. 13 "UM10569") the devices have to be stored at a temperature of +8 C to +45 C and a humidity of 25 % to 75 %. All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 31 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 11. Static characteristics Table 16. Static characteristics VDD = 2.0 V to 6.0 V; VSS = 0 V; VLCD = VDD 2.0 V to VDD 6.0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V Supplies VDD supply voltage VLCD LCD supply voltage 2.0 - 6.0 [1] VDD 6.0 - VDD 2.0 V IDD supply current: fclk = 200 kHz [2] - - 120 A IDD(lp) low-power mode supply current VDD = 3.5 V; VLCD = 0 V; fclk = 35 kHz; A0, A1 and A2 connected to VSS - - 60 A VIL LOW-level input voltage on pins CLK, SYNC, OSC, A0 to A2 and SA0 VSS - 0.3VDD V VIH HIGH-level input voltage on pins CLK, SYNC, OSC, A0 to A2 and SA0 0.7VDD - VDD V VOL LOW-level output voltage IOL = 0 mA - - 0.05 V VOH HIGH-level output voltage IOH = 0 mA VDD 0.05 - - V IOL LOW-level output current output sink current; VOL = 1.0 V; VDD = 5.0 V; on pins CLK and SYNC 1 - - mA IL leakage current VI = VDD or VSS; on pins CLK, SCL, SDA, A0 to A2 and SA0 1 - +1 A IL(OSC) leakage current on pin OSC VI = VDD 1 - +1 A Ipd pull-down current VI = 1.0 V; VDD = 5.0 V; on pins A0 to A2 and OSC 15 50 150 A RSYNC_N SYNC resistance 20 50 150 k VPOR power-on reset voltage [3] - 1.0 1.6 V CI input capacitance [4] - - 7 pF Logic I2C-bus; pins SDA and SCL VIL LOW-level input voltage VSS - 0.3VDD V VIH HIGH-level input voltage 0.7VDD - 6.0 V IOH(CLK) HIGH-level output current on pin CLK output source current; VOH = 4.0 V; VDD = 5.0 V 1 - - mA IOL(SDA) LOW-level output current on pin SDA output sink current; VOL = 0.4 V; VDD = 5.0 V 3 - - mA PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 32 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates Table 16. Static characteristics ...continued VDD = 2.0 V to 6.0 V; VSS = 0 V; VLCD = VDD 2.0 V to VDD 6.0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 20 - +20 mV LCD outputs VBP voltage on pin BP Cbpl = 35 nF; on pins BP0 to BP3 VS voltage on pin S Csgm = 5 nF; on pins S0 to S39 20 - +20 mV RBP resistance on pin BP VLCD = VDD 5 V; on pins BP0 to BP3 [5] - - 5 k resistance on pin S VLCD = VDD 5 V; on pins S0 to S39 [5] - - 7.5 k RS [1] VLCD VDD 3 V for 13 bias. [2] LCD outputs are open-circuit; inputs at VSS or VDD; external clock with 50 % duty factor; I2C-bus inactive. [3] Resets all logic when VDD < VPOR. [4] Periodically sampled, not 100 % tested. [5] Outputs measured one at a time. 11.1 Typical supply current characteristics PEH PEH ,'' /&' $ ,66 $ QRUPDO PRGH SRZHUVDYLQJ PRGH VDD = 5 V; VLCD = 0 V; Tamb = 25 C Fig 22. ISS as a function of ffr PCF8576C Product data sheet IIU +] IIU +] VDD = 5 V; VLCD = 0 V; Tamb = 25 C Fig 23. IDD(LCD) as a function of ffr All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 33 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates PEH ,66 $ PEH ,'' /&' $ QRUPDOPRGH IFON N+] & & SRZHUVDYLQJPRGH IFON N+] 9'' 9 & VLCD = 0 V; external clock; Tamb = 25 C 9'' 9 VLCD = 0 V; external clock; Tamb = 25 C Fig 24. ISS as a function of VDD Fig 25. IDD(LCD) as a function of VDD 11.2 Typical LCD output characteristics PEH 52 PD[ N PEH 52 PD[ N 56 56 5%3 5%3 9'' 9 VLCD = 0 V; Tamb = 25 C Fig 26. RO(max) as a function of VDD PCF8576C Product data sheet 7DPE & VDD = 5 V; VLCD = 0 V Fig 27. RO(max) as a function of Tamb All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 34 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 12. Dynamic characteristics Table 17. Dynamic characteristics VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = VDD 2.0 V to VDD 6.0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 125 200 315 kHz 21 31 48 kHz Timing characteristics: driver timing waveforms (see Figure 28) clock frequency fclk normal-power mode; VDD = 5 V [1] power-saving mode; VDD = 3 V tclk(H) clock HIGH time 1 - - s tclk(L) clock LOW time 1 - - s - - 400 ns 1 - - s - - 30 s 4.7 - - s tPD(SYNC_N) SYNC propagation delay tSYNC_NL SYNC LOW time tPD(drv) driver propagation delay VLCD = 5 V Timing characteristics: I2C-bus (see Figure 29) tBUF bus free time between a STOP and START condition [2] tHD;STA hold time (repeated) START condition 4.0 - - s tSU;STA set-up time for a repeated START condition 4.7 - - s tLOW LOW period of the SCL clock 4.7 - - s tHIGH HIGH period of the SCL clock 4.0 - - s tr rise time of both SDA and SCL signals - - 1 s tf fall time of both SDA and SCL signals - - 0.3 s Cb capacitive load for each bus line - - 400 pF tSU;DAT data set-up time 250 - - ns tHD;DAT data hold time 0 - - ns tSU;STO set-up time for STOP condition 4.0 - - s [1] fclk < 125 kHz, I2C-bus maximum transmission speed is derated. [2] All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to VIL and VIH with an input voltage swing of VSS to VDD. