CYBLE-222014-01
EZ-BLE™ Creator Module
Cypress Semiconductor Corporation 198 Champion Court San Jose,CA 95134-1709 408-943-2600
Document Number: 002-11186 Rev. *G Revised March 7, 2018
General Description
The Cypress CYBLE-222014-01 is a fully certified and qualified
module supporting Bluetooth Low Energy (BLE) 4.2 wireless
communication. The CYBLE-222014-01 is a turnkey solution
and includes onboard crystal oscillators, chip antenna, passive
components, and Cypress PSoC 4 BLE. Refer to the PSoC 4
BLE datasheet for additional details on the capabilities of the
BLE device used on this module.
The CYBLE-222014-01 supports a number of peripheral
functions (ADC, timers, counters, PWM) and serial
communication protocols (I2C, UART, SPI) through its
programmable architecture. The CYBLE-222014-01 includes a
royalty-free BLE stack compatible with Bluetooth 4.2 and
provides up to 16 GPIOs in a small 10 × 10 × 1.80 mm package.
The CYBLE-222014-01 is drop-in compatible with the
CYBLE-022001-00 (128KB BT 4.1) and CYBLE-222005-00
(256KB BT 4.1).
Module Description
■Module size: 10.0 mm ×10.0 mm × 1.80 mm (with shield)
■256-KB flash memory, 32-KB SRAM memory
■Up to 16 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output
■Bluetooth 4.2 qualified single-mode module
❐QDID: 82978
❐Declaration ID: D030801
■Certified to FCC, CE MIC, KC, and ISED regulations
■Eight-channel direct memory access (DMA) controller
■32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
■Industrial temperature range: –40 °C to +85 °C
■Watchdog timer with dedicated internal low-speed oscillator
(ILO)
■Two-pin SWD for programming
Power Consumption
■TX output power: –18 dbm to +3 dbm
■Received signal strength indicator (RSSI) with 1-dB resolution
■TX current consumption of 15.6 mA (radio only, 0 dbm)
■RX current consumption of 16.4 mA (radio only)
■Low power mode support
❐Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
❐Hibernate: 150 nA with SRAM retention
❐Stop: 60 nA with XRES wakeup
Functional Capabilities
■Up to 15 capacitive sensors for buttons or sliders with
best-in-class signal-to-noise ration (SNR) and liquid tolerance
■12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
■Two serial communication blocks (SCBs) supporting I2C
(master/slave), SPI (master/slave), or UART
■Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
■Programmable low-voltage detect (LVD) from 1.8 V to 4.5 V
■I2S master interface
■Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
■Switches between Central and Peripheral roles on-the-go
■Standard Bluetooth Low Energy profiles and services for
interoperability
■Custom profile and service for specific use cases
Benefits
The CYBLE-222014-01 module is provided as a turnkey
solution, including all necessary hardware required to use BLE
communication standards.
■Proven, qualified, and certified hardware design ready to use
■Small footprint (10 × 10 mm × 1.80 mm), perfect for space
constrained applications
■Reprogrammable architecture
■Fully certified module eliminates the time needed for design,
development and certification processes
■Bluetooth SIG qualified with QDID and Declaration ID
■Flexible communication protocol support
■PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 2 of 37
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to
quickly and effectively integrate the module into your design.
■Overview: EZ-BLE Module Portfolio, Module Roadmap
■PSoC 4 BLE Silicon Datasheet
■Application notes: Cypress offers a number of BLE application
notes covering a broad range of topics, from basic to advanced
level. Recommended application notes for getting started with
EZ-BLE modules are:
❐AN96841 - Getting Started with EZ-BLE Module
❐AN91267 - Getting Started with PSoC® 4 BLE
❐AN97060 - PSoC® 4 BLE and PRoC™ BLE - Over-The-Air
(OTA) Device Firmware Upgrade (DFU) Guide
❐AN91162 - Creating a BLE Custom Profile
❐AN91184 - PSoC 4 BLE - Designing BLE Applications
❐AN92584 - Designing for Low Power and Estimating Battery
Life for BLE Applications
❐AN85951 - PSoC® 4 CapSense® Design Guide
❐AN95089 - PSoC® 4/PRoC™ BLE Crystal Oscillator Selec-
tion and Tuning Techniques
❐AN91445 - Antenna Design and RF Layout Guidelines
■Technical Reference Manual (TRM):
❐PRoC® BLE Technical Reference Manual
■Knowledge Base Articles
❐KBA212312 - Pin Mapping Differences Between the
EZ-BLE™ Creator Evaluation Board (CYBLE-222014-EVAL)
and the BLE Pioneer Kit (CY8CKIT-042-BLE)
❐KBA97095 - EZ-BLE™ Module Placement
❐KBA210559 - RF Regulatory Certifications for EZ-BLE™
Creator Module CYBLE-222014-01
❐KBA213976 - FAQ for BLE and Regulatory Certifications with
EZ-BLE modules
❐KBA210802 - Queries on BLE Qualification and Declaration
Processes
❐KBA2108122 - 3D Model Files for EZ-BLE/EZ-BT Modules
■Development Kits:
❐CYBLE-222014-EVAL, CYBLE-222014-01 Evaluation Board
❐CY8CKIT-042-BLE, Bluetooth® Low Energy (BLE) Pioneer
Kit
❐CY8CKIT-002, PSoC® MiniProg3 Program and Debug Kit
■Test and Debug Tools:
❐CYSmart, Bluetooth® LE Test and Debug Tool (Windows)
❐CYSmart Mobile, Bluetooth® LE Test and Debug Tool
(Android/iOS Mobile App)
Two Easy-To-Use Design Environments to Get You Started Quickly
PSoC® Creator™ Integrated Design Environment (IDE)
PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and
debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 BLE and EZ-BLE module systems with no code size limitations. PSoC peripherals
are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified, production-ready PSoC
Components™.
PSoC Components are analog and digital “virtual chips,” represented by an icon that users can drag-and-drop into a design and
configure to suit a broad array of application requirements.
Bluetooth Low Energy Component
The Bluetooth Low Energy Component inside PSoC Creator provides a comprehensive GUI-based configuration window that lets you
quickly design BLE applications. The Component incorporates a Bluetooth Core Specification v4.1 compliant BLE protocol stack and
provides API functions to enable user applications to interface with the underlying Bluetooth Low Energy Sub-System (BLESS)
hardware via the stack.
EZ-Serial™ BLE Firmware Platform
The EZ-Serial Firmware Platform provides a simple way to access the most common hardware and communication features needed
in BLE applications. EZ-Serial implements an intuitive API protocol over the UART interface and exposes various status and control
signals through the module’s GPIOs, making it easy to add BLE functionality quickly to existing designs.
Use a simple serial terminal and evaluation kit to begin development without requiring an IDE. Refer to the EZ-Serial web page for
User Manuals and instructions for getting started as well as detailed reference materials.
EZ-BLE modules are pre-flashed with the EZ-Serial Firmware Platform. If you do not have EZ-Serial pre-loaded on your module, you
can download each EZ-BLE module’s firmware images on the EZ-Serial web page.
Technical Support
■Frequently Asked Questions (FAQs): Learn more about our BLE ECO System.
■Forum: See if your question is already answered by fellow developers on the PSoC 4 BLE.
■Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,
you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the prompt.
