W24257 (Winbond Electronics Corp. 32K x 8 CMOS STATIC RAM 8GENERAL DESCRIPTION The W24257 is a slow speed, low power CMOS static RAM organized as 32768 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES Low power consumption: All inputs and outputs directly TTL compatible Active: 400 mW (max.) Three-state outputs ~ Standby: 250 pW (max.) (LL-version) Battery back-up operation capability 500 pW (max.) (L-version) Data retention voltage: 2V (min.) Access time: 70/100 nS (max.) + Available packages: 28-pin 600 mil DIP, 330 + Single +5V power supply mil SOP, 300 mil skinny DIP and SOJ Fully static operation PIN CONFIGURATION BLOCK DIAGRAM VOD -> VSS > au [] 3 U 2 [] voo ao |. Leas coe Az C 2 a |] WE _ HREGOBERL->]- Q Le : | aa ie A? Cr 3 ze [J] ans : oe as [] 4 as |] aa - as [| 5 za [] 40 cs | oS we | vot m [le z [joan _| - : ae | oe Ad CI 7 22 r OE " a []s 24 7 A109 a []s 2 [] cs PIN DESCRIPTION so [| 19 [J wos SYMBOL DESCRIPTION vot C "4 18 | yo? AOQ-A14 Address I[nputs vor [] 12 7 [] vs VO1-VO8 Data Inputs/Outputs os [I] oC] ves cs Chip Select Input C Hy WE Write Enable Input Vsg 14 18 vO OE Output Enable Input Vob Power Suppiy Vss Ground Publication Release Date: April 1997 -]- Revision AllW24257 Winbond tectronics Carp. TRUTH TABLE s OE WE MODE V01-VO8 Vop CURRENT H Xx x Not Selected High Z IsB, IsB1 L H H Output Disable High Z Ipp L L H Read Data Out Ipp L x L Write Data In IpD DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER RATING UNIT Supply Voltage to Vss Potential -0.5 to +7.0 Vv Input/Output to Vss Potential -0.5 to VDD +0.5 V Allowable Power Dissipation 1.0 Ww Storage Temperature -65 to +150 C Operating Temperature 0 to +70 C Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliabilityof the device. Operating Characteristics (Von = 5V +10%, Vss= OV, Ta= 0 to 70 C) PARAMETER SYM. TEST CONDITIONS MIN. | TYP. | MAX. | UNIT Input Low Voltage VIL - -0.5 - +0.8 Vv Input High Voltage VIH - +2.2 - VbD +0.5 Vv input Leakage Current | ILI VIN = Vss to VoD -2 - +2 LA Output Leakage ILO | Vvo = Vss to Vop, CS = Vin -2 - +2 LA Current (min.)} or OE = ViH (min.) or WE = ViL (max.) Output Low Voltage VoL | lo. = +4.0 mA - - 0.4 Vv Output High Voltage VOH | IOH = -1.0 mA 2.4 - - Vv Operatina Power IDD | CS = ViL (min.), 70] - - 80 mA 0 =OmA Supply Current Cycle = min., 100 - - 70 mA Duty = 100% Standby Power ISB | CS = Vin (min.) - - 3 mA Supply Current Cycle = min., Duty = 100% Is81 | CS > Vpp -0.2V LL | - - 50 pA L - - 100 pA Note: Typical characteristics are at bp = 5V, Ta = 25 C.W24257 4 Winbond ES Electronics Corp. CAPACITANCE (Vop = 5V, Ta= 25 C, f= 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT input Capacitance CIN VIN = OV 6 pF Input/Output Capacitance Cvo Vout = 0V 8 pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER CONDITIONS input Pulse Levels 0.6V to 2.4V Input Rise and Fail Times 5nS Input and Output Timing Reference Level 1.5V Output Load CL = 100 pF, loH/loL = -1 mA/4 mA AC Test