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 35 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates I&/. WFON + WFON / 9'' &/. 9'' 9'' 6<1& 9'' W3' 6<1&B1 W3' 6<1&B1 W6<1&B1/ 9 %3WR%3 DQG6WR6 9'' 9 9 W3' GUY PFH Fig 28. Driver timing waveforms 6'$ W%8) W/2: WI 6&/ W+'67$ WU W+''$7 W+,*+ W68'$7 6'$ W6867$ W68672 PJD Fig 29. I2C-bus timing waveforms PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 36 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 13. Application information 13.1 Cascaded operation In large display configurations, up to 16 PCF8576Cs can be recognized on the same I2C-bus by using the 3-bit hardware subaddress (A0, A1, and A2) and the programmable I2C-bus slave address (SA0). Table 18. Addressing cascaded PCF8576C Cluster Bit SA0 Pin A2 Pin A1 Pin A0 Device 1 0 0 0 0 0 0 0 1 1 0 1 0 2 0 1 1 3 1 0 0 4 1 0 1 5 1 1 0 6 2 1 1 1 1 7 0 0 0 8 0 0 1 9 0 1 0 10 0 1 1 11 1 0 0 12 1 0 1 13 1 1 0 14 1 1 1 15 Cascaded PCF8576Cs are synchronized. They can share the backplane signals from one of the devices in the cascade. Such an arrangement is cost-effective in large LCD applications since the backplane outputs of only one device must be through-plated to the backplane electrodes of the display. The other PCF8576C of the cascade contribute additional segment outputs. The backplanes can either be connected together to enhance the drive capability, some can be left open-circuit (as shown in Figure 30) or just some of one and some of the other device can be taken to facilitate the layout of the display. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 37 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 9'' 9/&' 6'$ VHJPHQWGULYHV 6&/ /&'3$1(/ 6<1& 3&)& &/. %3WR%3 RSHQFLUFXLW 26& $ $ $ XSWR HOHPHQWV 6$2 966 9/&' 9'' 5 +267 0,&52 352&(6625 0,&52 &21752//(5 WU &E 9'' 9/&' VHJPHQWGULYHV 6'$ 6&/ 3&)& 6<1& %3WR%3 26& 966 EDFNSODQHV &/. $ $ $ 6$ 966 DDD Fig 30. Cascaded PCF8576C configuration The SYNC line is provided to maintain the correct synchronization between all cascaded PCF8576Cs. This synchronization is guaranteed after the power-on reset. The only time that SYNC is likely to be needed is if synchronization is accidentally lost (e.g. by noise in adverse electrical environments; or by the defining a multiplex mode when PCF8576Cs with differing SA0 levels are cascaded). SYNC is organized as an input/output pin; the output selection being realized as an open-drain driver with an internal pull-up resistor. A PCF8576C asserts the SYNC line and monitors the SYNC line at all other times. If synchronization in the cascade is lost, it is restored by the first PCF8576C to assert SYNC. The timing relationship between the backplane waveforms and the SYNC signal for the various drive modes of the PCF8576C are shown in Figure 31. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 38 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 7IU IIU %3 6<1& D VWDWLFGULYHPRGH %3 ELDV %3 ELDV 6<1& E PXOWLSOH[GULYHPRGH %3 ELDV 6<1& F PXOWLSOH[GULYHPRGH %3 ELDV 6<1& G PXOWLSOH[GULYHPRGH PJO Excessive capacitive coupling between SCL or CLK and SYNC causes erroneous synchronization. If this is a problem, you can increase the capacitance of the SYNC line (e.g. by an external capacitor between SYNC and VDD.) Degradation of the positive edge of the SYNC pulse can be countered by an external pull-up resistor. Fig 31. Synchronization of the cascade for the various PCF8576C drive modes PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 39 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 6'$ 6&/ 6<1& &/. 9'' 966 9/&' 6'$ 6 6 6&/ 6 6 6<1& 6 6 &/. 