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±R2
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DOUT2+
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS90LV031A
SNLS020D –JULY 1999–REVISED AUGUST 2016
DS90LV031A 3-V LVDS Quad CMOS Differential Line Driver
1
1 Features
1• >400-Mbps (200-MHz) Switching Rates
• 0.1-ns Typical Differential Skew
• 0.4-ns Maximum Differential Skew
• 2-ns Maximum Propagation Delay
• 3.3-V Power Supply Design
• ±350-mV Differential Signaling
• Low Power Dissipation (13-mW at 3.3-V Static)
• Interoperable With Existing 5-V LVDS Devices
• Compatible With IEEE 1596.3 SCI LVDS
Standard
• Compatible With TIA/EIA-644 LVDS Standard
• Industrial Operating Temperature Range
• Available in SOIC and TSSOP Surface-Mount
Packaging
2 Applications
• Building And Factory Automation
• Grid Infrastructure
3 Description
The DS90LV031A is a quad CMOS differential line
driver designed for applications requiring ultra low
power dissipation and high data rates. The device is
designed to support data rates in excess of 400 Mbps
(200 MHz) using Low Voltage Differential Signaling
(LVDS) technology.
The DS90LV031A accepts low voltage LVTTL or
LVCMOS input levels and translates them to low
voltage (350 mV) differential output signals. In
addition the driver supports a TRI-STATE®function
that may be used to disable the output stage,
disabling the load current, and thus dropping the
device to an ultra low idle power state of 13 mW
typical.
The EN and EN* inputs allow active Low or active
High control of the TRI-STATE outputs. The enables
are common to all four drivers. The DS90LV031A and
companion line receiver (DS90LV032A) provide a
new alternative to high power psuedo-ECL devices
for high speed point-to-point interface applications.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
DS90LV031A SOIC (16) 9.90 mm × 3.91 mm
TSSOP (16) 5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Block Diagram
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics – Industrial....................... 6
6.7 Dissipation Ratings ................................................... 6
6.8 Typical Characteristics.............................................. 7
7 Parameter Measurement Information .................. 8
8 Detailed Description............................................ 10
8.1 Overview................................................................. 10
8.2 Functional Block Diagram....................................... 11
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 11
9 Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application ................................................. 12
10 Power Supply Recommendations ..................... 13
11 Layout................................................................... 14
11.1 Layout Guidelines ................................................. 14
11.2 Layout Example .................................................... 15
12 Device and Documentation Support................. 16
12.1 Documentation Support ........................................ 16
12.2 Receiving Notification of Documentation Updates 16
12.3 Community Resources.......................................... 16
12.4 Trademarks........................................................... 16
12.5 Electrostatic Discharge Caution............................ 16
12.6 Glossary................................................................ 16
13 Mechanical, Packaging, and Orderable
Information........................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (April 2013) to Revision D Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1
3
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5 Pin Configuration and Functions
D or PW Package
16-Pin SOIC or TSSOP
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
DIN 1, 7, 9, 15 I Driver input pin, TTL/CMOS compatible
DOUT+ 2, 6, 10, 14 O Noninverting driver output pin, LVDS levels
DOUT– 3, 5, 11, 13 O Inverting driver output pin, LVDS levels
EN 4 I Active high enable pin, OR-ed with EN
EN 12 I Active low enable pin, OR-ed with EN
GND 8 — Ground pin
VCC 16 — Power supply pin, 3.3 V ± 0.3 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VCC –0.3 4 V
Input voltage, DIN –0.3 VCC + 0.3 V
Enable input voltage, EN, EN* –0.3 VCC + 0.3 V
Output voltage, DOUT+, DOUT−–0.3 3.9 V
Short circuit duration, DOUT+, DOUT−Continuous
Lead temperature, soldering (4 s) 260 °C
Maximum junction temperature 150 °C
Storage temperature, Tstg –65 150 °C
4
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(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±6000 V
6.3 Recommended Operating Conditions MIN NOM MAX UNIT
VCC Supply voltage 3 3.3 3.6 V
TAOperating free-air temperature, industrial –40 25 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1) DS90LV031A
UNITPW (TSSOP) D (SOIC)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 114 75 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51 36 °C/W
RθJB Junction-to-board thermal resistance 59 32 °C/W
ψJT Junction-to-top characterization parameter 8 6 °C/W
ψJB Junction-to-board characterization parameter 58 31.7 °C/W
5
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(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except: VOD1 and ΔVOD1.
(2) All typicals are given for: VCC = 3.3 V, TA= 25°C.