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 3 of 37
Contents
Overview ............................................................................ 4
Module Description...................................................... 4
Pad Connection Interface ................................................ 6
Recommended Host PCB Layout ...................................7
Digital and Analog Capabilities and Connections ......... 9
Power Supply Connections and Recommended External
Components .................................................................... 10
Connection Options................................................... 10
External Component Recommendation .................... 10
Critical Components List ...........................................12
Antenna Design......................................................... 12
Electrical Specification .................................................. 13
GPIO .........................................................................15
XRES .........................................................................17
Digital Peripherals .....................................................19
Serial Communication ...............................................21
Memory ..................................................................... 22
System Resources .................................................... 22
Environmental Specifications ....................................... 28
Environmental Compliance ....................................... 28
RF Certification ..........................................................28
Safety Certification ....................................................28
Environmental Conditions ......................................... 28
ESD and EMI Protection ........................................... 28
Regulatory Information.................................................. 29
FCC ........................................................................... 29
ISED .......................................................................... 30
European R&TTE Declaration of Conformity ............30
MIC Japan ................................................................. 31
KC Korea ................................................................... 31
Packaging........................................................................ 32
Ordering Information...................................................... 34
Part Numbering Convention ......................................34
Document Conventions ............................................. 35
Document History Page.................................................. 36
Sales, Solutions, and Legal Information ...................... 37
Worldwide Sales and Design Support....................... 37
Products .................................................................... 37
PSoC® Solutions ....................................................... 37
Cypress Developer Community ................................. 37
Technical Support ..................................................... 37
CYBLE-222014-01
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Overview
Module Description
The CYBLE-222014-01 module is a complete module designed to be soldered to the applications main board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE
module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs
should be held within the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1. Module Design Dimensions
See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-222014-01.
Dimension Item Specification
Module dimensions Length (X) 10.00 ± 0.15 mm
Width (Y) 10.00 ± 0.15 mm
Antenna location dimensions Length (X) 7.00 ± 0.15 mm
Width (Y) 5.00 ± 0.15 mm
PCB thickness Height (H) 0.50 ± 0.10 mm
Shield height Height (H) 1.10 ± 0.10 mm
Maximum component height Height (H) 1.30-mm typical (chip antenna)
Total module thickness (bottom of module to highest component) Height (H) 1.80-mm typical
CYBLE-222014-01
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Figure 1. Module Mechanical Drawing
Top View (View from Top)
Bottom View (Seen from Bottom)
Side View
Note
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on
recommended host PCB layout, see “Recommended Host PCB Layout” on page 7.
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Pad Connection Interface
As shown in the bottom view of Figure 1 on page 5, the CYBLE-222014-01 connects to the host board via solder pads on the back
of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-222014-01 module.
Figure 2. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the chip antenna located at the far corner.
This placement minimizes the additional recommended keep out area stated in item 2. Refer to AN96841 for module placement
best practices.
2. To maximize RF performance, the area immediately around the Cypress BLE module chip antenna should contain an additional
keep out area, where no grounding or signal traces are contained. The keep out area applies to all layers of the host board. The
recommended dimensions of the host PCB keep out area are shown in Figure 3 (dimensions are in mm).
Figure 3. Recommended Host PCB Keep Out Area Around the CYBLE-222014-01 Chip Antenna
Table 2. Solder Pad Connection Description
Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch
SP 22 Solder Pads 0.71 mm 0.41 mm 0.76 mm
Host PCB Keep Out Area Around Chip Antenna
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Recommended Host PCB Layout
Figure 4, Figure 5, Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the
CYBLE-222014-01. Dimensions are in millimeters unless otherwise noted. Pad length of 0.91 mm (0.455 mm from center of the pad
on either side) shown in Figure 6 is the minimum recommended host pad length. The host PCB layout pattern can be completed using
either Figure 4, Figure 5, or Figure 6. It is not necessary to use all figures to complete the host PCB layout pattern.
Figure 4. Host Layout Pattern for CYBLE-222014-01 Figure 5. Module Pad Location from Origin
Top View (Seen on Host PCB)
Top View (Seen on Host PCB)
CYBLE-222014-01
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Table 3 provides the center location for each solder pad on the CYBLE-222014-01. All dimensions are referenced to the center of the
solder pad. Refer to Figure 6 for the location of each module solder pad.
Table 3. Module Solder Pad Location Figure 6. Solder Pad Reference Location
Solder Pad
(Center of Pad)
Location (X,Y) from
Orign (mm)
Dimension from
Orign (mils)
1 (0.26, 1.64) (10.24, 64.57)
2 (0.26, 2.41) (10.24, 94.88)
3 (0.26, 3.17) (10.24, 124.80)
4 (0.26, 3.93) (10.24, 154.72)
5 (0.26, 4.69) (10.24, 184.65)
6 (0.26, 5.45) (10.24, 214.57)
7 (0.81, 9.74) (31.89, 383.46)
8 (1.57, 9.74) (61.81, 383.46)
9 (2.34, 9.74) (92.13, 383.46)
10 (3.10, 9.74) (122.05, 383.46)
11 (3.86, 9.74) (151.97, 383.46)
12 (4.62, 9.74) (181.89, 383.46)
13 (5.38, 9.74) (211.81, 383.46)
14 (6.15, 9.74) (242.13, 383.46)
15 (6.91, 9.74) (272.05, 383.46)
16 (7.67, 9.74) (301.97, 383.46)
17 (8.43, 9.74) (331.89, 383.46)
18 (9.19, 9.74) (361.81, 383.46)
19 (9.75, 8.50) (383.86, 334.65)
20 (9.75, 7.74) (383.86, 304.72)
21 (9.75, 6.98) (383.86, 274.80)
22 (9.75, 6.22) (383.86, 244.88)
Top View (Seen on Host PCB)
CYBLE-222014-01
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Digital and Analog Capabilities and Connections
Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on
CYBLE-222014-01, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each
connection is configurable for a single option shown with a ✓.
Table 4. Solder Pad Connection Definitions[2]
Solder Pad
Number
Device
Port Pin UART SPI I2CTCPWM[3,4] Cap-
Sense
WCO
OUT
ECO
OUT LCD SWD GPIO
1GND
[5] Ground Connection
2P4.1
[6] ✓(SCB1_CTS) ✓(SCB1_MISO) ✓(TCPWM0_N) ✓(Sensor/
CTANK)
✓✓
3P5.1✓(SCB1_TX) ✓(SCB1_SCLK) ✓(SCB1_SCL) ✓(TCPWM3_N) ✓✓✓ ✓
4P5.0✓(SCB1_RX) ✓(SCB1_SS0) ✓(SCB1_SDA) ✓(TCPWM3_P) ✓✓✓
5V
DDR Radio Power Supply (1.9 V to 5.5 V)
6V
REF[7] Voltage Reference Input (Optional)
7P1.6
✓(SCB0_RTS) ✓(SCB0_SS0) ✓(TCPWM) ✓(Sensor) ✓✓
8P0.7✓(SCB0_CTS) ✓(SCB0_SCLK) ✓(TCPWM) ✓✓
✓
(SWDCLK)
✓
9P0.4✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM) ✓✓✓ ✓
10 P0.5 ✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM) ✓✓✓
11 GND[5] Ground Connection
12 P0.6 ✓(SCB0_RTS) ✓(SCB0_SS0) ✓(TCPWM) ✓✓✓
(SWDIO)
✓
13 P1.7 ✓(SCB0_CTS) ✓(SCB0_SCLK) ✓(TCPWM) ✓(Sensor) ✓✓
14 VDD Digital Power Supply Input (1.71 V to 5.5 V)
15 XRES External Reset Hardware Connection Input
16 P3.5 ✓(SCB1_TX) ✓(SCB1_SCL) ✓(TCPWM) ✓✓✓
17 P3.4 ✓(SCB1_RX) ✓(SCB1_SDA) ✓(TCPWM) ✓✓✓
18 P3.7 ✓(SCB1_CTS) ✓(TCPWM) ✓✓ ✓ ✓
19 P1.4 ✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM) ✓✓✓
20 P1.5 ✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM) ✓✓✓
21 P3.6 ✓(SCB1_RTS) ✓(TCPWM3_P) ✓✓✓
22 P4.0[8] ✓(SCB1_RTS) ✓(SCB1_MOSI) ✓(TCPWM0_P) ✓(CMOD)✓✓
Notes
2. If the I2S feature is used in the design, the I2S pins shall be dynamically routed to the appropriate available GPIO by PSoC Creator.
3. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.
4. TCPWM connections on ports 0, 1, 2, and 3 can be routed through the Digital Signal Interconnect (DSI) to any of the TCPWM blocks and can be either positive
or negative polarity. TCPWM connections on ports 4 and 5 are direct and can only be used with the specified TCPWM block and polarity specified above.
5. The main board needs to connect both GND connections (Pad 1 and Pad 10) on the module to the common ground of the system.