Loads and Waveform R1 1000 ohm R1 1000 ohm SV 5V oo : | OUTPUT TT 100 pF 2? R2 | Including 660 ohm | itu ' 660 ohm Jig and _ dig and = Scope = Scope - (For Tewz, Toiz, Toxz, Touz, Twxz, Tow) 3.0V Fe0% 4 90% i \ i I\ 5nS-4 | 5nS Publication Release Date: April 1997 Revision AllW24257 AC Characteristics, continued (Voo = 5V +10%, Vss= OV, Ta=0 to 70 C) Read Cycle PARAMETER SYM. W24257-70 W24257-10 UNIT MIN. MAX. MIN. MAX. Read Cycle Time TRC 70 - 100 - nS Address Access Time TAA - 70 - 100 ns Chip Select Access Time TACS - 70 - 100 ns Output Enable to Output Valid TAOE - 35 - 50 ns Chip Selection to Output in Low Z TCLZ 10 ~ 10 - ns Output Enable to Output in Low Z TOLZ* 5 - 5 - ns Chip Deselection to Output in High Z TCHz* ~ 30 - 35 ns Output Disable to Output in High Z TOHz* - 30 - 35 ns Output Hold from Address Change TOH 10 - 10 - nS * These parameters are sampied but not 100% tested Write Cycle PARAMETER SYM. W24257-70 W24257-10 UNIT MIN. MAX. MIN. MAX. Write Cycle Time Twe 70 - 100 - ns Chip Selection to End of Write Tow 60 - 80 - ns Address Valid to End of Write TAW 60 - 80 - ns Address Setup Time TAS 0 - 0 - ns Write Pulse Width Twp 45 - 60 - ns Write Recovery Time CS, WE | TwR 0 - 0) - ns Data Valid to End of Write Tow 30 - 40 - ns Data Hold from End of Write TDH 0 - 0 - ns Write to Output in High Z TWHZ* - 30 - 30 ns Output Disable to Output in High Z TOHZ* - 30 - 30 ns Output Active from End of Write Tow 0 - 0 - n$ * These parameters are sampled but not 100% testedW24257 linbond Electronics Corp. TIMING WAVEFORMS Read Cycle 1 (Address Controlled) 7 SS + TAA i ~ pe TOH i Tou im Read Cycle 2 (Chip Select Controlled) es AAA LLLLLLLLLL - Terz - ez bow XXXK Read Cycle 3 (Output Enable Controlled) Address DauT Publication Release Date: April 1997 -3- Revision AllW24257 Timing Waveforms, continued Write Cycle 1 ss GE 4/// LL) TYNAN S N\NAAADR SS LLL SLL WE os\e \ \ oe of SS33333S_ Dour ve TOW ie Tor c COX MN Write Cycle 2 (OE = Vit Fixed) _- Two pe i Address x = WW WZ a ANA fe wa (2) 8) por CONS IN SOUISTSI ISIN te To LLLLLLL LLL? L_ TOH . < XXXXX Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from Dout are the same as the data written to DN during the write cycle. 3. Dout provides the read data for the next address. 4. Transition is measured +500 mV from steady state with = 5 pF. This parameter is guaranteed but not 100% tested.W24257 finbond Electronics Corp. DATA RETENTION CHARACTERISTICS (Ta = 0 to 70 C) PARAMETER SYM. | TEST CONDITIONS | MIN. | TYP.| MAX. | UNIT Vob for Data Retention VDR |GS > Vpp -0.2V 2.0 - - Vv Data Retention Current IDDDR | GS > Vpp -0.2V tL} - - 20 | pA Vob = 3V L - - 50 | pA Chip Deselect to Data Retention Time | TcpR | See data retention 0 - - ns Operation Recovery Time TR waveform TRC*| - - ns Trc* = Read Cycle Time DATA RETENTION WAVEFORM DATA RETENTION MODE . Toor. o) =_ ote ORDERING INFORMATION PART NO. ACCESS OPERATING STANDBY PACKAGE TIME (nS) CURRENT CURRENT MAX. (mA) MAX. (mA) W24257-70LL 