6 6 9'' 6 6 26& 6 6 $ 6 6 $ 6 6 $ 6 6 6$ 6 6 966 6 6 9/&' 6 6 %3 6 %3 6 %3 6 %3 6 %3 6 %3 6 %3 6 %3 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 RSHQ 3&)&7 6 6 6 6 6 6 6 6 VHJPHQWV EDFNSODQHV 3&)&7 6 6 6 6 PEH Fig 32. Single plane wiring of packaged PCF8576CT PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 40 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 14. Package outline /4)3SODVWLFORZSURILOHTXDGIODWSDFNDJHOHDGVERG\[[PP 627 F \ ; $ =( H ( +( $ $ $ $ Z0 ES SLQLQGH[ /S / GHWDLO; H =' Z0 ES Y 0 $ ' % +' Y 0 % PP VFDOH ',0(16,216 PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ PP $ $ $ ES F ' ( +' H +( / /S Y Z \ =' =( R R 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 5()(5(1&(6 287/,1( 9(56,21 ,(& -('(& 627 ( 06 -(,7$ (8523($1 352-(&7,21 ,668('$7( Fig 33. Package outline SOT314-2 (LQFP64) of PCF8576CHL/1 PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 41 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 962SODVWLFYHU\VPDOORXWOLQHSDFNDJHOHDGV 627 ' ( $ ; F \ +( Y 0 $ = 4 $ $ $ $ SLQLQGH[ /S / GHWDLO; Z 0 ES H PP VFDOH ',0(16,216 LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV 81,7 $ PD[ $ $ $ ES PP LQFKHV F ' ( H +( / /S 4 Y Z \ = R R 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPP LQFK PD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFLQWHUOHDGSURWUXVLRQVRIPP LQFK PD[LPXPSHUVLGHDUHQRWLQFOXGHG 287/,1( 9(56,21 5()(5(1&(6 ,(& -('(& -(,7$ (8523($1 352-(&7,21 ,668('$7( 627 Fig 34. Package outline SOT190-1 (VSO56) of PCF8576CT/1 PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 42 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 15. Bare die outline %DUHGLHEXPSV[[PP 3&)&8 ' & H ; [ ( \ & ) < / $ $ $ E GHWDLO; GHWDLO< 'LPHQVLRQV 8QLW PP PP VFDOH $ $ $ E ' ( PD[ QRP PLQ H / 1RWH 'LPHQVLRQQRWGUDZQWRVFDOH 0DUNLQJFRGH3&& 2XWOLQH YHUVLRQ SFIFXBBGR 5HIHUHQFHV ,(& -('(& -(,7$ (XURSHDQ SURMHFWLRQ ,VVXHGDWH 3&)&8 Fig 35. Bare die outline of PCF8576CU/2/F2 PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 43 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates :LUHERQGGLHERQGLQJSDGV[[PP 3&)&8 ' $ & H ; [ ( \ & ) 3 3 3 3 GHWDLO; VFDOH 'LPHQVLRQV 8QLW PP PP $ ' PD[ QRP PLQ ( H 3 3 3 3 1RWH 3DGVL]H 3DVVLYDWLRQRSHQLQJ 'LPHQVLRQQRWGUDZQWRVFDOH 0DUNLQJFRGH3&& 2XWOLQH YHUVLRQ SFIFXBGR 5HIHUHQFHV ,(& -('(& -(,7$ (XURSHDQ SURMHFWLRQ ,VVXHGDWH 3&)&8 Fig 36. Bare die outline of PCF8576CU/F1 PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 44 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates Table 19. Pad and bump description for PCF8576CU All x/y coordinates represent the position of the center of each pad with respect to the center (x/y = 0) of the chip. PCF8576C Product data sheet Symbol Pad X (m) Y (m) Description SDA 1 74 1380 I2C-bus serial data input/output SCL 2 148 1380 I2C-bus serial clock input SYNC 3 355 1380 cascade synchronization input/output CLK 4 534 1380 external clock input/output VDD 5 742 1380 supply voltage OSC 6 913 1380 internal oscillator enable input A0 7 1087 1380 subaddress input A1 8 1290 1284 subaddress input A2 9 1290 1116 subaddress input SA0 10 1290 945 subaddress input VSS 11 1290 751 logic ground VLCD 12 1290 485 LCD supply voltage BP0 13 1290 125 LCD backplane output BP2 14 1290 285 LCD backplane output BP1 15 1290 458 LCD backplane output BP3 16 1290 618 LCD backplane output S0 17 1290 791 LCD segment output S1 18 1290 951 LCD segment output S2 19 1290 1124 LCD segment output S3 20 1290 1284 LCD segment output S4 21 1074 1380 LCD segment output S5 22 914 1380 LCD segment output S6 23 741 1380 LCD segment output S7 24 581 1380 LCD segment output S8 25 408 1380 LCD segment output S9 26 248 1380 LCD segment output S10 27 75 1380 LCD segment output S11 28 85 1380 LCD segment output S12 29 258 1380 LCD segment output S13 30 418 1380 LCD segment output S14 31 591 1380 LCD segment output S15 32 751 1380 LCD segment output S16 33 924 1380 LCD segment output S17 34 1084 1380 LCD segment output S18 35 1290 1243 LCD segment output S19 36 1290 1083 LCD segment output S20 37 1290 910 LCD segment output S21 38 1290 750 LCD segment output S22 39 1290 577 LCD segment output All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 45 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates Table 19. Pad and bump description for PCF8576CU All x/y coordinates represent the position of the center of each pad with respect to the center (x/y = 0) of the chip. Symbol Pad X (m) Y (m) Description S23 40 1290 417 LCD segment output S24 41 1290 244 LCD segment output S25 42 1290 84 LCD segment output S26 43 1290 89 LCD segment output S27 44 1290 249 LCD segment output S28 45 1290 422 LCD segment output S29 46 1290 582 LCD segment output S30 47 1290 755 LCD segment output S31 48 1290 915 LCD segment output S32 49 1290 1088 LCD segment output S33 50 1290 1248 LCD segment output S34 51 1083 1380 LCD segment output S35 52 923 1380 LCD segment output S36 53 750 1380 LCD segment output S37 54 590 1380 LCD segment output S38 55 417 1380 LCD segment output S39 56 257 1380 LCD segment output Table 20. PCF8576C Product data sheet Alignment marks Symbol X (m) Y (m) C1 1290 1385 C2 1295 1385 F 1305 1405 All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 46 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 16. