○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
. 1/13
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
TSZ22111・14・001
www.rohm.com
Voltage Detector IC Series
Free Delay Time Setting
CMOS Voltage Detector IC Series
BD52xx series BD53xx series
General Description
Rohm's BD52xx and BD53xx series are highly
accurate, low current consumption Voltage Detector
ICs with a capacitor-controlled time delay. The line up
includes BD52xx devices with N channel open drain
output and BD53xx devices with CMOS output. The
devices are available for specific detection voltages
ranging from 2.3V to 6.0V in increments of 0.1V.
Features
Delay Time Controlled by external Capacitor
Two output types (N channel open drain and CMOS
output)
Ultra-low current consumption
Very small and low height package
Package SSOP5 is similar to SOT-23-5(JEDEC)
Key Specifications
Detection voltage: 2.3V to 6.0V (Typ.)
0.1V steps
High accuracy detection voltage: ±1.0%
Ultra-low current consumption: 0.95µA (Typ.)
Package W(typ) x D(typ) x H(max)
SSOP5: 2.90mm x 2.80mm x 1.25mm
VSOF5: 1.60mm x 1.60mm x 0.60mm
Applications
Circuits using microcontrollers or logic circuits that
require a reset.
Typical Application Circuit
Connection Diagram
SSOP5 VSOF5
Pin Descriptions
SSOP5
VSOF5
PIN No.
Symbol
Function
PIN No.
Symbol
Function
1
VOUT
Reset Output
1
VOUT
Reset Output
2
VDD
Power Supply Voltage
2
SUB
Substrate*
3
GND
GND
3
CT
Capacitor connection terminal for
output delay time
4
N.C.
Unconnected Terminal
4
GND
GND
5
CT
Capacitor connection terminal for
output delay time
5
VDD
Power Supply Voltage
*Connect the substrate to GND.
Open Drain Output type
BD52xx Series
CMOS Output type
BD53xx Series
VDD1
BD52xx
VDD2
GND
CL
(Capacitor for
noise filtering)
CT
RL
RST
Micro
controller
VDD1
BD53xx
GND
CT
CL
(Capacitor for
noise filtering)
RST
Micro
controller
TOP VIEW
TOP VIEW
VOUT
VDD
GND
N.C.
CT
Lot. No
Marking
GND
VOUT
SUB
CT
VDD
4
3
2
1
5
Marking
Lot. No
Datashee
t
2/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Ordering Information
B D x x x x x - T R
Part Output Type Reset Voltage Value Package Packaging and
Number 52 : Open Drain 23 : 2.3V G : SSOP5 forming specification
53 : CMOS 0.1V step FVE : VSOF5
TR : Embossed tape
60 : 6.0V and reel
3/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Lineup
Output Type
Open Drain
CMOS
Detection Voltage
Marking
Part Number
Marking
Part Number
6.0V
PW
BD5260
RW
BD5360
5.9V
PV
BD5259
RV
BD5359
5.8V
PU
BD5258
RU
BD5358
5.7V
PT
BD5257
RT
BD5357
5.6V
PS
BD5256
RS
BD5356
5.5V
PR
BD5255
RR
BD5355
5.4V
PQ
BD5254
RQ
BD5354
5.3V
PP
BD5253
RP
BD5353
5.2V
PN
BD5252
RN
BD5352
5.1V
PM
BD5251
RM
BD5351
5.0V
PL
BD5250
RL
BD5350
4.9V
PK
BD5249
RK
BD5349
4.8V
PJ
BD5248
RJ
BD5348
4.7V
PH
BD5247
RH
BD5347
4.6V
PG
BD5246
RG
BD5346
4.5V
PF
BD5245
RF
BD5345
4.4V
PE
BD5244
RE
BD5344
4.3V
PD
BD5243
RD
BD5343
4.2V
PC
BD5242
RC
BD5342
4.1V
PB
BD5241
RB
BD5341
4.0V
PA
BD5240
RA
BD5340
3.9V
MV
BD5239
QV
BD5339
3.8V
MU
BD5238
QU
BD5338
3.7V
MT
BD5237
QT
BD5337
3.6V
MS
BD5236
QS
BD5336
3.5V
MR
BD5235
QR
BD5335
3.4V
MQ
BD5234
QQ
BD5334
3.3V
MP
BD5233
QP
BD5333
3.2V
MN
BD5232
QN
BD5332
3.1V
MM
BD5231
QM
BD5331
3.0V
ML
BD5230
QL
BD5330
2.9V
MK
BD5229
QK
BD5329
2.8V
MJ
BD5228
QJ
BD5328
2.7V
MH
BD5227
QH
BD5327
2.6V
MG
BD5226
QG
BD5326
2.5V
MF
BD5225
QF
BD5325
2.4V
ME
BD5224
QE
BD5324
2.3V
MD
BD5223
QD
BD5323
4/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Absolute maximum ratings
Parameter
Symbol
Limits
Unit
Power Supply Voltage
VDD-GND
-0.3 to +10
V
Output Voltage
Nch Open Drain Output
VOUT
GND-0.3 to +10
V
CMOS Output
GND-0.3 to VDD+0.3
Output Current
Io
80
mA
Power
Dissipation
SSOP5 *1*3
Pd
540
mW
VSOF5 *2*3
210
Operating Temperature
Topr
-40 to +105
°C
Ambient Storage Temperature
Tstg
-55 to +125
°C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 Reduced by 2.1mW/°C when used over 25°C.