(3) The DS90LV031A is a current mode device and only functions within datasheet specifications when a resistive load is applied to the
driver outputs typical range is (90 Ωto 110 Ω)
(4) Output short-circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
6.5 Electrical Characteristics
over supply voltage and operating temperature ranges (unless otherwise noted)(1)(2)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOD1 Differential output voltage RL= 100 Ω, DOUT−, DOUT+ pins (see Figure 3) 250 350 450 mV
ΔVOD1 Change in magnitude of VOD1
for complementary output states RL= 100 Ω, DOUT−, DOUT+ pins (see Figure 3) 4 35 |mV|
VOS Offset voltage RL= 100 Ω, DOUT−, DOUT+ pins (see Figure 3) 1.125 1.25 1.375 V
ΔVOS Change in magnitude of VOS
for complementary output states RL= 100 Ω, DOUT−, DOUT+ pins (see Figure 3) 5 25 |mV|
VOH Output voltage high RL= 100 Ω, DOUT−, DOUT+ pins (see Figure 3) 1.38 1.6 V
VOL Output voltage low RL= 100 Ω, DOUT−, DOUT+ pins (see Figure 3) 0.90 1.03 V
VIH Input voltage high DIN, EN, EN* pins 2 VCC V
VIL Input voltage low DIN, EN, EN* pins GND 0.8 V
IIH Input current high VIN = VCC or 2.5 V, DIN, EN, EN* pins −10 ±1 10 µA
IIL Input current low VIN = GND or 0.4 V, DIN, EN, EN* pins −10 ±1 10 µA
VCL Input clamp voltage ICL = –18 mA, DIN, EN, EN* pins −1.5 −0.8 V
IOS Output short circuit current Enabled, DOUT−, DOUT+ pins(4), DIN = VCC, DOUT+
= 0 V, or DIN = GND, DOUT−= 0 V −6−9 mA
IOSD Differential output short circuit
current Enabled, VOD = 0 V, DOUT−, DOUT+ pins(4) −6−9 mA
IOFF Power-off leakage VOUT = 0 V or 3.6 V, VCC = 0 V or open, DOUT−,
DOUT+ pins −20 ±1 20 µA
IOZ Output TRI-STATE current EN = 0.8 V and EN* = 2 V, VOUT = 0 V or VCC,
DOUT−, DOUT+ pins −10 ±1 10 µA
ICC No load supply current drivers
enabled DIN = VCC or GND, VCC pin 5 8 mA
ICCL Loaded supply current drivers
enabled RL= 100 Ω(all channels), DIN = VCC or GND
(all inputs), VCC pin 23 30 mA
ICCZ No load supply current drivers
disabled DIN = VCC or GND, EN = GND, EN* = VCC, VCC
pin 2.6 6 mA
6
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(1) All typicals are given for: VCC = 3.3 V, TA= 25°C.
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO= 50 Ω, tr≤1 ns, and tf≤1 ns.
(3) CLincludes probe and jig capacitance.
(4) tSKD1, |tPHLD −tPLHD| is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
(5) tSKD2 is the differential channel-to-channel skew of any event on the same device.
(6) tSKD3, differential part-to-part skew, is defined as the difference between the minimum and maximum specified differential propagation
delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
(7) tSKD4, part-to-part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max −Min|
differential propagation delay.
(8) fMAX generator input conditions: tr= tf< 1 ns, (0% to 100%), 50% duty cycle, 0 V to 3 V. Output criteria: duty cycle = 45% / 55%, VOD >
250 mV, all channels switching.