70 80 50 600 mil DIP W24257-70L 70 80 100 600 mil DIP W24257-10L 100 70 100 600 mil DIP W24257S-70LL 70 80 50 330 mil SOP W24257S-70L 70 80 400 330 mil SOP W24257S-10L 100 70 100 330 mil SOP W24257K-70LL 70 80 50 300 mil Skinny W24257K-70L 70 80 100 300 mil Skinny W24257K-10L 100 70 100 300 mil Skinny W24257J-70LL 70 80 50 300 mil SOS W24257J-70L 70 80 100 300 mil SOJ W24257J-10L 100 70 100 300 mil SOJ Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. Publication Release Date: April 1997 -7- Revision AllBO linbond Electranics Corp. NDING PAD DIAGRAM W24257 AB a AOSUOUEEGAALA Aa 5 AB OAT OAIZ Ald VOO voO WE AI3 AB OAS ATI a a) cern aeneennenye Sop te zis Bi 3 id ae 2 (Be) C3) aL] [3] C3 si 3] 8 8 PAD NO x Y 1 -127.08 2785.05 2 -377.73 2785.05 3 628.38 2785.05 4 -879.03 2785.05 i) -1129.68 2785.05 6 -1380.33 2785.05 7 ~1686.51 2640.06 8 -1682.01 ~2645.91 9 -1448.10 -2802.51 10 -1090.80 ~2802.51 i1 -877.32 -2807.28 12 -627.84 -2807.28 13 -349.56 -2807.28 148-1 -155.52 -2781.00 148-2 -7.02 ~2771.64 15 249.21 -2807.28 16 498.69 -2807.28 17 776.97 -2807.28 18 1026.45 -2807.28 19 1304.73 -2807.28 20 1689.30 -2802.51 21 1686.51 -2520.90 22 1686.51 2644.74 23 1459.17 2785.05 24 1208.52 2785.05 25 957.87 2785.05 26 707.22 2785.05 27 456.57 2785.05 288-1 205.92 2771.55 288-2 21.42 2780.91 Note: For bare chip form (C.O.B.) applications, the substrate must be connected to bb or left floating in the PCB layout.linbond Electronics Corp. PACKAGE DIMENSIONS 28-pin P-DIP W24257 Aan ete DO oO O WIRATA RITES RAT GAGE GT GAT TT = UY Ce \ pt - . in inches in mam Min, |Nom.| Maz. Min. |Nom.| Max. A | [awe | | [52 Ar [oor | | jos | | A, [0180 |0155 jorso | 3ar | 394 | 408 |B [eere Jams ome [os | oe | 056 |B [bess [occ joan | 147 | 152 | 163 nos lane joo | o20 | 028 | 036 D =~ f[1.aeo [iara | [370s jara4 E ose ioeco losio lisa [1524 | 15.40 E: 0540 |0545 lonsd [13.72 [13.84 (4387 @, [0080 joteo jana | 22% | 254 | 279 L 0120 [0130 Jota | 308 | 330 | 356 a a [s 8 448 @. [0630 |oe80 |os7o [1600 | 1851 | 27.02 Ss - | -- [ovo | | | 229 Notes: 4+, Dimension D Max. & & include mold flash or fie bar burrs. 2. Dimension Et does not include interlead flash. 3. Dimension D & E1 include mod mismatch and are deterninad at the mold parting line. 4. Dimension &1 does net include dambar protusionfiritrusion, . 5, Cantrafiing dimension: Inches. 6. General appearance spec. should ba based on o sas oeataAaaasa A i) o O pd TOP CARA CA GAR Oy * " Be ahr final visual inspection spec. 28-pin P-DIP Skinny | in Inches in mm | Symbot Min. |Nom.| Max. Min. [Nom.| Max. | a = af Ot 7 1686 J Bs aoe | |) | 025 ee A O12 [O430 (8135 | 218 ix 343 BOIS | O08 | o022 | O41 6.46 O56 +B |g, _[008 |o080 [ones | 47 | 152 | 1.63 c ooos jooio jams | o20 | 025 | 036 D 41308 | 1.400 | ~- [2526 | 558 E 0.30 | 03t0 | oz | 762 | 787 | BIS | 6, [0.253 [ease [ozs | 719 | 732 | 740 a, _|eo% [oto [ero | 229 | 284 | 279 L o120 [0130 jo1o | 305 | 330 | 356 a o | | ts of om | 1 en | 0330 |0380 {ogo | 833 | Bas | 940 Ss _ oe | 0.085 | 140 Notes: 1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash, 3. Dimension D & E1 inckade moi mismatch and are determined at the mold parting line. 4. Dimension B1 dos not include dambar protrusion/ntrusion. 