*3 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Parameter
Symbol
Condition
Limit
Unit
Min.
Typ.
Max.
Detection Voltage
VDET
VDD=HL, RL=470kΩ *1
VDET(T)
×0.99
VDET(T)
VDET(T)
×1.01
V
VDET=2.5V
Ta=+25°C
2.475
2.5
2.525
Ta=-40°C to 85°C
2.418
-
2.584
Ta=85°C to 105°C
2.404
-
2.597
VDET=3.0V
Ta=+25°C
2.970
3.0
3.030
Ta=-40°C to 85°C
2.901
-
3.100
Ta=85°C to 105°C
2.885
-
3.117
VDET=3.3V
Ta=+25°C
3.267
3.3
3.333
Ta=-40°C to 85°C
3.191
-
3.410
Ta=85°C to 105°C
3.173
-
3.428
VDET=4.2V
Ta=+25°C
4.158
4.2
4.242
Ta=-40°C to 85°C
4.061
-
4.341
Ta=85°C to 105°C
4.039
-
4.364
VDET=4.8V
Ta=+25°C
4.752
4.8
4.848
Ta=-40°C to 85°C
4.641
-
4.961
Ta=85°C to 105°C
4.616
-
4.987
Circuit Current when ON
IDD1
VDD=VDET-0.2V
VDET =2.3-3.1V
-
0.80
2.40
µA
VDET =3.2-4.2V
-
0.85
2.55
VDET =4.3-5.2V
-
0.90
2.70
VDET =5.3-6.0V
-
0.95
2.85
Circuit Current when OFF
IDD2
VDD=VDET+2.0V
VDET =2.3-3.1V
-
0.75
2.25
µA
VDET =3.2-4.2V
-
0.80
2.40
VDET =4.3-5.2V
-
0.85
2.55
VDET =5.3-6.0V
-
0.90
2.70
Operating Voltage Range
VOPL
VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ
0.95
-
-
V
VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ
1.20
-
-
‘Low’ Output Voltage (Nch)
VOL
VDD=1.2V, ISINK = 0.4 mA, VDET=2.3-6.0V
-
-
0.5
V
VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V
-
-
0.5
‘High’ Output Voltage (Pch)
VOH
VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V)
VDD-0.5
-
-
V
VDD=6.0V, ISOURCE=0.9 mA, VDET(4.3V to 5.2V)
VDD-0.5
-
-
VDD=8.0V, ISOURCE=1.1 mA, VDET(5.3V to 6.0V)
VDD-0.5
-
-
VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guaranteed at Ta=25°C.
5/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued
Parameter
Symbol
Condition
Limit
Unit
Min.
Typ.
Max.
Leak Current
Ileak
VDD=VDS=10V *1
-
-
0.1
µA
CT pin Threshold Voltage
VCTH
VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ
VDD
×0.30
VDD
×0.40
VDD
×0.60
V
VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ
VDD
×0.30
VDD
×0.45
VDD
×0.60
VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ
VDD
×0.35
VDD
×0.50
VDD
×0.60
VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ
VDD
×0.40
VDD
×0.50
VDD
×0.60
Output Delay Resistance
RCT
VDD=VDET×1.1 VCT=0.5V *1
5.5
9
12.5
MΩ
CT pin Output Current
ICT
VCT=0.1V VDD=0.95V *1
15
40
-
µA
VCT=0.5V VDD=1.5V
150
240
-
Detection Voltage
Temperature coefficient
VDET/∆T
Ta=-40°C to 105°C
-
±100
±360
ppm/°C
Hysteresis Voltage
∆ VDET
VDD=LHL, RL=470kΩ
VDET
×0.03
VDET
×0.05
VDET
×0.08
V
VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guaranteed at Ta=25°C.