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent standards. 17. Packing information 17.1 Tray information Tray information for the PCF8576CU/F1 and PCF8576CU/2/F2 is shown in Figure 37, Figure 38 and Table 21. & - $ + [ % $ $ . ) ( ' \ \ [ * ) ( & 2 1 / 0 6(&7,21$$ ; 'LPHQVLRQVLQPP GHWDLO; DDD Fig 37. Tray details PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 47 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates Table 21. Description of tray details Tray details are shown in Figure 37. Tray details Dimensions A B C D E F G H J K L M N O Unit 4.4 4.4 3.02 3.3 50.8 45.72 39.6 5.6 5.6 39.6 3.96 2.18 2.49 0.5 mm Number of pockets x direction y direction 10 10 PDUNLQJFRGH DDD Fig 38. Tray alignment PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 48 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 18. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description". 18.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 18.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: * Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: * * * * * * Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 18.3 Wave soldering Key characteristics in wave soldering are: * Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave * Solder bath specifications, including temperature and impurities PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 49 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 18.4 Reflow soldering Key characteristics in reflow soldering are: * Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 39) than a SnPb process, thus reducing the process window * Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board * Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 22 and 23 Table 22. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 < 2.5 235 220 2.5 220 220 Table 23. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 39. PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 50 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 39. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description". PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 51 of 62 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors PCF8576C Product data sheet 19. Appendix 19.1 LCD segment driver selection Table 24. Selection of LCD segment drivers Type name Number of elements at MUX VDD (V) VLCD (V) ffr (Hz) 1:1 1:2 1:3 1:4 1:6 1:8 1:9 VLCD (V) VLCD (V) Tamb (C) charge temperature pump compensat. Interface Package AECQ100 PCA8561AHN[5] 18 36 54 72 - - - 1.8 to 5.5 1.8 to 5.5 32 to 256[1] N N 40 to 105 I2C HVQFN32 Y PCA8561BHN[5] 18 36 54 72 - - - 1.8 to 5.5 1.8 to 5.5 32 to 256[1] N N 40 to 105 SPI HVQFN32 Y PCF8566TS 24 48 72 96 - - - 2.5 to 6 N N 40 to 85 I2C VSO40 N 40 to 85 I2C TSSOP48 N I2C TSSOP48 Y PCF85162T 32 64 96 128 - - - 2.5 to 6 69 1.8 to 5.5 2.5 to 6.5 82 N N 32 64 96 128 - - - 1.8 to 5.5 2.5 to 8 110 N N 40 to 95 PCA85262ATT 32 64 96 128 - - - 1.8 to 5.5 2.5 to 8 200 N N 40 to 105 I2C TSSOP48 Y TSSOP48 N TSSOP48 N PCF8551ATT[5] PCF8551BTT[5] 36 36 72 72 108 144 108 144 - - - 1.8 to 5.5 1.8 to 5.5 32 to 128[1] N N 40 to 85 I2C 1.8 to 5.5 1.8 to 5.5 32 to 128[1] N N 40 to 85 SPI 256[1] I2C TSSOP48 Y PCA8551ATT[5] 36 72 108 144 - - - 1.8 to 5.5 1.8 to 5.5 32 to N N 40 to 105 PCA8551BTT[5] 36 72 108 144 - - - 1.8 to 5.5 1.8 to 5.5 32 to 256[1] N N 40 to 105 SPI TSSOP48 Y PCF85176T 40 80 120 160 - - - 1.8 to 5.5 2.5 to 6.5 82 N N 40 to 85 I2C TSSOP56 N N 40 to 95 I2C TSSOP56 Y N N 40 to 105 I2C TSSOP56 Y N N 40 to 85 I2C TQFP64 N N 40 to 95 I2C TQFP64 Y TSSOP56 N PCA85176T 40 80 120 160 - - - 1.8 to 5.5 2.5 to 8 110 PCA85276ATT 40 80 120 160 - - - 1.8 to 5.5 2.5 to 8 PCF85176H 40 80 120 160 - - - 1.8 to 5.5 2.5 to 6.5 82 PCA85176H PCF8553ATT[5] 40 40 80 80 120 160 120 160 - - - 1.8 to 5.5 2.5 to 8 N 200 82 N 1.8 to 5.5 1.8 to 5.5 32 to 128[1] N N 40 to 85 I2C 128[1] 40 80 120 160 - - - 1.8 to 5.5 1.8 to 5.5 32 to N N 40 to 85 SPI TSSOP56 N PCA8553ATT[5] 40 80 120 160 - - - 1.8 to 5.5 1.8 to 5.5 32 to 256[1] N N 40 to 105 I2C TSSOP56 Y - 1.8 to 5.5 1.8 to 5.5 32 to 256[1] N N 40 to 105 SPI TSSOP56 Y 1.8 to 5.5 2.5 to 9 60 to 300[1] N N 40 to 95 I2C TSSOP56 Y 300[1] N N 40 to 95 SPI TSSOP56 Y Y Y[3] 40 to 95 I2C TQFP64 Y Y Y[3] 40 to 95 SPI TQFP64 Y N 40 to 85 I2C