6.6 Switching Characteristics – Industrial
VCC = 3.3 V ±10% and TA= –40°C to 85°C (unless otherwise noted)(1)(2)(3)
MIN NOM MAX UNIT
tPHLD Differential propagation delay
high to low RL= 100 Ωand CL= 10 pF (see Figure 4
and Figure 5)0.8 1.18 2 ns
tPLHD Differential propagation delay
low to high RL= 100 Ωand CL= 10 pF (see Figure 4
and Figure 5)0.8 1.25 2 ns
tSKD1 Differential pulse skew(4)
|tPHLD −tPLHD|RL= 100 Ωand CL= 10 pF (see Figure 4
and Figure 5)0 0.07 0.4 ns
tSKD2 Channel-to-channel skew(5) RL= 100 Ωand CL= 10 pF (see Figure 4
and Figure 5)0 0.1 0.5 ns
tSKD3 Differential part-to-part skew(6) RL= 100 Ωand CL= 10 pF (see Figure 4
and Figure 5)0 1 ns
tSKD4 Differential part-to-part skew(7) RL= 100 Ωand CL= 10 pF (see Figure 4
and Figure 5)0 1.2 ns
tTLH Rise time RL= 100 Ωand CL= 10 pF (see Figure 4
and Figure 5)0.38 1.5 ns
tTHL Fall time RL= 100 Ωand CL= 10 pF (see Figure 4
and Figure 5)0.4 1.5 ns
tPHZ Disable time high to Z RL= 100 Ωand CL= 10 pF (see Figure 6
and Figure 7)5 ns
tPLZ Disable time low to Z RL= 100 Ωand CL= 10 pF (see Figure 6
and Figure 7)5 ns
tPZH Enable time Z to high RL= 100 Ωand CL= 10 pF (see Figure 6
and Figure 7)7 ns
tPZL Enable time Z to low RL= 100 Ωand CL= 10 pF (see Figure 6
and Figure 7)7 ns
fMAX Maximum operating frequency(8) 200 250 MHz
6.7 Dissipation Ratings MAXIMUM PACKAGE POWER DISSIPATION AT 25°C
D package 1088 mW
PW package 866 mW
Derate D package 8.5 mW/°C above 25°C
Derate PW package 6.9 mW/°C above 25°C
7
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6.8 Typical Characteristics
Figure 1. Typical DS90LV031A, DOUT (Single-Ended)
vs RL, TA= 25°C Figure 2. Typical DS90LV031A, DOUT
vs RL, VCC = 3.3 V, TA= 25°C
8
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7 Parameter Measurement Information
Figure 3. Driver VOD and VOS Test Circuit
Figure 4. Driver Propagation Delay and Transition Time Test Circuit
Figure 5. Driver Propagation Delay and Transition Time Waveforms
9
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Parameter Measurement Information (continued)
Figure 6. Driver TRI-STATE Delay Test Circuit
Figure 7. Driver TRI-STATE Delay Waveforms
10
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8 Detailed Description
8.1 Overview
LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as
is shown in Figure 9. This configuration provides a clean signaling environment for the quick edge rates of the
drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair
cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic differential impedance of the media
is in the range of 100 Ω. A termination resistor of 100 Ωmust be selected to match the media, and is located as
close to the receiver input pins as possible. The termination resistor converts the current sourced by the driver
into a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver
configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as
well as ground shifting, noise margin limits, and total termination loading must be considered.
The DS90LV031A differential line driver is a balanced current source design. A current mode driver, generally
speaking has a high output impedance and supplies a constant current for a range of loads (a voltage mode
driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in
one direction to produce a logic state and in the other direction to produce the other logic state. The output
current is typically 3.5 mA, a minimum of 2.5 mA, and a maximum of 4.5 mA. The current mode requires (as
discussed above) that a resistive termination be employed to terminate the signal and to complete the loop as
shown in Figure 9. AC or unterminated configurations are not allowed. The 3.5-mA loop current develops a
differential voltage of 350 mV across the 100-Ωtermination resistor which the receiver detects with a 250-mV
minimum differential noise margin neglecting resistive line losses (driven signal minus receiver threshold
(350 mV – 100 mV = 250 mV)). The signal is centered around 1.2 V (Driver Offset, VOS) with respect to ground
as shown in Figure 8. Note that the steady-state voltage (VSS) peak-to-peak swing is twice the differential voltage
(VOD) and is typically 700 mV.
The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its
quiescent current remains relatively flat versus switching frequency. Whereas the RS-422 voltage mode driver
increases exponentially in most case between 20 MHz to 50 MHz. This is due to the overlap current that flows
between the rails of the device when the internal gates switch. Whereas the current mode driver switches a fixed
current between its output without any substantial overlap current. This is similar to some ECL and PECL
devices, but without the heavy static ICC requirements of the ECL or PECL designs. LVDS requires >80% less
current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other existing
RS-422 drivers.
The TRI-STATE function allows the driver outputs to be disabled, thus obtaining an even lower power state when
the transmission of data is not required.
The footprint of the DS90LV031A is the same as the industry standard 26LS31 Quad Differential (RS-422) Driver
and is a step-down replacement for the 5-V DS90C031 Quad Driver.