6. When using the capacitive sensing functionality, Pad 2 (P4.1) can be connected to a CTANK capacitor (located off of Cypress BLE Module). CTan k should be used
if implementing a shield layer on the capacitive sensor. If used, this capacitor should be placed as close to the module as possible.
7. Analog block functionality is augmented for the user with the external VREF input. The internal bandgap may be bypassed with a 1-µF to 10-µF capacitor.
8. When using the capacitive sensing functionality, Pad 21 (P4.0) must be connected to a CMOD capacitor (located off of Cypress BLE Module). The value of this
capacitor is 2.2 nF and should be placed as close to the module as possible.
CYBLE-222014-01
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Power Supply Connections and Recommended External Components
Power Connections
The CYBLE-222014-01 contains two power supply connections,
VDD and VDDR. The VDD connection supplies power for both
digital and analog device operation. The VDDR connection
supplies power for the device radio.
VDD accepts a supply range of 1.71 V to 5.5 V. VDDR accepts
a supply range of 1.9 V to 5.5 V. These specifications can be
found in Table 9. The maximum power supply ripple for both
power connections on the module is 100 mV, as shown in
Table 7.
The power supply ramp rate of VDD must be equal to or greater
than that of VDDR.
Connection Options
Two connection options are available for any application:
1. Single supply: Connect VDD and VDDR to the same supply.
2. Independent supply: Power VDD and VDDR separately.
External Component Recommendation
In either connection scenario, it is recommended to place an
external ferrite bead between the supply and the module
connection. The ferrite bead should be positioned as close as
possible to the module pin connection.
Figure 7 details the recommended host schematic options for a
single supply scenario. The use of one or two ferrite beads will
depend on the specific application and configuration of the
CYBLE-222014-01.
Figure 8 details the recommended host schematic for an
independent supply scenario.
The recommended ferrite bead value is 330 , 100 MHz. (Murata
BLM21PG331SN1D).
Figure 7. Recommended Host Schematic Options for a Single Supply Option
Figure 8. Recommended Host Schematic for an Independent Supply Option
Single Ferrite Bead Option (Seen from Bottom) Two Ferrite Bead Option (Seen from Bottom)
Independent Power Supply Option (Seen from Bottom)
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The CYBLE-222014-01 schematic is shown in Figure 9.
Figure 9. CYBLE-222014-01 Schematic Diagram
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Critical Components List
Table 5 details the critical components used in the CYBLE-222014-01 module.
Table 5. Critical Component List
Antenna Design
Table 6 details the chip antenna used in the CYBLE-222014-01 module. The specifications listed are according to the vendor’s
datasheet. The Cypress module performance improves many of these characteristics. For more information, see Table 8.
Table 6. Chip Antenna Specifications
Component Reference Designator Description
Silicon U1 76-pin WLCSP PSoC 4 BLE
Crystal Y1 24.000 MHz, 10PF
Crystal Y2 32.768 kHz, 12.5PF
Antenna E1 2.4 GHz–2.5 GHz chip antenna
Item Description
Chip Antenna Manufacturer Johanson Technology Inc.
Chip Antenna Part Number 2450AT18B100
Frequency Range 2400–2500 MHz
Peak Gain 0.5-dBi typical
Average Gain –0.5-dBi typical
Return Loss 9.5-dB minimum
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Electrical Specification
Table 7 details the absolute maximum electrical characteristics for the Cypress BLE module.
Table 7. CYBLE-222014-01 Absolute Maximum Ratings
Table 8 details the RF characteristics for the Cypress BLE module.
Table 8. CYBLE-222014-01 RF Performance Characteristics
Table 9 through Ta ble 48 list the module level electrical characteristics for the CYBLE-222014-01. All specifications are valid for –
40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted.
Parameter Description Min Typ Max Units Details/Conditions
VDDD_ABS Analog, digital, or radio supply relative to VSS
(VSSD = VSSA)–0.5 – 6 V Absolute maximum
VCCD_ABS Direct digital core voltage input relative to VSSD –0.5 – 1.95 V Absolute maximum
VDDD_RIPPLE Maximum power supply ripple for VDD and VDDR
input voltage – – 100 mV
3.0-V supply
Ripple frequency of 100 kHz
to 750 kHz
VGPIO_ABS GPIO voltage –0.5 – VDD +0.5 V Absolute maximum
IGPIO_ABS Maximum current per GPIO –25 – 25 mA Absolute maximum
IGPIO_injection GPIO injection current: Maximum for VIH > VDD
and minimum for VIL < VSS –0.5 – 0.5 mA Absolute maximum current
injected per pin
LU Pin current for latch up –200 200 mA –
Parameter Description Min Typ Max Units Details/Conditions
RFO RF output power on ANT –18 0 3 dBm Configurable via register
settings
RXSRF receive sensitivity on ANT – –87 – dBm Guaranteed by design
simulation
FRModule frequency range 2400 – 2480 MHz –
GPPeak gain – 0.5 – dBi –
GAvg Average gain – –0.5 – dBi –
RL Return loss – –10.5 – dB –
Table 9. CYBLE-222014-01 DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
VDD1 Power supply input voltage 1.8 – 5.5 V With regulator enabled
VDD2 Power supply input voltage unregulated 1.71 1.8 1.89 V Internally unregulated
supply
VDDR1 Radio supply voltage (radio on) 1.9 – 5.5 V –
VDDR2 Radio supply voltage (radio off) 1.71 – 5.5 V –
Active Mode, VDD = 1.71 V to 5.5 V
IDD3 Execute from flash; CPU at 3 MHz – 1.7 – mA T = 25 °C,
VDD = 3.3 V
IDD4 Execute from flash; CPU at 3 MHz – – – mA T = –40 °C to 85 °C
IDD5 Execute from flash; CPU at 6 MHz – 2.5 – mA T = 25 °C,
VDD = 3.3 V
IDD6 Execute from flash; CPU at 6 MHz – – – mA T = –40 °C to 85 °C
IDD7 Execute from flash; CPU at 12 MHz – 4 – mA T = 25 °C,
VDD = 3.3 V
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IDD8 Execute from flash; CPU at 12 MHz – – – mA T = –40 °C to 85 °C
IDD9 Execute from flash; CPU at 24 MHz – 7.1 – mA T = 25 °C,
VDD = 3.3 V
IDD10 Execute from flash; CPU at 24 MHz – – – mA T = –40 °C to 85 °C
IDD11 Execute from flash; CPU at 48 MHz – 13.4 – mA T = 25 °C,
VDD = 3.3 V
IDD12 Execute from flash; CPU at 48 MHz – – – mA T = –40 °C to 85 °C
Sleep Mode, VDD = 1.8 V to 5.5 V
IDD13 IMO on – – – mA T = 25 °C, VDD = 3.3 V,
SYSCLK = 3 MHz
Sleep Mode, VDD and VDDR = 1.9 V to 5.5 V
IDD14 ECO on – – – mA T = 25 °C, VDD = 3.3 V,
SYSCLK = 3 MHz
Deep-Sleep Mode, VDD = 1.8 V to 3.6 V
IDD15 WDT with WCO on – 1.5 – µA T = 25 °C,
VDD = 3.3 V
IDD16 WDT with WCO on – – – µA T = –40 °C to 85 °C