LQFP80 N N 40 to 95 I2C LQFP80 Y PCA8553BTT[5] PCA8546ATT 40 - 80 - 120 160 - 176 - - - 52 of 62 (c) NXP B.V. 2013. All rights reserved. PCA8546BTT - - - 176 - - - 1.8 to 5.5 2.5 to 9 60 to PCA8547AHT[5] 44 88 - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300[1] 1.8 to 5.5 2.5 to 9 300[1] PCA8547BHT[5] PCF85134HL PCA85134H 44 60 60 88 - 176 - 120 180 240 120 180 240 - - - 60 to 1.8 to 5.5 2.5 to 6.5 82 1.8 to 5.5 2.5 to 8 82 N N PCF8576C PCF8553BTT[5] Universal LCD driver for low multiplex rates Rev. 13 -- 16 December 2013 All information provided in this document is subject to legal disclaimers. PCA85162T xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Selection of LCD segment drivers ...continued Type name Number of elements at MUX VDD (V) VLCD (V) ffr (Hz) VLCD (V) VLCD (V) Tamb (C) charge temperature pump compensat. 60 to 300[1] Y Y 1:1 1:2 1:3 1:4 1:6 1:8 1:9 40 to 105 I2C LQFP80 Y 120 - 240 - PCF8545ATT - - - 176 252 320 - 1.8 to 5.5 2.5 to 5.5 60 to 300[1] N N 40 to 85 I2C TSSOP56 N PCF8545BTT - - - 176 252 320 - 1.8 to 5.5 2.5 to 5.5 60 to 300[1] N N 40 to 85 SPI TSSOP56 N 176 252 320 - 60 to 300[1] N N 40 to 85 I2C TSSOP56 N 300[1] - - 2.5 to 5.5 2.5 to 9 AECQ100 60 - - Package PCA8543AHL PCF8536AT[4] - Interface 1.8 to 5.5 2.5 to 9 PCF8536BT[4] - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to N N 40 to 85 SPI TSSOP56 N PCA8536AT[4] - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300[1] N N 40 to 95 I2C TSSOP56 Y 1.8 to 5.5 2.5 to 9 60 to 300[1] N N 40 to 95 SPI TSSOP56 Y 60 to 300[1] Y Y[3] 40 to 85 I2C TQFP64 300[1] PCA8536BT[4] PCF8537AH 44 88 - 176 252 320 176 276 352 - 1.8 to 5.5 2.5 to 9 N 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to Y 40 to 85 SPI TQFP64 N PCA8537AH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] Y Y[3] 40 to 95 I2C TQFP64 Y PCA8537BH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] Y Y[3] 40 to 95 SPI TQFP64 Y 2.5 to 5.5 2.5 to 9 60 to 300[1] Y Y[3] 40 to 105 I2C LQFP80 Y 60 to 300[1] Y Y[3] 40 to 105 I2C bare die Y - 1.8 to 5.5 1.8 to 5.5 32 to 128[1] N N 40 to 85 I2C, SPI bare die N - 256[1] N 40 to 105 I2C, bare die Y N 40 to 85 I2C bare die N I2C 60 120 - PCA9620U 60 120 - PCF8552DUG[5] 36 72 PCA8552DUG[5] PCF8576DU 36 40 72 80 240 320 480 240 320 480 - 108 144 108 144 120 160 - - - 2.5 to 5.5 2.5 to 9 1.8 to 5.5 1.8 to 5.5 32 to 1.8 to 5.5 2.5 to 6.5 77 N N SPI PCF8576EUG 40 80 120 160 - - - 1.8 to 5.5 2.5 to 6.5 77 N N 40 to 85 bare die N PCA8576FUG 40 80 120 160 - - - 1.8 to 5.5 2.5 to 8 N N 40 to 105 I2C bare die Y N 40 to 85 I2C bare die N N 40 to 95 I2C bare die Y I2C PCF85133U PCA85133U 80 80 160 240 320 160 240 320 - PCA85233U 80 PCA8530DUG[5] 102 204 - PCF85132U 408 - 160 320 480 640 160 320 480 640 - 53 of 62 (c) NXP B.V. 2013. All rights reserved. PCA85232U 160 320 480 640 - PCF8538UG 102 204 - PCA8538UG 102 204 - - - 1.8 to 5.5 2.5 to 6.5 82, 110[2] 1.8 to 5.5 2.5 to 8 110[2] 82, N N 40 to 105 bare die Y Y Y[3] 40 to 105 I2C, SPI bare die Y N 40 to 85 I2C bare die N N 40 to 95 I2C bare die Y N N 40 to 95 I2C bare die Y Y Y[3] 40 to 85 I2C, SPI[2] bare die N Y Y[3] 40 to 105 I2C, Y - 1.8 to 5.5 2.5 to 8 150, - - 2.5 to 5.5 4 to 12 45 to 300[1] - - 1.8 to 5.5 1.8 to 8 1.8 to 5.5 1.8 to 8 1.8 to 5.5 1.8 to 8 60 to 90[1] 60 to 90[1] 117 to 176[1] 408 612 816 918 2.5 to 5.5 4 to 12 45 to 300[1] 408 612 816 918 2.5 to 5.5 4 to 12 300[1] [1] Can be selected by command. [2] Can be selected by pin configuration. 45 to N 220[2] - N N N SPI[2] bare die PCF8576C PCA85132U 160 240 320 - - 200 Universal LCD driver for low multiplex rates Rev. 13 -- 16 December 2013 All information provided in this document is subject to legal disclaimers. PCF8537BH Y[3] PCA9620H NXP Semiconductors PCF8576C Product data sheet Table 24. xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Extra feature: Temperature sensor. [4] Extra feature: 6 PWM channels. [5] In development. NXP Semiconductors PCF8576C Product data sheet [3] PCF8576C 54 of 62 (c) NXP B.V. 2013. All rights reserved. Universal LCD driver for low multiplex rates Rev. 13 -- 16 December 2013 All information provided in this document is subject to legal disclaimers. PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 20. Abbreviations Table 25. PCF8576C Product data sheet Abbreviations Acronym Description CDM Charged-Device Model DC Direct Current HBM Human Body Model I2C Inter-Integrated Circuit IC Integrated Circuit LCD Liquid Crystal Display LSB Least Significant Bit MM Machine Model MOS