7/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Typical Performance Curves
Fig.3 Circuit Current
0.0
0.5
1.0
1.5
2.0
0 1 2 3 4 5 6 7 8 9 10
VDD SUPPLY VOLTAGE ：VDD[V]
CIRCUIT CURRENT ： I
DD[μA]
【BD5242G/FVE】
0
3
6
9
12
15
18
0.0 0.5 1.0 1.5 2.0 2.5
DRAIN-SOURCE VOLTAGE ： VDS[V]
"LOW" OUTPUT CURRENT ： I
OL[mA]
【BD5242G/FVE】
VDD=2.4V
VDD=1.2V
Fig.4 “Low” Output Current
0
5
10
15
20
25
30
35
40
45
0 1 2 3 4 5 6
DRAIN-SOURCE VOLTAGE ： VDS[V]
"HIGH" OUTPUT CURRENT ： I
OH[mA]
【BD5342G/FVE】
VDD=8.0V
VDD=6.0V
VDD=4.8V
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
0
1
2
3
4
5
6
7
8
9
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VDD SUPPLY VOLTAGE ：VDD[V]
OUTPUT VOLTAGE ： VOUT[V]
【BD5242G/FVE】
Ta=25℃
【BD5242】
【BD5342】
【BD5342】
【BD5242】
【BD5342】
【BD5242】
【BD5342】
8/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Typical Performance Curves – continued
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.5 1.0 1.5 2.0 2.5
VDD SUPPLY VOLTAGE ： VDD[V]
OUTPUT VOLTAGE
： V
OUT[V]
【BD5242G/FVE】
Fig.7 Operating Limit Voltage
Fig.8 CT Terminal Current
0
50
100
150
200
250
300
350
400
450
0 1 2 3 4 5
VDD SUPPLY VOLTAGE ： VDD[V]
CT OUTPUT CURRENT ： I
CT[μA]
【BD5242G/FVE】
3.2
3.6
4.0
4.4
4.8
5.2
5.6
-40 0 40 80
TEMPERATURE ： Ta[℃]
DETECTION VOLTAGE ： VDET[V]
Low to high(VDET+ΔVDET)
High to low(VDET)
【BD5242G/FVE】
～
～
Fig.9 Detection Voltage
Release Voltage
0.0
0.5
1.0
1.5
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN ON ： I DD1[μA ]
【BD5242G/FVE】
Fig.10 Circuit Current when ON
【BD5242】
【BD5342】
【BD5242】
【BD5342】
【BD5242】
【BD5342】
【BD5242】
【BD5342】
9/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Typical Performance Curves – continued
0
1
2
3
4
5
6
7
8
9
10
11
12
13
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
RESISTANCE OF CT
： RCT[MΩ ]
【BD5242G/FVE】
Fig.13 CT Terminal Circuit Resistance
0.0
0.5
1.0
1.5
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN OFF ： I DD2[μA]
【BD5242G/FVE】
Fig.11 Circuit Current when OFF
0.0
0.5
1.0
1.5
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
MINIMUM OPERATING VO LTAGE ： V OPL [V]
【BD5242G/FVE】
Fig.12 Operating Limit Voltage
0.1
1
10
100
1000
10000
0.0001 0.001 0.01 0.1
CAPACITANCE OF CT ： CCT[μF]
DELAY TIME ： tPLH[ms]
【BD5242G/FVE】
Fig.14 Delay Time (tPLH) and
CT Terminal External Capacitance
【BD5242】
【BD5342】
【BD5242】
【BD5342】
【BD5242】
【BD5342】
【BD5242】
【BD5342】
10/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Application Information
Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical
Characteristics for information on hysteresis. Because the BD52xx series uses an open drain output type, it is necessary to
connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes
VDD or the voltage of the other power supply].