IDD17 WDT with WCO on – – – µA T = 25 °C,
VDD = 5 V
IDD18 WDT with WCO on – – – µA T = –40 °C to 85 °C
Deep-Sleep Mode, VDD = 1.71 V to 1.89 V (Regulator Bypassed)
IDD19 WDT with WCO on – – – µA T = 25 °C
IDD20 WDT with WCO on – – – µA T = –40 °C to 85 °C
Hibernate Mode, VDD = 1.8 V to 3.6 V
IDD27 GPIO and reset active – 150 – nA T = 25 °C,
VDD = 3.3 V
IDD28 GPIO and reset active – – – nA T = –40 °C to 85 °C
Hibernate Mode, VDD = 3.6 V to 5.5 V
IDD29 GPIO and reset active – – – nA T = 25 °C,
VDD = 5 V
IDD30 GPIO and reset active – – – nA T = –40 °C to 85 °C
Stop Mode, VDD = 1.8 V to 3.6 V
IDD33 Stop-mode current (VDD)–20–nA
T = 25 °C,
VDD = 3.3 V
IDD34 Stop-mode current (VDDR)–40–- nA
T = 25 °C,
VDDR = 3.3 V
IDD35 Stop-mode current (VDD) – – – nA T = –40 °C to 85 °C
IDD36 Stop-mode current (VDDR)–––nA
T = –40 °C to 85 °C,
VDDR = 1.9 V to 3.6 V
Stop Mode, VDD = 3.6 V to 5.5 V
IDD37 Stop-mode current (VDD)–––nA
T = 25 °C,
VDD = 5 V
IDD38 Stop-mode current (VDDR)–––nA
T = 25 °C,
VDDR = 5 V
IDD39 Stop-mode current (VDD) – – – nA T = –40 °C to 85 °C
IDD40 Stop-mode current (VDDR) – – – nA T = –40 °C to 85 °C
Table 9. CYBLE-222014-01 DC Specifications (continued)
Parameter Description Min Typ Max Units Details/Conditions
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Table 10. AC Specifications
GPIO
Parameter Description Min Typ Max Units Details/Conditions
FCPU CPU frequency 3 – 48 MHz 1.71 V VDD 5.5 V
TSLEEP Wakeup from Sleep mode – 0 – µs Guaranteed by characterization
TDEEPSLEEP Wakeup from Deep-Sleep mode – – 25 µs 24-MHz IMO. Guaranteed by
characterization
THIBERNATE Wakeup from Hibernate mode – – 2 ms Guaranteed by characterization
TSTOP Wakeup from Stop mode – – 2.2 ms XRES wakeup
Table 11. GPIO DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
VIH[9]
Input voltage HIGH threshold 0.7 × VDD – – V CMOS input
LVTTL input, VDD < 2.7 V 0.7 × VDD – – V –
LVTTL input, VDD >= 2.7 V 2.0 – – V –
VIL
Input voltage LOW threshold – – 0.3 × VDD VCMOS input
LVTTL input, VDD < 2.7 V – – 0.3× VDD V–
LVTTL input, VDD >= 2.7 V – – 0.8 V –
VOH
Output voltage HIGH level VDD –0.6 – – V IOH = 4 mA at 3.3-V VDD
Output voltage HIGH level VDD –0.5 – – V IOH = 1 mA at 1.8-V VDD
VOL
Output voltage LOW level – – 0.6 V IOL = 8 mA at 3.3-V VDD
Output voltage LOW level – – 0.6 V IOL = 4 mA at 1.8-V VDD
Output voltage LOW level – – 0.4 V IOL = 3 mA at 3.3-V VDD
RPULLUP Pull-up resistor 3.5 5.6 8.5 k–
RPULLDOWN Pull-down resistor 3.5 5.6 8.5 k–
IIL Input leakage current (absolute value) – – 2 nA 25 °C, VDD = 3.3 V
IIL_CTBM Input leakage on CTBm input pins – – 4 nA –
CIN Input capacitance – – 7 pF –
VHYSTTL Input hysteresis LVTTL 25 40 – mV VDD > 2.7 V
VHYSCMOS Input hysteresis CMOS 0.05 × VDD – – 1 –
IDIODE Current through protection diode to
VDD/VSS – – 100 µA –
ITOT_GPIO Maximum total source or sink chip
current – – 200 mA –
Note
9. VIH must not exceed VDD + 0.2 V.
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Table 12. GPIO AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TRISEF Rise time in Fast-Strong mode 2 – 12 ns 3.3-V VDDD, CLOAD = 25 pF
TFALLF Fall time in Fast-Strong mode 2 – 12 ns 3.3-V VDDD, CLOAD = 25 pF
TRISES Rise time in Slow-Strong mode 10 – 60 ns 3.3-V VDDD, CLOAD = 25 pF
TFALLS Fall time in Slow-Strong mode 10 – 60 ns 3.3-V VDDD, CLOAD = 25 pF
FGPIOUT1 GPIO FOUT; 3.3 V VDD 5.5 V
Fast-Strong mode ––33MHz
90/10%, 25-pF load, 60/40 duty
cycle
FGPIOUT2 GPIO FOUT; 1.7 VVDD 3.3 V
Fast-Strong mode – – 16.7 MHz 90/10%, 25-pF load, 60/40 duty
cycle
FGPIOUT3 GPIO FOUT; 3.3 V VDD 5.5 V
Slow-Strong mode –– 7 MHz
90/10%, 25-pF load, 60/40 duty
cycle
FGPIOUT4 GPIO FOUT; 1.7 V VDD 3.3 V
Slow-Strong mode ––3.5MHz
90/10%, 25-pF load, 60/40 duty
cycle
FGPIOIN GPIO input operating frequency
1.71 V VDD 5.5 V – – 48 MHz 90/10% VIO
Table 13. OVT GPIO DC Specifications (P5_0 and P5_1 Only)
Parameter Description Min Typ Max Units Details/Conditions
IIL Input leakage (absolute value).
VIH > VDD – – 10 µA 25°C, VDD = 0 V, VIH = 3.0 V
VOL Output voltage LOW level – – 0.4 V IOL = 20 mA, VDD > 2.9 V
Table 14. OVT GPIO AC Specifications (P5_0 and P5_1 Only)
Parameter Description Min Typ Max Units Details/Conditions
TRISE_OVFS Output rise time in Fast-Strong mode 1.5 – 12 ns 25-pF load, 10%–90%, VDD=3.3 V
TFALL_OVFS Output fall time in Fast-Strong mode 1.5 – 12 ns 25-pF load, 10%–90%, VDD=3.3 V
TRISESS Output rise time in Slow-Strong mode 10 – 60 ns 25-pF load, 10%-90%,
VDD = 3.3 V
TFALLSS Output fall time in Slow-Strong mode 10 – 60 ns 25-pF load, 10%-90%,
VDD = 3.3 V
FGPIOUT1 GPIO FOUT; 3.3 V VDD 5.5 V
Fast-Strong mode ––24MHz
90/10%, 25-pF load, 60/40 duty
cycle
FGPIOUT2 GPIO FOUT; 1.71 V VDD 3.3 V
Fast-Strong mode ––16MHz
90/10%, 25-pF load, 60/40 duty
cycle
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XRES
Temperature Sensor
SAR ADC
Table 15. XRES DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
VIH Input voltage HIGH threshold 0.7 × VDDD – – V CMOS input
VIL Input voltage LOW threshold – – 0.3 × VDDD V CMOS input
RPULLUP Pull-up resistor 3.5 5.6 8.5 k–
CIN Input capacitance – 3 – pF –
VHYSXRES Input voltage hysteresis – 100 – mV –
IDIODE Current through protection diode to
VDD/VSS – – 100 µA –
Table 16. XRES AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TRESETWIDTH Reset pulse width 1 – – µs –
Table 17. Temperature Sensor Specifications
Parameter Description Min Typ Max Units Details/Conditions
TSENSACC Temperature-sensor accuracy –5 ±1 5 °C –40 to +85 °C
Table 18. SAR ADC DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
A_RES Resolution – – 12 bits
A_CHNIS_S Number of channels - single-ended – – 6 6 full-speed[10]
A-CHNKS_D Number of channels - differential – – 3 Diff inputs use neighboring I/Os[10]
A-MONO Monotonicity – – – Yes
A_GAINERR Gain error – – ±0.1 % With external reference
A_OFFSET Input offset voltage – – 2 mV Measured with 1-V VREF
A_ISAR Current consumption – – 1 mA
A_VINS Input voltage range - single-ended VSS –V
DD V
A_VIND Input voltage range - differential VSS – VDD V
A_INRES Input resistance – – 2.2 k
A_INCAP Input capacitance – – 10 pF
VREFSAR Trimmed internal reference to SAR –1 – 1 % Percentage of Vbg (1.024 V)
Note
10. A maximum of six single-ended ADC Channels can be accomplished only if the AMUX Buses are not being used for other functionality (such as CapSense).
If the AMUX Buses are being used for other functionality, then the maximum number of single-ended ADC channels is four. Similarly, if the AMUX Buses are
being used for other functionality, then the maximum number of differential ADC channels is two.