Metal-Oxide Semiconductor MSB Most Significant Bit MSL Moisture Sensitivity Level PCB Printed-Circuit Board POR Power-On Reset RC Resistance-Capacitance RAM Random Access Memory RMS Root Mean Square SCL Serial CLock line SDA Serial DAta line SMD Surface-Mount Device All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 55 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 21. References [1] AN10170 -- Design guidelines for COG modules with NXP monochrome LCD drivers [2] AN10365 -- Surface mount reflow soldering description [3] AN10706 -- Handling bare die [4] AN11267 -- EMC and system level ESD design guidelines for LCD drivers [5] IEC 60134 -- Rating systems for electronic tubes and valves and analogous semiconductor devices [6] IEC 61340-5 -- Protection of electronic devices from electrostatic phenomena [7] IPC/JEDEC J-STD-020D -- Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices [8] JESD22-A114 -- Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM) [9] JESD22-A115 -- Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM) [10] JESD22-C101 -- Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components [11] JESD78 -- IC Latch-Up Test [12] UM10204 -- I2C-bus specification and user manual [13] UM10569 -- Store and transport requirements PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 56 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 22. Revision history Table 26. Revision history Document ID Release date Data sheet status Change notice Supersedes PCF8576C v.13 20131216 Product data sheet - PCF8576C v.12 Modifications: * * Changed product ordering information Enhanced the description of connecting segment and backplane outputs in a cascade (Section 13) PCF8576C v.12 20130716 Product data sheet - PCF8576C v.11 PCF8576C v.11 20120330 Product data sheet - PCF8576C v.10 PCF8576C v.10 20100722 Product data sheet - PCF8576C v.9 PCF8576C v.9 20090709 Product data sheet - PCF8576C v.8 PCF8576C v.8 20041122 Product specification - PCF8576C v.7 PCF8576C v.7 20011002 Product specification - PCF8576C v.6 PCF8576C v.6 19980730 Product specification - PCF8576C v.5 PCF8576C v.5 19971114 Product specification - PCF8576C v.4 PCF8576C v.4 19970402 Product specification - PCF8576C v.3 PCF8576C v.3 19970203 Product specification - PCF8576C v.2 PCF8576C v.2 19961209 Product specification - PCF8576C v.1 PCF8576C v.1 19950630 Product specification - - PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 57 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 23. Legal information 23.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 23.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 23.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCF8576C Product data sheet Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 58 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. Translations -- A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Bare die -- All die are tested on compliance with their related technical specifications as stated in this data sheet up to the point of wafer sawing and are handled in accordance with the NXP Semiconductors storage and transportation conditions. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post-packing tests performed on individual die or wafers. NXP Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, NXP Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. All die sales are conditioned upon and subject to the customer entering into a written die sale agreement with NXP Semiconductors through its legal department. 23.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of NXP B.V. 24. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 59 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 25. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Ordering information . . . . . . . . . . . . . . . . . . . . .2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2 Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .7 Selection of possible display configurations . . . .8 Biasing characteristics . . . . . . . . . . . . . . . . . . .10 LCD frame frequencies [1] . . . . . . . . . . . . . . . .18 Blink frequencies . . . . . . . . . . . . . . . . . . . . . . .23 Definition of PCF8576C commands . . . . . . . . .27 Mode-set command bit description . . . . . . . . .28 Load-data-pointer command bit description . . .28 Device-select command bit description . . . . . .28 Bank-select command bit description . . . . . . .29 Blink-select command bit description . . . . . . . .29 