EGP20A THRU EGP20G
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
Reverse Voltage - 50 to 400 Volts Forward Current - 2.0 Amperes
FEATURES
♦ Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
♦ Glass passivated cavity-free junction
♦ Superfast recovery time for high efficiency
♦ Low forward voltage, high current capability
♦ Low leakage current
♦ High surge current capability
♦ High temperature
metallurgically bonded construction
♦ High temperature soldering guaranteed:
300°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: JEDEC DO-204AC molded plastic over solid glass
body
Terminals: Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.015 ounce, 0.4 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
EGP EGP EGP EGP EGP EGP
SYMBOLS 20A 20B 20C 20D 20F 20G UNITS
Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 Volts
Maximum RMS voltage VRMS 35 70 105 140 210 280 Volts
Maximum DC blocking voltage VDC 50 100 150 200 300 400 Volts
Maximum average forward rectified current
0.375" (9.5mm) lead length at TA=55°C I(AV) 2.0 Amps
Peak forward surge current,
8.3 ms single half sine-wave superimposed
on rated load IFSM 75.0 Amps
Maximum instantaneous forward voltage at 2.0A VF0.95 1.25 Volts
Maximum DC reverse current TA=25°C 5.0
at rated DC blocking voltage TA=125°C IR100.0 µA
Maximum reverse recover y time (NOTE 1) trr 50.0 ns
Typical junction capacitance (NOTE 2) CJ70.0 45.0 pF
Typical ther mal resistance (NOTE 3) RΘJA 40.0
RΘJL 15.0 °C/W
Operating junction and storage temperature range TJ, TSTG -65 to +150 °C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHZand applied reverse voltage of 4.0 Volts
(3) Ther mal resistance from junction to ambient, and from junction to lead at 0.375” (9.5mm) lead length, P.C.B. mounted
4/98
0.034 (0.86)
0.028 (0.71)
0.140 (3.6)
0.104 (2.6)
DIA.
DIA.
1.0
MIN.
(25.4)
0.230 (5.8)
0.300 (7.6)
1.0
MIN.
(25.4)
DO-204AC
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
PATENTED*