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CSD
Table 19. SAR ADC AC Specifications
Parameter Description Min Typ Max Units Details/
Conditions
A_PSRR Power-supply rejection ratio 70 – – dB Measured at 1-V
reference
A_CMRR Common-mode rejection ratio 66 – – dB
A_SAMP Sample rate – – 1 Msps 806 Ksps for More Part
Numbers devices
Fsarintref SAR operating speed without external ref.
bypass
– – 100 Ksps 12-bit resolution
A_SNR Signal-to-noise ratio (SNR) 65 – – dB FIN = 10 kHz
A_BW Input bandwidth without aliasing – – A_SAMP/2 kHz
A_INL Integral nonlinearity. VDD = 1.71 V to 5.5 V,
1 Msps
–1.7 – 2 LSB VREF = 1 V to VDD
A_INL Integral nonlinearity. VDDD = 1.71 V to 3.6 V,
1 Msps
–1.5 – 1.7 LSB VREF = 1.71 V to VDD
A_INL Integral nonlinearity. VDD = 1.71 V to 5.5 V,
500 Ksps
–1.5 – 1.7 LSB VREF = 1 V to VDD
A_dnl Differential nonlinearity. VDD = 1.71 V to
5.5 V, 1 Msps
–1 – 2.2 LSB VREF = 1 V to VDD
A_DNL Differential nonlinearity. VDD = 1.71 V to
3.6 V, 1 Msps
–1 – 2 LSB VREF = 1.71 V to VDD
A_DNL Differential nonlinearity. VDD = 1.71 V to
5.5 V, 500 Ksps
–1 – 2.2 LSB VREF = 1 V to VDD
A_THD Total harmonic distortion – – –65 dB FIN = 10 kHz
CSD Block Specifications
Parameter Description Min Typ Max Units Details/Conditions
VCSD Voltage range of operation 1.71 – 5.5 V
IDAC1 DNL for 8-bit resolution –1 – 1 LSB
IDAC1 INL for 8-bit resolution –3 – 3 LSB
IDAC2 DNL for 7-bit resolution –1 – 1 LSB
IDAC2 INL for 7-bit resolution –3 – 3 LSB
SNR Ratio of counts of finger to noise 5 – – Ratio Capacitance range of
9 pF to 35 pF, 0.1-pF
sensitivity. Radio is not
operating during the scan
IDAC1_CRT1 Output current of IDAC1 (8 bits) in High
range
–612 – µA
IDAC1_CRT2 Output current of IDAC1 (8 bits) in Low
range
–306 – µA
IDAC2_CRT1 Output current of IDAC2 (7 bits) in High
range
–305 – µA
IDAC2_CRT2 Output current of IDAC2 (7 bits) in Low
range
–153 – µA
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Digital Peripherals
Timer
Counter
Table 20. Timer DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
ITIM1 Block current consumption at 3 MHz – – 43 µA 16-bit timer
ITIM2 Block current consumption at 12 MHz – – 152 µA 16-bit timer
ITIM3 Block current consumption at 48 MHz – – 620 µA 16-bit timer
Table 21. Timer AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TTIMFREQ Operating frequency FCLK –48MHz
TCAPWINT Capture pulse width (internal) 2 × TCLK ––ns
TCAPWEXT Capture pulse width (external) 2 × TCLK ––ns
TTIMRES Timer resolution TCLK ––ns
TTENWIDINT Enable pulse width (internal) 2 × TCLK ––ns
TTENWIDEXT Enable pulse width (external) 2 × TCLK ––ns
TTIMRESWINT Reset pulse width (internal) 2 × TCLK ––ns
TTIMRESEXT Reset pulse width (external) 2 × TCLK ––ns
Table 22. Counter DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
ICTR1 Block current consumption at 3 MHz – – 43 µA 16-bit counter
ICTR2 Block current consumption at 12 MHz – – 152 µA 16-bit counter
ICTR3 Block current consumption at 48 MHz – – 620 µA 16-bit counter
Table 23. Counter AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TCTRFREQ Operating frequency FCLK –48MHz
TCTRPWINT Capture pulse width (internal) 2 × TCLK ––ns
TCTRPWEXT Capture pulse width (external) 2 × TCLK ––ns
TCTRES Counter Resolution TCLK ––ns
TCENWIDINT Enable pulse width (internal) 2 × TCLK ––ns
TCENWIDEXT Enable pulse width (external) 2 × TCLK ––ns
TCTRRESWINT Reset pulse width (internal) 2 × TCLK ––ns
TCTRRESWEXT Reset pulse width (external) 2 × TCLK –– ns
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Pulse Width Modulation (PWM)
LCD Direct Drive
Table 24. PWM DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
IPWM1 Block current consumption at 3 MHz – – 43 µA 16-bit PWM
IPWM2 Block current consumption at 12 MHz – – 152 µA 16-bit PWM
IPWM3 Block current consumption at 48 MHz – – 620 µA 16-bit PWM
Table 25. PWM AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TPWMFREQ Operating frequency FCLK –48MHz
TPWMPWINT Pulse width (internal) 2 × TCLK ––ns
TPWMEXT Pulse width (external) 2 × TCLK ––ns
TPWMKILLINT Kill pulse width (internal) 2 × TCLK ––ns
TPWMKILLEXT Kill pulse width (external) 2 × TCLK ––ns
TPWMEINT Enable pulse width (internal) 2 × TCLK ––ns
TPWMENEXT Enable pulse width (external) 2 × TCLK ––ns
TPWMRESWINT Reset pulse width (internal) 2 × TCLK ––ns
TPWMRESWEXT Reset pulse width (external) 2 × TCLK ––ns
Table 26. LCD Direct Drive DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
ILCDLOW Operating current in low-power mode – 17.5 – µA 16 × 4 small segment
display at 50 Hz
CLCDCAP LCD capacitance per segment/common
driver
– 500 5000 pF
LCDOFFSET Long-term segment offset – 20 – mV
ILCDOP1 LCD system operating current
VBIAS = 5 V
– 2 – mA 32 × 4 segments. 50 Hz at
25 °C
ILCDOP2 LCD system operating current
VBIAS = 3.3 V
– 2 – mA 32 × 4 segments
50 Hz at 25 °C
Table 27. LCD Direct Drive AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
FLCD LCD frame rate 10 50 150 Hz
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Serial Communication
Table 28. Fixed I2C DC Specifications
Table 30. Fixed UART DC Specifications
Table 31. Fixed UART AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
II2C1 Block current consumption at 100 kHz – – 50 µA –
II2C2 Block current consumption at 400 kHz – – 155 µA –
II2C3 Block current consumption at 1 Mbps – – 390 µA –
II2C4 I2C enabled in Deep-Sleep mode – – 1.4 µA –
Table 29. Fixed I2C AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
FI2C1 Bit rate – – 1 Mbps
Parameter Description Min Typ Max Units Details/Conditions
IUART1 Block current consumption at 100 kbps – – 55 µA –
IUART2 Block current consumption at 1000 kbps – – 360 µA –
Parameter Description Min Typ Max Units Details/Conditions
FUART Bit rate – – 1 Mbps –
Table 32. Fixed SPI DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
ISPI1 Block current consumption at 1 Mbps – – 360 µA –
ISPI2 Block current consumption at 4 Mbps – – 560 µA –
ISPI3 Block current consumption at 8 Mbps – – 600 µA –
Table 33. Fixed SPI AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
FSPI SPI operating frequency (master; 6x over sampling) – – 8 MHz –
Table 34. Fixed SPI Master Mode AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TDMO MOSI valid after SCLK driving edge – – 18 ns –
TDSI MISO valid before SCLK capturing edge
Full clock, late MISO sampling used 20 – – ns Full clock, late MISO sampling
THMO Previous MOSI data hold time 0 – – ns Referred to Slave capturing edge
Table 35. Fixed SPI Slave Mode AC Specifications
Parameter Description Min Typ Max Units
TDMI MOSI valid before SCLK capturing edge 40 – – ns
TDSO MISO valid after SCLK driving edge – – 42 + 3 × TCPU ns
TDSO_ext MISO Valid after SCLK driving edge in
external clock mode. VDD < 3.0 V – – 53 ns
THSO Previous MISO data hold time 0 – – ns
TSSELSCK SSEL valid to first SCK valid edge 100 – – ns
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Memory
System Resources
Power-on-Reset (POR)
Table 36. Flash DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
VPE Erase and program voltage 1.71 – 5.5 V –
TWS48 Number of Wait states at 32–48 MHz 2 – – CPU execution from flash
TWS32 Number of Wait states at 16–32 MHz 1 – – CPU execution from flash
TWS16 Number of Wait states for 0–16 MHz 0 – – CPU execution from flash
Table 37. Flash AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TROWWRITE[11] Row (block) write time (erase and program) – – 20 ms Row (block) = 128 bytes
TROWERASE[11] Row erase time – – 13 ms –
TROWPROGRAM[11] Row program time after erase – – 7 ms –
TBULKERASE[11] Bulk erase time (128 KB) – – 35 ms –
TDEVPROG[11] Total device program time – – 25 seconds –
FEND Flash endurance 100 K – – cycles –
FRET Flash retention. TA 55 °C, 100 K P/E cycles 20 – – years –
FRET2 Flash retention. TA 85 °C, 10 K P/E cycles 10 – – years –
Note
11. It can take as much as 20 ms to write to flash. During this time, the device should not be reset, or flash operations will be interrupted and cannot be relied on to have
completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs. Make
certain that these are not inadvertently activated.