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .31 Static characteristics . . . . . . . . . . . . . . . . . . . .32 Dynamic characteristics . . . . . . . . . . . . . . . . . .35 Addressing cascaded PCF8576C . . . . . . . . . .37 Pad and bump description for PCF8576CU . . .45 Alignment marks . . . . . . . . . . . . . . . . . . . . . . . .46 Description of tray details . . . . . . . . . . . . . . . . .48 SnPb eutectic process (from J-STD-020D) . . .50 Lead-free process (from J-STD-020D) . . . . . .50 Selection of LCD segment drivers . . . . . . . . . .52 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .55 Revision history . . . . . . . . . . . . . . . . . . . . . . . .57 PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 60 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 26. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Fig 16. Fig 17. Fig 18. Fig 19. Fig 20. Fig 21. Fig 22. Fig 23. Fig 24. Fig 25. Fig 26. Fig 27. Fig 28. Fig 29. Fig 30. Fig 31. Fig 32. Fig 33. Fig 34. Fig 35. Fig 36. Fig 37. Fig 38. Fig 39. Block diagram of PCF8576C . . . . . . . . . . . . . . . . .3 Pin configuration for LQFP64 (PCF8576CHL/1) . .4 Pin configuration for VSO56 (PCF8576CT/1) . . . .5 Pin locations of PCF8576CU/F1 and PCF8576CU/2/F2 . . . . . . . . . . . . . . . . . . . . . . . . .6 Example of displays suitable for PCF8576C . . . . .8 Typical system configuration . . . . . . . . . . . . . . . . .9 Electro-optical characteristic: relative transmission curve of the liquid . . . . . . . . . . . . . .12 Static drive mode waveforms . . . . . . . . . . . . . . . .13 Waveforms for the 1:2 multiplex drive mode with 12 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Waveforms for the 1:2 multiplex drive mode with 13 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Waveforms for the 1:3 multiplex drive mode with 13 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Waveforms for the 1:4 multiplex mode with 13 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Display RAM bit map . . . . . . . . . . . . . . . . . . . . . .20 Relationship between LCD layout, drive mode, display RAM filling order, and display data transmitted over the I2C-bus . . . . . . . . . . . . . . . .21 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Definition of START and STOP conditions. . . . . .24 System configuration . . . . . . . . . . . . . . . . . . . . . .25 Acknowledgement of the I2C-bus . . . . . . . . . . . .25 I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . .27 General format of the command byte . . . . . . . . .27 Device protection diagram . . . . . . . . . . . . . . . . . .30 ISS as a function of ffr . . . . . . . . . . . . . . . . . . . . . .33 IDD(LCD) as a function of ffr . . . . . . . . . . . . . . . . . .33 ISS as a function of VDD . . . . . . . . . . . . . . . . . . . .34 IDD(LCD) as a function of VDD . . . . . . . . . . . . . . . .34 RO(max) as a function of VDD . . . . . . . . . . . . . . . . .34 RO(max) as a function of Tamb . . . . . . . . . . . . . . . .34 Driver timing waveforms . . . . . . . . . . . . . . . . . . .36 I2C-bus timing waveforms . . . . . . . . . . . . . . . . . .36 Cascaded PCF8576C configuration . . . . . . . . . .38 Synchronization of the cascade for the various PCF8576C drive modes . . . . . . . . . . . . . . . . . . .39 Single plane wiring of packaged PCF8576CT . . .40 Package outline SOT314-2 (LQFP64) of PCF8576CHL/1 . . . . . . . . . . . . . . . . . . . . . . . . . .41 Package outline SOT190-1 (VSO56) of PCF8576CT/1 . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Bare die outline of PCF8576CU/2/F2 . . . . . . . . .43 Bare die outline of PCF8576CU/F1 . . . . . . . . . . .44 Tray details . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Tray alignment . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Temperature profiles for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 PCF8576C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 13 -- 16 December 2013 (c) NXP B.V. 2013. All rights reserved. 61 of 62 PCF8576C NXP Semiconductors Universal LCD driver for low multiplex rates 27. Contents 1 2 3 3.1 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.3.1 7.4 7.4.1 7.4.2 7.4.3 7.4.4 7.5 7.5.1 7.5.2 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.14.1 7.14.2 7.15 7.16 7.16.1 7.16.2 7.16.3 7.16.4 7.16.5 7.16.6 7.17 7.18 7.18.1 7.18.2 7.18.3 7.18.4 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 Functional description . . . . . . . . . . . . . . . . . . . 