Copyright © 2016, Texas Instruments Incorporated
+
±R4
+
±R3
+
±R2
+
±R1 DOUT1+
DOUT2+
DOUT3+
DOUT4+
EN
EN*
RIN4
RIN3
RIN2
RIN1 DOUT1-
DOUT2-
DOUT3-
DOUT4-
11
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8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Fail-Safe LVDS Interface
If the LVDS link as shown in Figure 9 needs to support the case where the Line Driver is disabled, powered off,
or removed (unplugged) and the Receiver device is powered on and enabled, the state of the LVDS bus is
unknown and therefore the output state of the Receiver is also unknown. If this is of concern, consult the
respective LVDS Receiver data sheet for guidance on Fail-safe Biasing options for the LVDS interface to set a
known state on the inputs for these conditions.
Figure 8. Driver Output Levels
8.4 Device Functional Modes
Table 1 lists the functional modes of DS90LV031A.
Table 1. Truth Table
ENABLES INPUT OUTPUTS
EN EN* DIN DOUT+ DOUT−
L H X Z Z
All other combinations of ENABLE inputs L L H
H H L
Copyright © 2016, Texas Instruments Incorporated
ENABLE
DATA
INPUT
¼ DS9OLVO31A
+
±
RT
100Ÿ
Any LVDS Receiver
DATA
OUTPUT
12
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DS90LV031A has a flow-through pinout that allows for easy PCB layout. The LVDS signals on one side of
the device easily allows for matching electrical lengths of the differential pair trace lines between the driver and
the receiver as well as allowing the trace lines to be close together to couple noise as common-mode. Noise
isolation is achieved with the LVDS signals on one side of the device and the TTL signals on the other side.
See Related Documentation for general application guidelines and hints for LVDS drivers and receivers.
9.2 Typical Application
Figure 9. Point-to-Point Application
9.2.1 Design Requirements
When using LVDS devices, it is important to remember to specify controlled impedance PCB traces, cable
assemblies, and connectors. All components of the transmission media must have a matched differential
impedance of about 100 Ω. They must not introduce major impedance discontinuities.
Balanced cables (for example, twisted pair) are usually better than unbalanced cables (ribbon cable) for noise
reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and also
tend to pick up electromagnetic radiation as common-mode (not differential mode) noise which is rejected by the
LVDS receiver.
9.2.2 Detailed Design Procedure
9.2.2.1 Probing LVDS Transmission Lines
Always use high impedance (>100 kΩ), low capacitance (<2 pF) scope probes with a wide bandwidth (1 GHz)
scope. Improper probing gives deceiving results.
9.2.2.2 Cables and Connectors, General Comments
When choosing cable and connectors for LVDS it is important to remember:
Use controlled impedance media. The cables and connectors you use must have a matched differential
impedance of about 100 Ω. They must not introduce major impedance discontinuities.
Balanced cables (for example, twisted pair) are usually better than unbalanced cables (such as ribbon cable or
simple coax) for noise reduction and signal quality. Balanced cables tend to generate less EMI due to field
canceling effects and also tend to pick up electromagnetic radiation as common-mode (not differential mode)
noise which is rejected by the receiver. For cable distances < 0.5 m, most cables can be made to work
effectively. For distances 0.5 m ≤d≤10 m, Category 3 (CAT 3) twisted pair cable works well, is readily available,
and relatively inexpensive.
13
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Typical Application (continued)
9.2.3 Application Curves
Figure 10. Typical DS90LV031A, DOUT (Single-Ended)
vs RL, TA= 25°C Figure 11. Typical DS90LV031A, DOUT
vs RL, VCC = 3.3 V, TA= 25°C
10 Power Supply Recommendations
Although the DS90LV031A draws very little power, at higher switching frequencies there is a small dynamic
current component which increases the overall power consumption. The DS90LV031A power supply design must
include local decoupling capacitance to maintain optimal device performance at higher data rates.
14
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11 Layout
11.1 Layout Guidelines
• Use at least 4 PCB layers (top to bottom): LVDS signals, ground, power, and TTL signals.
• Isolate TTL signals from LVDS signals, otherwise the TTL may couple onto the LVDS lines. It is best to put
TTL and LVDS signals on different layers which are isolated by power or ground plane(s).
• Keep drivers and receivers as close to the (LVDS port side) connectors as possible.
11.1.1 Power Decoupling Recommendations
Bypass capacitors must be used on power pins. High frequency ceramic (surface-mount recommended) 0.1-µF
in parallel with 0.01-µF, in parallel with 0.001-µF at the power supply pin as well as scattered capacitors over the
printed-circuit board. Multiple vias must be used to connect the decoupling capacitors to the power planes. A
10‑µF, 35-V (or greater) solid tantalum capacitor must be connected at the power entry point on the printed-
circuit board.