Table 38. POR DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
VRISEIPOR Rising trip voltage 0.80 – 1.45 V –
VFALLIPOR Falling trip voltage 0.75 – 1.40 V –
VIPORHYST Hysteresis 15 – 200 mV –
Table 39. POR AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TPPOR_TR Precision power-on reset (PPOR) response
time in Active and Sleep modes ––1µs –
Table 40. Brown-Out Detect
Parameter Description Min Typ Max Units Details/Conditions
VFALLPPOR BOD trip voltage in Active and Sleep modes 1.64 – – V –
VFALLDPSLP BOD trip voltage in Deep Sleep 1.4 – – V –
Table 41. Hibernate Reset
Parameter Description Min Typ Max Units Details/Conditions
VHBRTRIP BOD trip voltage in Hibernate 1.1 – – V –
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Voltage Monitors (LVD)
SWD Interface
Table 42. Voltage Monitor DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
VLVI1 LVI_A/D_SEL[3:0] = 0000b 1.71 1.75 1.79 V –
VLVI2 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 V –
VLVI3 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 V –
VLVI4 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05 V –
VLVI5 LVI_A/D_SEL[3:0] = 0100b 2.05 2.10 2.15 V –
VLVI6 LVI_A/D_SEL[3:0] = 0101b 2.15 2.20 2.26 V –
VLVI7 LVI_A/D_SEL[3:0] = 0110b 2.24 2.30 2.36 V –
VLVI8 LVI_A/D_SEL[3:0] = 0111b 2.34 2.40 2.46 V –
VLVI9 LVI_A/D_SEL[3:0] = 1000b 2.44 2.50 2.56 V –
VLVI10 LVI_A/D_SEL[3:0] = 1001b 2.54 2.60 2.67 V –
VLVI11 LVI_A/D_SEL[3:0] = 1010b 2.63 2.70 2.77 V –
VLVI12 LVI_A/D_SEL[3:0] = 1011b 2.73 2.80 2.87 V –
VLVI13 LVI_A/D_SEL[3:0] = 1100b 2.83 2.90 2.97 V –
VLVI14 LVI_A/D_SEL[3:0] = 1101b 2.93 3.00 3.08 V –
VLVI15 LVI_A/D_SEL[3:0] = 1110b 3.12 3.20 3.28 V –
VLVI16 LVI_A/D_SEL[3:0] = 1111b 4.39 4.50 4.61 V –
LVI_IDD Block current – – 100 µA –
Table 43. Voltage Monitor AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TMONTRIP Voltage monitor trip time – – 1 µs –
Table 44. SWD Interface Specifications
Parameter Description Min Typ Max Units Details/Conditions
F_SWDCLK1 3.3 V VDD 5.5 V – – 14 MHz SWDCLK 1/3 CPU clock frequency
F_SWDCLK2 1.71 V VDD 3.3 V – – 7 MHz SWDCLK 1/3 CPU clock frequency
T_SWDI_SETUP T = 1/f SWDCLK 0.25 × T – – ns –
T_SWDI_HOLD T = 1/f SWDCLK 0.25 × T – – ns –
T_SWDO_VALID T = 1/f SWDCLK – – 0.5 × T ns –
T_SWDO_HOLD T = 1/f SWDCLK 1 – – ns –
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Internal Main Oscillator
Internal Low-Speed Oscillator
Table 49. ECO Trim Value Specification
BLE Subsystem
Table 45. IMO DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
IIMO1 IMO operating current at 48 MHz – – 1000 µA –
IIMO2 IMO operating current at 24 MHz – – 325 µA –
IIMO3 IMO operating current at 12 MHz – – 225 µA –
IIMO4 IMO operating current at 6 MHz – – 180 µA –
IIMO5 IMO operating current at 3 MHz – – 150 µA –
Table 46. IMO AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
FIMOTOL3 Frequency variation from 3 to 48 MHz – – ±2 % With API-called calibration
FIMOTOL3 IMO startup time – 12 – µs –
Table 47. ILO DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
IILO2 ILO operating current at 32 kHz – 0.3 1.05 µA –
Table 48. ILO AC Specifications
Parameter Description Min Typ Max Units Details/Conditions
TSTARTILO1 ILO startup time – – 2 ms –
FILOTRIM1 32-kHz trimmed frequency 15 32 50 kHz –
Parameter Description Value Details/Conditions
ECOTRIM 24-MHz trim value
(firmware configuration) 0x0000A0A0 Optimum trim value that needs to be loaded to register
CY_SYS_XTAL_BLERD_BB_XO_CAPTRIM_REG
Table 50. BLE Subsystem
Parameter Description Min Typ Max Units Details/
Conditions
RF Receiver Specification
RXS, IDLE RX sensitivity with idle transmitter – –89 – dBm
RX sensitivity with idle transmitter
excluding Balun loss
– –91 – dBm Guaranteed by design
simulation
RXS, DIRTY RX sensitivity with dirty transmitter – –87 –70 dBm RF-PHY Specification
(RCV-LE/CA/01/C)
RXS, HIGHGAIN RX sensitivity in high-gain mode with idle
transmitter
––91 – dBm
PRXMAX Maximum input power –10 –1 – dBm RF-PHY Specification
(RCV-LE/CA/06/C)
CI1 Cochannel interference,
Wanted signal at –67 dBm and Interferer
at FRX
– 9 21 dB RF-PHY Specification
(RCV-LE/CA/03/C)
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CI2 Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±1 MHz
– 3 15 dB RF-PHY Specification
(RCV-LE/CA/03/C)
CI3 Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±2 MHz
– –29 – dB RF-PHY Specification
(RCV-LE/CA/03/C)
CI4 Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±3 MHz
– –39 – dB RF-PHY Specification
(RCV-LE/CA/03/C)
CI5 Adjacent channel interference
Wanted Signal at –67 dBm and Interferer
at Image frequency (FIMAGE)
– –20 – dB RF-PHY Specification
(RCV-LE/CA/03/C)
CI3 Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at Image frequency (FIMAGE ± 1 MHz)
– –30 – dB RF-PHY Specification
(RCV-LE/CA/03/C)
OBB1 Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 30–2000 MHz
–30 –27 – dBm RF-PHY Specification
(RCV-LE/CA/04/C)
OBB2 Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 2003–2399 MHz
–35 –27 – dBm RF-PHY Specification
(RCV-LE/CA/04/C)
OBB3 Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 2484–2997 MHz
–35 –27 – dBm RF-PHY Specification
(RCV-LE/CA/04/C)
OBB4 Out-of-band blocking,
Wanted signal a –67 dBm and Interferer
at F = 3000–12750 MHz
–30 –27 – dBm RF-PHY Specification
(RCV-LE/CA/04/C)
IMD Intermodulation performance
Wanted signal at –64 dBm and 1-Mbps
BLE, third, fourth, and fifth offset channel
–50 – – dBm RF-PHY Specification
(RCV-LE/CA/05/C)
RXSE1 Receiver spurious emission
30 MHz to 1.0 GHz
– – –57 dBm 100-kHz measurement
bandwidth
ETSI EN300 328 V1.8.1
RXSE2 Receiver spurious emission
1.0 GHz to 12.75 GHz
– – –47 dBm 1-MHz measurement
bandwidth
ETSI EN300 328 V1.8.1
RF Transmitter Specifications
TXP, ACC RF power accuracy – ±4 – dB
TXP, RANGE RF power control range – 20 – dB
TXP, 0dBm Output power, 0-dB Gain setting (PA7) – 0 – dBm
TXP, MAX Output power, maximum power setting
(PA10)
–3 – dBm
TXP, MIN Output power, minimum power setting
(PA1)
––18 – dBm
F2AVG Average frequency deviation for
10101010 pattern
185 – – kHz RF-PHY Specification
(TRM-LE/CA/05/C)
Table 50. BLE Subsystem (continued)
Parameter Description Min Typ Max Units Details/
Conditions
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F1AVG Average frequency deviation for
11110000 pattern
225 250 275 kHz RF-PHY Specification
(TRM-LE/CA/05/C)
EO Eye opening = F2AVG/F1AVG 0.8 – – RF-PHY Specification
(TRM-LE/CA/05/C)
FTX, ACC Frequency accuracy –150 – 150 kHz RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, MAXDR Maximum frequency drift –50 – 50 kHz RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, INITDR Initial frequency drift –20 – 20 kHz RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, DR Maximum drift rate –20 – 20 kHz/
50 µs
RF-PHY Specification
(TRM-LE/CA/06/C)
IBSE1 In-band spurious emission at 2-MHz
offset
– – –20 dBm RF-PHY Specification
(TRM-LE/CA/03/C)
IBSE2 In-band spurious emission at 3-MHz
offset
– – -30 dBm RF-PHY Specification
(TRM-LE/CA/03/C)
TXSE1 Transmitter spurious emissions
(average), <1.0 GHz
– – -55.5 dBm FCC-15.247
TXSE2 Transmitter spurious emissions
(average), >1.0 GHz
– – -41.5 dBm FCC-15.247
RF Current Specifications
IRX Receive current in normal mode – 18.7 – mA
