June 2010 Doc ID 13446 Rev 3 1/22
22
LD49150XX08
LD49150XX10, LD49150XX12
1.5 A very low drop for low output voltage regulator
Features
Input voltage range:
–V
I = 1.4 V to 5.5 V
–V
BIAS = 3 V to 6 V
Stable with ceramic capacitor
±1.5 % initial tolerance
Maximum dropout voltage (VI - VO) of 200 mV
over temperature
Adjustable output voltage down to 0.8 V
Ultra fast transient response (up to 10 MHz
bandwidth)
Excellent line and load regulation
specifications
Logic controlled shutdown option
Thermal shutdown and current limit protection
Junction temperature range: - 25 °C to 125 °C
Applications
Graphics processors
PC add-in cards
Microprocessor core voltage supply
Low voltage digital ICs
High efficiency linear power supplies
SMPS post regulators
Description
The LD49150xx is a high-bandwidth, low-dropout,
1.5 A voltage regulator, ideal for powering core
voltages of low-power microprocessors. The
LD49150xx implements a dual supply
configuration allowing for very low output
impedance and very fast transient response. The
LD49150xx requires a bias input supply and a
main input supply, allowing for ultra-low input
voltages on the main supply rail. The input supply
operates from 1.4 V to 5.5 V and the bias supply
requires between 3 V and 6 V for proper
operation. The LD49150xx offers fixed output
voltages from 0.8 V to 1.8 V and adjustable output
voltages down to 0.8 V. The LD49150xx requires a
minimum output capacitance for stability, and
work optimally with small ceramic capacitors.
PPAK DFN6 (3x3 mm)
Table 1. Device summary
Order codes
Output voltages
PPAK (tape and reel) DFN6 (tape and reel) (1)
LD49150PT08R 0.8 V (2)
LD49150PT10R LD49150PU10R 1.0 V
LD49150PT12R LD49150PU12R 1.2 V
1. Available on request.
2. Adjustable version.
www.st.com
Contents LD49150XX08, LD49150XX10, LD49150XX12
2/22 Doc ID 13446 Rev 3
Contents
1 Typical application circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Alternative application circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7 Typical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.1 Input supply voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.2 Bias supply voltage (VBIAS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.3 External capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.4 Output capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.5 Minimum load current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.6 Power sequencing recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8.7 Power dissipation/heatsinking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8.8 Heatsinking PPAK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.9 Adjustable regulator design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.10 Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
LD49150XX08, LD49150XX10, LD49150XX12 Typical application circuits
Doc ID 13446 Rev 3 3/22
1 Typical application circuits
Figure 1. Adjustable version
Figure 2. Fixed version with Enable
Alternative application circuits LD49150XX08, LD49150XX10, LD49150XX12
4/22 Doc ID 13446 Rev 3
2 Alternative application circuits
Figure 3. Single supply voltage solution
Figure 4. LD49150xx plus DC-DC pre-regulator to reduce power dissipation
LD49150XX08, LD49150XX10, LD49150XX12 Pin configuration
Doc ID 13446 Rev 3 5/22
3 Pin configuration
Figure 5. Pin connections (top view for PPAK, bottom view for DFN)
PPAK
DFN6 (3 x 3 mm)
Table 2. Pin description
Pin n° for
PPAK
Pin n° for
DFN Symbol Note
12
EN For fixed versions: Enable (Input) - Logic High = Enable, Logic Low =
Shutdown.
ADJ For adjustable versions: Adjustable regulator feedback input. Connect to
resistor voltage divider.
23V
IN Input voltage which supplies current to the output power device.
3 1 GND Ground (TAB is connected to ground).
44V
OUT Regulator output.
56V
BIAS
Input bias voltage for powering all circuitry on the regulator with the
exception of the output power device.
5 N.C. Not connect.
Diagram LD49150XX08, LD49150XX10, LD49150XX12
6/22 Doc ID 13446 Rev 3
4 Diagram
Figure 6. Block diagram
LD49150XX08, LD49150XX10, LD49150XX12 Maximum ratings
Doc ID 13446 Rev 3 7/22
5 Maximum ratings
Note: Absolute maximum ratings are those values beyond which damage to the device may occur.
Functional operation under these conditions is not implied.