8 Power-On-Reset (POR) . . . . . . . . . . . . . . . . . . 9 LCD bias generator . . . . . . . . . . . . . . . . . . . . . 9 LCD voltage selector . . . . . . . . . . . . . . . . . . . . 9 Electro-optical performance . . . . . . . . . . . . . . 11 LCD drive mode waveforms . . . . . . . . . . . . . . 13 Static drive mode . . . . . . . . . . . . . . . . . . . . . . 13 1:2 Multiplex drive mode. . . . . . . . . . . . . . . . . 14 1:3 Multiplex drive mode. . . . . . . . . . . . . . . . . 16 1:4 multiplex drive mode. . . . . . . . . . . . . . . . . 17 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Internal clock . . . . . . . . . . . . . . . . . . . . . . . . . 18 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 18 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Display register . . . . . . . . . . . . . . . . . . . . . . . . 19 Shift register . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Segment outputs. . . . . . . . . . . . . . . . . . . . . . . 19 Backplane outputs . . . . . . . . . . . . . . . . . . . . . 19 Display RAM . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Sub-address counter . . . . . . . . . . . . . . . . . . . 22 Bank selector . . . . . . . . . . . . . . . . . . . . . . . . . 23 Output bank selector . . . . . . . . . . . . . . . . . . . 23 Input bank selector . . . . . . . . . . . . . . . . . . . . . 23 Blinking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Characteristics of the I2C-bus. . . . . . . . . . . . . 24 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 START and STOP conditions . . . . . . . . . . . . . 24 System configuration . . . . . . . . . . . . . . . . . . . 24 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 25 PCF8576C I2C-bus controller . . . . . . . . . . . . . 26 Input filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 26 Command decoder . . . . . . . . . . . . . . . . . . . . . 27 Mode-set command . . . . . . . . . . . . . . . . . . . . 28 Load-data-pointer command. . . . . . . . . . . . . . 28 Device-select command . . . . . . . . . . . . . . . . . 28 Bank-select command . . . . . . . . . . . . . . . . . . 29 7.18.5 Blink-select command . . . . . . . . . . . . . . . . . . 29 7.19 Display controller . . . . . . . . . . . . . . . . . . . . . . 29 8 Internal circuitry . . . . . . . . . . . . . . . . . . . . . . . 30 9 Safety notes. . . . . . . . . . . . . . . . . . . . . . . . . . . 30 10 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 31 11 Static characteristics . . . . . . . . . . . . . . . . . . . 32 11.1 Typical supply current characteristics . . . . . . 33 11.2 Typical LCD output characteristics. . . . . . . . . 34 12 Dynamic characteristics. . . . . . . . . . . . . . . . . 35 13 Application information . . . . . . . . . . . . . . . . . 37 13.1 Cascaded operation. . . . . . . . . . . . . . . . . . . . 37 14 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 41 15 Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 43 16 Handling information . . . . . . . . . . . . . . . . . . . 47 17 Packing information . . . . . . . . . . . . . . . . . . . . 47 17.1 Tray information . . . . . . . . . . . . . . . . . . . . . . . 47 18 Soldering of SMD packages . . . . . . . . . . . . . . 49 18.1 Introduction to soldering. . . . . . . . . . . . . . . . . 49 18.2 Wave and reflow soldering. . . . . . . . . . . . . . . 49 18.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 49 18.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 50 19 Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 19.1 LCD segment driver selection . . . . . . . . . . . . 52 20 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 55 21 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . 57 23 Legal information . . . . . . . . . . . . . . . . . . . . . . 58 23.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 58 23.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 23.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 58 23.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 59 24 Contact information . . . . . . . . . . . . . . . . . . . . 59 25 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 26 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 27 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 December 2013 Document identifier: PCF8576C Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: NXP: PCF8576CT/1,112 PCF8576CT/1,118 PCF8576CTT/1,118 PCF8576CHL/1,157 PCF8576CHL/1,118 PCF8576CT/S480/1,1 PCF8576CU/F1,026 PCF8576CU/2/F2,026 PCF8576CT/1,518