11.1.2 Differential Traces
Use controlled impedance traces which match the differential impedance of your transmission medium (that is,
cable) and termination resistor. Run the differential pair trace lines as close together as possible as soon as they
leave the IC (stubs must be < 10 mm long). This helps eliminate reflections and ensure noise is coupled as
common-mode. Lab experiments show that differential signals which are 1 mm apart radiate far less noise than
traces 3 mm apart because magnetic field cancellation is greater with the closer traces. Plus, noise induced on
the differential lines is much more likely to appear as common-mode which is rejected by the receiver.
Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase
difference between signals which destroys the magnetic field cancellation benefits of differential signals and
results in EMI. Note the velocity of propagation, v = c/Er where c (the speed of light) = 0.2997 mm/ps or 0.0118
in/ps. Do not rely solely on the auto-route function for differential traces. Carefully review dimensions to match
differential impedance and provide isolation for the differential lines. Minimize the number of vias and other
discontinuities on the line.
Avoid 90° turns (these cause impedance discontinuities). Use arcs or 45° bevels.
Within a pair of traces, the distance between the two traces must be minimized to maintain common-mode
rejection of the receivers. On the printed-circuit board, this distance must remain constant to avoid discontinuities
in differential impedance. Minor violations at connection points are allowable.
11.1.3 Termination
Use a resistor which best matches the differential impedance of your transmission line. The resistor must be
between 90 Ωand 130 Ω. Remember that the current mode outputs need the termination resistor to generate the
differential voltage. LVDS will not work without resistor termination. Typically, connect a single resistor across the
pair at the receiver end.
Surface-mount 1% to 2% resistors are best. PCB stubs, component lead, and the distance from the termination
to the receiver inputs must be minimized. The distance between the termination resistor and the receiver must be
< 10 mm (12 mm maximum).
8
7
Decoupling Cap
6
5
4
3
2
1
9
10
11
12
13
14
15
16
VCC
DIN2
DIN1
EN
DIN3
DIN4
EN*
GND
DOUT4-
DOUT4+
DOUT3+
DOUT3-
DOUT2-
DOUT2+
DOUT1+
DOUT1-
DS90LV031A
Input Termination
(Required at Receiver)
Control Signals
Input Termination
(Required at Receiver)
LVCMOS Input
LVCMOS Input
LVCMOS Input
LVCMOS Input
Input Termination
(Required at Receiver)
Input Termination
(Required at Receiver)
15
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11.2 Layout Example
Figure 12. DS90LV031A Example Layout
16
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
•LVDS Owner's Manual
•AN-808 Long Transmission Lines and Data Signal Quality (SNLA028)
•AN-977 LVDS Signal Quality: Jitter Measurements Using Eye Patterns Test Report #1 (SNLA166)
•AN-971 An Overview of LVDS Technology (SNLA165)
•AN-916 A Practical Guide to Cable Selection (SNLA219)
•AN-805 Calculating Power Dissipation for Differential Line Drivers (SNOA233)
•AN-903 A Comparison of Differential Termination Techniques (SNLA034)
•AN-1035 PCB Design Guidelines for LVDS Technology (SNOA355)
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
TRI-STATE is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS90LV031ATM NRND SOIC D 16 48 Non-RoHS
& Green Call TI Call TI -40 to 85 DS90LV031A
TM
DS90LV031ATM/NOPB ACTIVE SOIC D 16 48 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV031A
TM
DS90LV031ATMTC NRND TSSOP PW 16 92 Non-RoHS
& Green Call TI Call TI -40 to 85 DS90LV
031AT
DS90LV031ATMTC/NOPB ACTIVE TSSOP PW 16 92 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV
031AT
DS90LV031ATMTCX/NOPB ACTIVE TSSOP PW 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV
031AT
DS90LV031ATMX NRND SOIC D 16 2500 Non-RoHS
& Green Call TI Call TI -40 to 85 DS90LV031A
TM
DS90LV031ATMX/NOPB ACTIVE SOIC D 16 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 85 DS90LV031A
TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS90LV031ATMTCX/NO
PB TSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
DS90LV031ATMX SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1
DS90LV031ATMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS90LV031ATMTCX/NOP
BTSSOP PW 16 2500 367.0 367.0 35.0
DS90LV031ATMX SOIC D 16 2500 367.0 367.0 35.0
DS90LV031ATMX/NOPB SOIC D 16 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
BNOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
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