Table 3. Absolute maximum ratings (1)
1. All the values are referred to ground.
Symbol Parameter Value Unit
VIN Supply voltage -0.3 to 7 V
VOUT Output voltage -0.3 to VIN + 0.3
-0.3 to VBIAS + 0.3 V
VBIAS BIAS supply voltage -0.3 to 7 V
VEN Enable input voltage -0.3 to 7 V
PDPower dissipation Internally limited
TSTG Storage temperature range -50 to 150 °C
Table 4. Operating ratings
Symbol Parameter Value Unit
VIN Supply voltage 1.4 to 5.5 V
VOUT Output voltage 0.8 to 4.5 V
VBIAS BIAS supply voltage 3 to 6 V
VEN Enable input voltage 0 to VBIAS V
TJJunction temperature range -25 to 125 °C
Electrical characteristics LD49150XX08, LD49150XX10, LD49150XX12
8/22 Doc ID 13446 Rev 3
6 Electrical characteristics
TJ = - 25 °C to 125 °C, VBIAS = VO + 2.1 V (1); VI = VO+1 V; VEN = VBIAS (2), IO = 10 mA; CI =
1 µF; CO = 10 µF; CBIAS = 1 µF; unless otherwise specified.
Typical values are referred to TJ = 25 °C.
Table 5. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
VOOutput voltage accuracy TJ = 25 °C, fixed voltage options -1.5 1.5 %
Over temperature range -3 3
VLINE Line regulation VI = VO + 1 V to 5.5 V -0.1 0.1 %/V
VLOAD Load regulation IL = 0 mA to 3 A, VBIAS 3 V 1 %
VDROP Dropout voltage (VI - VO)I
L = 1.5 A 200 mV
VDROP Dropout voltage (VBIAS- VO)I
L = 1.5 A (1) 1.5 2.1 V
IGND Ground pin current IL = 0 mA 4 6 mA
IL = 1.5 A 4 6
IGND_SHD Ground pin current in shutdown VEN 0.4 V (2) A
IVBIAS Current through VBIAS
IL = 0 mA 3 5 mA
IL = 1.5 A 3 5
ILCurrent limit VO = 0 V 2.5 A
Enable input (2)
VEN
Enable input threshold (fixed
voltage only)
Regulator Enable 1.4 V
Regulator Shutdown 0.4
IEN Enable pin input current 0.1 1 µA
Reference
VREF Reference voltage TJ = 25 °C 0.788 0.8 0.812 V
Over temperature range 0.776 0.8 0.824
SVR Supply voltage rejection VI = 2.5 V ± 0.5 V, VO = 1 V,
F = 120 Hz, VBIAS = 3.3 V 68 dB
1. For VO 1 V, VBIAS dropout specification does not apply due to a minimum 3 V VBIAS input.
2. Fixed output voltage version only.
LD49150XX08, LD49150XX10, LD49150XX12 Typical characteristics
Doc ID 13446 Rev 3 9/22
7 Typical characteristics
Figure 7. Reference voltage vs. temperature Figure 8. Output voltage vs. temperature
Figure 9. Load regulation vs. temperature Figure 10. Line regulation vs. temperature
Figure 11. Output voltage vs. input voltage Figure 12. Dropout voltage (VIN-VOUT) vs.
temperature
Typical characteristics LD49150XX08, LD49150XX10, LD49150XX12
10/22 Doc ID 13446 Rev 3
Figure 13. Dropout voltage (VIN-VOUT) vs.
temperature
Figure 14. VBIAS pin current vs. temperature
Figure 15. Noise vs. frequency Figure 16. Quiescent current vs. temperature
Figure 17. Supply voltage rejection vs. output
current
Figure 18. Stability region vs. COUT & High
ESR
LD49150XX08, LD49150XX10, LD49150XX12 Typical characteristics
Doc ID 13446 Rev 3 11/22
Figure 19. Stability region vs. COUT & low ESR Figure 20. VBIAS & VIN start up transient
response (VIN and VBIAS start up at
the same time)
VIN=VBIAS=VINH=3.1V, VOUT=1V, COUT=1µF
Figure 21. VIN start up transient response
(VBIAS start up before VIN)
Figure 22. VIN start up transient response
(VBIAS start up before VIN)
VIN=2.5V, VBIAS=VINH=3.1V, VOUT=1V, COUT=1µF
VIN=2.5V, VBIAS=VINH=3.1V, VOUT=1V, COUT=1µF
Typical characteristics LD49150XX08, LD49150XX10, LD49150XX12
12/22 Doc ID 13446 Rev 3
Figure 23. VIN start up transient response
(VBIAS start up before VIN and
VINH=VIN)
VIN=VINH=2.5V, VBIAS=3.1V, VOUT=1V, COUT=1µF
LD49150XX08, LD49150XX10, LD49150XX12 Application hints
Doc ID 13446 Rev 3 13/22
8 Application hints
The LD49150xx is an ultra-high performance, low dropout linear regulator, designed for high
current application that requires fast transient response. The LD49150xx operates from two
input voltages, to reduce dropout voltage. The LD49150xx is designed so that a minimum of
external component are necessary.
8.1 Input supply voltage (VIN)
VIN provides the power input current to the LD49150xx. The minimum input voltage can be
as low as 1.4 V, allowing conversion from very low voltage supplies to achieve low output
voltage levels with very low power dissipation.