IRX_RF Radio receive current in normal mode – 16.4 – mA Measured at VDDR
IRX, HIGHGAIN Receive current in high-gain mode – 21.5 – mA
ITX, 3dBm TX current at 3-dBm setting (PA10) – 20 – mA
ITX, 0dBm TX current at 0-dBm setting (PA7) – 16.5 – mA
ITX_RF, 0dBm Radio TX current at 0 dBm setting (PA7) – 15.6 – mA Measured at VDDR
ITX_RF, 0dBm Radio TX current at 0 dBm excluding
Balun loss
– 14.2 – mA Guaranteed by design
simulation
ITX,-3dBm TX current at –3-dBm setting (PA4) – 15.5 – mA
ITX,-6dBm TX current at –6-dBm setting (PA3) – 14.5 – mA
ITX,-12dBm TX current at –12-dBm setting (PA2) – 13.2 – mA
ITX,-18dBm TX current at –18-dBm setting (PA1) – 12.5 – mA
Iavg_1sec, 0dBm Average current at 1-second BLE
connection interval
– 18.9 – µA TXP: 0 dBm; ±20-ppm
master and slave clock
accuracy.
For empty PDU exchange
Iavg_4sec, 0dBm Average current at 4-second BLE
connection interval
– 6.25 – µA TXP: 0 dBm; ±20-ppm
master and slave clock
accuracy.
For empty PDU exchange
General RF Specifications
FREQ RF operating frequency 2400 – 2482 MHz
CHBW Channel spacing – 2 – MHz
Table 50. BLE Subsystem (continued)
Parameter Description Min Typ Max Units Details/
Conditions
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 27 of 37
DR On-air data rate – 1000 – kbps
IDLE2TX BLE.IDLE to BLE. TX transition time – 120 140 µs
IDLE2RX BLE.IDLE to BLE. RX transition time – 75 120 µs
RSSI Specifications
RSSI, ACC RSSI accuracy – ±5 – dB
RSSI, RES RSSI resolution – 1 – dB
RSSI, PER RSSI sample period – 6 – µs
Table 50. BLE Subsystem (continued)
Parameter Description Min Typ Max Units Details/
Conditions
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 28 of 37
Environmental Specifications
Environmental Compliance
This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF)
directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
RF Certification
The CYBLE-222014-01 module is certified under the following RF certification standards:
■FCC: WAP2005
■CE
■IC: 7922A-2005
■MIC: 203-JN0495
■KC: MSIP-CRM-Cyp-2005
Safety Certification
The CYBLE-222014-01 module complies with the following safety regulations:
■Underwriters Laboratories, Inc. (UL): Filing E331901
■CSA
■TUV
Environmental Conditions
Table 51 describes the operating and storage conditions for the Cypress BLE module.
Table 51. Environmental Conditions for CYBLE-222014-01
ESD and EMI Protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure
near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground.
Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Description Minimum Specification Maximum Specification
Operating temperature -40 °C 85 °C
Operating humidity (relative, non-condensation) 5% 85%
Thermal ramp rate – 3 °C/minute
Storage temperature –40 °C 85 °C
Storage temperature and humidity – 85 ° C at 85%
ESD: Module integrated into system
Components[12] –15-kV Air
2.2-kV Contact
Note
12. This does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for 500-V HBM.
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 29 of 37
Regulatory Information
FCC
FCC NOTICE:
The device CYBLE-222014-01, including the antenna 2450AT18B100 from Johanson Technology, complies with Part 15 of the FCC
Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter
Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must
accept any interference received, including interference that may cause undesired operation.
CAUTION:
The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by
Cypress Semiconductor may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
■Reorient or relocate the receiving antenna.
■Increase the separation between the equipment and receiver.
■Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
■Consult the dealer or an experienced radio/TV technician for help
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible
label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well
as the FCC Notice above. The FCC identifier is FCC ID: WAP2005.
In any case the end product must be labeled exterior with "Contains FCC ID: WAP2005"
ANTENNA WARNING:
This device is tested with a standard SMA connector and with the antennas listed below. When integrated in the OEMs product, these
fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the
following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions.
RF EXPOSURE:
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved
antenna in the previous.
The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antennas
in Table 6 on page 12, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal
instructions about the integrated radio module is not allowed.
The radiated output power of CYBLE-222014-01 with the chip antenna mounted (FCC ID: WAP2005) is far below the FCC radio
frequency exposure limits. Nevertheless, use CYBLE-222014-01 in such a manner that minimizes the potential for human contact
during normal operation.
End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with
transmitter operating conditions for satisfying RF exposure compliance.
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 30 of 37
ISED
Innovation, Science and Economic Development Canada (ISED) Certification
CYBLE-222014-01 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development Canada
(ISED),
License: IC: 7922A-2005
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure
compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from
www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Table 6 on page 12, having a maximum gain of 0.5 dBi. Antennas
not included in this list or having a gain greater than 0.5 dBi are strictly prohibited for use with this device. The required antenna
impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter.
ISED NOTICE:
The device CYBLE-222014-01 including the antenna 2450AT18B100 from Johanson technology, complies with Canada RSS-GEN
Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-GEN. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference
received, including interference that may cause undesired operation.
ISED RADIATION EXPOSURE STATEMENT FOR CANADA
This device complies with Innovation, Science and Economic Development (ISED) Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Cet appareil est conforme à la norme sur l'innovation, la science et le développement économique (ISED) norme RSS exempte de
licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur
de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible
label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as
the ISED Notice above. The IC identifier is 7922A-2005. In any case, the end product must be labeled in its exterior with "Contains
IC: 7922A-2005"
European R&TTE Declaration of Conformity
Hereby, Cypress Semiconductor declares that the Bluetooth module CYBLE-222014-01 complies with the essential requirements and
other relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of the
Directive 1999/5/EC, the end-customer equipment should be labeled as follows:
All versions of the CYBLE-222014-01 in the specified reference design can be used in the following countries: Austria, Belgium,
Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxem-
bourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway.