Fig.15 (BD52xxType Internal Block Diagram) Fig.16 (BD53xxType Internal Block Diagram)
Setting of Detector Delay Time
It is possible to set the delay time at the rise of VDD using a capacitor connected to the Ct terminal.
Delay time at the rise of VDD tPLH：Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release
voltage(VDET+∆VDET)
tPLH = -CCT×RCT×ln
CCT: CT pin External Capacitance
RCT: CT pin Internal Impedance（Please refer to Electrical Characteristics.）
VCTH: CT pin Threshold Voltage（Please refer to Electrical Characteristics.）
ln : Natural Logarithm
Reference Data of Falling Time (tPHL) Output
Examples of Falling Time (tPHL) Output
Part Number
tPHL[µs] -40°C
tPHL[µs] ,+25°C
tPHL[µs],+105°C
BD5227
30.8
30
28.8
BD5327
26.8
26
24.8
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Timing Waveforms
Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Figure.15 and 16).
1
When the power supply is turned on, the output is unstable
from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not outputted when
the rise time of VDD is faster than tPHL.
2
When VDD is greater than VOPL but less than the reset release
voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)
voltages will switch to L.
3
If VDD exceeds the reset release voltage (VDET+∆VDET), then
VOUT switches from L to H (with a delay due to the CT terminal).
4
If VDD drops below the detection voltage (VDET) when the
power supply is powered down or when there is a power supply
fluctuation, VOUT switches to L (with a delay of tPHL).
5
The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VDET). The
system is designed such that the output does not toggle with
power supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.
Vref
VDD
GND
CT
R1
R2
R3
Q3
Q1
VOUT
RESET
RL
VDD
Vref
VDD
GND
CT
R1
R2
R3
Q3
Q2
VOUT
RESET
Q1
VDD
VDD-VCTH
VDD
VDD
VDET+ΔVDET
VDET
VOPL
0V
1/2 VDD
tPHL
①
tPLH
tPHL
tPLH
②
③
④
VCT
⑤
VOUT
Fig.17 Timing Waveform
11/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Circuit Applications
1) Examples of a common power supply detection reset circuit
Application examples of BD52xx series (Open Drain
output type) and BD53xx series (CMOS output type) are
shown below.
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use an open drain output type (BD52xx) device with a
load resistance RL attached as shown Fig.18.
CASE2: Power supply of the microcontroller (VDD1) is the
same as the power supply of the reset detection (VDD1).
Use a CMOS output type (BD53xx) device or an open
drain output type (BD52xx) device with a pull up resistor
between the output and VDD1.
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall of the output voltage (VOUT).
Please refer to Operational Notes for recommendations
on resistor and capacitor values.
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD52xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
VDD1
BD52xx
VDD2
GND
CL
（Noise-filtering
Capacitor）
CT
RL
RST
Micro
controller
Fig.18 Open Drain Output Type
CL
（Noise-filtering
Capacitor）
VDD1
BD53xx
CT
GND
RST
Micro
controller
Fig.19 CMOS Output Type
VDD1
VDD3
GND
RST
microcontroller
CT
RL
VDD2
CT
BD52xx
NO.1
BD52xx
NO.2
Fig.20 OR Circuit Connection Application
12/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
3) Examples of the power supply with resistor dividers
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of
current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow
may cause malfunction in the systems operation such as output oscillations, etc.
Figure.21
When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to
oscillation.
Figure.22 IDD Peak Current vs. Power Supply Voltage
* This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
VOUT
R2
VDD
BD52xx
BD53xx
GND
R1
I1
V1
CIN
CL
IDD
VDD
VDET
0
Inrush Current
0.001
0.01
0.1
1
10
3 4 5 6 7 8 9 10
IDD-peak[mA]
VDD[V]
VDD - IDD Peak Current Ta=25℃
BD52xx
BD53xx
Fig.21 Resistor Divider Connection Application
13/13
BD52xx series BD53xx series
TSZ02201-0GJG0G300040-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
29.May.2017 Rev.007
www.rohm.com
TSZ22111・15・001
Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) The VDD line impedance might cause oscillation because of the detection current.
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) External parameters
The recommended value of RL Resistor is 50kΩ to 1MΩ. The recommended value of CT Capacitor is over 100pF to
0.1µF. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using
practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
14) CT pin discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
.
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
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product performance, reliability, etc, prior to use, must be necessary:
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[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
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Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
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3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