8.2 Bias supply voltage (VBIAS)
The LD49150xx control circuitry is supplied the VBIAS pin which requires a very low bias
current (3 mA typ.) even at the maximum output current level (1.5 A). A bypass capacitor on
the bias pin is recommended to improve the performance of the LD49150xx during line and
load transient. The small ceramic capacitor from VBIAS to ground reduces high frequency
noise that could be injected into the control circuitry from the bias rail. In typical applications
a 1 µF ceramic chip capacitor may be used. The VBIAS input voltage must be 2.1 V above
the output voltage, with a minimum VBIAS input voltage of 3 V.
8.3 External capacitors
To assure regulator stability, input and output capacitors are required as shown in the 1:
Typical application circuits.
8.4 Output capacitor
The LD49150xx requires a minimum output capacitance to maintain stability. A ceramic chip
capacitor of at least 1 µF is required. However, specific capacitor selection could be needed
to ensure the transient response. A 1 µF ceramic chip capacitor satisfies most applications
but 10 µF is recommended to ensure better transient performances. In applications where
the VIN level is close to the maximum operating voltage (VIN > 4 V), it is strongly
recommended to use an output capacitors of, at least, 10 µF in order to avoid over-voltage
stress on the Input/output power pins during short circuit conditions due to parasitic
inductive effect. The output capacitor must be located as close as possible to the output pin
of the LD49150xx. The ESR (equivalent series resistance) of the output capacitor must be
within the "stable" region as shown in the typical characteristics figures. Both ceramic and
tantalum capacitors are suitable.
8.5 Minimum load current
The LD49150xx does not require a minimum load to maintain output voltage regulation.
Application hints LD49150XX08, LD49150XX10, LD49150XX12
14/22 Doc ID 13446 Rev 3
8.6 Power sequencing recommendations
In order to ensure the correct biasing and settling of the regulator internal circuitry during the
startup phase, as well as to avoid overvoltage spikes at the output, it is recommended to
provide for the correct power sequencing.
As a general rule the VIN and VINH signals timings at startup should be chosen properly, so
that they are applied to the device after the VBIAS voltage is already settled at its minimum
operative value (see paragraph 8.2: Bias supply voltage (VBIAS)). This can be achieved, for
instance, by avoiding too slow VBIAS rising edges (Tr >10 ms).
Provided that the above condition is satisfied, when fast VIN transient input (Tr < 100 µs) is
present, a smooth startup, with limited overvoltage on the output, can be obtained by
applying VIN voltage at the same time as the VBIAS voltage (refer to Figure 20, Figure 21
and Figure 22 on page 11).
In the fixed voltage versions it is possible to reduce overvoltage spikes during very fast
startup (Tr << 100 µs) by pulling the VINH pin up to VIN voltage (see Figure 23 on page 12).
8.7 Power dissipation/heatsinking
A heatsink may be required depending on the maximum power dissipation and maximum
ambient temperature of the application. Under all possible conditions, the junction
temperature must be within the range specified under operating conditions. The total power
dissipation of the device is given by:
PD = VIN x IIN + VBIAS x IBIAS - VOUT x IOUT
Where:
VIN, input supply voltage
VBIAS, bias supply voltage
VOUT
, output voltage
IOUT
, load current
From this data, we can calculate the thermal resistance (θSA) required for the heat sink
using the following formula:
θSA = (TJ - TA/PD) - (θJC + θCS)
The maximum allowed temperature rise (TRmax) depends on the maximum ambient
temperature (TAmax) of the application, and the maximum allowable junction temperature
(TJmax):
TRmax = TJmax - TAmax
The maximum allowable value for junction to ambient thermal resistance, θJA, can be
calculated using the formula:
θJAmax = TRmax / PD
This part is available for the PPAK package.
The thermal resistance depends on the amount of copper area or heat sink, and on air flow.
If the maximum allowable value of θJA calculated above is 100 °C/W for the PPAK
package, no heatsink is needed since the package can dissipate enough heat to satisfy
these requirements. If the value for allowable θJA falls below these limits, a heat sink is
required as described below.
LD49150XX08, LD49150XX10, LD49150XX12 Application hints
Doc ID 13446 Rev 3 15/22
8.8 Heatsinking PPAK package
The PPAK package uses the copper plane on the PCB as a heatsink. The tab of these
packages is soldered to the copper plane for heat sinking. It is also possible to use the PCB
ground plane a heatsink. This area can be the inner GND layer of a multi-layer PCB, or, in a
dual layer PCB, it can be an unbroken GND area on the opposite side where the IC is
situated with a dissipating area thermally connected through vias holes, filled by solder.
Figure 26 shows a curve for θJA of the PPAK package for different copper area sizes, using
a typical PCB with 1/16 in thick G10/FR4.