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 31 of 37
MIC Japan
CYBLE-222014-01 is certified as a module with type certification number 203-JN0495. End products that integrate CYBLE-222014-01
do not need additional MIC Japan certification for the end product.
End product can display the certification label of the embedded module.
KC Korea
CYBLE-222014-01 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2005.
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 32 of 37
Packaging
The CYBLE-222014-01 is offered in tape and reel packaging. Figure 10 details the tape dimensions used for the CYBLE-222014-01.
Figure 10. CYBLE-222014-01 Tape Dimensions
Figure 11 details the orientation of the CYBLE-222014-01 in the tape as well as the direction for unreeling.
Figure 11. Component Orientation in Tape and Unreeling Direction
Table 52. Solder Reflow Peak Temperature
Module Part Number Package Maximum Peak Temperature Maximum Time at Peak
Temperature No. of Cycles
CYBLE-222014-01 22-pad SMT 260 °C 30 seconds 2
Table 53. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number Package MSL
CYBLE-222014-01 22-pad SMT MSL 3
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 33 of 37
Figure 12 details reel dimensions used for the CYBLE-222014-01.
Figure 12. Reel Dimensions
The CYBLE-222014-01 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The
center-of-mass for the CYBLE-222014-01 is detailed in Figure 13.
Figure 13. CYBLE-222014-01 Center of Mass
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 34 of 37
Ordering Information
Table 54 lists the CYBLE-222014-01 part number and features. Tab le 55 lists the reel shipment quantities for the CYBLE-222014-01.
Table 54. Ordering Information
Table 55. Tape and Reel Package Quantity and Minimum Order Amount
The CYBLE-222014-01 is offered in tape and reel packaging. The CYBLE-222014-01 ships with a maximum of 500 units/reel.
Part Numbering Convention
The part numbers are of the form CYBLE-FATT##-SB where the fields are defined as follows.
For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales
representative. To locate the nearest Cypress office, visit our website.
Part Number
CPU
Speed
(MHz)
Flash
Size
(KB)
DMA CapSense SCB TCPWM
12-Bit
SAR
ADC
I2SLCD Package Packing
CYBLE-222014-01 48 256 Yes Yes 2 4 1 Msps Yes Yes 22-SMT Tape and
Reel
Description Minimum Reel Quantity Maximum Reel Quantity Comments
Reel Quantity 500 500 Ships in 500 unit reel quantities.
Minimum Order Quantity (MOQ) 500 –
Order Increment (OI) 500 –
U.S. Cypress Headquarters Address 198 Champion Court, San Jose, CA 95134
U.S. Cypress Headquarter Contact Info (408) 943-2600
Cypress website address http://www.cypress.com
CY BLE –F A T T # # –SB
Device Identification Number: Unique sequential product number for each module
EZ-BLE Module Type: 2/4 = PSoC4, 3 = WICED, 4 = PSoC6
Antenna Type: 0 = No Antenna, 1 = PCB Antenna, 2 = Chip Antenna
Flash Size: 0 = 128KB, 2 = 256KB
Marketing Code: BLE = BLE Product Family
Company ID: CY = Cypress
Temperature Range: 0 = Industrial, 1 = Extended Industrial
Integration Type: 0 = Full Integration With Shield, 1 = No Shield
Bluetooth Version: 0 = BT 4.1, 1 = BT 4.2, 2 = BT 5.0
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 35 of 37
Acronyms
Document Conventions
Units of Measure
Acronym Description
BLE Bluetooth Low Energy
Bluetooth SIG Bluetooth Special Interest Group
CE European Conformity
CSA Canadian Standards Association
DMA direct memory access
EMI electromagnetic interference
ESD electrostatic discharge
FCC Federal Communications Commission
GPIO general-purpose input/output
IC Industry Canada
IDE integrated design environment
KC Korea Certification
MIC Ministry of Internal Affairs and Communications (Japan)
PCB printed circuit board
RX receive
QDID qualification design ID
SMT surface-mount technology; a method for producing electronic circuitry in which the components are placed
directly onto the surface of PCBs
TCPWM timer, counter, pulse width modulator (PWM)
TUV Germany: Technischer Überwachungs-Verein (Technical Inspection Association)
TX transmit
Symbol Unit of Measure
°C degree Celsius
kV kilovolt
mA milliamperes
mm millimeters
mV millivolt
µA microamperes
µm micrometers
MHz megahertz
GHz gigahertz
Vvolt
CYBLE-222014-01
Document Number: 002-11186 Rev. *G Page 36 of 37
Document History Page
Document Title: CYBLE-222014-01 EZ-BLE™ Creator Module
Document Number: 002-11186
Revision ECN Orig. of
Change
Submission
Date Description of Change
** 5142440 DSO 02/18/2016 Preliminary datasheet for CYBLE-222014-01 module.
*A 5187154 DSO 03/21/2016 Updated Table 3 to include Solder Pad 6 location in the 22 pad connections.
Updated Table 4 to include Solder Pad 6 definition in the 22 pad connections.
Added Note 5 on page 9 for VREF item in Table 4.
*B 5411189 DSO 08/26/2016 Remove “Preliminary” document status.
Added Table 4 to add additional information for the functionality of each solder
pad.
Added Table 55 to specify minimum and maximum reel quantities that ship for
orders of the CYBLE-222014-01 module.
Added Safety Certification and relative filing number.
Updated More Information to add additional Knowledge Base Article references.
Updated Cypress logo and Sales, Solutions, and Legal Information page.
*C 5536076 DSO 11/30/2016 Updated More Information:
Added EZ-Serial™ BLE Firmware Platform section.
Updated Recommended Host PCB Layout:
Updated Figure 4, Figure 5, and Figure 6 captions to specify that these as “Seen
on Host PCB”.
Updated Power Supply Connections and Recommended External Components:
Updated Figure 7 and Figure 8 to specify that these are “Seen from Bottom”.
Updated Digital and Analog Capabilities and Connections:
Updated Table 4:
Updated TCPWM column to add TCPWM capability on Port 2 pins.
Added Footnote 4.
*D 5554670 DSO 12/15/2016 Updated Electrical Specification:
Updated SAR ADC:
Updated Table 18 to add Note 10 to specify under what conditions the maximum
number of ADC channels can be achieved.
*E 5709580 GNKK 04/24/2017 Updated the Cypress logo and copyright information.
*F 6006702 DSO 12/27/2017 Updated reel dimensions in Figure 10 and Figure 12.
*G 6087230 DSO 03/07/2018 Updated document title as “EZ-BLE™ Creator Module”.
Updated “PRoC™” references to “Creator”.
Updated the links of QDID and Declaration ID in Module Description section as
“https://launchstudio.bluetooth.com/ListingDetails/2152”
Updated “PRoC BLE” to “PSoC 4 BLE” throughout the document.
Updated More Information section.
Updated the term “IC” to “ISED”.
Changed the Heading “Industry Canada (IC) Certification” to “ISED” and added a
subtitle “Innovation, Science and Economic Development Canada (ISED) Certifi-
cation”.
Updated Part Numbering Convention.
Added “Cet appareil est conforme à la norme sur l'innovation, la science et le
développement économique (ISED) norme RSS exempte de licence.
L'exploitation est autorisée aux deux conditions suivantes:” in ISED RADIATION
EXPOSURE STATEMENT FOR CANADA.
Updated the Copyright year.
Document Number: 002-11186 Rev. *G Revised March 7, 2018 Page 37 of 37
CYBLE-222014-01
© Cypress Semiconductor Corporation, 2016-2018. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. No computing
device can be absolutely secure. Therefore, despite security measures implemented in Cypress hardware or software products, Cypress does not assume any liability arising out of any security breach,
such as unauthorized access to or use of a Cypress product. In addition, the products described in these materials may contain design defects or errors known as errata which may cause the product
to deviate from published specifications. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any
liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming
code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this
information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons
systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances
management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device
or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you
shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from
and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
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