5. Controfling dimension: inches. . General arance should be based on finat cvsual prspaction spec Publication Release Date: April 1997 Revision AllW24257 linbond Electronics Corp. Package Dimensions, continued 28-pin SO Wide Body Olmension in inches; Dimension In mm! Min.| Nom. Max.) Min. /Nom.| Max, oe [om [ome | | om [ze Ay [004 | | mm jaw | | 0.093 [0.088 (0.103 fase ] zee | 2.62 0.014 jb0e iaom [ose jae | 051 oes foo feoa [oz | 02 | 026 jo73 jorsa | [sar [182 ons {0301 [owe | 628 feat | 30 0.044 16.080 |Go8e | 112 6 1.27 | 1.42 0.483 (O.4e5 | Oerr fins1 tet [1212 0.028 |o036 [0.088 [or fos | 1.12 ooss fooe7 [oors | 180 [170 fim _ ~ | @0er _ a | 48 Symbel | t er re & Bm pe jr _ | 000A _ a | BAD of | eo | | 10 Notes: . Dirnension D Max. & $ include maid flash or tie bar burrs. Dimension b does not include dambar protrusionfntrusion. Dimension D & E include moid mismatch and determined af the mokd parting ine. . Controliing dimension: Inches. Le. . General appearance spec should be based ~ Seating Ptane on final visual inspection spec. Nn fo i 28-pin Small Outline J Band A in inches inmm Symbol [> ] j e027 | f DOS | 0.100 10105 | 241 254 | 287 oo2s |0028 (0032 | 386 art oat nae {Gord foo | O41 O46 | O56 DOOR [G01O foMma | 220 GB 0.36 > > a 2B 6 PO oS 02% 10300 10305 | 749 7.62 795 0.084 (0.060 10086 | 112 127 tae B28 |6265 [0.285 | 4.22 8.73 724 Om? low? ;Os47 | 31 856 Bat , E| He elim ip |e. io ! 1O | { LO a a 0 ew 1 14 6077 [0.087 [2087 | 196 224 246 ~ [OOS ae pita | ~ four | | [oro oh fo |r be jo Notes: 1. Dimension D Max. & S include mold flash or te bar burrs. 2. Dimension b does nt include dambar protrusion/intrusio 3. Dimension 0 & E include mold mismatch and are determined at the mold parting line. 4. Controiling dimension: inches. 5. General appearance spec. should be based on final visua! inspection spe: -10-W24257 inbond Electronics Corp. Yinbond Electronics Corp. Headquarters Winbond Electronics (H.K.) Ltd. Winbond Electronics North America Corp. No. 4, Creation Rd. Hl. Rm. 803, World Trade Square. Tower Il, Winbond Memory Lab. Science-Based Industrial Park. 123 Hol Bun Rd.. Kwun Tona. Winbond Microelectronics Corp. Hsinchu, Taiwan Kowloon, Hong Kona Winbond Systems Lab TEL: 886-3-5770066 TEL: 852-27513100 . FAX: 886-3-5792647 FAX: 852-27552064 2727 N. First Street. San Jose. htte:/Avww.winbond.com.tw/ CA 95134, U.S.A. Voice & Fax-on-demand: 886-2-7197006 TEL: 1-408-9436666 FAX: 1-408-5441798 Taipei Office 41F, No. 115, Sec. 3, Min-Sheng East Rd.. Taipei. Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502 Note: All data and specifications are subiect to chanae without notice. Publication Release Date: January 1997 -{]- Revision All