8.9 Adjustable regulator design
The LD49150xx adjustable version allows fixing output voltage anywhere between 0.8 V and
4.5 V using two resistors as shown in the typical application circuit. For example, to fix the
R1 resistor value between VOUT and the ADJ pin, the resistor value between ADJ and GND
(R2) is calculated by:
R2 = R1 [0.8/(VOUT - 0.8)]
Where VOUT is the desired output voltage.
It is suggested to use R1 values lower than 10 kΩ to obtain better load transient
performances. Even, higher values up to 100 kΩ are suitable.
8.10 Enable
The fixed output voltage versions of LD49150xx feature an active high Enable input (EN)
that allows on-off control of the regulator. The EN input threshold is guaranteed between 0.4
V and 1.4 V, for simple logic interfacing. The regulator is set in shut down mode when VEN <
0.4 V and it is in operating mode (VOUT activated) when VEN > 1.4 V. If not in use, the EN pin
must be tied directly to the VIN to keep the regulator continuously activated. The En pin must
not be left at high impedance.
Figure 24. θJA vs. copper area for PPAK package
Package mechanical data LD49150XX08, LD49150XX10, LD49150XX12
16/22 Doc ID 13446 Rev 3
9 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
LD49150XX08, LD49150XX10, LD49150XX12 Package mechanical data
Doc ID 13446 Rev 3 17/22
Dim.
mm. inch.
Min. Typ. Max. Min. Typ. Max.
A 2.2 2.4 0.086 0.094
A1 0.91.1 0.035 0.043
A2 0.030.230.001 0.009
B 0.4 0.6 0.015 0.023
B2 5.2 5.4 0.204 0.212
C 0.45 0.6 0.017 0.023
C2 0.480.6 0.0190.023
D 6 6.2 0.236 0.244
D1 5.1 0.201
E 6.4 6.6 0.252 0.260
E1 4.7 0.185
e 1.27 0.050
G4.95.25 0.193 0.206
G1 2.38 2.7 0.093 0.106
H9.35 10.1 0.3680.397
L2 0.81 0.0310.039
L4 0.6 1 0.0230.039
L5 1 0.039
L6 2.80.110
PPAK mechanical data
0078180-E
Package mechanical data LD49150XX08, LD49150XX10, LD49150XX12
18/22 Doc ID 13446 Rev 3
Dim.
mm. inch.
Min. Typ. Max. Min. Typ. Max.
A0.800.90 1.00 0.031 0.035 0.039
A1 0 0.02 0.05 0 0.001 0.002
A30.20 0.008
b0.230.300.38 0.0090.012 0.015
D2.903.00 3.10 0.114 0.1180.122
D2 2.232.38 2.480.088 0.094 0.098
E2.903.00 3.10 0.114 0.1180.122
E2 1.50 1.65 1.75 0.0590.065 0.069
e0.950.037
L0.30 0.40 0.50 0.012 0.016 0.020
DFN6 (3x3 mm) mechanical data
7946637A
LD49150XX08, LD49150XX10, LD49150XX12 Package mechanical data
Doc ID 13446 Rev 3 19/22
Dim.
mm. inch.
Min. Typ. Max. Min. Typ. Max.
A330 12.992
C12.813.0 13.2 0.504 0.512 0.519
D 20.2 0.795
N60 2.362
T22.40.882
Ao 6.806.90 7.00 0.2680.272 0.2.76
Bo 10.40 10.50 10.60 0.4090.4130.417
Ko 2.55 2.65 2.75 0.100 0.104 0.105
Po 3.94.0 4.1 0.1530.157 0.161
P7.98.0 8.1 0.311 0.315 0.319
Tape & reel DPAK-PPAK mechanical data
Package mechanical data LD49150XX08, LD49150XX10, LD49150XX12
20/22 Doc ID 13446 Rev 3
Dim.
mm. inch.
Min. Typ. Max. Min. Typ. Max.
A180 7.087
C 12.813.2 0.504 0.519
D 20.2 0.795
N60 2.362
T 14.4 0.567
Ao 3.30.130
Bo 3.30.130
Ko 1.1 0.043
Po 4 0.157
P80.315
Tape & reel QFNxx/DFNxx (3x3) mechanical data
LD49150XX08, LD49150XX10, LD49150XX12 Revision history
Doc ID 13446 Rev 3 21/22
10 Revision history
Table 6. Document revision history
Date Revision Changes
18-Apr-2007 1 Initial release.
12-Jan-2009 2 Added new package DFN6 (3x3 mm) and mechanical data.
29-Jun-2010 3 Modified Section 8.6: Power sequencing recommendations on page 14.
LD49150XX08, LD49150XX10, LD49150XX12
22/22 Doc ID 13446 Rev 3
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